TWI550522B - Method for manufacturing rfid tag - Google Patents

Description

RFID tag manufacturing method

The present invention relates to a method of manufacturing an RFID tag.

Conventional RFID tags are manufactured by forming an RFID antenna and a wafer on a film, and then attaching the film to a substrate. The process is complicated and time consuming, and the cost is further increased.

In addition, most RFID antennas are wound around a metal wire and fixed on a film. The cost is relatively high, and the production efficiency is extremely low, and it is difficult to produce a contoured circuit.

In view of this, how to produce RFID tags in a relatively simple process step and how to improve the quality of the RFID antenna circuit while increasing production efficiency and reducing costs has become a problem that the industry is eager to solve.

The main object of the present invention is to provide a method for manufacturing an RFID tag which has a relatively simple procedure and can simplify the process and reduce the cost.

In order to achieve the above object, the present invention provides a method for manufacturing an RFID tag, comprising the steps of: preparing a substrate, the substrate is made of PET and having a first surface and a second surface; and color printing: the substrate Color printing on the first side to form a color printing layer; feeding: attaching a catalyst ink to the area of the second surface of the substrate to form a specific image The ink layer is formed by: immersing the substrate in a plating bath to perform electroless plating on the ink layer on the substrate to form a copper metal RFID antenna on the ink layer; and flipping the crystal on the second side of the substrate Positioning a wafer; upper barrier layer: attaching a release paper to the second side of the substrate to cover the RFID antenna and the wafer to complete an RFID tag.

However, the present invention also provides another sequence of steps: preparing a substrate, the substrate is made of PET and having a first surface and a second surface; and feeding: a catalyst ink is attached to the substrate a second surface portion of the area to form a specific pattern of the ink layer; a plating: the substrate is immersed in a plating tank to chemically coat the ink layer on the substrate to form a copper metal RFID antenna on the ink layer; color printing: Color printing on the first side of the substrate to form a color printing layer; flip chip: a wafer is disposed on a second surface of the substrate at a predetermined position; and an upper barrier layer: a second release paper attached to the substrate An RFID tag is completed to cover the RFID antenna and the chip.

Or another step sequence: preparing a substrate, the substrate is made of PET and has a first surface and a second surface; and feeding: a catalyst ink is attached to the substrate The surface area of the surface is formed to form a specific pattern of the ink layer; the plating: the substrate is immersed in a plating bath to chemically coat the ink layer on the substrate to form a copper metal RFID antenna on the ink layer; a substrate is disposed at a predetermined position on the second surface of the substrate; an upper barrier layer: a release paper is attached to the second surface of the substrate to cover the RFID antenna and the wafer to complete an RFID tag; A film printed with a color layer is attached to the first side of the substrate.

Therefore, compared with the conventional technology, the present invention does not need to attach an RFID antenna to a film before attaching the film to the substrate, and only needs to be formed directly on the substrate by using an electroless plating film. The shape of the wire is quite convenient.

11‧‧‧Substrate

S21‧‧‧ Preparation

12‧‧‧Color printing layer

12'‧‧‧ film

13‧‧‧RFID antenna

14‧‧‧ wafer

15‧‧‧away paper

S11‧‧‧ Preparation

S12‧‧ color printing

S13‧‧‧Upper protective layer

S14‧‧‧Feeding

S15‧‧‧ plating

S16‧‧‧Flip chip

S17‧‧‧ upper barrier

S22‧‧‧ loading

S23‧‧‧ plating

S24‧‧ color printing

S25‧‧‧Upper protective layer

S26‧‧‧Flip chip

S27‧‧‧ upper barrier

S31‧‧‧ Preparation

S32‧‧‧ loading

S33‧‧‧ plating

S34‧‧‧Flip chip

S35‧‧‧ Upper barrier

S36‧‧‧Upper color layer

Figure 1 is a flow chart of the steps of the present invention.

2 is a top plan view of the RFID tag of the present invention.

Figure 3 is an exploded perspective view of the RFID tag of the present invention.

Figure 4 is a bottom perspective view of the RFID tag of the present invention.

Figure 5 is a flow chart showing the steps of the second embodiment of the present invention.

Figure 6 is a flow chart showing the steps of the third embodiment of the present invention.

Fig. 7 is an exploded perspective view showing the RFID tag of the third embodiment of the present invention.

The following is a description of the possible embodiments of the present invention, and is not intended to limit the scope of the invention as claimed.

Referring to FIG. 1 to FIG. 4, the present invention provides a method for manufacturing an RFID tag, comprising the following steps: preparing a material S11: preparing a substrate 11 which is PET, PP, ABS, PC, PS, PMMA or TYVEK (Tekvik) Made of and having a first side and a second side.

Color printing S12: performing color printing on the first surface of the substrate 11 to form a color printing layer 12.

The upper protective layer S13: a transparent protective layer is attached on the first surface of the substrate 11 to cover the color printed layer.

Feeding S14: attaching a catalyst ink to the second surface portion of the substrate 11 to form a specific pattern of the ink layer. In this embodiment, the catalyst ink is attached to the substrate by printing or spraying. The second side of the 11 and the pattern formed by the catalyst ink is identical to the RFID antenna line to be formed.

The plating layer S15: the substrate 11 is immersed in a plating bath to chemically coat the ink layer on the substrate 11 to form a copper metal RFID antenna 13 on the ink layer. In this embodiment, the composition of the catalyst ink The resin and the palladium metal are contained, and the liquid contained in the plating tank contains copper ions and a reducing agent, and the copper ions are catalyzed by the palladium metal to be reduced to copper atoms by the reducing agent and deposited on the ink layer to form copper. Metallic RFID antenna 13.

The flip chip S16: a wafer 14 is disposed at a predetermined position on the second surface of the substrate 11.

The upper barrier layer S17: a release paper 15 is attached to the second surface of the substrate 11 to cover the RFID antenna 13 and the wafer 14 to complete an RFID tag. In this embodiment, the adhesive is The release paper 15 is bonded to the second side of the substrate 11. In other embodiments, any material of PET, PP, ABS, PC, PS, PMMA or TYVEK corresponding to the substrate size may be selected by a thermocompression bonding method (such as high-frequency means), and the barrier layer covers the second surface of the substrate.

Referring to FIG. 2 to FIG. 5, in the second embodiment of the present invention, the following steps may be further included: preparing the material S21: preparing a substrate 11 which is PET, PP, ABS, PC, PS, PMMA or TYVEK ( Made by Tevek and having a first side and a second side.

Feeding S22: attaching a catalyst ink to the second surface portion of the substrate 11 to form a specific pattern of the ink layer. In this embodiment, the catalyst ink is printed or sprayed. The coating means is attached to the second side of the substrate 11, and the pattern formed by the catalyst ink is identical to the RFID antenna line to be formed.

The plating layer S23: the substrate 11 is immersed in a plating bath to chemically coat the ink layer on the substrate 11 to form a copper metal RFID antenna 13 on the ink layer. In this embodiment, the composition of the catalyst ink The resin and the palladium metal are contained, and the liquid contained in the plating tank contains copper ions and a reducing agent, and the copper ions are catalyzed by the palladium metal to be reduced to copper atoms by the reducing agent and deposited on the ink layer to form copper. Metal RFID antenna.

Color printing S24: performing color printing on the first surface of the substrate 11 to form a color printing layer 12.

The upper protective layer S25: a transparent protective layer is attached on the first surface of the substrate 11 to cover the color printed layer 12.

The flip chip S26: a wafer 14 is disposed at a predetermined position on the second surface of the substrate 11.

The upper barrier layer S27: a release paper 15 is attached to the second surface of the substrate 11 to cover the RFID antenna 13 and the wafer 14 to complete an RFID tag. In this embodiment, the adhesive is The release paper 15 is bonded to the second side of the substrate 11. In other embodiments, any material of PET, PP, ABS, PC, PS, PMMA or TYVEK corresponding to the substrate size may be selected by a thermocompression bonding method (such as high-frequency means), so that the barrier layer covers the second surface of the substrate. .

In another embodiment shown in FIG. 6 and FIG. 7, a further sequence of steps is included: preparation S31: preparing a substrate 11, which is PET, PP, ABS, PC, PS, PMMA or TYVEK ( Made by Tevek and having a first side and a second side.

Feeding S32: attaching a catalyst ink to the second surface portion of the substrate 11 to form a specific pattern of the ink layer, more specifically, attaching the catalyst ink to the substrate 11 by means of printing or spraying. On the second side, the pattern formed by the catalyst ink is identical to the RFID antenna line to be formed, and the composition of the catalyst ink comprises a resin and palladium metal.

S33: the substrate 11 is immersed in a plating bath to chemically coat the ink layer on the substrate 11, and a copper metal RFID antenna 13 is formed on the ink layer, and the liquid contained in the plating tank contains copper ions. With the reducing agent, the copper ions are catalyzed by the palladium metal and reduced by the reducing agent into copper atoms and deposited on the ink layer to form a copper metal RFID antenna 13.

The flip chip S34: a wafer 14 is disposed at a predetermined position on the second surface of the substrate 11.

Upper barrier layer S35: a release paper 15 is attached to the second side of the substrate 11 to cover the RFID antenna 13 and the wafer 14 to complete an RFID tag, more specifically, a glue is used to separate the The paper 15 is adhered to the second side of the substrate 11. In other embodiments, any material of PET, PP, ABS, PC, PS, PMMA or TYVEK corresponding to the substrate size may be selected by a thermocompression bonding method (such as high-frequency means), so that the barrier layer covers the second surface of the substrate. .

The upper color layer S36: a film 12' printed with a color layer is attached to the first surface of the substrate 11.

According to the above manufacturing method, the present invention can provide an RFID tag having a simple structure, and the manufacturing process is relatively simple, and the shape of the line of the RFID antenna can be formed more quickly and accurately by the electroless plating film, which is highly effective.

S11‧‧‧ Preparation

S12‧‧ color printing

S13‧‧‧Upper protective layer

S14‧‧‧Feeding

S15‧‧‧ plating

S16‧‧‧Flip chip

S17‧‧‧ upper barrier

Claims (10)

A method for manufacturing an RFID tag, comprising the steps of: preparing a substrate, the substrate having a first surface and a second surface; and printing: forming a color printing layer on the first surface of the substrate; and protecting the upper layer: Attaching a transparent protective layer on the first surface of the substrate to cover the color printing layer; feeding: an ink layer attached to the second surface portion of the substrate by a catalyst ink to form a specific pattern; The substrate is immersed in a plating bath to chemically coat the ink layer on the substrate to form a copper metal RFID antenna on the ink layer; and a wafer is disposed on a second surface of the substrate at a predetermined position. The RFID tag manufacturing method according to claim 1, wherein the material of the substrate is selected from the group consisting of PET, PP, ABS, PC, PS, PMMA or TYVEK. The RFID tag manufacturing method according to claim 1, wherein in the "feeding" step, the catalyst ink is attached to the second surface of the substrate by means of printing or spraying. The method of manufacturing an RFID tag according to claim 1, wherein the component of the catalyst ink comprises a resin and a palladium metal, and in the step of "plating", the liquid contained in the plating tank contains copper ions and a reducing agent. The method for manufacturing an RFID tag according to claim 1, wherein the step of "upper barrier layer" is further performed after the "flip-chip" step, and in the step of "upper barrier layer", the adhesive is removed by a glue. Paper is bonded to the second side of the substrate. An RFID tag manufacturing method comprising the following steps: Preparation: preparing a substrate having a first surface and a second surface opposite to each other; feeding: an ink layer attached to the second surface portion of the substrate by a catalyst ink to form a specific pattern; The substrate is immersed in a plating bath to chemically coat the ink layer on the substrate to form a copper metal RFID antenna on the ink layer; color printing: forming a color printing layer on the first surface of the substrate; upper protective layer: A transparent protective layer is attached on the first surface of the substrate to cover the color printing layer; and a wafer is disposed on a second surface of the substrate at a predetermined position. The RFID tag manufacturing method according to claim 6, wherein the material of the substrate is selected from the group consisting of PET, PP, ABS, PC, PS, PMMA or TYVEK. The method of manufacturing an RFID tag according to claim 6, wherein in the "feeding" step, the catalyst ink is attached to the second side of the substrate by means of printing or spraying. The method of manufacturing an RFID tag according to claim 6, wherein the component of the catalyst ink comprises a resin and a palladium metal, and in the step of "plating", the liquid contained in the plating tank contains copper ions and a reducing agent. The method of manufacturing an RFID tag according to claim 6, wherein the step of "upper barrier layer" is further performed after the "flip-chip" step, and in the step of "upper barrier layer", the adhesive is removed by a glue. Paper is bonded to the second side of the substrate.