CN101460017B - Thru-hole electroplating method for printed circuit board - Google Patents
Thru-hole electroplating method for printed circuit board Download PDFInfo
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- CN101460017B CN101460017B CN2007101957087A CN200710195708A CN101460017B CN 101460017 B CN101460017 B CN 101460017B CN 2007101957087 A CN2007101957087 A CN 2007101957087A CN 200710195708 A CN200710195708 A CN 200710195708A CN 101460017 B CN101460017 B CN 101460017B
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- printed substrate
- dry film
- clamping zone
- copper foil
- printed circuit
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Abstract
The invention provides an electric plating method of conducting holes of printed circuit boards, which comprises providing a printed circuit board, and jointing dry films on a copper foil on the printed circuit board, designing a filin negative, and permeating the filin negative to expose the dry films, immerging the printed circuit board whose dry films are exposed into developing liquid for developing, exposing the conducting hole, keeping dry films on part of the copper foil formed with the circuit on the printed circuit board and part of a clamping area, clamping the clamping area of the printed circuit board through a metal clamp, and immerging the printed circuit board into a plating bath for plating. As part of the clamping area of the metal clamp is kept with dry films, the metal clamp does not have bigger current, thereby not causing disadvantage effects to nearby copper foil coating distribution.
Description
Technical field
The present invention relates to the printed substrate field, more particularly, relate to the thru-hole electroplating method of printed substrate.
Background technology
As everyone knows, in the process for making of printed substrate, in order to realize the current lead-through between the circuit, this manufacturing process comprises the brill via, and makes the metallized operation of this via.
Via metallization is that the copper facing by via realizes.Before to via copper facing, because the hole wall of described via can not conduct electricity, thereby, can chemical copper be deposited on the hole wall by utilizing inner hole deposition long-pending Pd catalysis electrolytic copper free and HCHO effect, on hole wall, adhere to one deck than the brass bed course that approaches; Perhaps by making other electric conducting materials such as graphite applying on the hole wall of via, thereby hole wall can be conducted electricity, be beneficial to electroplating work procedure subsequently.
When via copper facing, because the Copper Foil in printed wire slab products two sides need have preset thickness to form circuit, thereby, for the ease of in the formation of operation ectomesoderm circuit subsequently with help the bending of product flexing, before the plating of via, need carry out the graphic making of hole plating copper.
Specifically, earlier dry film is fitted on the Copper Foil of printed substrate two sides; See through and be manufactured with the film of line pattern to dry film irradiation ultraviolet radiation (exposure) in advance; Develop then, the Copper Foil that form circuit is covered by dry film; Carry out the electroplating operations of hole plating copper again.At this moment, because the Copper Foil of circuit to be formed protects by dry film, thereby in the process of hole plating copper, this part Copper Foil can plated with copper, and thickness can not increase.
For flexible circuit board, because bending appears in flexible circuit board easily, thereby when electroplating, need keep flexible circuit board to be in reliable firm position, also need to make the Copper Foil of flexible circuit board to be connected simultaneously with the negative electricity of DC power supply.Therefore, as shown in Figure 1, when traditional plating, printed substrate 1 is clamped four sides (being the clamping zone 2 that dotted line fenced up among Fig. 1) of this printed substrate 1 by metal fixture usually and is able to firmly the Copper Foil of printed substrate 1 is connected with the negative electricity of DC power supply.
Yet, in electroplating process, since metal fixture by the good conductor material of electricity make (as, iron or copper etc.) and surface area bigger, the electric current of metal fixture self is bigger, thereby the concentration that is close to copper ion in the zone that this metal fixture electroplates is higher, make the electrodeposited coating that forms on this metal fixture thicker, it is also thicker to electroplate the coating that forms on the Copper Foil in the described clamping zone simultaneously; But the copper ion in the described metal fixture near zone is relatively low, thereby, near the clamping zone Copper Foil but makes the coating of electroplating formation on this Copper Foil thin partially because copper ion concentration is lower, make the electrodeposited coating thickness that forms on the via hole wall in this part Copper Foil also thin partially.As shown in Figure 1, owing to a part of via 3 is positioned among the part of contiguous clamping zone, thereby the copper coating that forms on the hole wall of this part via 3 is thin partially, and causes this printed substrate to be scrapped.
