WO2014058267A1

WO2014058267A1 - Method for forming precision printed circuit board in which circuit pattern and communication line inside through-hole are formed

Info

Publication number: WO2014058267A1
Application number: PCT/KR2013/009096
Authority: WO
Inventors: 정광춘; 한영구; 윤광백; 정봉기
Original assignee: 주식회사 잉크테크
Priority date: 2012-10-12
Filing date: 2013-10-11
Publication date: 2014-04-17
Also published as: KR101532388B1; KR20140047481A; TW201429349A; TWI507105B

Abstract

The present invention relates to a method for forming a precision printed circuit board in which circuit patterns and a communication line inside a through-hole are formed. The method for forming a precision printed circuit board comprises the steps of: forming a first conductive circuit pattern that forms a circuit on the upper surface of an insulation layer; forming a second conductive circuit pattern that forms a circuit on the lower surface of the insulation layer; forming a through-hole which vertically penetrates the insulation layer; and forming a conductive material on the inner circumferential surface of the through-hole so that the first circuit pattern and the second circuit pattern communicate via the through-hole.

Description

Precision printed circuit board forming method to form circuit patterns and conductive lines in through holes

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a precision printed circuit board for forming a circuit pattern and a conductive line in a through hole. In particular, a circuit pattern is easily formed on upper and lower surfaces of an insulating layer, The present invention relates to a method of forming a printed circuit board to easily form a current supply.

FIG. 1 schematically illustrates a process of forming a circuit pattern in a conventional printed circuit board and energizing circuit patterns formed on upper and lower sides of an insulating layer.

Referring to FIG. 1, a conventional printed circuit board is prepared with a raw material (double-sided copper foil film) on which conductive layers are mounted on both surfaces of an insulating layer. It shows that a polyimide film is used as the insulating layer and a copper film is used as the conductive layer.

Subsequently, a front etching process is performed. In the case of double-sided copper foil film, the thickness of copper foil is fixed, and when the whole-hole plating is performed, a thickness of about 10 μm or more is formed. Therefore, when a fine pattern is to be formed, it is too thick. The process is carried out to reduce the thickness.

Next, the through-hole is processed through the conductive layer and the insulating layer. Subsequently, the conductive layer and the insulating layer in which the through-holes are formed are exposed to the conductive aqueous solution to form a conductive film to perform a pre-plating process (Shadow process).

Subsequently, an electroless copper plating film is formed on the conductive layer and the insulating layer on which the conductive film is formed to perform the entire electroplating process, and the inner wall of the through-hole is coated with the conductive copper of the thin film using Pd (palladium) catalysis. The electrolytic reaction of copper is used to completely coat the inner wall of the trough hole with conductive copper.

Subsequently, the photosensitive film is laminated, and a process of exposure, development, corrosion, and peeling is performed to form a circuit having a desired pattern to form a final circuit.

As described above, in the conventional printed circuit board, the process of implementing the circuit patterns formed on both surfaces of the insulating layer to be energized through the through holes is complicated, which leads to a decrease in productivity and a failure rate.

The present invention has been made to solve the problems described above, so that the circuit pattern formed on the upper and lower surfaces of the insulating layer can be easily formed, and the energization of the circuit pattern formed on the upper and lower surfaces of the insulating layer can be easily formed. It is an object of the present invention to provide a method of forming a printed circuit board.

The precision printed circuit board forming method for forming the circuit pattern and the conductive line in the through hole according to the present invention, the circuit pattern is easily formed on the upper and lower surfaces of the insulating layer, and the energization of the circuit pattern formed on the upper and lower surfaces of the insulating layer Provides an effect that is easy to implement.

In addition, the simplified process reduces the manufacturing time, thereby improving productivity, and lowering the defective rate, thereby providing an effect of improving product quality.

1 is a view schematically showing a circuit pattern forming method and a through hole energizing process of a conventional printed circuit board,

2 is a flowchart of a method of forming a printed circuit board according to an embodiment of the present invention;

3 to 9 are flowcharts of a method of forming a printed circuit board according to another exemplary embodiment of the present invention.

In accordance with another aspect of the present invention, a method for forming a precision printed circuit board for forming a circuit pattern and a conductive line in a through hole includes forming a conductive first circuit pattern constituting a circuit on an upper surface of an insulating layer; Forming a conductive second circuit pattern constituting a circuit on a lower surface of the insulating layer; Forming a through hole penetrating the insulating layer in a vertical direction; And forming a conductive material on an inner circumferential surface of the through hole so that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.

