KR20100029431A - Manufacturing method for printed circuit board - Google Patents

Manufacturing method for printed circuit board Download PDF

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Publication number
KR20100029431A
KR20100029431A KR1020080088221A KR20080088221A KR20100029431A KR 20100029431 A KR20100029431 A KR 20100029431A KR 1020080088221 A KR1020080088221 A KR 1020080088221A KR 20080088221 A KR20080088221 A KR 20080088221A KR 20100029431 A KR20100029431 A KR 20100029431A
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South Korea
Prior art keywords
insulating substrate
metal ink
via hole
manufacturing
ink
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KR1020080088221A
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Korean (ko)
Inventor
조수환
정재우
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삼성전기주식회사
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Priority to KR1020080088221A priority Critical patent/KR20100029431A/en
Publication of KR20100029431A publication Critical patent/KR20100029431A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE: A manufacturing method for a printed circuit board is provided to shorten manufacturing time and reduce manufacturing costs by forming a via hole together with a circuit patter through an ink-jet method. CONSTITUTION: A via hole(12) is punched in an insulating substrate(10). A first circuit pattern(14) is formed in one side of the insulating substrate by discharging a metallic ink(22) on the side of the insulating substrate through an ink-jet method. The metallic ink is spread on the inner wall of the via hole. A second circuit pattern is formed in the other side of the insulating substrate by discharging a metallic ink on the other side of the insulating substrate through the ink-jet method. The metallic ink is spread on the inner wall of the via hole.

Description

양면 인쇄회로기판 제조방법{Manufacturing method for printed circuit board}Manufacturing method for printed circuit boards {Manufacturing method for printed circuit board}

본 발명은 양면 인쇄회로기판 제조방법에 관한 것이다.The present invention relates to a double-sided printed circuit board manufacturing method.

현재 양산되고 있는 인쇄회로기판은 단면, 양면, 다층기판 등 여러 종류가 있다. 이러한 인쇄회로기판을 제조함에 있어서, 공정의 간편성과 대량 생산의 가능성, 환경 친화적이라는 장점 때문에 현재 전자부품의 회로 형성에 비접촉 방식으로 임의의　패턴을 쉽게 인쇄할 수 있는 잉크젯 방식을 적용하기 위해 많은 연구가 진행되고 있다. 이러한 잉크젯 방식을 사용하면 기판제조공정을 대폭 줄일 수 있고, 시간 및 비용도 절약할 수 있다.There are many types of printed circuit boards currently in mass production, such as single-sided, double-sided, and multilayer boards. In manufacturing such a printed circuit board, due to the advantages of simplicity of process, possibility of mass production, and environmental friendliness, many studies have been conducted to apply an inkjet method that can easily print arbitrary patterns in a non-contact manner to form circuits of electronic components. Is going on. By using such an inkjet method, the substrate manufacturing process can be greatly reduced, and time and cost can be saved.

종래의 양면기판 제조법은 현재 널리 사용되고 있는 일반적인 회로형성법과 기본적으로 동일하다. 양면 동박적층판에 드라이필름을 적층하고, 노광 및 에칭 공정을 거쳐 양면에 회로를 형성하고 양면의 회로를 전기적으로 연결시켜주기 위하여 비아홀을 가공한 후, 비아홀 내부에 도금 및 충진을 하여준다. 그 후 회로보호를 위해 솔더레지스트를 형성함으로써, 인쇄회로기판 제조공정을 마무리하게 된다.The conventional double-sided substrate manufacturing method is basically the same as the general circuit forming method widely used now. Dry film is laminated on the double-sided copper-clad laminate, the circuit is formed on both sides through an exposure and etching process, and the via holes are processed to electrically connect the circuits on both sides, and the plating and filling are performed in the via holes. After that, by forming a solder resist for circuit protection, the printed circuit board manufacturing process is completed.

