CN108124383A - The production method of printed circuit board - Google Patents
The production method of printed circuit board Download PDFInfo
- Publication number
- CN108124383A CN108124383A CN201611080778.3A CN201611080778A CN108124383A CN 108124383 A CN108124383 A CN 108124383A CN 201611080778 A CN201611080778 A CN 201611080778A CN 108124383 A CN108124383 A CN 108124383A
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- Prior art keywords
- circuit board
- printed circuit
- screen
- printing
- spray
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The present invention relates to a kind of production methods of printed circuit board, which is characterized in that comprises the following steps：Nog plate, circuit silk-screen, etching, anti-welding preceding nog plate, solder mask screen printing, character silk-screen, CCD drillings, stamping, electrical measurement, OSP and product inspection.The production method manufacturing procedure design of printed circuit board of the present invention is reasonable, and with short production cycle, production cost is low, high yield rate, product quality is stable, consistent, and circuit reliability is high, and the automation for the integrated of electronic equipment, micromation, production provides good development space.
Description
Technical field
The present invention relates to PCB product manufacture technology fields, and in particular to a kind of production method of printed circuit board.
Background technology
Printed circuit board (PCB circuit board), also known as printed circuit board (PCB) are the suppliers of electronic component electrical connection.It
Development have the history of more than 100 years.Its design is mainly layout design, and the major advantage using circuit board is to subtract significantly
Few mistake connected up and assemble, improves the gentle productive labor rate of Automated water.Printed circuit board from individual layer develop to dual platen,
Multi-layer board and flex plate, and constantly develop to high-precision, high density and high reliability direction.Constantly reduce volume, reduce into
Originally performance, is improved so that printed circuit board still maintains powerful vitality in the evolution of future electronic product.Not
Come printed circuit board manufacturing technology development trend be in performance to high density, high-precision, fine pore, thin wire, small
Away from, highly reliable, multiple stratification, high-speed transfer, light weight, slim direction develop.
Growing with hyundai electronics, design difficulty and manufacture craft requirement to printed circuit board are also increasingly
It is high.The making stream production cycle of current printed circuit board is long, and complex procedures are of high cost, and complex procedures are easily damaged printing
Circuit board causes high rejection rate in production process, so as to reduce the profit of enterprise.
The content of the invention
The purpose of the present invention is being directed to above-mentioned deficiency, it is reasonable to provide a kind of process step design, with short production cycle, production cost
It is low, the production method of the printed circuit board of high yield rate.
What the present invention was realized in：
A kind of production method of printed circuit board, which is characterized in that comprise the following steps：
S1, nog plate：Brushing is carried out to printed circuit board substrate surface with brush rod；
S2, circuit silk-screen：By circuit silk-screen screen frame on printing machine rack, locking is used after screen frame alignment printed circuit board
Screw fixes screen frame, and the ink for having stirred and having stood uniformly is poured into screen frame and is printed, be completed for printing after, it is necessary to
Light is carried out to printed circuit board substrate to consolidate, using LED lamp tube as light source, UV energy when light is solid>650mj/cm2, light consolidates speed
For 3-5m/min；
S3, etching：Copper foil on the two-sided logicalnot circuit region of printed circuit board substrate is etched away using etching solution；
S4, anti-welding preceding nog plate：With brush rod to carrying out brushing through overetched printed circuit board substrate surface；
S5, solder mask screen printing：The two sides of printed circuit board substrate is printed respectively by solder mask screen printing halftone using ink
Brush, screen frame frame locks screen frame after screen frame alignment printed circuit board substrate on printing machine rack with small cylinder, and ink is uniform
