CN113416948B - PCB copper deposition process and copper deposition frame thereof - Google Patents

PCB copper deposition process and copper deposition frame thereof Download PDF

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Publication number
CN113416948B
CN113416948B CN202110650085.8A CN202110650085A CN113416948B CN 113416948 B CN113416948 B CN 113416948B CN 202110650085 A CN202110650085 A CN 202110650085A CN 113416948 B CN113416948 B CN 113416948B
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China
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pcb
basket
copper
copper deposition
sub
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CN202110650085.8A
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CN113416948A (en
Inventor
伍海霞
梅佳月
周文光
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Jinlu Electronic Technology Co ltd
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Jinlu Electronic Technology Co ltd
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Priority to CN202110650085.8A priority Critical patent/CN113416948B/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

The application provides a PCB copper deposition process and a copper deposition frame thereof. The PCB copper deposition frame comprises a mother basket and a son basket, wherein the mother basket comprises a first bracket, a base, a second bracket and a fixing rod, the first bracket is connected with the base, the second bracket is connected with one end of the base far away from the first bracket, and the fixing rod is respectively connected with the first bracket and the second bracket; the sub-basket comprises a basket body and a hanging piece, wherein the hanging piece is connected to one side of the basket body and is used for being detachably connected with the fixing rod, and the basket body is provided with a positioning groove which is used for placing a PCB. The PCB copper deposition frame is simpler and more convenient to operate, and the problem of wiping the upper plate and the lower plate of the PCB can be reduced or avoided.

Description

PCB copper deposition process and copper deposition frame thereof
Technical Field
The application relates to the technical field of printed circuit boards, in particular to a PCB copper precipitation process and a copper precipitation frame thereof.
Background
Electroless copper plating (Eletcroless Plating Copper), also commonly referred to as copper plating or hole forming (PTH), is an autocatalytic redox reaction that is widely used in the production of printed wiring boards (Printed Circuit Board, abbreviated as PCBs) with through holes, including processes for bonding pads, vias, solder masks, silk-screening layers, copper plating, etc. Copper deposition is widely used in the production of printed wiring boards with through holes, and is mainly a technique of plating copper on a board by chemical reaction, wherein a thin layer of copper is deposited on a drilled non-conductive hole wall substrate by chemical method to serve as a substrate for copper electroplating.
Except the upper plate and the lower plate in the PCB copper deposition process, the copper deposition process needs to be carried out in liquid medicine tanks, and the liquid medicine added by each liquid medicine tank is determined according to the functions of the liquid medicine tanks. In the process, the copper deposition frame is used as a carrier of the PCB to sequentially immerse the PCB into the liquid medicine cylinder according to a copper deposition flow, and the PCB is lifted and sent to the next liquid medicine cylinder after the reaction is completed. The copper deposition frame mainly has the function of fixing the PCB on a copper deposition machine so as to facilitate the copper deposition process.
However, the existing copper deposition frame is large in size, and the copper deposition frame needs to be detached and installed entirely when being mounted on the upper plate and the lower plate, which is time-consuming and labor-consuming. In addition, the existing copper precipitation process is easy to cause quality problems such as PCB wiping and the like.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a PCB copper precipitation process and a copper precipitation frame thereof, wherein the operation is simpler and more convenient, and the problem of wiping upper and lower plates of the PCB can be reduced or avoided.
The aim of the invention is realized by the following technical scheme:
the PCB copper deposition frame comprises a mother basket and a child basket, wherein the mother basket comprises a first support, a base, a second support and a fixing rod, the first support is connected with the base, the second support is connected with one end, far away from the first support, of the base, and the fixing rod is respectively connected with the first support and the second support; the sub-basket comprises a basket body and a hanging piece, wherein the hanging piece is connected to one side of the basket body and is used for being detachably hung with the fixing rod, the basket body is provided with a positioning groove, and the positioning groove is used for placing the PCB.
In one embodiment, the sub-basket further comprises a handle loop connected to the basket body.
In one embodiment, the width of the opening of the basket body is greater than the width of the bottom of the basket body.
The application also provides a PCB copper deposition process, which adopts the PCB copper deposition frame according to any embodiment to perform copper deposition operation on the PCB, and comprises the following steps:
placing the PCB in the sub-basket;
fixing the parent basket on a copper sinking wire;
hanging the sub-basket with the PCB into the main basket;
performing pretreatment operation on the PCB to obtain a pretreated PCB;
carrying out copper deposition operation on the pretreated PCB to obtain a copper deposition PCB;
and detaching the sub-basket from the main basket, and replacing the copper-deposited PCB in the sub-basket.
In one embodiment, after the step of placing the PCB in the sub-basket and before the step of fixing the parent basket on the copper sink line, the PCB copper sink process further comprises the steps of:
and performing a flushing operation on the PCB.
In one embodiment, after the step of placing the PCB in the sub-basket and before the step of fixing the parent basket on the copper sink line, the PCB copper sink process further comprises the steps of:
And carrying out oil removal operation on the PCB.
In one embodiment, the preprocessing operation specifically includes the following steps:
performing microetching operation on the PCB to obtain a microetching PCB;
carrying out acid washing operation on the microetching PCB to obtain an acid washing PCB;
performing presoaking operation on the acid-washed PCB to obtain a presoaked PCB;
performing an activating operation on the pre-impregnated PCB to obtain an activated PCB;
performing acceleration operation on the activated PCB to obtain an acceleration PCB;
and performing water washing operation on the accelerated PCB to obtain the PCB to be copper deposited.
In one embodiment, the temperature in the prepreg operation is 15 ℃ to 25 ℃.
In one embodiment, the temperature in the activation operation is 25 ℃ to 35 ℃.
In one embodiment, the activating operation comprises a first activating operation and a second activating operation, and the activating intensity in the first activating operation is greater than the activating intensity in the second activating operation.
Compared with the prior art, the invention has at least the following advantages:
1. according to the PCB copper precipitation process, the PCB copper precipitation frame comprising the mother basket and the son basket is adopted, the mother basket is fixedly connected to the copper precipitation line, the son basket is provided with the suspension piece, the son basket can be detachably hung on the mother basket through the suspension piece, before the PBC board is subjected to copper precipitation operation, the PCB can be firstly put into the son basket, and then the son basket with the PCB is directly hung on the mother basket to be subjected to copper precipitation operation.