이러한 종래기술에 따르면, 각종 패턴을 형성하기 위해 노광, 에칭 등 복잡하고 많은 공정을 거쳐 시간과 비용이 많이 소모되는 문제가 있으며, 특히, 비아 내부에 도금을 수행하기 위한 여러 공정이 필수적으로 수반되는 관계로 제조시간 단축에 한계를 가질 수 밖에 없으며, 그 결과 비용 절감의 측면에도 불리한 점이 있다.According to the conventional technology, there is a problem that time and cost are consumed through complicated and many processes such as exposure and etching to form various patterns, and in particular, various processes for performing plating inside the via are necessarily accompanied. As a result, manufacturing time is limited, and as a result, there are disadvantages in terms of cost reduction.

본 발명은 잉크젯 방식을 이용하여, 간단하면서도 효율이 높은 양면 인쇄회로기판 제조방법을 제공하는 것이다.The present invention provides a method for manufacturing a double-sided printed circuit board, which is simple and highly efficient, using an inkjet method.

본 발명의 일 측면에 따르면, 절연기판에 비아홀을 천공하는 단계; 잉크젯 방식을 이용하여 절연기판의 일면에 금속잉크를 토출함으로써, 절연기판의 일면에 제1 회로패턴 형성되고, 금속잉크가 비아홀의 내벽에 도포되도록 하는 단계; 잉크젯 방식을 이용하여 절연기판의 타면에 금속잉크를 토출함으로써, 절연기판의 타면에 제2 회로패턴 형성되고, 금속잉크가 비아홀의 내벽에 도포되도록 하는 단계; 및 금속잉크를 소결하는 단계를 포함하는 양면 인쇄회로기판 제조방법을 제공할 수 있다.According to one aspect of the invention, the step of drilling a via hole in the insulating substrate; Discharging the metal ink to one surface of the insulating substrate by using an inkjet method, so that a first circuit pattern is formed on one surface of the insulating substrate and the metal ink is applied to the inner wall of the via hole; Discharging the metal ink to the other surface of the insulating substrate by using an inkjet method, thereby forming a second circuit pattern on the other surface of the insulating substrate and allowing the metal ink to be applied to the inner wall of the via hole; And it may provide a double-sided printed circuit board manufacturing method comprising the step of sintering the metal ink.

절연기판의 타면에 금속잉크를 토출하는 단계 이전에, 절연기판의 일면 및 비아홀의 내벽에 도포된 금속잉크를 건조시키는 단계를 수행할 수도 있으며, 이 때, 소결하는 단계는, 절연기판의 일면에 도포된 금속잉크 및 절연기판의 타면에 도포된 금속잉크 모두에 대해 수행될 수 있다.Prior to the step of discharging the metal ink to the other surface of the insulating substrate, the step of drying the metal ink applied to one surface of the insulating substrate and the inner wall of the via hole may be performed, wherein the step of sintering, the one surface of the insulating substrate This can be done for both the applied metal ink and the metal ink applied to the other side of the insulating substrate.

또한, 절연기판의 타면에 금속잉크를 토출하는 단계 이전에, 절연기판의 일면 및 비아홀의 내벽에 도포된 금속잉크를 소결하는 단계를 더 수행할 수도 있다.In addition, prior to the step of discharging the metal ink on the other surface of the insulating substrate, the step of sintering the metal ink applied to one surface of the insulating substrate and the inner wall of the via hole may be further performed.

한편, 절연기판의 타면에 금속잉크를 토출하는 단계는, 금속잉크가 비아홀 내부에 충전(充塡)되도록 수행될 수 있다.Meanwhile, the discharging of the metal ink on the other surface of the insulating substrate may be performed so that the metal ink is filled in the via hole.

본 발명의 바람직한 실시예에 따르면, 잉크젯 방식을 이용하여 회로패턴과 함께 비아를 형성함으로써, 공정단축을 통한 회로기판 제조시간 및 비용을 절감할 수 있다.According to a preferred embodiment of the present invention, by forming a via together with a circuit pattern using an inkjet method, it is possible to reduce the circuit board manufacturing time and cost through process shortening.

