KR20160097801A - Printed circuit board and method of manufacturing the same - Google Patents

Abstract

According to the present invention, a printed circuit board comprises: a circuit layer and an insulating layer between the circuit layers. The insulating layer is made of a thermoplastic insulating material and a thermosetting insulating material. Therefore, the printed circuit board can secure component mounting properties and flexibility.

Description

Technical Field [0001] The present invention relates to a printed circuit board and a method of manufacturing the same,

The present invention relates to a printed circuit board and a manufacturing method thereof.

There is a demand for a technology in which electronic components such as an IC, a semiconductor chip, an active device and a passive device are inserted into a substrate in response to a technical requirement of the electronic devices in the IT field including a mobile phone, In recent years, a technique has been developed in which components are embedded in a substrate in various ways.

A general printed circuit board (PCB) is formed by printing a circuit line pattern on a electrically insulating substrate with a conductive material such as copper, and refers to a substrate immediately before mounting electronic components. In other words, a circuit board on which a mounting position of each component is determined and a circuit pattern connecting the components is printed on the surface of the flat plate to fix the various kinds of electronic devices densely on the flat plate.

In recent years, a printed circuit board has been disclosed as a multilayer printed circuit board, in particular a flexible rigid flexible printed circuit board (RFPCB) due to downsizing, thinning, and high density of electronic products.

US Patent Publication No. US 2008-0099230

One aspect (or perspective) of the present invention is to provide a printed circuit board on which a thermoplastic resin and a thermosetting resin having good flexibility can be applied to an interlayer insulating material in a printed circuit board to ensure component mounting and bending properties.

Another aspect of the present invention is to provide a method of manufacturing a printed circuit board that can secure component mounting and bendability by applying a thermoplastic resin and a thermosetting resin having good flexibility to an interlayer insulating material in a printed circuit board.

A printed circuit board according to an embodiment includes an insulating layer formed between a circuit layer and a circuit layer, and the insulating layer is composed of a double insulating layer of a thermoplastic insulating material and a thermosetting insulating material.

According to another aspect of the present invention, there is provided a method of manufacturing a printed circuit board, including: forming a first circuit layer on a core layer; Forming a first insulating layer on the first circuit layer with a thermoplastic insulating material; Forming a second insulating layer on the first insulating layer with a thermosetting insulating material; And forming a second circuit layer on the second insulating layer.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

1 is a cross-sectional view of a printed circuit board according to a first embodiment of the present invention.
2 is a cross-sectional view of a printed circuit board according to a second embodiment of the present invention.
3A to 3E are process sectional views of a method of manufacturing a printed circuit board according to a first embodiment of the present invention.
4A and 4F are process sectional views according to a method of manufacturing a printed circuit board of a second embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, particular advantages and novel features of the invention will become more apparent from the following detailed description and examples taken in conjunction with the accompanying drawings. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements have the same numerical numbers as much as possible even if they are displayed on different drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. In this specification, the terms first, second, etc. are used to distinguish one element from another, and the element is not limited by the terms. In the accompanying drawings, some of the elements are exaggerated, omitted or schematically shown, and the size of each element does not entirely reflect the actual size.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Printed circuit board

First, a printed circuit board according to a first embodiment of the present invention will be specifically described with reference to the drawings. Here, reference numerals not shown in the drawings to be referred to may be reference numerals in other drawings showing the same configuration.

1 is a cross-sectional view of a printed circuit board according to a first embodiment of the present invention. As shown in Fig. 1, a printed circuit board includes: a first circuit layer formed on both sides of a core layer; A first insulating layer formed on the first circuit layer, the first insulating layer being formed of a thermoplastic insulating material; A second insulating layer formed on the first insulating layer and formed of a thermosetting insulating material; A second circuit layer formed on the second insulating layer, and a solder resist layer formed on the second circuit layer with a hardened photo-solder resist material.

A copper clad laminate (CCL) is formed on both sides of the core layer 110, and the first circuit layer 120 is formed by patterning the copper foil layer on one side or both sides. Here, the first circuit layer 120 includes vias passing through the core layer 110.

