CN114364165B - Electroplating processing method for high-thickness-diameter ratio through hole of circuit board - Google Patents
Electroplating processing method for high-thickness-diameter ratio through hole of circuit board Download PDFInfo
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- CN114364165B CN114364165B CN202111555411.3A CN202111555411A CN114364165B CN 114364165 B CN114364165 B CN 114364165B CN 202111555411 A CN202111555411 A CN 202111555411A CN 114364165 B CN114364165 B CN 114364165B
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- circuit board
- cylinder body
- liquid medicine
- thickness
- oil cylinder
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- 238000009713 electroplating Methods 0.000 title claims abstract description 22
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- 239000003814 drug Substances 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 238000007747 plating Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 238000005406 washing Methods 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- 238000012545 processing Methods 0.000 claims abstract description 3
- 238000005238 degreasing Methods 0.000 claims description 7
- 238000005554 pickling Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 230000002411 adverse Effects 0.000 abstract description 2
- 238000012986 modification Methods 0.000 abstract description 2
- 230000004048 modification Effects 0.000 abstract description 2
- 239000004519 grease Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000002791 soaking Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000005237 degreasing agent Methods 0.000 description 2
- 239000013527 degreasing agent Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a circuit board high-thickness-diameter ratio through hole electroplating processing method, which comprises an oil cylinder body, wherein liquid medicine is contained in the oil cylinder body, and the liquid medicine contains an oil removing agent with the concentration of 3%, and the processing process comprises the following steps: s1: before copper plating of the circuit board, oil treatment is carried out on the circuit board, and the circuit board is put into an oil cylinder body for containing liquid medicine; s2: after the oil removal treatment is completed, the circuit board is taken out for double water washing, and the residual liquid medicine on the surface of the circuit board is removed; s3: and (2) microetching the circuit board after the operation in the step (S2), and after microetching is finished, performing double-water washing again to remove the residual liquid medicine on the surface of the circuit board. In the use process, the oil removal time is prolonged without changing the electroplating Cheng Xutiao, the method is simple and convenient to operate, the cost is low, the quality of the product is not adversely affected, and the problem that the copper-free hole is caused by high-thickness-ratio resistance plating can be solved without any modification to electroplating equipment.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) processing, in particular to a method for electroplating a through hole with a high thickness-to-diameter ratio of a circuit board.
Background
Along with the rapid development of electronic and communication products, the design of the circuit board also develops towards the high-level and high-density direction, and the characteristics of large thickness-diameter ratio of high-level multiple holes and the like appear in the aspect of high level, and the circuit board is classified according to the number of circuit layers: the method is divided into a single panel, a double panel and a multi-layer board. Common multi-layer boards are typically 4-layer boards or 6-layer boards, and complex multi-layer boards can reach tens of layers.
For the PCB with high thickness-to-diameter ratio, residues such as grease, dirt and the like in holes are difficult to clean in the conventional time of pattern plating after the dry film development of the PCB with high thickness-to-diameter ratio, the problem of plating resistance easily occurs, batch holes are free of copper abnormality in the alkaline etching of copper and tin cannot be plated, the pattern plating equipment pauses to lengthen the degreasing time, the residues such as grease, dirt and the like in holes can be cleaned, the plating resistance risk is reduced, and the plating multilayer copper and the plate surface whitening abnormality can be caused due to the delay of plate copper plating of the whole production line.
Therefore, to solve such problems, we propose a method for electroplating a high aspect ratio through hole of a circuit board.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a circuit board high-thickness-diameter-ratio through hole electroplating processing method.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the electroplating processing method of the high-thickness-diameter ratio through hole of the circuit board comprises an oil cylinder body, wherein liquid medicine is contained in the oil cylinder body, and the liquid medicine contains an oil removing agent with the concentration of 3 percent, and comprises the following steps of:
s1: before copper plating of the circuit board, firstly, degreasing the circuit board, and putting the circuit board into an oil cylinder body for containing liquid medicine;
s2: after the oil removal treatment is completed, the circuit board is taken out for double water washing, and the residual liquid medicine on the surface of the circuit board is removed;
s3: then microetching the circuit board after the S2 step operation, and after microetching is finished, performing double-water washing again to remove the residual liquid medicine on the surface of the circuit board;
s4: carrying out pickling treatment and copper plating treatment on the circuit board after the S3 step operation;
s5: double-washing the circuit board after the S4 step operation to remove the residual liquid medicine on the surface of the circuit board;
s6: and (5) carrying out pickling treatment on the circuit board after the operation in the step (S5), and then carrying out tinning treatment:
s7: and (3) after the steps S1-S6 are completed, the circuit board after the operation is completed is taken out.
Preferably, the dimensions of the cylinder body of the oil cylinder are respectively as follows: a length of 700mm; a width of 625mm; the height is 750mm; the thickness is 10mm, and the material of hydro-cylinder body is PP.
Preferably, in the process of removing oil on the graphic electroplating plate, the circuit board immersed in the cylinder body of the oil cylinder is ensured to be in a flat state, and is immersed for 3 times in a straight up-down mode.