In addition, after the non-conductive protective film is laminated on the second circuit pattern, the through hole is formed, and after the conductive material is formed on the inner circumferential surface of the through hole, the protective film is preferably laminated.

In addition, when the first circuit pattern is formed, the insulating layer is exposed to the outside at the portion where the through hole is formed, and when the second circuit pattern is formed, the insulating layer is exposed to the outside at the portion where the through hole is formed. It is desirable to be.

In addition, the first and second circuit patterns may be patterned and printed, and the inner circumferential surface of the through hole may be printed with the conductive material.

In addition, it is preferable to form a plating film on the conductive material formed on the first and second circuit patterns and the inner peripheral surface of the through hole.

In addition, after the conductive material is formed on the inner circumferential surface of the through hole, it is preferable that heat treatment is performed.

The first and second protective films may be formed after laminating non-conductive first and second protective films on the upper surfaces of the first and second circuit patterns, respectively, and after the conductive material is formed on the inner circumferential surface of the through holes. Preference is given to dilaminating.

In addition, after forming the through hole, it is preferable to laminate the non-conductive protective film on the second circuit pattern, and to form the conductive material on the inner circumferential surface of the through hole, and then to laminate the protective film.

In addition, the non-conductive first protective film is laminated on the second circuit pattern, the through hole is formed, and after the second protective film is laminated on the first circuit pattern, the conductive material is formed on the inner circumferential surface of the through hole, It is preferable to delaminate the protective film.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a flowchart of a method of forming a printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 2, a method of forming a printed circuit board according to an exemplary embodiment of the present disclosure may include forming first and

second circuit patterns

20 and 30, forming a through hole 40, and a through hole. Forming a conductive material 50 on the inner circumferential surface of the 40.

The printed circuit board according to the present invention first forms a circuit of a desired pattern.

The first circuit pattern 20 is a circuit patterned using a conductive material to form a circuit on the upper surface of the insulating layer 10. In the present embodiment, the first circuit pattern 20 is printed using a known paste such as silver (Ag), copper (Cu), nickel (Ni), aluminum (Al), and the like. Of course, the first circuit pattern 20 is not limited to being formed by a printing method. As the insulating layer 10, a known one such as a polyimide film is used.

The second circuit pattern 30 is a circuit patterned using a conductive material to form a circuit on the lower surface of the insulating layer 10. In the present embodiment, the second circuit pattern 30 is similar to the first circuit pattern 20 by using a known paste such as silver (Ag), copper (Cu), nickel (Ni), aluminum (Al), or the like. It is printed. Of course, the second circuit pattern 30 is not limited to being formed by the printing method.

Subsequently, the step of forming the through hole 40 is performed. The through hole 40 penetrates the insulating layer 10 in the vertical direction. 2, when the first circuit pattern 20 is formed, the insulating layer 10 is exposed to the outside at a portion where the through hole 40 is formed. In addition, when the second circuit pattern 30 is formed, the insulating layer 10 is exposed to the outside at the portion where the through hole 40 is formed.

Therefore, the first circuit pattern 20 provided above the portion where the through hole 40 is formed and the second circuit pattern 30 provided below are patterned in consideration of the through hole 40 to be subsequently formed. Therefore, the through hole 40 is formed by processing the hole substantially penetrating the insulating layer 10.

Subsequently, the step of forming the conductive material 50 on the inner circumferential surface of the barrel hole 40 is performed.

In this embodiment, the inner circumferential surface of the barrel hole 40 is printed using a known paste such as silver (Ag), copper (Cu), nickel (Ni), aluminum (Al), and the like. By such a process, a printed circuit board through which the first and

second circuit patterns

20 and 30 are energized by the through hole 40 is formed.

Therefore, in the method of forming a printed circuit board according to the present invention, first and

second circuit patterns

20 and 30 are first formed, and then, through holes 40 are formed, and the conductive material 50 is formed in the through holes 40. Since the process of energizing the first and second circuit patterns (20,30) by forming a, the conventional printed circuit board is printed by a simplified method as compared to the complicated process to implement the circuit pattern is energized by the through hole It will provide the effect that the circuit board can be implemented.

Meanwhile, according to the exemplary embodiment of the present invention, a process of laminating the protective film 60 may be performed before the conductive material 50 is formed on the inner circumferential surface of the barrel hole 40.