More specifically, the first circuit layer 120 may be formed by a subtractive method for selectively removing the copper clad laminate using an etching resist, an additive method using electroless copper plating and electrolytic copper plating, Semi-Additive Process), MSAP (Modified Semi Additive Process), and SAP (Semi Additive Process), and the detailed description is omitted here.

The first insulating layer 130 is formed of a thermoplastic insulating material on the core layer 110 on which the first circuit layer 120 is formed. For example, it may be formed of polyvinyl chloride (PVC) to be flexible in a printed circuit board, and may be changed in shape at a high temperature as it is formed of a thermoplastic material.

The second insulating layer 140 may be formed of a thermosetting insulating material on the first insulating layer 130 and may be a ceramic, an organic-inorganic composite material, or a glass fiber impregnated. , BT (Bismaleimide Triazine), and ABF (Ajinomoto Build up Film). Alternatively, the resin may include a polyimide resin, but the present invention is not limited thereto.

The second circuit layer 150 may be formed by depositing a metal material layer on the second insulating layer 140 and then selectively removing the metal material layer using an etching resist, An Additive method using copper plating, a Semi-Additive Process (SAP), a Modified Semi Additive Process (MSAP), and a Semi Additive Process (SAP) method, and a detailed description thereof will be omitted.

The second circuit layer 150 may be formed on the second insulation layer 140 using a Resin Coated Copper (RCC) or a Copper Clad Laminate (CCL).

The second circuit layer 150 is formed with vias through the first insulating layer 130 and the second insulating layer 140 so as to be electrically connected to the first circuit layer 120.

The solder resist 160 is formed on the second circuit layer 150 using a hard-fired photo-solder resist material, and an opening is formed to expose the circuit pattern.

2 is a sectional view of a printed circuit board according to a second embodiment of the present invention. Fig. 2 shows an extension of the build-up layer configuration in addition to the printed circuit board of the first embodiment. That is, the buildup first insulation layer, the second insulation layer, and the circuit layer may be further formed in the basic structure of 2L to build up from 2L → 4L → 6L → 8L → 10L.

Here, the build-up layer is not limited to the embodiment but may be additionally formed as necessary.

Here, the description overlapping with the embodiment of FIG. 1 will be omitted with reference to FIG. The build-up layer includes a first circuit layer 221, a first insulation layer 222 formed of a thermoplastic insulating material, and a second insulation layer 223 formed of a thermosetting insulation material, sequentially on the core layer 210 The first build-up layer 230, the second build-up layer 240, and the third build-up layer 250 are repeatedly formed on the resultant product of the first embodiment including the first insulating layer, the second insulating layer, do.

Further, it is preferable that the solder resist layer is further formed on the outermost circuit layer of the build-up layer.

Manufacturing method of printed circuit board

3A to 3D are process flow diagrams illustrating a method of manufacturing a printed circuit board according to a first embodiment of the present invention. FIGS. 4A and 4F are views illustrating a process of manufacturing a printed circuit board according to a second embodiment of the present invention. Sectional view.

Hereinafter, the manufacturing method will be described in detail in order. At this time, the above-mentioned printed circuit board and Fig. 1 will be referred to, and thus redundant explanations can be omitted.

As shown in FIG. 3A, a metal layer is formed on both surfaces of the core layer 110. At this time, it is preferable that the metal layer is formed thinly using a copper clad laminate (CCL).

Then, as shown in FIG. 3B, the first circuit layer 120 including the vias passing through the core layer 110 is formed.

More specifically, after a via hole is formed through the core layer 110, a metal material is filled to form a via. Here, the core layer 110 is drilled to form a via hole. Then, the metal layer 120 is selectively removed to form a first circuit layer 120 including a circuit pattern. Here, the first circuit layer 120 is preferably formed using an additive method or an SAP (Semi-Additive Process) method using a subtractive method, electroless copper plating, and electrolytic copper plating.

As shown in FIG. 3C, a first insulating layer is formed on the first circuit layer, a thermally insulating insulating material is formed on the first insulating layer, and a metal layer is sequentially formed on the first insulating layer.

