WO2014058265A1

WO2014058265A1 - Method for forming two-sided printed circuit board formed by printing circuit pattern and communication line inside through-hole

Info

Publication number: WO2014058265A1
Application number: PCT/KR2013/009094
Authority: WO
Inventors: 정광춘; 한영구; 윤광백; 윤동국; 김수한; 문태진
Original assignee: 주식회사 잉크테크
Priority date: 2012-10-12
Filing date: 2013-10-11
Publication date: 2014-04-17
Also published as: TWI507106B; TW201433235A; KR20140047480A; CN104919908A

Abstract

The present invention relates to a method for forming a two-sided printed circuit board formed by printing a circuit pattern and a communication line inside a through-hole. The method for forming the two-sided printed circuit board comprises the steps of: forming the through-hole which penetrates through the upper surface and the lower surface of an insulation layer; a first pattern-forming step of forming a first circuit pattern on one surface of the insulation layer with a conductive material, wherein a pattern is formed so that a portion of the conductive material binds to the inner circumferential surface of the through-hole; and a second circuit pattern-forming step of forming a second circuit pattern on the other surface of the insulation layer, which is the surface opposite the one surface, with the conductive material, wherein a pattern is formed so that a portion of the conductive material binds to the inner circumferential surface of the through-hole so as to connect with the first circuit pattern.

Description

Formation method of double-sided printed circuit board which is formed by printing circuit pattern and conductive line in through hole

The present invention relates to a method for forming a double-sided printed circuit board for printing a circuit pattern and a conductive line in a through hole. Particularly, a through hole for energizing a circuit pattern formed on the top and bottom surfaces of an insulating layer and a circuit pattern formed on the top and bottom surfaces. A double-sided printed circuit board forming method for forming a conductive line therein by a printing method.

FIG. 1 schematically illustrates a process of forming a circuit pattern in a conventional printed circuit board and energizing circuit patterns formed on upper and lower sides of an insulating layer.

Referring to FIG. 1, a conventional printed circuit board is prepared with a raw material (double-sided copper foil film) on which conductive layers are mounted on both surfaces of an insulating layer. It shows that a polyimide film is used as the insulating layer and a copper film is used as the conductive layer.

Subsequently, a front etching process is performed. In the case of double-sided copper foil film, the thickness of copper foil is fixed, and when the whole-hole plating is performed, a thickness of about 10 μm or more is formed. Therefore, when a fine pattern is to be formed, it is too thick. The process is carried out to reduce the thickness.

Next, the through-hole is processed through the conductive layer and the insulating layer. Subsequently, the conductive layer and the insulating layer in which the through-holes are formed are exposed to the conductive aqueous solution to form a conductive film to perform a pre-plating process (Shadow process).

Subsequently, an electroless copper plating film is formed on the conductive layer and the insulating layer on which the conductive film is formed to perform the entire electroplating process, and the inner wall of the through-hole is coated with the conductive copper of the thin film using Pd (palladium) catalysis. The electrolytic reaction of copper is used to completely coat the inner wall of the trough hole with conductive copper.

Subsequently, the photosensitive film is laminated, and a process of exposure, development, corrosion, and peeling is performed to form a circuit having a desired pattern to form a final circuit.

As described above, in the conventional printed circuit board, the process of implementing the circuit patterns formed on both surfaces of the insulating layer to be energized through the through holes is complicated, which leads to a decrease in productivity and a failure rate.

SUMMARY OF THE INVENTION The present invention has been made to solve the problems described above, and the circuit pattern is easily formed on the upper and lower surfaces of the insulating layer, and the conductive lines in the through-holes for conducting the circuit patterns formed on the upper and lower surfaces are printed. It is an object of the present invention to provide a method for forming a double-sided printed circuit board which is formed by printing a circuit pattern and a conductive line in the through hole to be easily formed.

In the method for forming a double-sided printed circuit board by printing the circuit pattern and the conductive line in the through hole according to the present invention, the circuit pattern is easily formed on the upper and lower surfaces of the insulating layer, and the circuit patterns respectively formed on the upper and lower surfaces of the through hole are formed. It provides an effect of easily forming a conductive line through the printing method in the same manner as the circuit pattern through the electricity.

In addition, the simplified process reduces the manufacturing time, thereby improving productivity, and lowering the defective rate, thereby providing an effect of improving product quality.

