CN103763865A - Solder resist ink entry hole processing method - Google Patents
Solder resist ink entry hole processing method Download PDFInfo
- Publication number
- CN103763865A CN103763865A CN201410050057.2A CN201410050057A CN103763865A CN 103763865 A CN103763865 A CN 103763865A CN 201410050057 A CN201410050057 A CN 201410050057A CN 103763865 A CN103763865 A CN 103763865A
- Authority
- CN
- China
- Prior art keywords
- washing
- pcb board
- soak
- ink
- minutes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 title abstract description 5
- 238000005406 washing Methods 0.000 claims abstract description 68
- 239000000126 substance Substances 0.000 claims abstract description 33
- 238000004140 cleaning Methods 0.000 claims abstract description 18
- 239000003814 drug Substances 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 238000002791 soaking Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 30
- 238000003466 welding Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 239000008367 deionised water Substances 0.000 claims description 15
- 229910021641 deionized water Inorganic materials 0.000 claims description 15
- 229940079593 drug Drugs 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 239000004604 Blowing Agent Substances 0.000 claims description 5
- 238000007654 immersion Methods 0.000 claims description 5
- 239000012286 potassium permanganate Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 238000001035 drying Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410050057.2A CN103763865B (en) | 2014-02-13 | 2014-02-13 | Welding resistance ink hand-hole processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410050057.2A CN103763865B (en) | 2014-02-13 | 2014-02-13 | Welding resistance ink hand-hole processing method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103763865A true CN103763865A (en) | 2014-04-30 |
CN103763865B CN103763865B (en) | 2016-05-04 |
Family
ID=50530998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410050057.2A Active CN103763865B (en) | 2014-02-13 | 2014-02-13 | Welding resistance ink hand-hole processing method |
Country Status (1)
Country | Link |
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CN (1) | CN103763865B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106198142A (en) * | 2016-07-01 | 2016-12-07 | 广州兴森快捷电路科技有限公司 | Welding resistance obstacles in quit |
CN108024451A (en) * | 2017-11-24 | 2018-05-11 | 江门市奔力达电路有限公司 | A kind of pcb board moves back oily technique |
CN112804835A (en) * | 2020-12-30 | 2021-05-14 | 深圳市迅捷兴科技股份有限公司 | Method for preventing gold plate ink inlet hole from causing hole to be copper-free |
CN113498270A (en) * | 2021-07-08 | 2021-10-12 | 江西晶弘新材料科技有限责任公司 | Method for removing and washing solidified ink in aluminum nitride ceramic substrate |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1064089A (en) * | 1992-03-04 | 1992-09-02 | 高智 | Ink eradicator |
EP0930349A1 (en) * | 1998-01-21 | 1999-07-21 | Dainichiseika Color & Chemicals Mfg. Co. Ltd. | Removable ink composition and process for removing said ink composition from printed articles |
CN1408795A (en) * | 2002-09-18 | 2003-04-09 | 刘航 | Poison-free correcting fluid |
CN101645519A (en) * | 2008-08-06 | 2010-02-10 | 富士重工业株式会社 | Electric storage device |
CN102958280A (en) * | 2011-08-24 | 2013-03-06 | 深南电路有限公司 | Method for gold-plating sectional gold fingers |
CN103237419A (en) * | 2013-04-22 | 2013-08-07 | 胜华电子(惠阳)有限公司 | Method for stripping silver surface of silver removing circuit board |
CN103437230A (en) * | 2013-08-29 | 2013-12-11 | 华南理工大学 | Biological enzyme-based process for deinking wastepaper by neutral-alkaline dual-loop flotation |
-
2014
- 2014-02-13 CN CN201410050057.2A patent/CN103763865B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1064089A (en) * | 1992-03-04 | 1992-09-02 | 高智 | Ink eradicator |
EP0930349A1 (en) * | 1998-01-21 | 1999-07-21 | Dainichiseika Color & Chemicals Mfg. Co. Ltd. | Removable ink composition and process for removing said ink composition from printed articles |
CN1408795A (en) * | 2002-09-18 | 2003-04-09 | 刘航 | Poison-free correcting fluid |
CN101645519A (en) * | 2008-08-06 | 2010-02-10 | 富士重工业株式会社 | Electric storage device |
CN102958280A (en) * | 2011-08-24 | 2013-03-06 | 深南电路有限公司 | Method for gold-plating sectional gold fingers |
CN103237419A (en) * | 2013-04-22 | 2013-08-07 | 胜华电子(惠阳)有限公司 | Method for stripping silver surface of silver removing circuit board |
CN103437230A (en) * | 2013-08-29 | 2013-12-11 | 华南理工大学 | Biological enzyme-based process for deinking wastepaper by neutral-alkaline dual-loop flotation |
Non-Patent Citations (1)
Title |
---|
曾小君等: "水基印刷线路板油墨清洗剂的研制", 《电镀与涂饰》, vol. 32, no. 3, 15 March 2013 (2013-03-15), pages 37 - 40 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106198142A (en) * | 2016-07-01 | 2016-12-07 | 广州兴森快捷电路科技有限公司 | Welding resistance obstacles in quit |
CN108024451A (en) * | 2017-11-24 | 2018-05-11 | 江门市奔力达电路有限公司 | A kind of pcb board moves back oily technique |
CN112804835A (en) * | 2020-12-30 | 2021-05-14 | 深圳市迅捷兴科技股份有限公司 | Method for preventing gold plate ink inlet hole from causing hole to be copper-free |
CN113498270A (en) * | 2021-07-08 | 2021-10-12 | 江西晶弘新材料科技有限责任公司 | Method for removing and washing solidified ink in aluminum nitride ceramic substrate |
CN113498270B (en) * | 2021-07-08 | 2023-06-02 | 江西晶弘新材料科技有限责任公司 | Method for stripping solidified ink in aluminum nitride ceramic substrate |
Also Published As
Publication number | Publication date |
---|---|
CN103763865B (en) | 2016-05-04 |
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Legal Events
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Solder resist ink entry hole processing method Effective date of registration: 20190313 Granted publication date: 20160504 Pledgee: Suining rural commercial bank Limited by Share Ltd Pledgor: Wesky (Suining) Electronics Co., Ltd. Registration number: 2019510000026 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201215 Granted publication date: 20160504 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: 2019510000026 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Processing method of solder resist ink in hole Effective date of registration: 20201217 Granted publication date: 20160504 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2020510000113 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211124 Granted publication date: 20160504 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2020510000113 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Treatment method of solder resist ink entering hole Effective date of registration: 20211129 Granted publication date: 20160504 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2021980013515 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220329 Granted publication date: 20160504 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2021980013515 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Treatment method of solder resist ink entering hole Effective date of registration: 20220331 Granted publication date: 20160504 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2022980003697 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |