200934317 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種線路板，且特別是有關於一種具 有射頻識別（Radio Frequency Identification, RFID)天線的 線路板之製作方法。 【先前技術】 φ 近年來，隨著射頻識別的技術進步，射頻識別標籤已 廣泛地使用於現代社會中。目前的射頻識別標籤不僅能作 為商品的防盜標籤，同時也能製作成智慧卡（smartcard)。 智慧卡就是一般所謂的晶片卡（或IC卡），其因為 具有天線線圈，所以能透過讀取機（reader)來與資訊系 統來進行資料處理。智慧卡所應用的領域相當廣泛。舉例 來說’現在的智‘慧卡已製作成絲卡、捷運所使用的悠遊 卡（easy card)以及手機内的用戶身份模組（SubscriberBACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board, and more particularly to a method of fabricating a circuit board having a radio frequency identification (RFID) antenna. [Prior Art] φ In recent years, with the advancement of radio frequency identification technology, radio frequency identification tags have been widely used in modern society. The current RFID tag can be used not only as a security tag for goods, but also as a smart card. A smart card is a so-called chip card (or IC card). Since it has an antenna coil, it can perform data processing with a data system through a reader. Smart cards are used in a wide range of fields. For example, the 'now Zhi' Hui card has been made into a silk card, an easy card used by the MRT, and a user identity module in the mobile phone (Subscriber)
Identity Module，SIM，也就是一般所稱的SIM卡）等。因 此，智慧卡已成為現代社會大眾不可或缺的重要工具。最 近由於手機歧地被㈣，因此有人將智慧卡與手機内的 電路整合成射頻識別線路板⑽IDcircuitb〇ard)。如此， 手=但具有基本的通訊能力，同時更具有智慧卡所具有 目則的射頻識別線路板是採用軟質銅箱基板⑺饮· :r_C〇atedLaminate，FCCL)製作而成。詳細而古，制 作射頻識職路㈣綠乃是將軟_絲板進行微影二 此這種用_製作射賴麟路㈣方法 的雷阻偽古，、在頻天線 能’且會影響射頻天線的 電磁感應I力。此外，銀膠的成本比銅 用龥朦劁於知鞋..... ^戶斤以上述利 ❹ ❹ 的缺點 200934317 使軟質鋪基板上的銅落形成射頻天線。缺 製作過程費時以及成本太高的缺點。 會每成 另一種製作射頻識別線路板的方法是將 乍天線線圈。然而，銀的導電係數比“，因 用銀膠製作智慧卡的方法亦有成本太高 【發明内容】 方法本^\提供—種具有射頻識別天線的線路板之製作 ^製作具有較佳電磁感應能力的天線^ 方法供—種具有咖朗天_祕板之製作 本發別線路板的製作成本。 方法，其包括首先種具在有=別天線的線路板之製作 第-表面《及相對ί4:=:成多個貫穿基材之--圖案層於基材的第—=面：：著第第 於基材的第二表面上 軸帛-圖案層 蓋第-圖案層、第二圖2 ’形成-圖案化導體層’其覆 案化導體層包括二以及這些貫孔之孔壁，其中圖 在本發明之-實施例中，上述之形成第一圖案層與第 200934317 導電油墨於基材上。 括形成帛明Γ一貫施例中，在形成第一圖案層之前更包 括形成-第—保護層於第二表面上。 咖 法包實施例中’上述之形成第—保護層的方 凌巴栝將一膠帶貼附於第二表面上。 括:ίί發在形成第二圖案層之前更包 第一圖案層上。…蔓日。接著’形成-第二保護層於 實施例中，上述之形成第二㈣層的方 无l括將一膠帶貼附於第一圖案層上。 方法圖η ’上述之形成圖案化導體層的 電電鑛或電鑛。第二圖案層以及這些貫孔進行無 .馨 本發明藉由第一圖案層與第一 =線路(即上述之_導：?其 可天線迴路’另—層線路可作為訊號線路，供 射頻識別天線的線路板。此外出具有 f姆程來製作線路板，所以微 本發明更具有低製作成本的優點。 打而5 ’ t讓本發明之上述概和優點能更明 舉較佳實施例，並配合所_式，作詳細朗如下了文特 【實施方式】 7 200934317 圖1A〜圖1E是本發明一實施例之具有射頻識別天線 ，線路板之製作方法的步驟示意®。在此需事先說明的 疋’圖1A〜圖1E所示之線路板的製作方法僅是用來舉例 說明，’以使本發明所屬領射的具树常知識者能具體實 施而為之，因此本發明之範#並不僅限於® 1A〜圖1D所 ，露的線路板的製作方法，且還包括其他未有圖式揭露的 實施為此，本發明之範•仍應_請專職圍為準。 參閱圖，圖1A中的步驟A〜B乃是將一基材 110貝穿:以形成多個貫孔112。這些貫孔112是貫穿基材 110的第表面114與一第二表面ns而形成，其中第 :ί面m目ϊ於第二表面116。這些貫孔112可以作為 S「線，層電性連接的導電通孔（ρι— Th酿幽触， k些貝孔i12可以利用機械鑽孔、雷射燒匕似 ablation)或是蝕刻的方法形成。 j閱圖1B’圖m中的步驟A〜c是在基材削的 、φ 114上形成一篦一圇安駄，丄 ，，Identity Module, SIM, which is commonly referred to as SIM card, etc. Therefore, smart cards have become an indispensable tool for the modern public. Recently, due to the dislocation of the mobile phone (4), some people integrated the smart card with the circuit inside the mobile phone into a radio frequency identification circuit board (10) IDcircuitb〇ard). In this way, the hand=but has the basic communication capability, and at the same time, the RFID card with the purpose of the smart card is made of soft copper box substrate (7) drink: r_C〇atedLaminate, FCCL). Detailed and ancient, the production of radio frequency identification road (four) green is to soft _ silk plate for lithography two of this use _ production shooting Lai Lin Road (four) method of lightning resistance pseudo-ancient, the frequency antenna can 'and will affect the RF The electromagnetic induction I force of the antenna. In addition, the cost of silver glue is better than that of copper. It is a disadvantage of the above-mentioned benefits. 