Referring to FIG. 2, after forming the first and

second circuit patterns

20 and 30, a process of laminating the non-conductive protective film 60 on the second circuit pattern 30 is performed. In the present embodiment, the protective film 60 is a polyethylene terephthalate (PET) film is used. The protective film 60 is provided to prevent the conductive material 50 from penetrating into the second circuit pattern 30 when the conductive material 50 is subsequently printed on the inner circumferential surface of the through hole 40.

That is, when the conductive material 50 is excessive when printing the conductive material 50 on the inner circumferential surface of the through hole 40 without the protective film 60, the conductive material 50 penetrates into the second circuit pattern 30. This may cause a defect of the printed circuit board. The protective film 60 prevents the conductive material 50 from spreading to the second circuit pattern 30.

As described above, after the protective film 60 is laminated, as shown in FIG. 2, a process of forming the through hole 40 and a printing process in the through hole 40 is performed, and then the protective film 60 is removed. The delaminate process is performed.

Through this process, first and

second circuit patterns

20 and 30 are finally formed on the upper and lower surfaces of the insulating layer 10, and the first and

second circuit patterns

20 and 30 are formed on the inner circumferential surface of the through hole 40. It is energized by the conductive material 50 formed in the.

In addition, according to the present embodiment, a heat treatment process is performed after a printing process is performed on the barrel hole 40. After the conductive material 50 is printed in the barrel hole 40, the conductive material is cured and shrinks as the conductive material is cured.

Meanwhile, referring to FIG. 3, the conductive plating film 70 may be formed on the first and

second circuit patterns

20 and 30 and the conductive material 50 formed on the inner circumferential surface of the through hole 40.

In the present embodiment, the plating film 70 may be a copper film formed by electroless or electrolytic copper plating. The plating film 70 may be plated by appropriately adjusting the thickness in consideration of the amount of current applied and consumed.

Since the electrical conductivity is increased by the plating layer 70, the first and

second circuit patterns

20 and 30 may be formed only to maintain the properties of the seed layer, and when the amount of applied and consumed current is large, It is preferable to form and form the plating film 70 in a suitable thickness.

As described above, in the method of forming the printed circuit board according to the exemplary embodiment of the present invention, the first and

second circuit patterns

20 and 30 are quickly formed, and the through holes 40 connecting the first and

second circuit patterns

20 and 30 are provided. ) And conducting the first and

second circuit patterns

20 and 30 by printing the conductive material 50 on the inner circumferential surface of the through hole 40, thereby allowing the first and second circuits of the printed circuit board to be simplified. The

patterns

20 and 30 can be energized.

Therefore, it is possible to shorten the process time to improve the productivity, and at the same time can significantly lower the defective rate generated by the conventional complex process by a simplified process, and provides the effect of improving the quality of the product.

4 to 8 illustrate a method of forming a precision printed circuit board for forming a circuit pattern and a conductive line in a through hole according to another embodiment of the present invention.

Referring to FIG. 4, first and

second circuit patterns

20 and 30 are formed on upper and lower surfaces of the insulating layer 10, and the first and second protective films are formed on the first and

second circuit patterns

20 and 30. After laminating 61 and 62, the hole 40 is processed.

Subsequently, a process of printing the conductive material 50 in the through hole 40 is performed, and a process of delaminating the first and second

protective films

61 and 62 is performed. In the present embodiment, the heat treatment process is performed after the conductive material 50 is printed in the through hole 40, and the conductive material 50 printed in the through hole 40 is cured and contracted during the heat treatment.

FIG. 5 illustrates that in addition to the embodiment of FIG. 4, the conductive plating film 70 may be further added to the conductive material 50 formed in the first and

second circuit patterns

20 and 30 and the through hole 40. It is shown. The action and effect of the plated film 70 is described above, so a detailed description thereof will be omitted.

Referring to FIG. 6, first and

second circuit patterns

20 and 30 are formed on the top and bottom surfaces of the insulating layer 10, and then the through holes 40 are formed. Subsequently, the non-conductive protective film 60 is laminated on the second circuit pattern 30, and after the conductive material 50 is printed in the through hole 40, the lamination process of the protective film 60 is performed. .

In the present embodiment, after the conductive material 50 is printed in the through hole 40, a heat treatment process is performed, and the conductive material 50 shrinks while curing the conductive material 50.

7 illustrates that in addition to the embodiment of FIG. 5, the conductive plating film 70 may be further added to the conductive material 50 formed in the first and

second circuit patterns

Referring to FIG. 8, first and

second circuit patterns

20 and 30 are formed on upper and lower surfaces of the insulating layer 10, and a non-conductive first protective film 61 is laminated on the second circuit pattern 30. do. Subsequently, the through hole 40 is formed, and the second protective film 62 is laminated on the first circuit pattern 20 by inverting the insulating layer 10 on which the through hole 40 is formed.