It adds in halftone and solder mask screen printing is carried out to printed circuit board substrate, it is necessary to carry out light to printed circuit board substrate after being completed for printing
Gu using LED lamp tube as light source, UV energy when light is solid>1200mj/cm2, the printed circuit board substrate progress water cooling after light is solid
After air-dry, cooling water temperature be 30-45 DEG C, hot blast temperature be 30-50 DEG C；
S6, character silk-screen：The two sides of printed circuit board substrate is printed respectively by character silk-screen halftone using ink
Brush, character silk-screen screen frame are aligned after printed circuit board with small cylinder locking screen frame on printing machine rack, and by screen frame, will print
Circuit board processed moves into silk-screen table top, and the ink for having stirred and having stood uniformly is poured into screen frame and is printed, after being completed for printing,
It needs to consolidate printed circuit board substrate progress light, light consolidates speed as 4-6m/min, UV energy when light is solid>1000mj/cm2, light is solid
Printed circuit board substrate afterwards air-dries after carrying out water cooling, and cooling water temperature is 30-40 DEG C, and hot blast temperature is 30-50 DEG C；
S7, CCD drill：It is drilled on a printed circuit board according to program prepared in advance using CCD drilling machines；
S8, stamping：First printed circuit board element is faced out, is fitly placed on heating machine baffle, heater sets temperature
It spends for 70-110 DEG C, when 40-80 DEG C of printed circuit plate temperature arrival, punching machine used for printed circuit board with location hole is positioned, is printed
Circuit board copper foil carries out upwardly punching；
S9, electrical measurement：Low pressure detection carries out printed circuit board using on off test machine, enters after detection is qualified and adds a work
Sequence is processed；
S10、OSP：OSP processing is carried out to the printed circuit board of electrical measurement qualification, it is made to be formed in printed circuit board copper-clad surface
One layer of 0.2-0.6um organic protective film makes the purpose that printed circuit board copper surface copper-clad surface is not oxidized, helps weldering and moisture-proof；
S11, product inspection：Carry out product inspection to the printed circuit board by OSP processing, it is qualified after packaging and storage.
Further preferably, spray watering, nog plate are carried out to printed circuit board substrate in the step S1 nog plate process
Hot-air seasoning is carried out after finishing, and hot blast temperature is 35-55 DEG C, until steam is dried completely.
Further preferably, the scraper angle of printing machine is 65-75 °, scraper in the step S2 circuits silk-screen process
Pressure is 0.1-0.2MPa, print speed printing speed 40-80mm/s, time black speed are 30-80mm/s.
Further preferably, the step of being etched in the step S3 is specific as follows：It etches, wash, going ink, pickling and washing；
The etching speed is 15-30HZ, and the temperature of etching solution is 30-50 DEG C, and etching solution proportion is 22-35kg/cm2；
The washing is using spray washing, spray pressure 0.5-0.8MPa；
It is described that black speed is gone to remove ink, NaOH concentration 9-12%, until printed circuit using NaOH solution for 15-30m/min
The removal completely of plate substrate surface ink is clean；
The pickling carries out spray pickling using sulfuric acid solution, and pickle pH is 1-3, pickling time 30-60s, is sprayed
Pressure is 0.1-0.5MPa；
The washing is using spray washing, spray pressure 0.5-0.8MPa.
Further preferably, spray is carried out in the anti-welding preceding nog plate process of the step S4 to printed circuit board substrate to spill
Water, nog plate are dried after finishing, and spray pressure 0.4-0.6MPa, drying temperature is 65-85 DEG C, until printed circuit board base
Plate copper foil surface is bright and clean, non-oxidation, and steam is dried completely.
Further preferably, the scraper angle of printing machine is 65-75 °, scraper in the step S5 solder mask screen printing process
Pressure is 0.1-0.2MPa, print speed printing speed 160-400mm/s, time black speed are 160-450mm/s.
Further preferably, further including will carry out by the printed circuit board of stamping at sets of holes, the cutting of V slots, leveling and cleaning
After reason, electrical measurement process is entered back into.
Further preferably, the scraper angle of printing machine is 60-75 °, scraper in the step S6 characters silk-screen process
Pressure is 0.1-0.2MPa, print speed printing speed 180-400mm/s, time black speed are 450-550mm/s.