200934317 The copper on the soft-laid substrate forms an RF antenna. The shortcomings of the production process are time consuming and costly. Every other way to make a radio frequency identification circuit board is to twist the antenna coil. However, the conductivity ratio of silver is higher than that of the method of making a smart card with silver glue. [Inventive content] The method provides a circuit board with a radio frequency identification antenna. The ability of the antenna ^ method for the production cost of the production of the circuit board with the curry _ secret board. The method, which includes the first production of the circuit board with the = other antenna - the surface - and relative ί4 :=: a plurality of through-substrate--the pattern layer on the first surface of the substrate:: on the second surface of the substrate, the axis-pattern layer cover first-pattern layer, the second figure 2 The 'form-patterned conductor layer' includes a patterned conductor layer including two holes and a hole wall of the through hole, wherein in the embodiment of the invention, the first pattern layer and the 200934317 conductive ink are formed on the substrate In the consistent embodiment, the formation of the first pattern layer further includes forming a -first protective layer on the second surface. In the embodiment of the coffee package, the above-mentioned square forming the first protective layer Bayu attaches a tape to the second surface. ί 更 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在Attached to the first pattern layer. Method η 'the above-mentioned electroforming or electric ore forming the patterned conductor layer. The second pattern layer and the through holes are performed without the present invention by the first pattern layer and the first = The line (that is, the above-mentioned _guide: its antenna loop) can be used as a signal line for the circuit board of the radio frequency identification antenna. In addition, the circuit has a circuit to make the circuit board, so the micro-invention is more low-production. Advantages of the cost. The advantages of the above-mentioned general advantages of the present invention can be more clearly described in the preferred embodiment, and the details are as follows: [Embodiment] 7 200934317 FIG. 1A to FIG. 1E It is a schematic diagram of a method for manufacturing a circuit board with a radio frequency identification antenna according to an embodiment of the present invention. The method for manufacturing the circuit board shown in FIG. 1A to FIG. 1E, which is described in advance, is for illustrative purposes only. 'To make the invention belong Those skilled in the art can implement it specifically. Therefore, the invention of the present invention is not limited to the method of manufacturing the exposed circuit board of the type 1A to FIG. 1D, and includes other implementations not disclosed in the drawings. The method of the present invention should still be based on the full-time. Referring to the drawings, steps A to B in Fig. 1A are to pierce a substrate 110 to form a plurality of through holes 112. These through holes 112 are through-bases. The first surface 114 of the material 110 is formed with a second surface ns, wherein the first surface is viewed from the second surface 116. The through holes 112 can serve as S" lines, electrically connected through holes (ρι- Th brewing touch, k some shell holes i12 can be formed by mechanical drilling, laser burning like ablation) or etching. J. Figure 1B' Figure A in step m ~ c is cut in the substrate, Forming a 囵 囵 丄 on the φ 114, 丄,,