2. In the PCB copper deposition process, when the PCB is replaced, the whole copper deposition frame is not required to be disassembled, and only the sub-basket is required to be disassembled for upper and lower plates, so that the weight of an operator for disassembling the copper deposition frame is reduced, and compared with the process for disassembling the whole copper deposition frame, the time can be effectively saved, and the production efficiency of the PCB is improved. In addition, when carrying out the PCB and changing, can dismantle the change with PCB and sub basket together, can effectively prevent the problem that the PCB was rubbed when changing.
3. In the PCB copper deposition process, the PCBs are respectively arranged in the sub-baskets, and then the sub-baskets with the PCBs are hung on the parent basket for copper deposition operation, so that the PCB is prevented from being too concentrated in the copper deposition process, the liquid medicine can flow in the PCB more smoothly, and the copper deposition effect is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an assembled PCB copper frame in an embodiment;
FIG. 2 is a schematic diagram of the structure of a female basket in the PCB copper sink frame shown in FIG. 1;
FIG. 3 is a schematic view of a sub-basket structure in the PCB copper sink rack of FIG. 1;
FIG. 4 is a flow chart of a PCB copper deposition process using the PCB copper deposition frame shown in FIG. 1;
fig. 5 is a process flow diagram of a pretreatment operation in the copper deposition process of the PCB of fig. 4.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The application provides a PCB copper deposition frame, which comprises a mother basket and a child basket, wherein the mother basket comprises a first bracket, a base, a second bracket and a fixing rod, the first bracket is connected with the base, the second bracket is connected with one end of the base far away from the first bracket, and the fixing rod is respectively connected with the first bracket and the second bracket; the sub-basket comprises a basket body and a hanging piece, wherein the hanging piece is connected to one side of the basket body and is used for being detachably hung with the fixing rod, the basket body is provided with a positioning groove, and the positioning groove is used for placing the PCB.
Please refer to fig. 1, which is a schematic diagram of a PCB copper deposition frame according to an embodiment of the present application.
Referring to fig. 2, the copper deposition frame 10 of an embodiment includes a parent basket 100 and a child basket 200, wherein the parent basket 100 includes a first bracket 110, a base 120, a second bracket 130 and a fixing rod 140, the first bracket 110 is connected with the base 120, the second bracket 130 is connected with one end of the base 120 far away from the first bracket 110, and the fixing rod 140 is respectively connected with the first bracket 110 and the second bracket 130; the sub-basket 200 includes a basket body 210 and a hanging member 220, the hanging member 220 is connected to one side of the basket body 210, the hanging member 220 is detachably connected to the fixing rod 140, the basket body 210 is provided with a positioning groove 212, and the positioning groove 212 is used for placing a PCB.
In the above-mentioned PCB copper deposition frame 10, copper deposition frame 10 includes female basket 100 and sub-basket 200, sub-basket 200 includes basket body 210 and hanger 220, and hanger 220 is connected in one side of basket body 210, and hanger 220 is used for dismantling the link with dead lever 140, can dismantle copper deposition frame 10 more convenient and swift through hanger 220, realizes the quick replacement to the PCB, and sub-basket 200 can PCB play the guard action moreover, prevents that PCB from taking place scratch and the wiping scheduling problem in copper deposition or change process. Secondly, the basket body 210 is provided with a positioning groove 212, the positioning groove 212 is used for placing a PCB, the PCB can be further fixed through the positioning groove 212, and the problems of scratch, scratch and the like caused by collision of the PCB in the copper deposition or replacement process are prevented. Further, the female basket 100 is fixedly connected to the copper-clad wire, so that the stability of the female basket 100 in the copper-clad wire can be improved, and when copper-clad operation is performed, the sub-basket 200 provided with the PCB is hung in the female basket 100, so that the stability of the PCB in the copper-clad process is ensured. In addition, the copper deposition frame 10 of the application is simple in design and easy to operate, compared with the traditional copper deposition frame 10, the original process of detaching the whole copper deposition frame 10 is changed into the process of detaching only the sub-blue upper and lower plates, and the weight of workers detaching the copper deposition frame 10 can be reduced by changing the process, so that compared with detaching the whole copper deposition frame 10, the time is saved, and the production efficiency is improved.
As shown in fig. 3 and 5, in one embodiment, the sub-basket 200 further includes a handle ring 230, the handle ring 230 being connected to the basket body 210. It will be appreciated that the copper deposition frame 10 includes a main basket 100 and a sub basket 200, the sub basket 200 having a smaller volume than the main basket 100, and the sub basket 200 being capable of being hung in the fixing rod 140 of the main basket 100 by a hanging member 220. When the PCB is replaced, the PCB may be loaded into the sub-basket 200 first, and then the sub-basket 200 is connected to the sub-basket 100 together after the loading. In order to improve the convenience of sub-basket 200 installation and dismantlement, in this embodiment, sub-basket 200 still includes handle ring 230, and handle ring 230 is connected with basket body 210, because the structural design of sub-basket contains handle ring 230 and the volume is less for the installation is more convenient and fast with the operation of dismantlement sub-basket 200, can effectively solve the problem of the easy scratch of circuit board upper and lower board in-process simultaneously.
In one embodiment, the width of the basket 210 at the opening is greater than the width of the bottom of the basket 210. It will be appreciated that when the PCB is replaced, the PCB may be loaded into the sub-basket 200 first, and then the sub-basket 200 is connected to the sub-basket 100 and loaded into the main basket 100. However, the PCB is easily collided with the basket body 210 of the sub-basket 200 during loading, thereby causing a scratch of the PCB. In order to prevent the PCB from being scratched due to collision with the basket body 210 of the sub-basket 200 in the loading process, in this embodiment, the width of the opening of the basket body 210 is greater than the width of the bottom of the basket body 210, and no shielding object is arranged above the sub-basket 200, and the design with wide top and narrow bottom is adopted, so that the PCB can be accurately prevented by an operator in the loading and unloading process, and further the problem of scratching due to collision between the PCB and the basket body 210 of the sub-basket 200 in the loading process is prevented.