Further preferably, it is specific as follows the step of OSP in the step S10：Pickling, microetch, washing, anti-oxidation and baking
It is dry；
The pickling carries out spray acid for printed circuit board is put into descaling bath, using sulfuric acid solution to printed circuit board
Remove oil, sulfuric acid concentration 90-200g/L, pickling time 30-60s, spray pressure 0.5-1.5MPa；
The microetch is that will be put into microetch slot after the washing of the printed circuit board of overpickling to carry out microetch, the temperature of micro-corrosion liquid
For 35-45 DEG C, spray pressure 0.5-3.5MPa；
The printed circuit board spray washing of microetch, spray pressure 0.1-0.15MPa are adopted in the washing for that will pass through；
The oxygen, which turns to the printed circuit board by washing being sent into the stoste slot allocation equipped with preimpregnation stoste, prevents
Oxidation processes, anti-oxidation processing time are 30-90s, and preimpregnation tank liquor pH is 3.0-3.4, absorbance 0.72-1.03, and preimpregnation is former
The temperature of liquid is 30-40 DEG C；
The drying is the drying temperature 70-100 to being dried after completing the printed circuit board washing of anti-oxidation processing
DEG C, drying time 60-150s.
The prominent substantive distinguishing features of the present invention and significant progress are：
The production method manufacturing procedure design of printed circuit board of the present invention is reasonable, and with short production cycle, production cost is low, finished product
Rate is high, and product quality is stable, consistent, and circuit reliability is high, and the automation for the integrated of electronic equipment, micromation, production carries
For good development space.
Specific embodiment
The present invention is made the following instructions with reference to embodiment.
Embodiment 1
A kind of production method of printed circuit board, comprises the following steps：
S1, nog plate：Brushing is carried out to printed circuit board substrate surface with brush rod, to printed circuit board in nog plate process
Substrate carries out spray watering, and hot-air seasoning is carried out after the completion of nog plate, and hot blast temperature is 35-55 DEG C, is dried completely until steam and is
Only.
S2, circuit silk-screen：By circuit silk-screen screen frame on printing machine rack, locking is used after screen frame alignment printed circuit board
Screw fixes screen frame, and the ink for having stirred and having stood uniformly is poured into screen frame and is printed, be completed for printing after, it is necessary to
Light is carried out to printed circuit board substrate to consolidate, using LED lamp tube as light source, UV energy when light is solid>650mj/cm2, light consolidates speed
For 3-5m/min；The scraper angle of printing machine is 65-75 °, scraper pressure 0.1-0.2MPa, print speed printing speed 40-80mm/s,
It is 30-80mm/s to return black speed.
S3, etching：Copper foil on the two-sided logicalnot circuit region of printed circuit board substrate is etched away using etching solution；
The step of etching, is specific as follows：It etches, wash, going ink, pickling and washing；
Etching speed is 15-30HZ, and the temperature of etching solution is 30-50 DEG C, and etching solution proportion is 22-35kg/cm2；
Washing is using spray washing, spray pressure 0.5-0.8MPa；
Black speed is gone to remove ink, NaOH concentration 9-12%, until printed circuit board base using NaOH solution for 15-30m/min
The removal completely of plate surface ink is clean；
Pickling using sulfuric acid solution carry out spray pickling, pickle pH be 1-3, pickling time 30-60s, spray pressure
For 0.1-0.5MPa；
Washing is using spray washing, spray pressure 0.5-0.8MPa.
S4, anti-welding preceding nog plate：With brush rod to carrying out brushing, anti-welding preceding nog plate through overetched printed circuit board substrate surface
Spray watering is carried out in process to printed circuit board substrate, is dried after the completion of nog plate, spray pressure 0.4-
0.6MPa；Drying temperature is 65-85 DEG C, and until printed circuit board substrate copper foil surface is bright and clean, non-oxidation, steam is dried completely.
