CN214206011U

CN214206011U - Flexible line VCP black hole and copper facing integral type production facility

Info

Publication number: CN214206011U
Application number: CN202023334774.8U
Authority: CN
Inventors: 林玉陕; 黄健; 桂爱军
Original assignee: Xinyu Mulinsen Circuit Board Co ltd
Current assignee: Xinyu Mulinsen Circuit Board Co ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-09-14
Anticipated expiration: 2030-12-31

Abstract

The utility model relates to a circuit board manufacturing technology field, concretely relates to flexible line VCP black hole and copper facing integral type production facility. The production equipment comprises a cutting device, a drilling device, an electroplating device, a circuit manufacturing device, an etching device and a subsequent processing device; the cutting device is used for primarily cutting the base material to obtain a substrate; the drilling device is used for drilling holes to obtain through holes communicating the front surface and the back surface of the substrate; the electroplating device comprises a black hole device and a VCP copper plating device, wherein the black hole device is used for forming a conductive layer on the hole wall of the through hole, and the VCP copper plating device is used for carrying out copper electroplating treatment on the substrate through a VCP copper plating technology. The utility model discloses a production facility increases black hole liquid medicine groove at VCP coppering device's front end, forms a black hole copper facing VCP production line, has reduced place and equipment input cost, the utility model discloses a production technology, in integrating VCP copper facing technology with black hole processing technology, reduced the process step, shortened the preparation time.

Description

Flexible line VCP black hole and copper facing integral type production facility

Technical Field

The utility model relates to a circuit board manufacturing technology field, concretely relates to flexible line VCP black hole and copper facing integral type production facility.

Background

In the double-sided flexible circuit electroplating manufacturing production equipment, the production equipment of the conducting hole is subjected to black hole treatment in the current industry after drilling, then the flexible plate material is placed into a VCP (vertical coaxial cable plating) plating line for copper plating, the black hole treatment is to uniformly disperse fine graphite and carbon black powder in a medium, namely deionized water, and graphite and carbon black particles uniformly distributed in a solution are kept stable by utilizing a surfactant in the solution, so that the graphite and the carbon black can be fully adsorbed on the surface of the hole wall of a non-conductor to form a uniform, fine and firmly-combined conducting layer.

The existing production equipment is generally two production lines of horizontal black hole production equipment and VCP electroplating equipment which operate independently, the two independent production lines are adopted, a large number of fields and equipment investment cost are occupied, a product transferring process is increased, the process is long, the labor cost and the quality risk are increased, the two independent production lines need to be operated and controlled independently, the water and electricity energy consumption is high, the use cost is high, and unnecessary working strength is increased due to multiple overlapping process manufacturing.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to solve one of the technical problem that exists among the prior art at least, provide a flexible circuit VCP black hole and copper facing integral type production facility.

In order to achieve the above object, the utility model adopts the following technical scheme: a flexible circuit VCP black hole and copper plating integrated production facility comprises a cutting device, a drilling device, an electroplating device, a circuit manufacturing device, an etching device and a subsequent processing device;

the cutting device is used for primarily cutting the base material to obtain a substrate;

the drilling device is used for drilling holes to obtain through holes communicating the front surface and the back surface of the substrate;

the electroplating device comprises a black hole device and a VCP copper plating device, wherein the black hole device is used for forming a conductive layer on the hole wall of the through hole, and the VCP copper plating device is used for carrying out copper electroplating treatment on the substrate through a VCP copper plating technology; wherein VCP represents vertical continuous plating;

the circuit manufacturing device is used for manufacturing a designed circuit on the substrate;

the etching device is used for etching the substrate;

the subsequent processing device is used for performing subsequent processing treatment on the substrate.

Furthermore, the black hole device comprises a black hole liquid medicine tank which is arranged at the front end of the VCP copper plating device.

The utility model also provides a flexible line way board VCP black hole and copper facing integral type production technology, including following step:

step 1, primarily cutting a base material through a cutting device to obtain a substrate;

step 2, drilling holes through a drilling device to obtain through holes communicating the front surface and the back surface of the substrate;

step 3, carrying out black hole treatment on the through hole by using an electroplating device to form a conductive layer on the hole wall of the through hole, and then carrying out electro-coppering treatment on the substrate by adopting a VCP (vertical copper plating) technology;

step 4, etching the substrate by an etching device;

and 5, carrying out subsequent processing on the substrate.