In one embodiment, the suspension member is slidably disposed on the fixed rod. It can be understood that in the copper deposition process of the PCB, the gas generated in the reaction process cannot escape in time, so that bubbles are easily formed in the PCB hole, the copper deposition effect of the PCB is damaged, and the follow-up procedure is affected. In order to remove the bubble in the PCB hole, make the timely escape of gas that the reaction in-process produced, in this embodiment, the hanger slides and sets up in the dead lever, and the hanger is connected with the catch bar, moves the hanger through the catch bar and makes the son basket that is equipped with heavy copper PCB reciprocating sliding on the dead lever of female basket, in the removal in-process, heavy copper liquid medicine flows in the hole of PCB to can effectively drive away the bubble, escape gas, still can further promote heavy copper effect simultaneously.
In one embodiment, the hanging piece comprises a fixing plate and an arc-shaped supporting plate, the fixing plate is connected with the basket body, one end of the arc-shaped supporting plate is connected with the fixing plate, the arc-shaped supporting plate and the fixing plate form a containing area and an opening area, the opening area is communicated with the containing area, the width of the opening area is larger than that of the containing area, the width of the containing area is larger than that of the communicating part of the opening area and the containing area, and the fixing rod is connected in the containing area. In this embodiment, the width of opening district is greater than the width of holding district, can be favorable to more to going into the dead lever with the hanger card to realize the quick connect of son basket and female basket. Further, the width of holding district is greater than the width of opening district and holding district intercommunication department, can prevent effectively that the dead lever from sliding out from holding the district.
As shown in fig. 5, in one embodiment, the basket 210 includes a fixed basket 2110, a movable basket 2120 and a positioning rod 2130, the fixed basket 2110 and the movable basket 2120 are respectively disposed at two ends of the positioning rod 2130, the fixed basket 2110 is fixedly connected with one end of the positioning rod 2130, and the movable basket 2120 is movably connected with the other end of the positioning rod 2130. In this embodiment, the number of the positioning rods 2130 is two, the two positioning rods 2130 are arranged in parallel, the movable basket 2120 can move relative to the positioning rods 2130, especially when the PCB is assembled or disassembled, the space size of the sub-basket 200 can be changed by adjusting the movable basket 2120, on one hand, the loading capacity of the PCB can be increased according to the actual requirement, and the copper deposition efficiency can be improved; on the other hand, the device can provide an operation space for operators, is convenient to load, and simultaneously prevents the problems of wiping and the like caused by collision in the loading process. After the PCB is loaded, the movable basket 2120 is fixed on the positioning rod 2130, so that the influence of the shaking of the movable basket 2120 on the copper deposition effect is prevented. Further, the movable basket 2120 is connected with the positioning rod 2130 through a bolt, the movable basket 2120 is sleeved on the positioning rod 2130, the positioning rod 2130 is provided with a first threaded through hole, the movable basket 2120 is provided with a second threaded through hole, and the movable basket 2120 can be locked on the positioning rod 2130 through the bolt penetrating through the first threaded through hole and the second threaded through hole. Furthermore, the positioning rod and the movable basket body are square structures, the movable basket body is sleeved on the positioning rod, and the joint of the positioning rod and the movable basket body can be prevented from rotating relatively, so that the structural stability of the sub-basket is improved.
In one embodiment, the positioning rod is provided with scale values. In this embodiment, when the movable basket body moves on the locating lever, the scale that the juncture of movable basket body and locating lever was exposed can make things convenient for operating personnel to adjust the size of sub-basket according to PCB's specification size, from being favorable to improving PCB's stability in sub-basket more, can prevent simultaneously that sub-basket adjustment from being too little and cause the PCB to be scraped the problem of flowers.
In one embodiment, as shown in fig. 5, the sub-basket 200 further includes a wave-shaped fixing plate 240, the wave-shaped fixing plate 240 is fixedly connected with the basket body 210, and the width of the recess of the wave-shaped fixing plate 240 is consistent with the thickness of the PCB. It will be appreciated that a plurality of PCBs are simultaneously loaded on the sub-basket 200, and if the basket body 210 is shaken, the PCBs are easily collided with each other, thereby causing scratch or scratch. In order to improve stability of the PCB in the sub-basket 200, in this embodiment, the sub-basket 200 further includes a wave-shaped fixing plate 240, the wave-shaped fixing plate 240 is fixedly connected with the basket body 210, and a width of a recess of the wave-shaped fixing plate 240 is consistent with a thickness of the PCB, when the PCB is loaded, a plurality of PCBs can be respectively clamped into the recess of the wave-shaped fixing plate 240, so that the plurality of PCBs are orderly separated, and meanwhile, the PCBs are fixed in the recess of the wave-shaped fixing plate 240, thereby improving stability of the PCBs in the sub-basket 200. Further, the surface of wave fixed plate is equipped with the one deck silica gel layer, and the silica gel layer can play the cushioning effect to PCB to avoid the friction between PCB and the basket body, and then effectively prevent PCB's the problem of rubbing. In this embodiment, the number of the wavy fixing plates 240 is two, and the two wavy fixing plates 240 are respectively disposed on two sides of the basket body 210, so as to further improve the stability of the PCB in the sub-basket 200.
Further, as shown in fig. 4, the female basket 100 further includes a first serrated fixing plate 150 and a second serrated fixing plate 160, the first serrated fixing plate 150 is fixedly connected to the first bracket 110, the second serrated fixing plate 160 is fixedly connected to the second bracket 130, and the widths of the serrated protrusions on the first serrated fixing plate 150 and the second serrated fixing plate 160 are consistent with the width of the recess on the wavy fixing plate 240. In this embodiment, the first serrated fixing plate 150 can enhance the structural strength of the first bracket 110, and the second serrated fixing plate 160 can enhance the structural strength of the second bracket 130, thereby enhancing the structural strength of the parent basket 100 and improving the stability of the copper deposition operation. In addition, the width of the serrated protruding parts on the first serrated fixed plate 150 and the second serrated fixed plate 160 is consistent with the width of the concave part on the wavy fixed plate 240, when the sub-basket 200 is installed on the main basket 100, the first serrated fixed plate 150 and the second serrated fixed plate 160 can be respectively engaged with the wavy fixed plate 240, so that the sub-basket 200 can be effectively prevented from sliding relative to the main basket 100, the stability of the PCB in copper plating operation is further improved, and the copper plating effect of the PCB is improved.