Thereby in traditional thru-hole electroplating method, the existence of metal fixture can have a negative impact to the distribution of electrodeposited coating on the printed substrate, causes the skewness of electrodeposited coating.
Summary of the invention
The objective of the invention is to overcome in traditional thru-hole electroplating method, metal fixture distributes to electrodeposited coating on the printed substrate and has the defective of adverse effect, and a kind of thru-hole electroplating method that can avoid the defective that metal fixture has a negative impact to the distribution of electrodeposited coating on the printed substrate is provided.
The thru-hole electroplating method of printed substrate provided by the invention comprises the steps:
A., printed substrate is provided, and dry film is fitted on the Copper Foil of printed substrate;
B. design film egative film, and described dry film is exposed through described film egative film;
C. the printed substrate after the dry film exposure is immersed in the developer solution and develop, described via is come out, and keeping dry film on the part Copper Foil that will form circuit on the described printed substrate and on the part clamping zone;
D. by the clamping zone of metal fixture clamping printed substrate, will electroplate in the printed substrate immersion plating groove.
In the method for the invention, because the part in the clamping zone of metal fixture remains with dry film, thereby, in carrying out electroplating process, the metal fixture that is clamped in this part clamping zone is not electrically connected with the Copper Foil of printed substrate, naturally can not have bigger electric current, not have a negative impact thereby can not distribute near the coating of the Copper Foil this part clamping zone.Simultaneously, clamping zone also has the part that does not keep dry film, and the metal fixture continuation meeting that is clamped in this part clamping zone is electrically connected with Copper Foil on the printed substrate, allows the carrying out of electroplating process.
Description of drawings
Fig. 1 is in the traditional via copper electroplating method, when printed substrate is carried out thru-hole electroplating, and the schematic diagram of the clamping zone on the printed substrate;
Fig. 2 is in the via copper electroplating method of the present invention, when printed substrate is carried out thru-hole electroplating, and the schematic diagram of the clamping zone on the printed substrate.
Embodiment
Below with reference to accompanying drawing the specific embodiment of the present invention is described in detail.
A kind of thru-hole electroplating method of printed substrate, this method comprises the steps:
A., printed substrate is provided, and dry film is fitted on the Copper Foil of printed substrate;
B. design film egative film, and described dry film is exposed through described film egative film;
C. the printed substrate after will exposing immerses in the developer solution and develops, and described via is come out, and keeping dry film on the part Copper Foil that will form circuit on the described printed substrate and on the part clamping zone;
D. by the clamping zone of the described printed substrate of metal fixture clamping, will electroplate in the printed substrate immersion plating groove.
In thru-hole electroplating method provided by the invention, in electroplating process, owing on the part clamping zone of metal fixture, remain with dry film, thereby, metal fixture on this part clamping zone directly is not electrically connected with the Copper Foil of printed substrate, thereby has overcome metal fixture harmful effect to electroplating in this part clamping zone.On this part clamping zone, can not occur making the Copper Foil coating of this metal fixture of next-door neighbour thicker because the electric current of metal fixture is big, and the thin defective of electrodeposited coating near the Copper Foil.
Before the via of printed substrate was electroplated, this printed substrate had been finished the processing of via.The purpose of the thru-hole electroplating method of printed substrate is, by electroplated conductive layer on the hole wall of via (being generally metal level, as the copper layer), to realize the electrical connection between the different layers circuit.
Printed substrate at first is provided, and dry film is fitted on the Copper Foil of printed substrate, wherein, printed substrate has been formed with via, and this printed substrate can be multiple printed substrate, as multi-layer sheet or double sided board etc., especially flexible double sided board.
After being ready to the printed substrate of pending thru-hole electroplating, the dry film of on the Copper Foil of this printed substrate, fitting, preferably, the shape of dry film size is identical with printed substrate.This dry film is a photosensitive dry film, if ultraviolet irradiation is arranged, this dry film then can produce chemical reaction, can not be dissolved in developer solution in developing process; And do not have ultraviolet irradiation, then can in developing process, be dissolved in the developer solution.