Preferably, the oil removal time of the circuit board with the normal thickness ratio is 3-5min, and the thickness ratio of the circuit board is more than 10:1, prolonging the soaking time for 3min, wherein the thickness ratio is larger than 10:1 is 6-8min.
Preferably, in the oil removal operation, the graphic circuit board is placed in the cylinder body of the oil cylinder before being put on the board, soaked for a certain time and then put on the board.
The electroplating processing method for the high-thickness-diameter ratio through hole of the circuit board has the beneficial effects that: according to the method, an oil cylinder body is designed before the pattern plating plate is arranged on the plate, the pattern plating plate is arranged in the oil cylinder body before the plate is arranged on the plate, the plate is arranged after being soaked in the oil cylinder body for 3min, the oil removing time is prolonged under the condition that electroplating Cheng Xutiao is not changed, the hydrophilic oil removing agent can effectively remove residual grease, stains, oxides and dry film residues in the plate, the surface of copper is activated and clean, the surface tension is reduced to achieve a hole wetting effect so as to provide the optimal electroplating effect, the oil removing time of a common plate is 3-5min, the grease and the stains to be remained in the plate can be effectively removed, and the thickness-to-diameter ratio is more than 10: the plate 1 can be effectively removed after the cleaning time is prolonged by about 3 minutes due to the fact that the aspect ratio is large and the hole filling capability is poor, the method is simple and convenient to operate, low in cost, free of adverse effects on the quality of products, and free of copper abnormality in holes caused by high-thickness-diameter-ratio resistance plating without any transformation on electroplating equipment.
Drawings
FIG. 1 is a process flow diagram of a method for electroplating a through hole with a high thickness-to-diameter ratio of a circuit board;
fig. 2 is a schematic structural diagram of an oil cylinder body component of the electroplating processing method for the through hole with high thickness-diameter ratio of the circuit board.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Referring to fig. 1-2, a method for electroplating a through hole with a high thickness-diameter ratio of a circuit board comprises an oil cylinder body, wherein liquid medicine is contained in the oil cylinder body, and the liquid medicine contains an oil removing agent with the concentration of 3%, and the method comprises the following steps of:
s1: before copper plating of the circuit board, firstly, degreasing the circuit board, and putting the circuit board into an oil cylinder body for containing liquid medicine;
s2: after the oil removal treatment is completed, the circuit board is taken out for double water washing, and the residual liquid medicine on the surface of the circuit board is removed;
s3: then microetching the circuit board after the S2 step operation, and after microetching is finished, performing double-water washing again to remove the residual liquid medicine on the surface of the circuit board;
s4: carrying out pickling treatment and copper plating treatment on the circuit board after the S3 step operation;
s5: double-washing the circuit board after the S4 step operation to remove the residual liquid medicine on the surface of the circuit board;
s6: and (5) carrying out pickling treatment on the circuit board after the operation in the step (S5), and then carrying out tinning treatment:
s7: and (3) after the steps S1-S6 are completed, the circuit board after the operation is completed is taken out.
The sizes of the cylinder bodies of the oil cylinders are respectively as follows: a length of 700mm; a width of 625mm; the height is 750mm; the thickness is 10mm, and the material of hydro-cylinder body is PP.
In the process of removing oil on the pattern electroplating plate, the circuit board immersed in the cylinder body of the oil cylinder is ensured to be in a flat state, and is immersed for 3 times in a straight up and down mode.
The oil removal time of the circuit board with the normal thickness ratio is 3-5min, and the thickness ratio of the circuit board is more than 10:1, prolonging the soaking time for 3min, wherein the thickness ratio is larger than 10:1 is 6-8min.
In the oil removing operation process, the graphic circuit board is placed in the cylinder body of the oil cylinder before being put on the board, soaked for a certain time and then put on the board.