The application also provides a PCB copper deposition process. The PCB copper deposition process comprises the following steps: manufacturing a PCB copper deposition frame, wherein the copper deposition frame comprises a mother basket and a child basket, and the child basket is provided with a suspension part and is used for being movably connected with the mother basket; placing the PCB in a sub-basket; fixing the parent basket on a copper sinking wire; hanging the sub-basket with the PCB into the main basket; performing pretreatment operation on the PCB to obtain a pretreated PCB; carrying out copper deposition operation on the pretreated PCB to obtain a copper deposition PCB; and detaching the sub-basket from the main basket, and replacing the copper-deposited PCB in the sub-basket.
Among the above-mentioned PCB copper deposition process, adopt the PCB copper deposition frame including female basket and son basket, female basket fixed connection is in heavy copper line, son basket is equipped with the suspension member, can hang the son basket and locate female basket through the suspension member, before carrying out copper deposition operation to the PBC board, can pack the PCB into son basket earlier, will be equipped with the son basket of PCB and directly hang and locate female basket in order to carry out copper deposition operation again, because the volume of son basket is less than the volume of female basket, the upper plate and the lower plate operation of PCB are easier, and be convenient for remove, thereby make the copper deposition operation of PCB more simple and convenient and reduce or avoid PCB upper and lower plate to wipe the problem. Firstly, the PCBs are respectively arranged in the sub-baskets, then the sub-baskets provided with the PCBs are hung on the parent basket to carry out copper precipitation operation, and the phenomenon that the PCBs are too concentrated in the copper precipitation process can be avoided, so that liquid medicine flows in the PCBs more smoothly, and the copper precipitation effect is improved. Further, when carrying out the PCB and changing, need not to dismantle whole heavy copper frame, only need dismantle the son basket and go up the hypoplastron to alleviate operating personnel and dismantle heavy copper frame's weight, compare in dismantling whole heavy copper frame, can save time effectively, thereby improve PCB's production efficiency. In addition, when carrying out the PCB and changing, can dismantle the change with PCB and sub basket together, can effectively prevent the problem that the PCB was rubbed when changing.
In order to better understand the PCB copper deposition process of the present invention, as shown in fig. 1, the PCB copper deposition process of an embodiment of the present invention uses the PCB copper deposition frame according to any of the above embodiments to perform copper deposition operation on the PCB, where the PCB copper deposition process includes some or all of the following steps:
s100, placing the PCB in the sub-basket.
In this embodiment, according to the copper deposition process of copper deposition process preparation novel PCB copper deposition frame, copper deposition frame includes female basket and son basket, and son basket is equipped with the suspension member for with female basket swing joint, female basket fixed connection is on heavy copper wire. Because son basket compares with female basket, and is smaller, and weight is lighter, when carrying out the PCB change, need not to dismantle whole heavy copper frame, only need dismantle son basket and go up the hypoplastron to alleviate the weight that operating personnel dismantled heavy copper frame, compare in dismantling whole heavy copper frame, can save time effectively, thereby improve PCB's production efficiency. In addition, when carrying out the PCB and changing, can dismantle the change with PCB and sub basket together, can effectively prevent the problem that the PCB was rubbed when changing.
Further, be equipped with a plurality of recesses that correspond with PCB in the sub-basket, place PCB in the recess, compare with the operation that directly put into heavy copper frame with PCB one by one, place PCB in the sub-basket convenient and fast more. Secondly, the sub-basket also has a protective effect on the PCB, and can prevent the PCB from being scratched or rubbed in the moving process of the copper deposition process.
And S200, fixing the parent basket on the copper sinking wire.
It is understood that in the copper deposition process flow, except the upper plate and the lower plate, the copper deposition process flow is carried out in liquid medicine cylinders, and the liquid medicine added by each liquid medicine cylinder is determined according to the functions of the liquid medicine cylinders. In the process, the copper deposition frame is used as a carrier of the PCB to sequentially immerse the PCB into the medicine water tank according to a copper deposition flow, and the PCB is lifted and sent to the next medicine water tank after the reaction is completed. The copper deposition frame mainly has the function of fixing the PCB on a copper deposition machine so as to facilitate the copper deposition process. In order to improve stability of the PCB in the copper deposition process, in the embodiment, the parent basket is fixed on the copper deposition line, so that stability of the parent basket in the copper deposition line is improved, and when copper deposition operation is carried out, the child basket provided with the PCB is hung in the parent basket, so that stability of the PCB in the copper deposition process is guaranteed.
S300, hanging the sub-basket with the PCB into the main basket.
In this embodiment, the son basket is equipped with the suspension member, is equipped with the dead lever in the female basket, can hang the son basket that is equipped with PCB into female basket through the suspension member, will be equipped with the son basket of PCB and install in female basket to conveniently carry out copper precipitation operation to PCB. And secondly, as the size of the sub-basket is smaller than that of the main basket, the upper plate and the lower plate of the PCB are easier to operate, and the movement is convenient, so that the copper deposition operation of the PCB is simpler and more convenient, and the problem of wiping the upper plate and the lower plate of the PCB is reduced or avoided.
S400, performing pretreatment operation on the PCB to obtain a pretreated PCB.
It is understood that copper deposition is primarily a technique for plating copper onto a plate using chemical reactions to chemically deposit a thin layer of copper on a drilled non-conductive hole wall substrate as a substrate for subsequent copper plating. Therefore, the state of the surface of the PCB before copper deposition has a large influence on the copper deposition effect. In order to improve the copper deposition effect of the PCB, in the embodiment, the PCB is subjected to pretreatment operation, so that the PCB reaches a state favorable for chemical copper deposition, and meanwhile, the binding force between copper layers of the PCB is enhanced, and the copper deposition effect of the PCB is further improved.