1 is a view schematically showing a circuit pattern forming method and a through hole energizing process of a conventional printed circuit board,

2 is a view schematically showing the flow of a method of forming a double-sided printed circuit board according to an embodiment of the present invention;

3 is a schematic flowchart of a method of forming a double-sided printed circuit board according to another embodiment of the present invention;

4 is a schematic flowchart of a method of forming a double-sided printed circuit board according to still another embodiment of the present invention;

5 is a schematic view showing a flowchart of a method of forming a double-sided printed circuit board according to another embodiment of the present invention.

According to an aspect of the present invention, there is provided a method of forming a double-sided printed circuit board by printing a circuit pattern and a conductive line in a through hole, the method comprising: forming a through hole penetrating through an upper surface and a lower surface of an insulating layer; A first circuit pattern forming step of forming a first circuit pattern of a conductive material on one surface of the insulating layer, wherein a pattern of the conductive material is coupled to an inner circumferential surface of the through hole; A second circuit pattern formed of a conductive material on the other surface of the insulating layer opposite to the one surface, wherein a portion of the conductive material is coupled to an inner circumferential surface of the through hole to form a pattern to be connected to the first circuit pattern It characterized in that it comprises a; 2 circuit pattern forming step.

In addition, the first and second circuit patterns may be printed and patterned.

In addition, it is preferable that a part of the conductive material forming the first and second circuit patterns flows to the inner circumferential surface of the through hole by its own weight and is coupled to the inner circumferential surface of the through hole.

In addition, the first circuit pattern is formed on the upper surface of the insulating layer, and a part of the conductive material forming the first circuit pattern flows down to the inner circumferential surface of the through hole due to its own weight, and the first circuit pattern is cured. The second circuit pattern is formed while the insulating layer is turned upside down so that the upper surface is a lower surface, and a part of the conductive material forming the second circuit pattern flows down to the inner circumferential surface of the through hole by its own weight. When the pattern is formed, the conductive material flowing along the inner circumferential surface of the through hole is preferably connected to each other.

The method may further include forming a conductive plating film on a conductive line in which the first and second circuit patterns and the first and second circuit patterns are connected in the through hole.

On the other hand, according to another aspect of the present invention, a method for forming a double-sided printed circuit board by printing the circuit pattern and the conductive line in the through-hole, forming a first circuit pattern of a conductive material on one surface of the insulating layer; Forming a through hole penetrating the upper and lower surfaces of the insulating layer; A second circuit pattern formed of a conductive material on the other surface of the insulating layer opposite to the one surface, wherein a portion of the conductive material is coupled to an inner circumferential surface of the through hole to form a conductive film connected to the first circuit pattern Forming a second circuit pattern for forming a; characterized in that it comprises a.

In addition, it is preferable to form a conductive plating film on the first and second circuit patterns and the conductive film.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a view schematically illustrating a flow of a method of forming a printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 2, in a method of forming a printed circuit board simultaneously forming a circuit pattern and a conductive line in a through hole according to an embodiment of the present disclosure, forming the through hole 40 in the insulating layer 10, the first circuit Forming a pattern 20, and forming a second circuit pattern 30.

According to the present exemplary embodiment, the through hole 40 is formed before the circuit pattern is formed on the upper and lower surfaces of the insulating layer 10. The through hole 40 is formed through the upper and lower surfaces of the insulating layer 10. As the insulating layer 10, a known one such as a polyimide film may be used.

In the forming of the first circuit pattern 20, the circuit is patterned on one surface of the insulating layer 10 by using a conductive material. As the conductive material, known materials such as silver (Ag), copper (Cu), nickel (Ni), and aluminum (Al) may be used.

According to the present embodiment, the first circuit pattern 20 is printed and patterned. The printing may be performed in a known manner such as flexo printing, flat screen printing, roll to roll printing, rotary screen printing, and the like.

According to the present embodiment, the first circuit pattern 20 is formed on the upper surface of the insulating layer 10. That is, the one surface on which the first circuit pattern 20 is formed becomes an upper surface with respect to the insulating layer 10.

In the forming of the first circuit pattern 20, a portion of the conductive material is coupled to an inner circumferential surface of the through hole 40. According to the present embodiment, the conductive material is a paste that maintains a predetermined viscosity and a portion of the conductive material flows down the inner circumferential surface of the through hole 40 by its own weight while the first circuit pattern 20 is printed. Attached to the inner circumferential surface of the).

As shown in FIG. 2, a part of the first circuit pattern 20 is patterned to flow into the inside of the through hole 40, and the conductive material flowed down by its own weight adheres to the inner circumferential surface of the through hole 40. do.

According to the present embodiment, a heat treatment process is performed after the first circuit pattern 20 is formed. The conductive material flowing into the first circuit pattern 20 and the through hole 40 by the heat treatment process is contracted while being cured.

In the forming of the second circuit pattern 30, a surface opposite to the one surface is formed by patterning a circuit using a conductive material on the other surface of the insulating layer 10.

According to the present embodiment, the second circuit pattern 30 is patterned in a printing manner similar to the first circuit pattern 20. As the printing method, the known method described above may be used.

According to the present embodiment, the forming of the second circuit pattern 30 is performed after the first circuit pattern 20 is heat treated and cured. Specifically, after the first circuit pattern 20 is cured, the insulating layer 10 is turned upside down so that the upper surface of the insulating layer 10 becomes a lower surface.

Therefore, the position of the first circuit pattern 20 formed on the top surface of the insulating layer 10 is changed to the bottom surface of the insulating layer 10 as the insulating layer 10 is inverted. In this state, the second circuit pattern 30 is formed. That is, the other surface of the insulating layer 10 is patterned in a printing manner with the second circuit pattern 30 in a state in which the upper surface is formed based on the insulating layer 10.

In the forming of the second circuit pattern 30, a portion of the conductive material is coupled to the inner circumferential surface of the through hole 40, and is coupled to the inner circumferential surface of the through hole 40 when the first circuit pattern 20 is formed. Are connected to each other with a conductive material.

According to the present embodiment, a part of the conductive material flows down the inner circumferential surface of the through hole 40 by its own weight as in the case of forming the first circuit pattern 20, and at the time of forming the first circuit pattern 20. It is connected to each other and the conductive material flowed down along the inner peripheral surface of the barrel hole (40).

According to the present embodiment, a heat treatment process is performed after the second circuit pattern 30 is formed. After the first circuit pattern 20 is formed, as in the heat treatment process, when the second circuit pattern 30 is heat treated, the conductive material flowing into the second circuit pattern 30 and the through hole 40 is cured and contracted.

As a result, a conductive line is formed in the through hole 40 for energizing the first circuit pattern 20 and the second circuit pattern 30.

In addition, according to the present embodiment, as shown in FIG. 3, the first and

second circuit patterns

20 and 30 and the first and

second circuit patterns

20 and 30 are connected in the through hole 40. The method may further include forming a conductive plating film 50 on the line.

In the present embodiment, the conductive plating film 50 may be a copper film formed by electroless or electrolytic copper plating. The conductive plating film 50 may be plated by appropriately adjusting the thickness in consideration of the amount of current applied and consumed.

Since the electrical conductivity is increased by the conductive plating film 50, the first and

second circuit patterns

20 and 30 may be formed only to maintain the properties of the seed layer, and when the amount of current applied and consumed is large. It is preferable to form and manufacture the said electroconductive plating film 50 in suitable thickness.

As described above, in the method of forming a double-sided printed circuit board according to the exemplary embodiment of the present invention, first, the through hole 40 is formed, and circuit patterns are formed on the upper and lower surfaces of the insulating layer 10. At this time, the conductive material forming the circuit pattern flows along the inner circumferential surface of the through hole 40 to form a conductive line.

Therefore, the circuit pattern and the conduction line in the through hole 40 for energizing the circuit pattern are provided through an easy and simplified process.

In addition, the circuit pattern and the conductive line in the through hole 40 are formed at the same time to shorten the process time to significantly improve productivity, and the defect rate generated by the conventional complex process can be drastically lowered by the simplified process. To improve the quality of the effect.

4 and 5 illustrate a method of forming a double-sided printed circuit board by printing a circuit pattern and a conductive line in a through hole according to another embodiment of the present invention.

Referring to FIG. 4, in the method of forming a double-sided printed circuit board by printing a circuit pattern and a conductive line in a through hole, the first circuit pattern 20 is formed of a conductive material on one surface of the insulating layer 10. Forming a hole, forming a through hole 40 penetrating the upper and lower surfaces of the insulating layer 10, and forming a second circuit with a conductive material on the other surface of the insulating layer 10 opposite to the one surface. A second circuit pattern 30 forming a pattern 30, wherein a portion of the conductive material is coupled to an inner circumferential surface of the through hole 40 to form a pattern in which a conductive film connected to the first circuit pattern 20 is formed. Forming a step.

Unlike the embodiment shown in FIG. 2, the first circuit pattern 20 is first formed on one surface of the insulating layer 10, and then the through hole 40 is formed. The second circuit pattern 30 is formed on the other surface of the insulating layer 10 in which the through hole 40 is formed. In the present embodiment, since the method of forming the first and

second circuit patterns

20 and 30 is the same as that of the embodiment of FIG. 2, detailed description thereof will be omitted. However, in the present embodiment, the conductive film connecting the first and

second circuit patterns

20 and 30 flows down to the inner circumferential surface of the through hole 40 when the second circuit pattern 30 is formed.