114。形成第―匾 基材110的第 屬成分的油墨， 仃步驟Β，形成第一圖案層13〇於基材110 4上，而第一圖案層130局部覆蓋第一表面 圖案層13G的方法可以是印刷—導電油墨於114. Forming the ink of the first component of the first substrate 110, and then forming the first pattern layer 13 on the substrate 110 4, and the method of partially covering the first surface pattern layer 13G by the first pattern layer 130 may be Printing - conductive ink
例如疋3纪或其他金屬的油墨。在印刷導 8 200934317 電油墨之後，部分導電油墨會滲入這些貫孔112内，以至 於第一圖案層130能延伸到這些貫孔112的孔壁。之後， 執行步驟C，移除第一保護層120。 請參閱圖1C，圖1C中的步驟A〜C是在基材110的 第二表面116上形成一第二圖案層150。在此須事先說明 的是，圖1C的各個步驟中所示的圖式是根據圖1B的步驟 C中的圖式翻轉之後所緣製而成。關於圖1C所示的步驟， β 首先，先執行步驟A，形成一第二保護層140於第一圖案 層130上，其中第二保護層140覆蓋這些貫孔112。形成 第二保護層140的方法可以與形成第一保護層120的方法 相同。也就是說，形成第二保護層140的方法可以是將膠 帶貼附於第一圖案層130上。 接著，執行步驟B，形成第二圖案層150於第二表面 116上，其中第二圖案層150局部覆蓋第二表面116。形成 第二圖案層150的方法可以與前述形成第一圖案層130的 方法相同，即第二圖案層150是將導電油墨印刷於第二表 © 面116上而形成。當然，此導電油墨可以是含有鈀或其他 金屬的油墨。在印刷導電油墨之後，部分導電油墨亦會滲 入這些貫孔112内，以至於第二圖案層150能延伸至這些 貫孔112的孔壁。之後，執行步驟C，將第二保護層140 移除。 值得說明的是，前述所介紹的第一圖案層130與第二 圖案層150是利用第一保護層120與第二保護層140遮蓋 基材110，並搭配印刷導電油墨的方式而形成。然而，在 200934317 例中，第一圖案層130與第二圖案層15〇亦可以在 厂保護層120與第二保護層140的條件下，直接印 在基材U〇上而形成。也就是說，第一圖案層 芦一圖案層15〇可以不透過第一保護層120與第二 Ι^ΐβ9^40而直接形成在基材H0的表面上。因此，前述 # β圖1C所揭露的第一保護層120與第二保護層140 僅疋^例_，在此並魏定本發明。 ❹ ❹ 宴第」if圖1D ’之後，形成一圖案化導體層160，其覆 二及這些貫孔112之 ===:形成圖案化導體層_方法 可以在未有外加電流她也化導體層160 此外，由於第一圖案ϋ用氧化遇原反應來形成。 電油墨所形成，也就是說第案/ 15〇是由導 ^具有導電性質，因此亦可曰 案層150以及這些貫孔112 130、第一圖 圖案化導體層在神電較钱，以形成 茱化導體層160形成之德，For example, 疋 3 or other metal inks. After the conductive ink is printed, a portion of the conductive ink penetrates into the through holes 112, so that the first pattern layer 130 can extend to the wall of the through holes 112. Thereafter, step C is performed to remove the first protective layer 120. Referring to FIG. 1C, steps A-C in FIG. 1C are to form a second pattern layer 150 on the second surface 116 of the substrate 110. It is to be noted here that the pattern shown in the respective steps of Fig. 1C is formed after the pattern is reversed according to the step C in Fig. 1B. With respect to the step shown in FIG. 1C, β first, step A is performed first to form a second protective layer 140 on the first pattern layer 130, wherein the second protective layer 140 covers the through holes 112. The method of forming the second protective layer 140 may be the same as the method of forming the first protective layer 120. That is, the method of forming the second protective layer 140 may be to attach the tape to the first pattern layer 130. Next, step B is performed to form a second pattern layer 150 on the second surface 116, wherein the second pattern layer 150 partially covers the second surface 116. The method of forming the second pattern layer 150 may be the same as the method of forming the first pattern layer 130 described above, that is, the second pattern layer 150 is formed by printing a conductive ink on the second surface 116. Of course, the conductive ink may be an ink containing palladium or other metals. After printing the conductive ink, a portion of the conductive ink also penetrates into the through holes 112, so that the second pattern layer 150 can extend to the wall of the through holes 112. Thereafter, step C is performed to remove the second protective layer 140. It should be noted that the first pattern