S500, carrying out copper deposition operation on the pretreated PCB to obtain a copper deposition PCB.
In the embodiment, the pretreated PCBs are sequentially immersed in a liquid medicine tank, lifted and sent to the next liquid medicine tank after the reaction is completed, and then a fine copper layer is deposited on the hole wall and the copper surface of the PCBs through the action of catalytic palladium to provide a conductive matrix for electroplating thickened copper.
And S600, the sub-basket is detached from the main basket, and the copper-deposited PCB in the sub-basket is replaced.
It is understood that the sub-basket is provided with a hanging piece, a fixing rod is arranged in the main basket, and the sub-basket with the PCB can be hung into the main basket through the hanging piece, namely, the sub-basket with the PCB is installed in the main basket. Similarly, in this embodiment, can directly lift the son basket off from female basket through the suspension member, and when carrying out the PCB change, need not to dismantle whole heavy copper frame, only need dismantle the son basket and go on the hypoplastron to alleviate operating personnel and dismantle heavy copper frame's weight, compare in dismantling whole heavy copper frame, can save time effectively, thereby improve PCB's production efficiency. In addition, when carrying out the PCB and changing, can dismantle the change with PCB and sub basket together, can effectively prevent the problem that the PCB was rubbed when changing.
In one embodiment, the PCB copper deposition process further includes the steps of, after the step of placing the PCB in the sub-basket and before the step of fixing the parent basket on the copper deposition wire: and (5) performing a flushing operation on the PCB. It is understood that copper deposition is primarily a technique for plating copper onto a plate using chemical reactions to chemically deposit a thin layer of copper on a drilled non-conductive hole wall substrate as a substrate for subsequent copper plating. Therefore, the state of the surface of the PCB before copper deposition has a large influence on the copper deposition effect. If the foreign matters on the surface of the PCB are not cleaned in time, the copper deposition effect on the surface of the PCB is easily affected. In order to improve the cleanliness of the surface of the PCB, in this embodiment, after the step of placing the PCB in the sub-basket, before the step of fixing the parent basket on the copper-clad wire, the method further comprises the steps of: the PCB is washed, and the child basket can be directly detached from the mother basket because the PCB is placed in the child basket, and the child basket is small in size, so that the PCB can be washed more comprehensively, foreign matters on the surface of the PCB are effectively removed, the cleanliness of the surface of the PCB is improved, and the copper deposition effect of the PCB is improved.
In one embodiment, the PCB copper deposition process further includes the steps of, after the step of placing the PCB in the sub-basket and before the step of fixing the parent basket on the copper deposition wire: and (5) carrying out oil removal operation on the PCB. It is understood that contamination of the contaminated site may cause problems with chemical copper coverage, i.e., the creation of micro-voids and copper-free areas, due to insufficient adsorption of the activator. The micro-voids are covered or bridged by the subsequent electroplated copper, but there is no bonding force between the electroplated copper layer and the non-conductive substrate of the base, and the end result may be detachment of the hole wall and blowing. Internal coating stress generated by an electroplated layer deposited on the chemical copper layer and steam expansion force generated by subsequent heating, such as baking plates, tin spraying, welding and the like, of water or gas wrapped by the coating in the substrate tend to pull the coating away from the non-conductive substrate of the hole wall, and the hole wall can be separated; copper powder generated by burrs in the holes is adsorbed in the holes and is also coated by the electroplated copper layer if not removed in the oil removal process, and the situation can finally cause the hole wall to be separated as a result in the case that no binding force exists between the copper layer and the non-conductive base material. In order to adjust the polarity of the hole wall substrate, so as to facilitate the adsorption of the colloidal palladium in the post-process, in this embodiment, after the step of placing the PCB in the sub-basket and before the step of fixing the parent basket on the copper-clad wire, the PCB copper-clad process further includes the steps of: and the PCB is subjected to oil removal operation, so that the purposes of cleaning the surface of the hole wall and adjusting the charge of the hole wall are achieved, the hole wall is adjusted from negative charge to positive charge, the adsorption of colloid palladium in the subsequent working procedure is facilitated, the hole wall binding force is improved, and the copper precipitation effect is improved. In addition, PCB places in sub-basket, and sub-basket detachably installs in female basket, can avoid PCB too concentrated or unable removal at the deoiling process effectively and cause the unclean problem of deoiling, promotes PCB's deoiling effect, and then promotes heavy copper effect in a poor light, strengthens the pore wall cohesion, prevents that the face from deoiling and producing peeling foaming phenomenon.
As shown in fig. 2, in one embodiment, the preprocessing operation specifically includes the following steps:
s410, performing microetching operation on the PCB to obtain a microetching PCB;
in this embodiment, microetching solution is used to perform microetching operation on the PCB, so as to remove oxides on the board surface, roughen the board surface, and ensure good bonding force between the subsequent copper deposition layer and the copper substrate. In addition, the PCB is placed in the sub-basket, the sub-basket is detachably arranged in the main basket, the PCB and microetching liquid can react more fully, and the newly generated copper surface has strong activity and can adsorb colloidal palladium better. In this example, the microetching solution is prepared from sodium persulfate and sulfuric acid in a ratio of (1.5-3): 1, wherein the concentration of sodium persulfate is 50g/L-90g/L, and the concentration of sulfuric acid is 18g/L-54g/L.
S420, carrying out acid washing operation on the microetching PCB to obtain an acid washing PCB.
It is understood that the oxide on the board surface is separated from the PCB after the pickling operation, thereby achieving the effect of roughening the board surface. However, if the copper surface oxide separated after microetching is not cleaned up in time, the copper deposition operation of the PCB is easy to be interfered. In order to improve the cleanliness of the PCB surface, in the embodiment, 5% -10% sulfuric acid is adopted to carry out acid washing operation on the microetching PCB, copper surface oxides remained on the microetching PCB are removed, the surface is further cleaned and roughened, and therefore copper deposition effect of the PCB is improved.
S430, performing presoaking operation on the acid-washed PCB to obtain the presoaked PCB.