이하, 본 발명에 따른 양면 인쇄회로기판 제조방법의 바람직한 실시예를 첨부도면을 참조하여 상세히 설명하기로 하며, 첨부 도면을 참조하여 설명함에 있어, 동일하거나 대응하는 구성 요소는 동일한 도면번호를 부여하고 이에 대한 중복되는 설명은 생략하기로 한다.Hereinafter, a preferred embodiment of a double-sided printed circuit board manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings, in the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and Duplicate description thereof will be omitted.

도 1은 본 발명의 일 실시예에 따른 양면 인쇄회로기판 제조방법을 나타내는 순서도이고, 도 2 내지 도 5는 본 발명의 일 실시예에 따른 양면 인쇄회로기판 제조방법의 각 공정을 나타내는 도면이다 .도 2 내지 도 5를 참조하면, 절연기판(10), 비아홀(12), 제1 회로패턴(14), 제2 회로패턴(16), 비아(18), 잉크젯헤드(20), 금속잉크(22)가 도시되어 있다.1 is a flowchart illustrating a method of manufacturing a double-sided printed circuit board according to an embodiment of the present invention, and FIGS. 2 to 5 are views illustrating respective processes of the method of manufacturing a double-sided printed circuit board according to an embodiment of the present invention. 2 to 5, the insulating substrate 10, the via hole 12, the first circuit pattern 14, the second circuit pattern 16, the via 18, the inkjet head 20, and the metal ink ( 22 is shown.

먼저, 도 2에 도시된 바와 같이, 절연기판(10)에 비아홀(12)을 천공한다(S110). 비아홀(12)이 천공되는 절연기판(10)으로는 B-stage의 BT 프리프레그(prepreg)를 열압착 경화시킨 C-stage의 BT 수지 재질을 이용할 수도 있으며, 연성을 갖는 폴리이미드(polyimide) 재질을 이용할 수도 있다. 이 밖에도, 인쇄회로기판에 사용될 수 있는 절연자재라면 어느 것이라도 절연기판(10)으로 이용될 수 있을 것이다.First, as shown in FIG. 2, the via hole 12 is drilled in the insulating substrate 10 (S110). As the insulating substrate 10 on which the via holes 12 are to be drilled, a C-stage BT resin material obtained by thermocompression-curing the B-stage BT prepreg may be used, and a flexible polyimide material may be used. Can also be used. In addition, any insulating material that can be used for a printed circuit board may be used as the insulating substrate 10.

이러한 절연기판(10)에 비아홀(12)을 천공한다. 비아홀(12)은 층간 접속을 위한 구현하기 위해 형성되는 것으로서, 기계적인 드릴링 공정이나 레이저를 이용한 드릴링 공정 등을 통해 형성될 수 있다.The via hole 12 is drilled in the insulating substrate 10. The via hole 12 is formed to implement the interlayer connection, and may be formed through a mechanical drilling process or a laser drilling process.

이 후, 잉크젯 방식을 이용하여 절연기판(10)의 일면에 금속잉크(22)를 토출함으로써, 절연기판(10)의 일면에 제1 회로패턴(14) 형성되고, 금속잉크(22)가 비아홀(12)의 내벽에 도포되도록 한다(S120). 즉, 도 3에 도시된 바와 같이, 잉크젯헤드(20)를 이용하여 은(Ag), 구리(Cu) 등과 같은 금속나노잉크를 토출함으로써 절연기판(10)의 일면에 제1 회로패턴(14)을 형성하고, 이 때 금속잉크(22)의 일부가 비아홀(12)에 흘러 들어가 비아홀(12)의 내벽에도 금속잉크(22)가 도포되도록 하는 것이다.Thereafter, by discharging the metal ink 22 to one surface of the insulating substrate 10 using an inkjet method, the first circuit pattern 14 is formed on one surface of the insulating substrate 10, and the metal ink 22 is a via hole. To be applied to the inner wall of (12) (S120). That is, as shown in FIG. 3, the first circuit pattern 14 is formed on one surface of the insulating substrate 10 by discharging metal nano ink such as silver (Ag), copper (Cu), etc. using the inkjet head 20. At this time, a portion of the metal ink 22 flows into the via hole 12 so that the metal ink 22 is also applied to the inner wall of the via hole 12.