S5, solder mask screen printing：The two sides of printed circuit board substrate is printed respectively by solder mask screen printing halftone using ink
Brush, screen frame frame locks screen frame after screen frame alignment printed circuit board substrate on printing machine rack with small cylinder, and ink is uniform
It adds in halftone and solder mask screen printing is carried out to printed circuit board substrate, it is necessary to carry out light to printed circuit board substrate after being completed for printing
Gu using LED lamp tube as light source, UV energy when light is solid>1200mj/cm2, the printed circuit board substrate progress water cooling after light is solid
After air-dry, cooling water temperature be 30-45 DEG C, hot blast temperature be 30-50 DEG C；The scraper angle of printing machine is 65-75 °, scraper pressure
Power is 0.1-0.2MPa, print speed printing speed 160-400mm/s, time black speed are 160-450mm/s.
S6, character silk-screen：The two sides of printed circuit board substrate is printed respectively by character silk-screen halftone using ink
Brush, character silk-screen screen frame are aligned after printed circuit board with small cylinder locking screen frame on printing machine rack, and by screen frame, will print
Circuit board processed moves into silk-screen table top, and the ink for having stirred and having stood uniformly is poured into screen frame and is printed, after being completed for printing,
It needs to consolidate printed circuit board substrate progress light, light consolidates speed as 4-6m/min, UV energy when light is solid>1000mj/cm2, light is solid
Printed circuit board substrate afterwards air-dries after carrying out water cooling, and cooling water temperature is 30-40 DEG C, and hot blast temperature is 30-50 DEG C, printing machine
Scraper angle for 60-75 °, scraper pressure 0.1-0.2MPa, print speed printing speed 180-400mm/s, it is 450- to return black speed
550mm/s。
S7, CCD drill：It is drilled on a printed circuit board according to program prepared in advance using CCD drilling machines；
S8, stamping：First printed circuit board element is faced out, is fitly placed on heating machine baffle, heater sets temperature
It spends for 70-110 DEG C, when 40-80 DEG C of printed circuit plate temperature arrival, punching machine used for printed circuit board with location hole is positioned, is printed
Circuit board copper foil carries out upwardly punching；
It further includes after the printed circuit board of stamping carries out sets of holes, the cutting of V slots, leveling and cleaning treatment, enters back into
Electrical measurement process.
S9, electrical measurement：Low pressure detection carries out printed circuit board using on off test machine, enters after detection is qualified and adds a work
Sequence is processed；
S10、OSP：OSP processing is carried out to the printed circuit board of electrical measurement qualification, it is made to be formed in printed circuit board copper-clad surface
One layer of 0.2-0.6um organic protective film makes the purpose that printed circuit board copper surface copper-clad surface is not oxidized, helps weldering and moisture-proof；
The step of OSP, is specific as follows：Pickling, microetch, washing, anti-oxidation and drying；
The pickling carries out spray acid for printed circuit board is put into descaling bath, using sulfuric acid solution to printed circuit board
Remove oil, sulfuric acid concentration 90-200g/L, pickling time 30-60s, spray pressure 0.5-1.5MPa；
The microetch is that will be put into microetch slot after the washing of the printed circuit board of overpickling to carry out microetch, the temperature of micro-corrosion liquid
For 35-45 DEG C, spray pressure 0.5-3.5MPa；
The printed circuit board spray washing of microetch, spray pressure 0.1-0.15MPa are adopted in the washing for that will pass through；
The oxygen, which turns to the printed circuit board by washing being sent into the stoste slot allocation equipped with preimpregnation stoste, prevents
Oxidation processes, anti-oxidation processing time are 30-90s, and preimpregnation tank liquor pH is 3.0-3.4, absorbance 0.72-1.03, and preimpregnation is former
The temperature of liquid is 30-40 DEG C；
The drying is the drying temperature 70-100 to being dried after completing the printed circuit board washing of anti-oxidation processing
DEG C, drying time 60-150s.
S11, product inspection：Carry out product inspection to the printed circuit board by OSP processing, it is qualified after packaging and storage.
The foregoing description of the disclosed embodiments, only for professional and technical personnel in the field is enable to realize or use this
Invention.A variety of modifications of these embodiments will be apparent for those skilled in the art, institute herein
The General Principle of definition can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore,
The present invention is not intended to be limited to the embodiments shown herein, and is to fit to special with principles disclosed herein and novelty
The consistent most wide scope of point.