Further, the subsequent processing comprises testing, mounting, pressing, solder resist making, character printing, surface processing, appearance processing, quality inspection processing and packaging processing of the substrate.

Further, the step 3 specifically includes:

step 3.1, placing the substrate into an electroplating device;

step 3.2, carrying out primary acid washing on the substrate;

step 3.3, carrying out primary water washing on the substrate;

step 3.4, soaking the substrate by using pure water mixed with the whole pore liquid;

step 3.5, soaking the substrate by using black hole liquid;

step 3.6, carrying out secondary acid washing on the substrate;

step 3.7, carrying out secondary water washing on the substrate;

step 3.8, carrying out electro-coppering treatment on the substrate;

step 3.9, washing the substrate for three times;

3.10, carrying out acid washing on the substrate for three times;

step 3.11, washing the substrate for four times;

and 3.12, blowing hot air to the substrate for drying treatment.

Further, the substrate is soaked in pure water mixed with cleaning liquid in the primary water washing.

Further, the substrate is sprayed with pure water mixed with sulfuric acid by the primary acid washing, the secondary acid washing and the tertiary acid washing.

Further, the substrate is sprayed with pure water in the secondary washing, the third washing and the fourth washing.

Further, the electrolytic copper plating treatment employs pure water mixed with sulfuric acid, copper sulfate, hydrochloric acid, and a copper polish to soak and jet the substrate.

The utility model has the advantages that: it is right by the aforesaid the utility model discloses a description can know, compares with prior art, the utility model discloses a flexible line VCP black hole and copper-plating integral type production facility increases black hole liquid medicine groove at VCP copper plating equipment's front end, and this increase section is the VCP mode, has replaced independent water flat line black hole production line and VCP copper-plating production line, forms a black hole copper-plating VCP production line, has reduced place and equipment input cost, has practiced thrift the running cost, the utility model provides a flexible line board VCP black hole and copper-plating integral type production technology, in integrating the VCP copper-plating technology with black hole processing technology, reduced the process step, shortened the preparation time, saved the water and electricity, reduced the cost of labor, avoided changeing material in-process quality risks such as the crease of polishing, remain the pickling and the washing function that original water flat line possessed.

Drawings

Fig. 1 is a block diagram of a flexible circuit VCP black hole and copper plating integrated production apparatus according to a preferred embodiment of the present invention;

FIG. 2 is a flow chart showing the steps of an integrated VCP black hole and copper plating process for manufacturing a flexible circuit according to a preferred embodiment of the present invention;

reference numerals: 1. a cutting device; 2. a drilling device; 3. an electroplating device; 4. a circuit manufacturing device; 5. an etching device; 6. a post-processing device; 31. a black hole device; 32. VCP copper plating equipment.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1, a preferred embodiment of the present invention is a VCP black hole and copper plating integrated production equipment for flexible circuits, which includes a cutting device 1, a drilling device 2, an electroplating device 3, a circuit manufacturing device 4, an etching device 5 and a subsequent processing device 6;

the cutting device 1 is used for primarily cutting the base material to obtain a substrate;

the drilling device 2 is used for drilling holes to obtain through holes communicating the front surface and the back surface of the substrate;

the electroplating device 3 comprises a black hole device 31 and a VCP copper plating device 32, wherein the black hole device 31 is used for forming a conductive layer on the hole wall of the through hole, and the VCP copper plating device 32 is used for carrying out copper electroplating treatment on the substrate by VCP copper plating technology; wherein VCP represents vertical continuous plating;

the circuit manufacturing device 4 is used for manufacturing a designed circuit on the substrate;

the etching device 5 is used for etching the substrate;

the post-processing device 6 is used for performing post-processing on the substrate.

In this embodiment, the black hole forming device 31 includes a black hole tank disposed at the front end of the VCP copper plating device 32.

The utility model discloses a black hole of flexible line VCP and copper-plating integral type production facility increases black hole liquid medicine groove at the front end of VCP coppering device 32, and this increase section is the VCP mode, has replaced independent water flat line black hole production line and VCP coppering production line, forms a black hole copper-plating VCP production line, has reduced place and equipment input cost, has practiced thrift the running cost.