More specifically, the first insulating layer 130 is formed of a thermoplastic insulating material on the core layer 110 on which the first circuit layer 120 is formed. For example, it may be formed of polyvinyl chloride (PVC) to be flexible in a printed circuit board, and may be changed in shape at a high temperature as it is formed of a thermoplastic material.

The second insulating layer 140 may be formed of a thermosetting insulating material on the first insulating layer 130 and may be a ceramic, an organic-inorganic composite material, or a glass fiber impregnated. , BT (Bismaleimide Triazine), and ABF (Ajinomoto Build up Film). Alternatively, the resin may include a polyimide resin, but the present invention is not limited thereto.

The metal layer 150 is formed on the second insulating layer 140. At this time, the metal layer 150 may be formed on the second insulation layer 140 using a Resin Coated Copper (RCC) or a Copper Clad Laminate (CCL).

Then, as shown in FIG. 3D, the metal layer is patterned to form a second circuit layer 150. [

More specifically, after a via hole is formed through the first insulating layer 130 and the second insulating layer 140, a metal material is filled to form a via. Here, it is preferable to form the via holes by using the YAG laser or the CO2 laser as the first and second insulating layers.

 Then, the metal layer is selectively removed to form a second circuit layer 150 including a circuit pattern. Here, the second circuit layer 150 is preferably formed using an additive method or an SAP (Semi-Additive Process) method using a subtractive method, electroless copper plating, and electrolytic copper plating.

A solder resist 160 having an opening is formed on the second circuit layer 150 to expose a circuit pattern using a hard-fired photo-solder resist material.

4A to 4F are cross-sectional views illustrating a manufacturing method of a printed circuit board according to a second embodiment of the present invention. Here, the overlapping description with reference to the first embodiment described above can be omitted.

First, as shown in FIG. 4A, a metal layer is formed on both sides of the core layer 210. At this time, it is preferable that the metal layer is formed thinly using a copper clad laminate (CCL).

Then, as shown in FIG. 4B, a first circuit layer 221 including vias passing through the core layer 210 is formed.

More specifically, after a via hole penetrating the core layer 210 is formed, a metal material is filled to form a via. Here, the core layer 210 is drilled to form a via hole. The metal layer 221 is selectively removed to form a first circuit layer 221 including a circuit pattern. Here, the first circuit layer 221 is preferably formed using an additive method or a semi-additive process (SAP) method using a subtractive method, electroless copper plating, and electrolytic copper plating.

A first insulating layer 222 is formed on the first circuit layer 221 as a thermoplastic insulating material and a second insulating layer 223 is formed on the first insulating layer 222 as a thermosetting insulating material. And a metal layer 231 are sequentially formed.

More specifically, the first insulating layer 222 is formed of a thermoplastic insulating material on the core layer 210 on which the first circuit layer 221 is formed. For example, it may be formed of polyvinyl chloride (PVC) to be flexible in a printed circuit board, and may be changed in shape at a high temperature as it is formed of a thermoplastic material.

The second insulating layer 223 may be formed of a thermosetting insulating material on the first insulating layer 222 and may be a ceramic, an organic-inorganic composite material, or a glass fiber impregnated. , BT (Bismaleimide Triazine), and ABF (Ajinomoto Build up Film). Alternatively, the resin may include a polyimide resin, but the present invention is not limited thereto.

The metal layer 231 is formed on the second insulating layer 223. At this time, the metal layer 231 may be formed on the second insulation layer 223 using a Resin Coated Copper (RCC) or a Copper Clad Laminate (CCL).

Then, as shown in FIG. 4D, the metal layer is patterned to form a second circuit layer 231. [

More specifically, after a via hole penetrating the first insulating layer 222 and the second insulating layer 223 is formed, a metal material is filled to form a via. Here, it is preferable to form the via holes by using the YAG laser or the CO2 laser as the first and second insulating layers.

Then, the metal layer is selectively removed to form a second circuit layer 231 including a circuit pattern. Here, the second circuit layer 231 is preferably formed using an additive method or a semi-additive process (SAP) method using a subtractive method, electroless copper plating, and electrolytic copper plating.