In the embodiment, the sub-basket and the pickling PCB in the sub-basket are transferred into the pre-immersion liquid through the main basket for pre-immersion operation, so that the palladium tank is protected from being polluted by the pretreatment tank liquid, the service life of the palladium tank is prolonged, the main components are consistent with the components of the palladium tank except palladium chloride, the hole wall can be effectively wetted, and the subsequent activating liquid can be conveniently and timely activated into the hole to be sufficiently and effectively activated.
S440, performing an activating operation on the prepreg PCB to obtain an activated PCB.
It can be understood that after pretreatment degreasing polarity adjustment, the positively charged pore wall can effectively adsorb enough negatively charged colloidal palladium particles so as to ensure uniformity, continuity and compactness of subsequent copper deposition. In this embodiment, the sub-basket and the pre-impregnated PCB in the sub-basket are transferred to an activating solution through a mother basket to perform an activating operation, palladium chloride in the activating solution exists in a colloid form, colloid palladium particles have negative charges, and non-conductive hole walls are activated by attaching colloid palladium to the hole walls to catalyze the deposition of chemical copper later.
S450, performing acceleration operation on the activated PCB to obtain an acceleration PCB.
In this embodiment, the activated PCB is accelerated to remove stannous ions surrounded by the colloidal palladium particles, exposing palladium nuclei in the colloidal particles for direct and efficient catalytic initiation of electroless copper reactions.
And S460, performing water washing operation on the accelerated PCB to obtain the PCB to be copper deposited.
It can be understood that after the pretreatment operation is performed on the PCB, each liquid medicine remained on the surface of the PCB also becomes a pollutant on the PCB, which affects the subsequent processes of copper deposition operation and the like of the PCB. In this embodiment, carry out the washing operation to accelerating PCB, can effectively clear away the remaining liquid medicine of PCB face, improve the cleanliness on PCB surface, and then promote PCB's copper deposition effect.
Further, the temperature in the prepreg operation is 15 to 25 ℃. It can be understood that the pre-soaking is also equivalent to the pre-activating treatment of the PCB, and the pre-soaking operation is performed on the PCB, so that the palladium tank can be protected from being polluted by the pretreatment tank liquid, the service life of the palladium tank is prolonged, the main components are consistent with the components of the palladium tank except palladium chloride, the hole wall can be effectively wetted, and the subsequent activating liquid can be conveniently and timely activated into the hole to enable the hole wall to be sufficiently and effectively activated. In order to further improve the wetting effect of the hole wall, in this embodiment, the temperature in the pre-impregnation operation is 15-25 ℃, so that the pre-impregnation liquid fully wets the hole wall, and is ready for further activation of the PCB.
Further, the temperature in the activation operation is 25℃to 35 ℃. It will be appreciated that the sub-basket and the pre-impregnated PCB in the sub-basket are transferred to an activation solution by the parent basket for activation operation, the palladium chloride in the activation solution is in colloidal form, the colloidal palladium particles carry a negative charge, and the non-conductive pore walls are activated by attaching the colloidal palladium to the pore walls to catalyze the subsequent deposition of chemical copper. In order to further improve the activation effect and the activation efficiency, in this embodiment, the temperature in the activation operation is 25 ℃ to 35 ℃, so that the activation effect can be effectively improved, the activation efficiency is improved, and meanwhile, the colloidal palladium precipitation caused by the overhigh temperature can be prevented.
In one embodiment, after the step of copper plating the pre-processed PCB to obtain a copper plated PCB and before the step of removing the sub-basket from the main basket and replacing the copper plated PCB in the sub-basket, the PCB copper plating process further comprises the steps of: and carrying out reciprocating movement operation on the sub-basket provided with the copper-deposited PCB. It can be understood that in the copper deposition process of the PCB, the gas generated in the reaction process cannot escape in time, so that bubbles are easily formed in the PCB hole, the copper deposition effect of the PCB is damaged, and the follow-up procedure is affected. In order to remove bubbles in the holes of the PCB and make the gas generated in the reaction process escape in time, in this embodiment, after the step of performing copper deposition operation on the pretreated PCB to obtain a copper deposited PCB and before the step of removing the sub-basket from the main basket and performing replacement operation on the copper deposited PCB in the sub-basket, the PCB copper deposition process further includes the steps of: the sub-basket provided with the copper-deposited PCB is subjected to reciprocating movement operation, specifically, the sub-basket provided with the copper-deposited PCB is made to reciprocate on the fixed rod of the main basket by moving the suspension piece, and copper-deposited liquid medicine flows in the hole of the PCB in the moving process, so that bubbles can be effectively removed, gas can escape, and meanwhile, the copper-deposited effect can be further improved. In addition, in this embodiment, by moving the sub-basket instead of moving the main basket or the container containing the copper-precipitating liquid, it can be understood that moving the main basket or the container containing the copper-precipitating liquid drives the bubbles in the impact hole of the copper-precipitating liquid, so that the impact force is difficult to control and is easy to damage or affect the flatness of the surface of the PCB, and moving the sub-basket enables the PCB to actively move in the copper-precipitating liquid and to be more attached to the flow of the copper-precipitating liquid, so that the flatness of the surface of the PCB can be improved while the bubbles are removed.