In addition, also need to design film egative film, and described dry film is exposed through described film egative film.On film egative film, be divided into two parts, light transmission part and non-light transmission part, but not the light transmission part is then corresponding with circuit to be formed on the Copper Foil of printed substrate.Like this, when making ultraviolet ray shine the dry film that is fitted on the printed substrate Copper Foil through film egative film, the dry film corresponding with the light transmission part of film egative film is subjected to ultraviolet irradiation, thereby react, in developing process subsequently, the dry film that this part is subjected to ultraviolet irradiation can not be dissolved in the developer solution; And the dry film corresponding with the non-light transmission part of film egative film is not subjected to ultraviolet irradiation, thereby can not react, and in developing process subsequently, the dry film that this part is not subjected to ultraviolet irradiation then can be dissolved in the developer solution.
After printed substrate after will exposing immersed and develops in the developer solution, the described part dry film that is subjected to ultraviolet irradiation was dissolved in the developer solution, and the dry film that another part is not subjected to ultraviolet irradiation then is retained on the Copper Foil of described printed substrate.Why need be on the Copper Foil of printed substrate the reserve part dry film; be because; need protect treating the part that will form outer-layer circuit on the Copper Foil; to be electroplate with the copper layer on the part that prevents from electroplating process, to make this outer-layer circuit; make the thickness of this part become big, be unfavorable in operation subsequently, forming outer field circuit by etching.
As shown in Figure 1, in traditional thru-hole electroplating method, after finishing development, the part that exposes on the Copper Foil of printed substrate 1 is: the via 3 that need electroplate and the zone that does not need to form circuit.In other words, the part that remains with dry film is for corresponding with the circuit that will form on the Copper Foil, and covers on the circuit zone that will form.And in electroplating process in the clamping zone 2 of metal fixture clamping printed substrate, then expose Copper Foil fully, and the Copper Foil in this clamping zone 2 directly contacts with metal fixture, be used for realizing that Copper Foil keeps maintaining static of printed substrate on the other hand as the negative pole of electroplating process on the printed substrate on the one hand.
Yet just because of this, in electroplating process, because the electric current of metal fixture self is bigger, thereby the concentration that is close to copper ion in the zone that this metal fixture electroplates is higher, makes that to electroplate the coating that forms in the described clamping zone on the Copper Foil also thicker; But the copper ion in the described metal fixture near zone is relatively low, and it is thin partially to electroplate the coating that forms near the Copper Foil the clamping zone, makes the electrodeposited coating thickness that forms on the via hole wall in this part Copper Foil also thin partially.
But in the thru-hole electroplating method of printed substrate provided by the invention, after the development, on the Copper Foil that will form circuit, remain with dry film at the part clamping zone of described printed substrate.Like this, in electroplating process, owing on this part clamping zone, be coated with dry film, thereby, in this part clamping zone, dry film separates metal fixture and Copper Foil, like this, the metal fixture of this part clamping zone of clamping can directly not be electrically connected with Copper Foil, can not occur the thin problem of electrodeposited coating that occurs in traditional electro-plating method near the Copper Foil this part clamping zone.
Certainly, in the method for the invention, be not in all clamping zones, all to remain with dry film, but satisfying under the prerequisite of electroplating requirement, keep a part of clamping zone by the direct clamping of metal fixture, the Copper Foil on the printed substrate is connected with negative electricity.
The thin defective of coating on the hole wall appears for fear of being positioned near the clamping zone via, in the preferred case, the part via of described printed substrate, contiguous with the described part clamping zone that keeps described dry film.Like this, defective in traditional method can not appear on the hole wall of this part via being similar to.
In whole clamping zone 2, the part clamping zone that keeps dry film can be selected according to actual needs, for example, can select to be arranged among Fig. 1 one side of the clamping zone 2 on rectangle printed substrate 1 four limits, only makes the clamping zone of this limit part keep dry film; Also can select the both sides in the clamping zone 2 to keep dry film.Preferably, the nearer part clamping zone of chosen distance via keeps dry film.
In order to keep the even distribution of current density on the printed substrate, preferably, the described part clamping zone 4 that remains with dry film is arranged in two relative sides of four sides of described printed substrate clamping zone.Like this, the electric current distribution that forms between these two relative sides is comparatively even, as shown in Figure 2.
In the process of electroplating, be equipped with in the electroplating bath of electroplate liquid by the immersion of metal fixture clamping printed substrate, the Copper Foil that makes this metal fixture and printed substrate is a negative pole, be provided with positive pole in the electroplating bath, under the plating condition of setting (as the composition of electroplating current, electroplating voltage, electroplate liquid and concentration etc.), through the electroplating time of setting, can be on the Copper Foil of printed substrate, and form desirable electrodeposited coating on the hole wall of the via of printed substrate.