Referring to fig. 2, the utility model also provides a flexible line way board VCP black hole and copper facing integral type production technology, including following step:

step 1, performing primary cutting on a base material through a cutting device 1 to obtain a substrate;

step 2, drilling holes through the drilling device 2 to obtain through holes communicating the front surface and the back surface of the substrate;

step 3, carrying out black hole treatment on the through hole by using the electroplating device 3 to form a conductive layer on the hole wall of the through hole, and then carrying out electro-coppering treatment on the substrate by adopting a VCP (vertical copper plating) technology;

step 4, etching the substrate by an etching device 5;

and 5, carrying out subsequent processing on the substrate.

In this embodiment, the subsequent processing includes testing, mounting, pressing, solder mask making, printing, surface processing, shape processing, quality inspection, and packaging of the substrate.

In this embodiment, the step 3 specifically includes:

step 3.1, placing the substrate into an electroplating device 3;

step 3.2, carrying out primary acid washing on the substrate;

step 3.3, carrying out primary water washing on the substrate;

step 3.5, soaking the substrate by using black hole liquid;

step 3.6, carrying out secondary acid washing on the substrate;

step 3.7, carrying out secondary water washing on the substrate;

step 3.8, carrying out electro-coppering treatment on the substrate;

step 3.9, washing the substrate for three times;

3.10, carrying out acid washing on the substrate for three times;

step 3.11, washing the substrate for four times;

and 3.12, blowing hot air to the substrate for drying treatment.

In the present embodiment, the one-time water washing soaks the substrate with pure water mixed with the cleaning liquid. Specifically, the cleaning solution adopts an acidic degreasing agent, and the content is 5-20%.

In this example, the primary acid cleaning, the secondary acid cleaning, and the tertiary acid cleaning each sprayed the substrate with pure water mixed with sulfuric acid. Specifically, the sulfuric acid is concentrated sulfuric acid with the purity of 98%, and the content is 3-15%.

In this embodiment, the second water washing, the third water washing, and the fourth water washing all use pure water to spray the substrate.

In this embodiment, the electrolytic copper plating treatment employs pure water mixed with sulfuric acid, copper sulfate, hydrochloric acid, and a copper brightener to soak and jet the substrate. Specifically, pure water mixed with 98% purity AR-grade sulfuric acid (content 150-.

The utility model provides a black hole of flexible line way board VCP and copper-plating integral type production technology, in will blacking the hole processing technology and integrating VCP copper-plating technology, the process step has been reduced, the preparation time has been shortened, the manufacturing time of every batch of flexible line way board can reduce about 1 hour, very big improvement production efficiency, water and electricity have been saved, the cost of labor has been reduced, quality risks such as the crease is wiped to the material transfer in-process have been avoidd, the pretreatment pickling and the washing function that remain original water flat line possesses.

The above additional technical features can be freely combined and used in superposition by those skilled in the art without conflict.

It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes or equivalents may be substituted for elements thereof by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are intended to be covered by the present invention.

Claims

1. The utility model provides a black hole of flexible line VCP and copper facing integral type production facility which characterized in that: comprises a cutting device (1), a drilling device (2), an electroplating device (3), a circuit manufacturing device (4), an etching device (5) and a subsequent processing device (6);

the cutting device (1) is used for primarily cutting the base material to obtain a substrate;

the drilling device (2) is used for drilling holes to obtain through holes communicating the front surface and the back surface of the substrate;

the electroplating device (3) comprises a black hole device (31) and a VCP copper plating device (32), wherein the black hole device (31) is used for forming a conductive layer on the hole wall of the through hole, and the VCP copper plating device (32) is used for carrying out copper electroplating treatment on the substrate by VCP copper plating technology; wherein VCP represents vertical continuous plating;

the circuit manufacturing device (4) is used for manufacturing a designed circuit on the substrate;

the etching device (5) is used for etching the substrate;

the subsequent processing device (6) is used for performing subsequent processing treatment on the substrate.

2. The flexible circuit VCP black hole and copper plating integrated production equipment as claimed in claim 1, wherein: the black hole device (31) comprises a black hole liquid medicine tank, and the black hole liquid medicine tank is arranged at the front end of the VCP copper plating device (32).