Then, as shown in FIGS. 4E and 4F, at least two buildup layers 230, 234 and 250 are formed on the second circuit layer 231.

The build-up layers 230, 234, and 250 are formed repeatedly on the second circuit layer 231, including an insulating layer formed of a thermoplastic insulating material, an insulating layer formed of a thermosetting insulating material, and a circuit layer.

A solder resist layer 260 is formed on the outermost circuit layer of the build-up layers 230, 234, and 250 by using a hardened photo-solder resist material.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the same is by way of illustration and example only and is not to be construed as limiting the present invention. It is obvious that the modification or improvement is possible.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

110, 210 --- core layer
120, 221 --- First circuit layer
130, 222 --- first insulation layer
140, 223 --- Second insulating layer
150, 231 --- Second circuit layer
160, 260 --- Solder resist
230, 240, 250 --- buildup layer

Claims (20)

In a printed circuit board,
An insulating layer formed between the circuit layer and the circuit layer,
Wherein the insulating layer is formed of a double insulation layer of a thermoplastic insulating material and a thermosetting insulating material.
The method according to claim 1,
Wherein the circuit layer and the insulating layer form build-up layers in which at least two or more layers are repeatedly laminated on both sides of the core layer.
The method of claim 2,
And a solder resist layer formed on the outermost circuit layer of the build-up layer, the solder resist layer being formed of a van-dia photo solder resist material.
The method of claim 2,
Wherein the circuit layer is formed with a via penetrating the core layer and a via penetrating the insulating layer.
A first circuit layer formed on both sides of the core layer;
A first insulating layer formed on the first circuit layer, the first insulating layer being formed of a thermoplastic insulating material;
A second insulating layer formed on the first insulating layer and formed of a thermosetting insulating material; And
And a second circuit layer formed on the second insulating layer.
The method of claim 5,
And a build-up layer laminated on at least two layers on the second circuit layer.
The method of claim 6,
Wherein the build-up layer is repeatedly formed on the second circuit layer, the circuit layer including an insulating layer formed of a thermoplastic insulating material, an insulating layer formed of a thermosetting insulating material, and a circuit layer.
The method of claim 5,
Further comprising a solder resist layer formed on the second circuit layer with a vanDouble photo solder resist material.
The method of claim 7,
And a solder resist layer formed on the outermost circuit layer of the build-up layer, the solder resist layer being formed of a van-dia photo solder resist material.
The method of claim 5,
Wherein a via is formed in the first circuit layer through the core layer and a via is formed in the second circuit layer through the first and second insulation layers.
The method of claim 5,
Wherein the core layer is made of a copper clad laminate (CCL).
Forming a first circuit layer on the core layer;
Forming a first insulating layer on the first circuit layer with a thermoplastic insulating material;
Forming a second insulating layer on the first insulating layer with a thermosetting insulating material; And
And forming a second circuit layer on the second insulating layer.
The method of claim 12,
Forming a build-up layer in which at least two or more layers are stacked on the second circuit layer.
14. The method of claim 13,
Wherein the build-up layer is repeatedly formed on the second circuit layer, the circuit layer including an insulating layer formed of a thermoplastic insulating material, an insulating layer formed of a thermosetting insulating material, and a circuit layer.
The method of claim 12,
And forming a solder resist layer formed of a hardened photo-solder resist material on the second circuit layer.
The method of claim 14,
Further comprising forming a solder resist layer formed of a hardened photo-solder resist material on the outermost circuit layer of the build-up layer.
The method of claim 12,
Wherein a via is formed through the core layer in the first circuit layer and a via is formed in the second circuit layer through the first and second insulation layers.
The method of claim 12,
Wherein the core layer is a copper clad laminate (CCL).
The method of claim 12,
Wherein the second insulating layer is formed of a glass fiber impregnated resin material.
15. The method of claim 14,
Wherein the insulating layer and the circuit layer formed of the thermosetting insulating material of the build-up layer are formed using a Resin Coated Copper (RCC) or a Copper Clad Laminate (CCL).

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