Thru-hole electroplating method of the present invention can be used for multiple printed substrate, as double sided board, multi-layer sheet, flexible board etc., is particularly useful for the double-faced flexible wiring board.
According to the thru-hole electroplating method of printed substrate provided by the invention, from having overcome to a great extent owing to metal fixture self electric current makes near the thin defective of via hole wall coating greatly.
Claims (5)
1. the thru-hole electroplating method of a printed substrate, this method comprises the steps:
A., printed substrate is provided, and dry film is fitted on the Copper Foil of printed substrate;
B. design film egative film, and described dry film is exposed through described film egative film;
C. the printed substrate after will exposing immerses in the developer solution and develops, and described via is come out, and keeping dry film on the part Copper Foil that will form circuit on the described printed substrate and on the part clamping zone;
D. by the clamping zone of the described printed substrate of metal fixture clamping, will electroplate in the printed substrate immersion plating groove, described clamping zone comprises described part clamping zone that remains with dry film and the part clamping zone that does not keep dry film.
2. method according to claim 1, the part via of wherein said printed substrate, contiguous with the described part clamping zone that remains with described dry film.
3. method according to claim 1 and 2, wherein said printed substrate are rectangular plate shape, and described clamping zone is positioned at four sides of this printed substrate.
4. method according to claim 3, the described part clamping zone that wherein remains with described dry film is arranged in two relative sides of four sides of described printed substrate.
5. method according to claim 1, wherein said printed substrate are the double-faced flexible wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101957087A CN101460017B (en) | 2007-12-11 | 2007-12-11 | Thru-hole electroplating method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101957087A CN101460017B (en) | 2007-12-11 | 2007-12-11 | Thru-hole electroplating method for printed circuit board |
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| Publication Number | Publication Date |
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| CN101460017A CN101460017A (en) | 2009-06-17 |
| CN101460017B true CN101460017B (en) | 2011-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007101957087A Active CN101460017B (en) | 2007-12-11 | 2007-12-11 | Thru-hole electroplating method for printed circuit board |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101616549B (en) * | 2009-07-21 | 2011-01-05 | 东莞康源电子有限公司 | Method for manufacturing single-side thick copper stepped plate by electroplating addition method |
| CN105430928A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Electroplating method of flexible circuit board, flexible circuit board and mobile terminal |
| CN111405775B (en) * | 2020-03-25 | 2021-07-13 | 盐城维信电子有限公司 | Substrate electroplating method and substrate manufactured by same |
| CN113447848A (en) * | 2021-06-24 | 2021-09-28 | 深圳市美信咨询有限公司 | Method for positioning electric leakage between PCB holes |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037354A (en) * | 2001-07-25 | 2003-02-07 | Matsushita Electric Ind Co Ltd | Method of manufacturing printed wiring board |
| CN1798484A (en) * | 2004-12-27 | 2006-07-05 | 淳华科技(昆山)有限公司 | Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board |
| KR100772432B1 (en) * | 2006-08-25 | 2007-11-01 | 대덕전자 주식회사 | Method of manufacturing printed circuit board |
-
2007
- 2007-12-11 CN CN2007101957087A patent/CN101460017B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037354A (en) * | 2001-07-25 | 2003-02-07 | Matsushita Electric Ind Co Ltd | Method of manufacturing printed wiring board |
| CN1798484A (en) * | 2004-12-27 | 2006-07-05 | 淳华科技(昆山)有限公司 | Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board |
| KR100772432B1 (en) * | 2006-08-25 | 2007-11-01 | 대덕전자 주식회사 | Method of manufacturing printed circuit board |
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| Publication number | Publication date |
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| CN101460017A (en) | 2009-06-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Thru-hole electroplating method for printed circuit board License type: Exclusive license Record date: 20080504 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14; CHANGE OF CONTRACT Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201124 Address after: 225732 Jiangsu city of Taizhou province Xinghua Diduo Town Industrial Park Patentee after: TAIZHOU RUNWEI MACHINERY Co.,Ltd. Address before: 518119 BYD Industrial Park, Yanan Road, Kwai Chung Town, Longgang District, Guangdong, Shenzhen Patentee before: BYD Co.,Ltd. |
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| TR01 | Transfer of patent right |