도 3에는 절연기판(10)이 고정된 상태에서 잉크젯헤드(20)가 이동하는 경우를 제시하였으나, 이와 반대로, 잉크젯헤드(20)가 고정되고 절연기판(10)이 이동함으로써 인쇄가 수행될 수도 있음은 물론이다.3 illustrates a case in which the inkjet head 20 moves while the insulating substrate 10 is fixed. On the contrary, printing may be performed by fixing the inkjet head 20 and moving the insulating substrate 10. Of course.

이렇게 금속잉크(22)를 도포한 다음, 도포된 금속잉크(22)를 건조한다(S125). 절연기판(10)의 반대 쪽 면에 인쇄를 진행하기에 앞서, 인쇄된 패턴이 유지될 수 있도록 하기 위한 것이다. 건조 공정을 수행함과 아울러, 소결 공정을 마저 수행하여 인쇄된 금속잉크(22)가 전기전도성을 갖도록 할 수도 있으며, 건조 공정만 수행한 후, 소결 공정은 추후에 수행할 수도 있다.After applying the metal ink 22, the coated metal ink 22 is dried (S125). Prior to printing on the opposite side of the insulating substrate 10, the printed pattern is to be maintained. In addition to performing the drying process, the sintering process may also be performed so that the printed metal ink 22 may have electrical conductivity. After the drying process is performed only, the sintering process may be performed later.

이 후, 절연기판(10)을 뒤집은 다음(S130), 도 4에 도시된 바와 같이, 잉크젯 방식을 이용하여 절연기판(10)의 타면에 금속잉크(22)를 토출함으로써, 절연기판(10)의 타면에 제2 회로패턴(16) 형성되고, 금속잉크(22)가 비아홀(12)의 내벽에 도포되도록 한다(S140).Thereafter, the insulator substrate 10 is turned upside down (S130), and as shown in FIG. 4, the insulator substrate 10 is discharged by discharging the metal ink 22 to the other surface of the insulator substrate 10 using an inkjet method. The second circuit pattern 16 is formed on the other surface of the metal ink 22 to be applied to the inner wall of the via hole 12 (S140).

즉, S120 공정과 마찬가지로, 잉크젯헤드(20)를 이용하여 은(Ag), 구리(Cu) 등과 같은 금속나노잉크를 토출함으로써 절연기판(10)의 반대쪽 면에 제2 회로패턴(16)을 형성하고, 이 때 금속잉크(22)의 일부가 비아홀(12)에 흘러 들어가, 비아홀(12)의 내벽에도 금속잉크(22)가 도포되도록 하는 것이다.That is, like the S120 process, the second circuit pattern 16 is formed on the opposite side of the insulating substrate 10 by discharging metal nano ink such as silver (Ag), copper (Cu), etc. using the inkjet head 20. At this time, a part of the metal ink 22 flows into the via hole 12 so that the metal ink 22 is also applied to the inner wall of the via hole 12.

이렇게 금속잉크(22)를 도포하게 되면, 비아홀(12)의 내벽에 도포된 금속잉크(22)가 S120 공정을 통해 비아홀(12)의 내벽에 도포된 금속잉크(22)와 서로 연결될 수 있게 되어, 층간 접속을 구현하는 비아(도 5의 18)를 형성할 수 있게 된다.When the metal ink 22 is applied in this way, the metal ink 22 coated on the inner wall of the via hole 12 may be connected to the metal ink 22 coated on the inner wall of the via hole 12 through the S120 process. In this way, it is possible to form vias 18 of FIG.

그리고 나서, 금속잉크(22)를 소결한다(S150). 이러한 소결 공정을 통해, 인쇄된 금속잉크(22)가 전기전도성을 가질 수 있게 되어, 회로패턴 등으로서의 기능을 수행할 수 있게 된다.Then, the metal ink 22 is sintered (S150). Through this sintering process, the printed metal ink 22 may have electrical conductivity, and thus may function as a circuit pattern.