In one embodiment, the activation operation comprises a first activation operation and a second activation operation, and the activation intensity in the first activation operation is greater than the activation intensity in the second activation operation. Firstly, completing the first activated palladium (colloid palladium) deposition in a first activation cylinder with relatively high activation strength (higher concentration of palladium ions), playing a role in dominant activation, and basically meeting the effect of activating pore walls; the second activation palladium deposition is completed in a second activation cylinder with relatively low activation strength, and the auxiliary or supplementary activation effect is achieved, and it is understood that the higher the concentration of the activation liquid in the activation cylinder is, the more difficult the surface tension of the activation liquid is to penetrate into the hole of the PCB, the weaker the back flow capacity in the hole is, whereas the lower the concentration of the activation liquid in the activation cylinder is, the lower the surface tension of the activation liquid is, the easier the activation liquid is to penetrate into the hole of the PCB, and the stronger the back flow capacity in the hole is. Because the activation strength of the second activation cylinder is relatively low, the activation liquid can enter the hole more easily, and the hole wall is activated more effectively and fully, so that the defect possibly left by the first activation is overcome to a certain extent, and the occurrence probability of the phenomena of thin copper and no copper in the hole is greatly reduced. In addition, the activation strength of the second activation cylinder is relatively low, so that the carrying-out consumption of palladium is low, the production cost can be reduced, the pressure of the subsequent water washing process can be effectively reduced, the pollution to water in the water washing tank is reduced, and the pollution to the environment is further reduced; and because the activation strength of the first activation cylinder is relatively high, the activation liquid carried out by the sub-basket and the PCB enters the second activation cylinder, and the activation liquid can be used as the activation liquid supplement of the second activation cylinder, so that the activated palladium can be directly reused, the purpose of double saving of the activated palladium is achieved, and the service lives of the first activation cylinder and the second activation cylinder are prolonged. In this embodiment, the activation strength of the first activation cylinder is 70% -90% and the activation strength of the second activation cylinder is 30% -50%.
Example 1
The novel PCB copper sinking frame is manufactured according to a copper sinking process and comprises a mother basket and a son basket, wherein the son basket is provided with a hanging piece and is movably connected with the mother basket and fixed on a copper sinking wire. And correspondingly placing the PCB to be copper-plated in the groove of the sub-basket, and hanging the sub-basket with the PCB into the main basket after placing. Then, the PCB is pretreated by moving the female basket to be immersed in different liquid medicine cylinders in sequence, and copper deposition is carried out on the pretreated PCB. And after each process is finished, directly disassembling the sub-basket to replace the PCB. The main flow is as follows: the method comprises the steps of sub-basket disassembly, upper plate disassembly, fluffing, double water washing, glue removal, recovery water washing, pre-neutralization, high-level water washing, neutralization, double water washing, oil removal, hot water washing, double water washing, microetching, double water washing, presoaking, double activation, double water washing, acceleration, double water washing, copper precipitation, double water washing, sub-basket disassembly and lower plate disassembly. Wherein the temperature in the prepreg operation is 15℃and the temperature in the activation operation is 25 ℃.
Example 2
The novel PCB copper sinking frame is manufactured according to a copper sinking process and comprises a mother basket and a son basket, wherein the son basket is provided with a hanging piece and is movably connected with the mother basket and fixed on a copper sinking wire. And correspondingly placing the PCB to be copper-plated in the groove of the sub-basket, and hanging the sub-basket with the PCB into the main basket after placing. Then, the PCB is pretreated by moving the female basket to be immersed in different liquid medicine cylinders in sequence, and copper deposition is carried out on the pretreated PCB. And after each process is finished, directly disassembling the sub-basket to replace the PCB. The main flow is as follows: the method comprises the steps of sub-basket disassembly, upper plate disassembly, fluffing, double water washing, glue removal, recovery water washing, pre-neutralization, high-level water washing, neutralization, double water washing, oil removal, hot water washing, double water washing, microetching, double water washing, presoaking, double activation, double water washing, acceleration, double water washing, copper precipitation, double water washing, sub-basket disassembly and lower plate disassembly. Wherein the temperature in the prepreg operation is 25℃and the temperature in the activation operation is 35 ℃.
Example 3
The novel PCB copper sinking frame is manufactured according to a copper sinking process and comprises a mother basket and a son basket, wherein the son basket is provided with a hanging piece and is movably connected with the mother basket and fixed on a copper sinking wire. And correspondingly placing the PCB to be copper-plated in the groove of the sub-basket, and hanging the sub-basket with the PCB into the main basket after placing. Then, the PCB is pretreated by moving the female basket to be immersed in different liquid medicine cylinders in sequence, and copper deposition is carried out on the pretreated PCB. And after each process is finished, directly disassembling the sub-basket to replace the PCB. The main flow is as follows: the method comprises the steps of sub-basket disassembly, upper plate disassembly, fluffing, double water washing, glue removal, recovery water washing, pre-neutralization, high-level water washing, neutralization, double water washing, oil removal, hot water washing, double water washing, microetching, double water washing, presoaking, double activation, double water washing, acceleration, double water washing, copper precipitation, double water washing, sub-basket disassembly and lower plate disassembly. Wherein the temperature in the prepreg operation is 20℃and the temperature in the activation operation is 30 ℃.
Compared with the prior art, the invention has at least the following advantages:
1. according to the PCB copper precipitation process, the PCB copper precipitation frame comprising the mother basket and the son basket is adopted, the mother basket is fixedly connected to the copper precipitation wire, the son basket is provided with the suspension piece, the son basket can be hung on the mother basket through the suspension piece, before copper precipitation operation is carried out on the PBC board, the PCB can be firstly put into the son basket, and then the son basket with the PCB is directly hung on the mother basket to carry out copper precipitation operation.
2. In the PCB copper deposition process, when the PCB is replaced, the whole copper deposition frame is not required to be disassembled, and only the sub-basket is required to be disassembled for upper and lower plates, so that the weight of an operator for disassembling the copper deposition frame is reduced, and compared with the process for disassembling the whole copper deposition frame, the time can be effectively saved, and the production efficiency of the PCB is improved. In addition, when carrying out the PCB and changing, can dismantle the change with PCB and sub basket together, can effectively prevent the problem that the PCB was rubbed when changing.
3. In the PCB copper deposition process, the PCBs are respectively arranged in the sub-baskets, and then the sub-baskets with the PCBs are hung on the parent basket for copper deposition operation, so that the PCB is prevented from being too concentrated in the copper deposition process, the liquid medicine can flow in the PCB more smoothly, and the copper deposition effect is improved.
The foregoing examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (10)

1. The PCB copper deposition frame is characterized by comprising a mother basket and a child basket, wherein the mother basket comprises a first support, a base, a second support and a fixing rod, the first support is connected with the base, the second support is connected with one end, far away from the first support, of the base, and the fixing rod is respectively connected with the first support and the second support; the sub-basket comprises a basket body and a hanging piece, the hanging piece is connected to one side of the basket body and is used for being detachably connected with the fixing rod, the basket body is provided with a positioning groove, and the positioning groove is used for placing the PCB; the sub-basket further comprises a wavy fixed plate, the wavy fixed plate is fixedly connected with the basket body, and the width of the concave part of the wavy fixed plate is consistent with the thickness of the PCB; the female basket further comprises a first serrated fixed plate and a second serrated fixed plate, the first serrated fixed plate is fixedly connected to the first bracket, the second serrated fixed plate is fixedly connected to the second bracket, and the widths of serrated protruding portions on the first serrated fixed plate and the second serrated fixed plate are consistent with the width of a concave portion on the wavy fixed plate; the hanging piece comprises a fixing plate and an arc-shaped supporting plate, the fixing plate is connected with the basket body, one end of the arc-shaped supporting plate is connected with the fixing plate, the arc-shaped supporting plate and the fixing plate form a containing area and an opening area, the opening area is communicated with the containing area, the width of the opening area is larger than that of the containing area, the width of the containing area is larger than that of the position where the opening area is communicated with the containing area, and the fixing rod is connected in the containing area; the basket body comprises a fixed basket body, a movable basket body and a positioning rod, wherein the fixed basket body and the movable basket body are respectively arranged at two ends of the positioning rod, the fixed basket body is fixedly connected with one end of the positioning rod, and the movable basket body is movably connected with the other end of the positioning rod; the locating rod and the movable basket body are of square structures, and the movable basket body is sleeved on the locating rod.
2. The PCB copper sink frame of claim 1, wherein the sub-basket further comprises a handle ring connected to the basket body.
3. The PCB copper sink of claim 1, wherein the width of the basket opening is greater than the width of the bottom of the basket.
4. A copper deposition process for a PCB, wherein the copper deposition operation is performed on the PCB using the copper deposition frame for a PCB according to any one of claims 1 to 3, the copper deposition process for a PCB comprising the steps of:
placing the PCB in the sub-basket;
fixing the parent basket on a copper sinking wire;
hanging the sub-basket with the PCB into the main basket;
performing pretreatment operation on the PCB to obtain a pretreated PCB;
carrying out copper deposition operation on the pretreated PCB to obtain a copper deposition PCB;
and detaching the sub-basket from the main basket, and replacing the copper-deposited PCB in the sub-basket.
5. The PCB copper deposition process according to claim 4, further comprising the steps of, after the step of placing the PCB in the sub-basket and before the step of fixing the parent basket on the copper deposition line:
and performing a flushing operation on the PCB.
6. The PCB copper deposition process according to claim 4, further comprising the steps of, after the step of placing the PCB in the sub-basket and before the step of fixing the parent basket on the copper deposition line:
and carrying out oil removal operation on the PCB.
7. The copper deposition process of claim 4, wherein the preprocessing operation specifically comprises the steps of:
performing microetching operation on the PCB to obtain a microetching PCB;
carrying out acid washing operation on the microetching PCB to obtain an acid washing PCB;
performing presoaking operation on the acid-washed PCB to obtain a presoaked PCB;
performing an activating operation on the pre-impregnated PCB to obtain an activated PCB;
performing acceleration operation on the activated PCB to obtain an acceleration PCB;
and performing water washing operation on the accelerated PCB to obtain the PCB to be copper deposited.
8. The copper deposition process of claim 7, wherein the temperature in the pre-dipping operation is 15 ℃ to 25 ℃.
9. The copper deposition process of claim 7, wherein the temperature in the activation operation is 25 ℃ to 35 ℃.
10. The PCB copper deposition process according to claim 7, wherein the activation operation includes a first activation operation and a second activation operation, and an activation intensity in the first activation operation is greater than an activation intensity in the second activation operation.
CN202110650085.8A 2021-06-10 2021-06-10 PCB copper deposition process and copper deposition frame thereof Active CN113416948B (en)

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Publication number Priority date Publication date Assignee Title
CN202131387U (en) * 2011-01-27 2012-02-01 中山市宝悦嘉电子有限公司 Special frame for copper deposition on PCB (printed circuit board) copper deposition production line
CN203201012U (en) * 2013-04-03 2013-09-18 马鞍山十七冶工程科技有限责任公司 Embedded wallboard with waved end faces
CN203238342U (en) * 2013-04-28 2013-10-16 胜宏科技（惠州）股份有限公司 Circuit board sedimented copper son basket hook
CN204529979U (en) * 2014-12-25 2015-08-05 惠州市星之光科技有限公司 A kind of pcb board sinks copper flashboard rack
CN105908246A (en) * 2016-06-24 2016-08-31 深圳市博敏电子有限公司 Electroplating copper plating system of high-aspect-ratio printed wiring board and copper plating method
CN205529115U (en) * 2016-05-06 2016-08-31 鹤山市中富兴业电路有限公司 Heavy copper basket
CN209584369U (en) * 2018-12-24 2019-11-05 广东科翔电子科技股份有限公司 A kind of heavy copper frame of high slab angle-inserting type

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202131387U (en) * 2011-01-27 2012-02-01 中山市宝悦嘉电子有限公司 Special frame for copper deposition on PCB (printed circuit board) copper deposition production line
CN203201012U (en) * 2013-04-03 2013-09-18 马鞍山十七冶工程科技有限责任公司 Embedded wallboard with waved end faces
CN203238342U (en) * 2013-04-28 2013-10-16 胜宏科技（惠州）股份有限公司 Circuit board sedimented copper son basket hook
CN204529979U (en) * 2014-12-25 2015-08-05 惠州市星之光科技有限公司 A kind of pcb board sinks copper flashboard rack
CN205529115U (en) * 2016-05-06 2016-08-31 鹤山市中富兴业电路有限公司 Heavy copper basket
CN105908246A (en) * 2016-06-24 2016-08-31 深圳市博敏电子有限公司 Electroplating copper plating system of high-aspect-ratio printed wiring board and copper plating method
CN209584369U (en) * 2018-12-24 2019-11-05 广东科翔电子科技股份有限公司 A kind of heavy copper frame of high slab angle-inserting type

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