As shown in Fig. 4, in this embodiment, after the first circuit pattern 20 is formed, a heat treatment process is performed. At this time, the first circuit pattern 20 is cured and contracted.

In addition, after the second circuit pattern 30 is formed, a heat treatment process is performed. At this time, the conductive material flowing into the inner circumferential surface of the through hole 40 when the second circuit pattern 30 is formed is cured and contracted.

In addition, referring to FIG. 5, the conductive plating film 50 may be formed on the first and

second circuit patterns

20 and 30 and the conductive film. As in the embodiment of FIG. 3, the conductive plating film 50 may be a copper film formed by electroless or electrolytic copper plating. The conductive plating film 50 may be plated by appropriately adjusting the thickness in consideration of the amount of current applied and consumed.

second circuit patterns

The operation and effect of the method of forming the double-sided printed circuit board according to the embodiments of FIGS. 4 and 5 are similar to those of the embodiment of FIG. 2, and a detailed description thereof will be omitted.

In the above, the present invention has been described in detail with reference to preferred embodiments, but the present invention is not limited to the above embodiments, and many other modifications may be provided without departing from the scope of the present invention.

10 ... insulation layer

20 ... First Circuit Pattern

30 ... Second Circuit Pattern

40.hole

50 ... conductive plating film

Claims

Forming a through hole 40 penetrating the upper and lower surfaces of the insulating layer 10;

A first circuit pattern 20 is formed on one surface of the insulating layer 10 with a conductive material, and the first circuit pattern 20 forms a pattern such that a part of the conductive material is coupled to the inner circumferential surface of the through hole 40. Forming step;

A second circuit pattern 30 is formed of a conductive material on the other surface of the insulating layer 10, which is opposite to the one surface, and a portion of the conductive material is coupled to an inner circumferential surface of the through hole 40 so that the first circuit is formed. Forming a second circuit pattern 30 to form a pattern to be connected to the pattern (20); The circuit pattern and a double-sided printed circuit board forming method for forming a conductive line in the through-hole formed by printing.
The method of claim 1,

The first and second circuit patterns (20, 30) is printed and patterned, characterized in that the printed circuit board and the printed circuit board forming method for forming the conductive line in the through hole.
The method according to claim 1 or 2,

A portion of the conductive material forming the first and second circuit patterns 20 and 30 flows to the inner circumferential surface of the through hole 40 by its own weight and is coupled to the inner circumferential surface of the through hole 40. And forming a conductive line in the through hole by printing.
The method of claim 2,

The first circuit pattern 20 is formed on the top surface of the insulating layer 10, and a part of the conductive material forming the first circuit pattern 20 flows down to the inner circumferential surface of the through hole 40 by its own weight. ,

After the first circuit pattern 20 is cured, the second circuit pattern 30 is formed while the insulating layer 10 is turned upside down so that the top surface is a bottom surface, and the second circuit pattern 30 is formed. A portion of the conductive material to be formed flows down to the inner circumferential surface of the through hole 40 by its own weight and is connected to the conductive material flowing down along the inner circumferential surface of the through hole 40 when the first circuit pattern 20 is formed. A method of forming a double-sided printed circuit board, which is formed by printing a circuit pattern and a conductive line in a through hole.
The method of claim 1,

The method may further include forming a conductive plating film 50 on a conductive line to which the first and second circuit patterns 20 and 30 and the first and second circuit patterns 20 and 30 are connected in the through hole 40. A method of forming a double-sided printed circuit board, which is formed by printing a circuit pattern and a conductive line in a through hole.
Forming a first circuit pattern 20 of a conductive material on one surface of the insulating layer 10;

Forming a through hole 40 penetrating the upper and lower surfaces of the insulating layer 10;

A second circuit pattern 30 is formed of a conductive material on the other surface of the insulating layer 10, which is opposite to the one surface, and a portion of the conductive material is coupled to an inner circumferential surface of the through hole 40 so that the first circuit is formed. Forming a second circuit pattern 30 forming a pattern on which a conductive film connected to the pattern 20 is formed; a double-sided printed circuit board formed by printing a circuit pattern and a conductive line in a through hole Formation method.
The method of claim 6,

A conductive plated film (50) is formed on the first and second circuit patterns (20,30) and the conductive film.