은(Ag)을 이용한 금속잉크(22)로 회로패턴을 형성한 경우 150 ~ 200℃의 온도에서 30분간 소결하는 방법을 이용할 수 있으며, 구리(Cu)를 이용한 금속잉크(22)로 회로패턴을 형성한 경우 포름산(formic acid) 분위기에서 150 ~ 250℃의 온도에서 1시간 ~ 2시간가량 소결하는 방법을 이용할 수도 있다.When the circuit pattern is formed of the metal ink 22 using silver (Ag), a method of sintering at a temperature of 150 to 200 ° C. for 30 minutes may be used. The circuit pattern may be formed of the metal ink 22 using copper (Cu). When formed, a method of sintering for about 1 hour to 2 hours at a temperature of 150 to 250 ° C. in a formic acid atmosphere may be used.

한편, 절연기판(10)의 일면에 대한 인쇄 후 건조 공정만 수행하고 소결 공정을 별도로 수행하지 않은 채, 양면에 대한 소결 공정을 동시에 수행함으로써, 공정을 간소화하는 방법을 이용할 수도 있음은 전술한 바와 같다.On the other hand, it is possible to use a method of simplifying the process by performing the sintering process on both surfaces simultaneously without performing the sintering process after performing only the drying process after printing on one surface of the insulating substrate 10 as described above. same.

이상에서 설명한 공정을 통해 제조된 양면 인쇄회로기판이 도 5에 도시되어 있다.A double-sided printed circuit board manufactured by the above-described process is shown in FIG. 5.

상기에서는 본 발명의 바람직한 실시예를 참조하여 설명하였지만, 해당 기술 분야에서 통상의 지식을 가진 자라면 하기의 특허 청구의 범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art to which the present invention pertains without departing from the spirit and scope of the present invention as set forth in the claims below It will be appreciated that modifications and variations can be made.

전술한 실시예 외의 많은 실시예들이 본 발명의 특허청구범위 내에 존재한다.Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

도 1은 본 발명의 일 실시예에 따른 양면 인쇄회로기판 제조방법을 나타내는 순서도.1 is a flow chart showing a method for manufacturing a double-sided printed circuit board according to an embodiment of the present invention.

도 2 내지 도 5는 본 발명의 일 실시예에 따른 양면 인쇄회로기판 제조방법의 각 공정을 나타내는 도면.2 to 5 are views showing each step of the method for manufacturing a double-sided printed circuit board according to an embodiment of the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10: 절연기판10: insulation board

12: 비아홀12: Via Hole

14: 제1 회로패턴14: first circuit pattern

16: 제2 회로패턴16: second circuit pattern

18: 비아18: Via

20: 잉크젯헤드20: inkjet head

22: 금속잉크22: metal ink

Claims (3)