layer 130 and the second pattern layer 150 described above are formed by covering the substrate 110 with the first protective layer 120 and the second protective layer 140, and are formed by printing conductive ink. However, in the case of 200934317, the first pattern layer 130 and the second pattern layer 15 can also be formed by directly printing on the substrate U〇 under the conditions of the factory protective layer 120 and the second protective layer 140. That is, the first pattern layer of the reed pattern layer 15 can be formed directly on the surface of the substrate H0 without being transmitted through the first protective layer 120 and the second layer. Therefore, the first protective layer 120 and the second protective layer 140 disclosed in the above #βFig. 1C are only exemplified, and the present invention is hereby incorporated. ❹ 第 第 "if Figure 1D", after forming a patterned conductor layer 160, which covers the second and the through holes 112 ===: forming a patterned conductor layer _ method can also be used in the conductor layer without the application of current Further, since the first pattern is formed by oxidation with an original reaction. The electric ink is formed, that is to say, the first case / 15 〇 is electrically conductive, so that the ruthenium layer 150 and the through holes 112 130, the first patterned conductor layer are more expensive in the gods to form The formation of the deuterated conductor layer 160,
採用無電讀或電鍍法形_ m咐U 錫或鎳金特料，其覆蓋於_化導電層 = 氧化。如此，具有射頻識別天線的線路板刚基本 成。 圖2A是根據圖1A至圖m所示的線 所製成的線路板之俯視圖，而圖2B是圖2A所示的^路板 200934317Use electroless read or electroplated _ m咐U tin or nickel gold special material, which covers the _ conductive layer = oxidation. Thus, the circuit board with the radio frequency identification antenna is just basic. 2A is a plan view of a circuit board made according to the line shown in FIG. 1A to FIG. 2B, and FIG. 2B is a circuit board shown in FIG. 2A.
之仰視圖。請同時參閱圖2A與圖2B，圖2A與圖2B所示 的線路板100 ’其圖案化導體層160包括一天線迴路部分 162 (圖2B所示的斜線部份）以及一訊號線路部分164。 天線迴路部分162用以負責接收讀取機所發出的特定射頻 訊號，並利用此射頻訊號感應而產生感應電流。如此，線 路板100具有射頻識別的功能。訊號線路部分164用以提 供手機、個人數位助理器（personal Digital Assistant，PDA) 或筆記型電腦等可攜式電子裝置的基本功能。 ， 以圖2A為例，圖2A所示的訊號線路部分164例如 是應用在手機的按鍵之線路，而訊號線路部分164包括二 傳輸線路164a、164b以及一按鍵觸發線路164c，以使使 用者得以藉由訊號線路部分164來操作手機。此外，基材 110更可以具有多個傳動孔118,因此基材11〇能利用這此 傳動孔118不間斷地進行後續的製程，進而減少製程 要的時間。 & 為了避免天線迴路部分162内的感應電流與訊號線路 部分164内的訊號互相干擾，天線迴路部分162與訊 路部分164會設計成二者電性絕緣。也就是說，^線^_ 部分162與訊號線路部分164並未電性連接，如圖' 之3 示。 所 值得注意的是，本實施例的線路板之製作方法不 以製作同時具有天線迴路部分162以及訊號線路部八= 的線路板⑽，更可以製作具有二層訊號線路的而 天線的線路板，或是具有二層_天_線路而無 11The bottom view. 2A and 2B, the patterned conductor layer 160 of the circuit board 100' shown in FIGS. 2A and 2B includes an antenna loop portion 162 (hatched portion shown in FIG. 2B) and a signal line portion 164. The antenna loop portion 162 is configured to receive a specific RF signal from the reader and use the RF signal to generate an induced current. As such, the circuit board 100 has a radio frequency identification function. The signal line portion 164 is used to provide basic functions of a portable electronic device such as a mobile phone, a personal digital assistant (PDA), or a notebook computer. As shown in FIG. 2A, the signal line portion 164 shown in FIG. 2A is, for example, a line applied to a button of a mobile phone, and the signal line portion 164 includes two transmission lines 164a and 164b and a button trigger line 164c for the user to The handset is operated by the signal line portion 164. In addition, the