Subsequently, after the printing process of filling the conductive material 50 in the tonghol 40 is performed, the process of delaminating the first and second

protective films

61 and 62 is performed. In the present embodiment, after the conductive material 50 is printed in the through hole 40, a heat treatment process is performed, and the conductive material 50 shrinks while curing the conductive material 50.

9 illustrates that in addition to the embodiment of FIG. 8, the conductive plating film 70 may be further added to the conductive material 50 formed in the first and

second circuit patterns

Since the operation and effect of the method of forming the precision printed circuit board according to the embodiments of FIGS. 4 to 9 are similar to those of the embodiment of FIG. 2, detailed description thereof will be omitted.

In the above, the present invention has been described in detail with reference to preferred embodiments, but the present invention is not limited to the above embodiments, and many other modifications may be provided without departing from the scope of the present invention.

10 ... insulation layer

20 ... First Circuit Pattern

30 ... Second Circuit Pattern

40.hole

50 ... conductive material

60 ... Protective Film

61 ... the first protective film

62 ... 2nd protective film

70 ... plated film

Claims

Forming a conductive first circuit pattern 20 constituting a circuit on an upper surface of the insulating layer 10;

Forming a conductive second circuit pattern (30) constituting a circuit on a lower surface of the insulating layer (10);

Forming a through hole 40 penetrating the insulating layer 10 in a vertical direction;

Forming a conductive material 50 on the inner circumferential surface of the through hole 40 such that the first circuit pattern 20 and the second circuit pattern 30 are electrically connected by the through hole 40. Method for forming a precision printed circuit board to form a circuit pattern and a conductive line in the through hole.
The method of claim 1,

After the non-conductive protective film 60 is laminated on the second circuit pattern 30, the through hole 40 is formed, and after the conductive material 50 is formed on the inner circumferential surface of the through hole 40, the protective film ( 60) is a method for forming a precision printed circuit board for forming a circuit pattern and a conductive line in the through hole, characterized in that the delaminated.
The method of claim 1,

When the first circuit pattern 20 is formed, the insulating layer 10 is exposed to the outside at a portion where the through hole 40 is formed, and the through hole 40 when the second circuit pattern 30 is formed. The printed circuit board forming method for forming a circuit pattern and a conductive line in the through hole, characterized in that the insulating layer 10 is exposed to the outside at the site where the) is formed.
The method of claim 1,

The first and second circuit patterns 20 and 30 are patterned and printed,

The inner circumferential surface of the through hole (40) is a precision printed circuit board forming method for forming a circuit pattern and a conductive line in the through hole, characterized in that the conductive material (50) is printed.
The method of claim 1,

Forming a plating pattern 70 on the first and second circuit patterns 20 and 30 and the conductive material 50 formed on the inner circumferential surface of the through hole 40 to form a circuit pattern and a conductive line in the through hole. Precision printed circuit board formation method.
The method of claim 1,

And forming a conductive pattern (50) on the inner circumferential surface of the through hole (40), followed by heat treatment.
The method of claim 1,

After laminating the non-conductive first and second protective films 61 and 62 on the upper surfaces of the first and second circuit patterns 20 and 30, respectively, the through holes 40 are formed, and on the inner circumferential surface of the through holes 40. The first and second protective films (61, 62) are laminated after the conductive material (50) is formed, the method for forming a precision printed circuit board to form a conductive pattern and a conductive line in the through hole.
The method of claim 7, wherein

And forming a conductive pattern (50) on the inner circumferential surface of the through hole (40), followed by heat treatment.
The method of claim 1,

After forming the through hole 40, the non-conductive protective film 60 is laminated on the second circuit pattern 30, and the protective film is formed after the conductive material 50 is formed on the inner circumferential surface of the through hole 40. A method for forming a precision printed circuit board for forming a circuit pattern and a conductive line in a through hole, characterized by delaminating (60).
The method of claim 1,

The non-conductive first protective film is laminated on the second circuit pattern 30, the through hole 40 is formed, and the second protective film is laminated on the first circuit pattern 20, followed by the through hole 40. Forming the conductive material (50) on the inner peripheral surface of the circuit board, characterized in that the protective film (60) to form a circuit pattern and a conductive line forming method in the through hole.