In the using process, the thickness-diameter ratio of the normal circuit board is more than 10:1, the oil removal time of a normal board is 3-5 minutes, grease and dirt in the board can be effectively removed, and the thickness-diameter ratio is more than 10: the cleaning time of the circuit board with the large aspect ratio and poor hole filling capability is prolonged by about 3 minutes to be effectively removed, so that the oil removing time of the circuit board with the thickness ratio of more than 10:1 is 6-8 minutes;
in the specific operation process, the degreasing liquid medicine is proportioned according to the volume of the cylinder body of the oil cylinder, 3% of hydrophilic degreasing agent is guaranteed to be contained in the degreasing liquid medicine, the plating copper front plate is soaked in a straight up and down mode for 3 times in a reciprocating mode, each soaking mode is soaked for 3-5 minutes or 6-8 minutes, hole copper is soaked in the degreasing liquid medicine while bubbles in holes are removed, the hydrophilic degreasing agent can effectively remove grease, stains, oxides and dry film residues remained in the plate, the surface of the copper is enabled to be activated and clean, and the surface tension is reduced to achieve a hole wetting effect so as to provide the optimal electroplating effect;
after the oil removal operation is finished, firstly removing the residual liquid medicine on the pattern plating plate in a double-water washing mode, respectively carrying out microetching to remove the oxide film on the surface, and removing the residual liquid medicine on the pattern plating plate in a double-water washing mode;
and finally, carrying out copper plating and tin plating treatment on the image plating plate through acid-soaking copper plating and acid-soaking tin plating respectively, so as to finish the electroplating work of the circuit board.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (2)
1. The electroplating processing method of the high-thickness-diameter ratio through hole of the circuit board is characterized by comprising an oil cylinder body, wherein liquid medicine is contained in the oil cylinder body, and the liquid medicine contains an oil removing agent with the concentration of 3 percent, and comprises the following steps of:
s1: before copper plating of the circuit board, firstly, degreasing the circuit board, and putting the circuit board into an oil cylinder body for containing liquid medicine;
s2: after the oil removal treatment is completed, the circuit board is taken out for double water washing, and the residual liquid medicine on the surface of the circuit board is removed;
s3: then microetching the circuit board after the S2 step operation, and after microetching is finished, performing double-water washing again to remove the residual liquid medicine on the surface of the circuit board;
s4: carrying out pickling treatment and copper plating treatment on the circuit board after the S3 step operation;
s5: double-washing the circuit board after the S4 step operation to remove the residual liquid medicine on the surface of the circuit board;
s6: and (5) carrying out pickling treatment on the circuit board after the operation in the step (S5), and then carrying out tinning treatment:
s7: after the steps S1-S6 are completed, the circuit board after the operation is completed is taken out;
in the process of removing oil on the graphic circuit board in the step S1, ensuring that the circuit board immersed in the cylinder body of the oil cylinder is in a flat state, and immersing for 3 times in a straight up-down mode in a reciprocating manner;
an oil cylinder body is designed in front of an upper plate of the graphic circuit board, the graphic circuit board is placed in the oil cylinder body before the upper plate and soaked for 3 minutes, and then the upper plate is arranged, and the high thickness-to-diameter ratio is that the thickness-to-diameter ratio is more than 10:1.
2. the method for electroplating processing the through hole with the high thickness-to-diameter ratio of the circuit board according to claim 1, wherein the dimensions of the cylinder body of the oil cylinder are respectively as follows: a length of 700mm; a width of 625mm; the height is 750mm; the thickness is 10mm, and the material of hydro-cylinder body is PP.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111555411.3A CN114364165B (en) | 2021-12-17 | 2021-12-17 | Electroplating processing method for high-thickness-diameter ratio through hole of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111555411.3A CN114364165B (en) | 2021-12-17 | 2021-12-17 | Electroplating processing method for high-thickness-diameter ratio through hole of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114364165A CN114364165A (en) | 2022-04-15 |
| CN114364165B true CN114364165B (en) | 2024-01-23 |
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| CN202111555411.3A Active CN114364165B (en) | 2021-12-17 | 2021-12-17 | Electroplating processing method for high-thickness-diameter ratio through hole of circuit board |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105357873A (en) * | 2015-10-23 | 2016-02-24 | 深圳市仁创艺电子有限公司 | Packed and plated HDI plate with high aspect ratio and fabrication method of packed and plated HDI plate |
| CN105813394A (en) * | 2016-03-28 | 2016-07-27 | 东莞美维电路有限公司 | Pattern electroplating production method for printed circuit board needed to be nickel-gold plated on whole board |
| CN106572602A (en) * | 2016-10-27 | 2017-04-19 | 江门崇达电路技术有限公司 | Method of removing solder resist layer of PCB (printed circuit board) |
| CN108377616A (en) * | 2018-03-09 | 2018-08-07 | 江门崇达电路技术有限公司 | A kind of graphic plating method of water-saving and environmental protection |
| CN111519218A (en) * | 2020-06-09 | 2020-08-11 | 麦德美科技（苏州）有限公司 | Electroplating process for through hole of printed circuit board |
-
2021
- 2021-12-17 CN CN202111555411.3A patent/CN114364165B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105357873A (en) * | 2015-10-23 | 2016-02-24 | 深圳市仁创艺电子有限公司 | Packed and plated HDI plate with high aspect ratio and fabrication method of packed and plated HDI plate |
| CN105813394A (en) * | 2016-03-28 | 2016-07-27 | 东莞美维电路有限公司 | Pattern electroplating production method for printed circuit board needed to be nickel-gold plated on whole board |
| CN106572602A (en) * | 2016-10-27 | 2017-04-19 | 江门崇达电路技术有限公司 | Method of removing solder resist layer of PCB (printed circuit board) |
| CN108377616A (en) * | 2018-03-09 | 2018-08-07 | 江门崇达电路技术有限公司 | A kind of graphic plating method of water-saving and environmental protection |
| CN111519218A (en) * | 2020-06-09 | 2020-08-11 | 麦德美科技（苏州）有限公司 | Electroplating process for through hole of printed circuit board |
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| Publication number | Publication date |
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| CN114364165A (en) | 2022-04-15 |
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