Claims (9)
1. a kind of production method of printed circuit board, which is characterized in that comprise the following steps：
S1, nog plate：Brushing is carried out to printed circuit board substrate surface with brush rod；
S2, circuit silk-screen：By circuit silk-screen screen frame on printing machine rack, lock-screw is used after screen frame alignment printed circuit board
Screen frame is fixed, the ink for having stirred and having stood uniformly is poured into screen frame and is printed, after being completed for printing, it is necessary to print
Circuit board substrate processed carries out light and consolidates, using LED lamp tube as light source, UV energy when light is solid>650mj/cm2, it is 3- that light, which consolidates speed,
5m/min；
S3, etching：Copper foil on the two-sided logicalnot circuit region of printed circuit board substrate is etched away using etching solution；
S4, anti-welding preceding nog plate：With brush rod to carrying out brushing through overetched printed circuit board substrate surface；
S5, solder mask screen printing：The two sides of printed circuit board substrate is printed respectively by solder mask screen printing halftone using ink, net
Frame locks screen frame with small cylinder after screen frame alignment printed circuit board substrate, ink is uniformly added on printing machine rack
Solder mask screen printing is carried out to printed circuit board substrate in halftone, consolidates after being completed for printing, it is necessary to carry out light to printed circuit board substrate, adopts
By the use of LED lamp tube as light source, UV energy when light is solid>1200mj/cm2, the printed circuit board substrate after light is solid carries out wind after water cooling
Dry, cooling water temperature is 30-45 DEG C, and hot blast temperature is 30-50 DEG C；
S6, character silk-screen：The two sides of printed circuit board substrate is printed respectively by character silk-screen halftone using ink, word
Silk-screen screen frame is accorded on printing machine rack, and screen frame is aligned after printed circuit board and locks screen frame with small cylinder, will printing it is electric
Road plate moves into silk-screen table top, and the ink for having stirred and having stood uniformly is poured into screen frame and is printed, be completed for printing after, it is necessary to
Light is carried out to printed circuit board substrate to consolidate, light consolidates speed as 4-6m/min, UV energy when light is solid>1000mj/cm2, after light is solid
Printed circuit board substrate air-dries after carrying out water cooling, and cooling water temperature is 30-40 DEG C, and hot blast temperature is 30-50 DEG C；
S7, CCD drill：It is drilled on a printed circuit board according to program prepared in advance using CCD drilling machines；
S8, stamping：First printed circuit board element is faced out, is fitly placed on heating machine baffle, heater set temperature is
70-110 DEG C, when 40-80 DEG C of printed circuit plate temperature arrival, punching machine used for printed circuit board is positioned with location hole, printed circuit
Plate copper foil carries out upwardly punching；
S9, electrical measurement：Low pressure detection carries out printed circuit board using on off test machine, enters after detection is qualified plus a process adds
Work；
S10、OSP：OSP processing is carried out to the printed circuit board of electrical measurement qualification；
S11, product inspection：Carry out product inspection to the printed circuit board by OSP processing, it is qualified after packaging and storage.
2. the production method of printed circuit board according to claim 1, it is characterised in that：The step S1 nog plates are processed
Spray watering is carried out in journey to printed circuit board substrate, hot-air seasoning is carried out after the completion of nog plate, hot blast temperature is 35-55 DEG C, directly
Until steam is dried completely.
3. the production method of printed circuit board according to claim 1, it is characterised in that：The step S2 circuit silk-screens add
The scraper angle of printing machine is 65-75 °, scraper pressure 0.1-0.2MPa, print speed printing speed 40-80mm/s during work, is returned
Black speed is 30-80mm/s.