절연기판에 비아홀을 천공하는 단계;Drilling a via hole in the insulating substrate; 잉크젯 방식을 이용하여 상기 절연기판의 일면에 금속잉크를 토출함으로써, 상기 절연기판의 일면에 제1 회로패턴 형성되고, 상기 금속잉크가 상기 비아홀의 내벽에 도포되도록 하는 단계;Discharging a metal ink to one surface of the insulating substrate by using an inkjet method, so that a first circuit pattern is formed on one surface of the insulating substrate and the metal ink is applied to an inner wall of the via hole; 잉크젯 방식을 이용하여 상기 절연기판의 타면에 금속잉크를 토출함으로써, 상기 절연기판의 타면에 제2 회로패턴 형성되고, 상기 금속잉크가 상기 비아홀의 내벽에 도포되도록 하는 단계; 및Discharging the metal ink to the other surface of the insulating substrate by using an inkjet method, so that a second circuit pattern is formed on the other surface of the insulating substrate, and the metal ink is applied to the inner wall of the via hole; And 상기 금속잉크를 소결하는 단계를 포함하는 양면 인쇄회로기판 제조방법.A method of manufacturing a double-sided printed circuit board comprising the step of sintering the metal ink. 제1항에 있어서,The method of claim 1, 상기 절연기판의 타면에 금속잉크를 토출하는 단계 이전에,Before the step of discharging the metal ink on the other surface of the insulating substrate, 상기 절연기판의 일면 및 상기 비아홀의 내벽에 도포된 금속잉크를 건조시키는 단계를 더 포함하며,Drying the metal ink applied to one surface of the insulating substrate and the inner wall of the via hole, 상기 소결하는 단계는,The sintering step, 상기 절연기판의 일면에 도포된 금속잉크 및 상기 절연기판의 타면에 도포된 금속잉크 모두에 대해 수행되는 것을 특징으로 하는 양면 인쇄회로기판 제조방법.And a metal ink applied to one surface of the insulating substrate and a metal ink applied to the other surface of the insulating substrate. 제1항에 있어서,The method of claim 1, 상기 절연기판의 타면에 금속잉크를 토출하는 단계 이전에,Before the step of discharging the metal ink on the other surface of the insulating substrate, 상기 절연기판의 일면 및 상기 비아홀의 내벽에 도포된 금속잉크를 소결하는 단계를 더 포함하는 것을 특징으로 하는 양면 인쇄회로기판 제조방법.And sintering the metal ink coated on one surface of the insulating substrate and the inner wall of the via hole.
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013103265A1 (en) * 2012-01-04 2013-07-11 주식회사 잉크테크 Method for manufacturing two-sided printed circuit board
WO2014058267A1 (en) * 2012-10-12 2014-04-17 주식회사 잉크테크 Method for forming precision printed circuit board in which circuit pattern and communication line inside through-hole are formed
WO2014058265A1 (en) * 2012-10-12 2014-04-17 주식회사 잉크테크 Method for forming two-sided printed circuit board formed by printing circuit pattern and communication line inside through-hole
CN104160794A (en) * 2012-01-04 2014-11-19 印可得株式会社 Method for manufacturing two-sided printed circuit board
KR101469614B1 (en) * 2013-08-30 2014-12-05 한국생산기술연구원 Method for forming metam patterns of double side flexible printedcircuit board
KR20150061108A (en) * 2013-11-25 2015-06-04 주식회사 잉크테크 The manufacturing method of printed circuit board
WO2023047671A1 (en) * 2021-09-24 2023-03-30 エレファンテック株式会社 Method of producing printed circuit board, and method of forming electroconductive underlayer

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013103265A1 (en) * 2012-01-04 2013-07-11 주식회사 잉크테크 Method for manufacturing two-sided printed circuit board
CN104160794A (en) * 2012-01-04 2014-11-19 印可得株式会社 Method for manufacturing two-sided printed circuit board
KR101505049B1 (en) * 2012-01-04 2015-04-07 주식회사 잉크테크 Manufacturing method of double-sided printed circuit board
US10080299B2 (en) 2012-01-04 2018-09-18 Inktec Co., Ltd. Manufacturing method of double sided printed circuit board
WO2014058267A1 (en) * 2012-10-12 2014-04-17 주식회사 잉크테크 Method for forming precision printed circuit board in which circuit pattern and communication line inside through-hole are formed
WO2014058265A1 (en) * 2012-10-12 2014-04-17 주식회사 잉크테크 Method for forming two-sided printed circuit board formed by printing circuit pattern and communication line inside through-hole
KR101532388B1 (en) * 2012-10-12 2015-07-01 주식회사 잉크테크 Method for manufacturing precision PCB forming circuit pattern and connecting the circuit pattern through via-hole
CN104919908A (en) * 2012-10-12 2015-09-16 印可得株式会社 Method for forming two-sided printed circuit board formed by printing circuit pattern and communication line inside through-hole
TWI507106B (en) * 2012-10-12 2015-11-01 Inktec Co Ltd Method of manufacturing double-side printed circuit board (pcb) in which circuit patterns and conductive lines in via holes for connecting the circuit patterns are formed by using printing method
KR101469614B1 (en) * 2013-08-30 2014-12-05 한국생산기술연구원 Method for forming metam patterns of double side flexible printedcircuit board
KR20150061108A (en) * 2013-11-25 2015-06-04 주식회사 잉크테크 The manufacturing method of printed circuit board
WO2023047671A1 (en) * 2021-09-24 2023-03-30 エレファンテック株式会社 Method of producing printed circuit board, and method of forming electroconductive underlayer

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