substrate 110 can have a plurality of transmission holes 118, so that the substrate 11 can utilize the transmission holes 118 to perform subsequent processes without interruption, thereby reducing the time required for the process. & In order to prevent the induced current in the antenna loop portion 162 from interfering with the signals in the signal line portion 164, the antenna loop portion 162 and the signal portion 164 are designed to be electrically insulated from each other. That is to say, the ^ line ^_ portion 162 and the signal line portion 164 are not electrically connected, as shown in FIG. It should be noted that the method for fabricating the circuit board of the present embodiment does not make a circuit board (10) having both the antenna loop portion 162 and the signal line portion VIII, and can also fabricate a circuit board having a two-layer signal line and an antenna. Or have two layers _ day _ line without 11
200934317 路的線路板。也就是說，太與 可以廣泛地應用於任何且有路板之製作方法亦 線路板之製程。7、有—層線路或二層以上之線路的 成圖本發明藉由第一圖案層與第二圖宰層來形 層線路可作為天線迴路，另 j路且其中一 棱供手機、獻触助理器絲 神 的線路板，以將智*卡^ 具有射頻識別天線 4#軸翻魏整合在可攜式電子 : X 3収料無需使祕影與侧製程來製 ^路Ϊ，也不用印刷轉來形成線路，因此相較於習知 何而5 ’本發明更具有低製作成切及製作過程簡單 優點。 —雖然本發明已哺佳實施·露如上，然其並非用以 限定本發明’任何所屬技術領域巾具有通常知識者，在不 脫離本發明之精神和範#可作些許之更動與潤飾， 因此本發明之保護範圍當視後附之申請專利範圍所界定者 為準。 【圖式簡單說明】 圖1A〜圖1E是本發明一實施例之具有射頻識別天線 的線路板之製作方法的步驟示意圖。 圖2A是根據圖1A至圖1E所示的線路板之製作方法 所製成的線路板之俯視圖。 12 200934317 圖2B是圖2A所示的線路板之仰視圖 【主要元件符號說明】 100 :線路板 110 基材 112 114 116 118 120 130 140 150 160 貫孔 第一表面 第二表面 傳動孔 第一保護層 第一圖案層 第二保護層 第二圖案層 圖案化導體層 162 天線迴路部分 164 訊號線路部分 164a、164b :傳輸線路 ⑩ 164c :按鍵觸發線路 170 :抗氧化層 13200934317 Road circuit board. That is to say, too and can be widely applied to any process that has a circuit board and a circuit board. 7. Mapping of a layered circuit or a layer of two or more layers. The present invention can be used as an antenna loop by using a first patterned layer and a second patterned layer, and the other side is provided for the mobile phone and the touch. The assistant's silk god's circuit board is to integrate the smart card with the radio frequency identification antenna 4# axis in the portable electronic: X 3 receiving material does not need to make the secret shadow and side process to make the road, nor print In turn, the circuit is formed, so that the present invention has the advantages of low production cut and simple manufacturing process compared to conventional knowledge. </ RTI> Although the present invention has been implemented as described above, it is not intended to limit the invention. Any subject matter of the technical field of the present invention may be modified and retouched without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A to FIG. 1E are schematic diagrams showing the steps of a method for fabricating a circuit board having a radio frequency identification antenna according to an embodiment of the present invention. Fig. 2A is a plan view of a wiring board produced in accordance with the method of fabricating the wiring board shown in Figs. 1A to 1E. 12 200934317 FIG. 2B is a bottom view of the circuit board shown in FIG. 2A [Main component symbol description] 100: circuit board 110 substrate 112 114 116 118 120 130 140 150 160 through hole first surface second surface drive hole first protection Layer first pattern layer second protective layer second pattern layer patterned conductor layer 162 antenna loop portion 164 signal line portion 164a, 164b: transmission line 10 164c: button trigger line 170: oxidation resistant layer 13