4. the production method of printed circuit board according to claim 1, it is characterised in that：The step etched in the step S3
It is rapid specific as follows：It etches, wash, going ink, pickling and washing；
The etching speed is 15-30HZ, and the temperature of etching solution is 30-50 DEG C, and etching solution proportion is 22-35kg/cm2；
The washing is using spray washing, spray pressure 0.5-0.8MPa；
It is described that black speed is gone to remove ink, NaOH concentration 9-12%, until printed circuit board base using NaOH solution for 15-30m/min
The removal completely of plate surface ink is clean；
The pickling using sulfuric acid solution carry out spray pickling, pickle pH be 1-3, pickling time 30-60s, spray pressure
For 0.1-0.5MPa；
The washing is using spray washing, spray pressure 0.5-0.8MPa.
5. the production method of printed circuit board according to claim 1, it is characterised in that：The anti-welding preceding nog plates of step S4
Spray watering is carried out in process to printed circuit board substrate, is dried after the completion of nog plate, spray pressure 0.4-
0.6MPa；Drying temperature is 65-85 DEG C, and until printed circuit board substrate copper foil surface is bright and clean, non-oxidation, steam is dried completely.
6. the production method of printed circuit board according to claim 1, it is characterised in that：The step S5 solder mask screen printings add
During work the scraper angle of printing machine be 65-75 °, scraper pressure 0.1-0.2MPa, print speed printing speed 160-400mm/s,
It is 160-450mm/s to return black speed.
7. the production method of printed circuit board according to claim 1, it is characterised in that：Further including will be by the print of stamping
After circuit board processed carries out sets of holes, the cutting of V slots, leveling and cleaning treatment, electrical measurement process is entered back into.
8. the production method of printed circuit board according to claim 1, it is characterised in that：The step S6 character silk-screens add
During work the scraper angle of printing machine be 60-75 °, scraper pressure 0.1-0.2MPa, print speed printing speed 180-400mm/s,
It is 450-550mm/s to return black speed.
9. the production method of printed circuit board according to claim 1, it is characterised in that：The step of OSP in the step S10
It is rapid specific as follows：Pickling, microetch, washing, anti-oxidation and drying；
The pickling carries out spray pickling to printed circuit board for printed circuit board is put into descaling bath, using sulfuric acid solution and removes
Oil, sulfuric acid concentration 90-200g/L, pickling time 30-60s, spray pressure 0.5-1.5MPa；
The microetch is that will be put into microetch slot after the washing of the printed circuit board of overpickling to carry out microetch, and the temperature of micro-corrosion liquid is
35-45 DEG C, spray pressure 0.5-3.5MPa；
The printed circuit board spray washing of microetch, spray pressure 0.1-0.15MPa are adopted in the washing for that will pass through；
The oxygen turns to will be anti-oxidation equipped with being carried out in the stoste slot allocation for presoaking stoste by the printed circuit board feeding washed
Processing, anti-oxidation processing time are 30-90s, and preimpregnation tank liquor pH is 3.0-3.4, and absorbance 0.72-1.03 presoaks stoste
Temperature is 30-40 DEG C；
The drying is to being dried after completing the printed circuit board washing of anti-oxidation processing, and drying temperature is 70-100 DEG C,
Drying time is 60-150s.
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|---|---|---|---|
| CN201611080778.3A CN108124383A (en) | 2016-11-30 | 2016-11-30 | The production method of printed circuit board |
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| CN201611080778.3A CN108124383A (en) | 2016-11-30 | 2016-11-30 | The production method of printed circuit board |
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| CN109518187A (en) * | 2018-11-29 | 2019-03-26 | 惠州市和鑫达电子科技有限公司 | A kind of pcb board surface chemistry pre-treating technology |
| CN110678012A (en) * | 2018-07-03 | 2020-01-10 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB with MIC hole design |
| CN111479401A (en) * | 2020-04-28 | 2020-07-31 | 景德镇市宏亿电子科技有限公司 | Manufacturing method of thick copper printed circuit board |
| WO2020211401A1 (en) * | 2019-04-16 | 2020-10-22 | 珠海中京电子电路有限公司 | Process method for improving color difference of led display screen |
| US10834830B2 (en) | 2019-02-13 | 2020-11-10 | International Business Machines Corporation | Creating in-via routing with a light pipe |
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| CN110678012A (en) * | 2018-07-03 | 2020-01-10 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB with MIC hole design |
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