CN103763860A - Method for treating single-sided board warpage - Google Patents
Method for treating single-sided board warpage Download PDFInfo
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- CN103763860A CN103763860A CN201410050056.8A CN201410050056A CN103763860A CN 103763860 A CN103763860 A CN 103763860A CN 201410050056 A CN201410050056 A CN 201410050056A CN 103763860 A CN103763860 A CN 103763860A
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- copper
- grid
- copper coating
- sided board
- board
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Abstract
The invention discloses a method for treating single-sided board warpage. The method includes the following steps of (1) copper coating, wherein after circuit layout and wiring, a circuit board is coated with copper before manufacturing circuit paper scraps, grid copper coating is adopted for the copper coating, the net copper coating area, used for the grid copper coating, of a single-sided board is larger than or equal to 100 cm<2>, the size of a grid adopted for the grid copper coating is 5 mm-10 mm* 5 mm-10 mm, and the line width of the grid is larger than or equal to 0.4 mm, (2) baking, (3) pattern transferring, (4) etching and (5) drilling. A traditional overall plate copper coating mode is replaced by the grid copper coating mode, so that the phenomenon of single-sided board warpage due to large stress caused by mechanical outer force or heating is effectively reduced; the board is baked before feeding, so that water and stress in the board can be removed effectively, and the conditions of single-sided board warpage due to large stress is further avoided; the line width of the grid used for copper coating is larger than or equal to 0.4 mm, and therefore it can be avoided that product quality is affected by dry film crush in the follow-up circuit procedure.
Description
Technical field
The present invention relates to pcb board and manufacture field, particularly relate to a kind of method that single sided board plate sticks up that solves.
Background technology
Printed circuit board is called for short pcb board, employing is made printed wiring, printed component or both conductive patterns combining by schematic diagram design in advance and is called printed circuit on insulating material, and on insulating substrate, provide the conductive pattern of the electrical connection between components and parts, be called printed wiring, above-mentioned printed circuit or printed wiring are made into production board and are called printed wiring board, or be called printed board or printed circuit board.It is mainly by circuit and drawing, dielectric layer and can make two-layer above circuit form in the hole of conducting each other, in addition, for some printed circuit boards, also can print the isolated copper face of one deck and eat the material of tin, avoid the anti-solder ink of short circuit between the non-circuit of eating tin and some are for identifying title, the position frame of each part, so that the silk-screen that postorder assembling and maintenance identification are used.In Printed Circuit Board Design process, the specification of using product in order to meet it, sometimes need the size of printed circuit board that the larger of the size more used than actual components and parts is set, therefore, copper when larger, need to be covered to these positions in gap between the position or the adjacent components and parts that do not have components and parts to place.
In the pcb board course of processing, due to factors such as mechanical pressure and temperature, the Copper Foil on PCB there will be projection phenomenon, thereby there is seesaw phenomenon, especially in the manufacturing process of single sided board, because double sided board and multi-layer sheet, because of its symmetrical configuration, are not therefore prone to seesaw phenomenon in manufacturing process.But, seesaw phenomenon is particularly outstanding in the single sided board course of processing, its reason is that the one side of single sided board is covered with copper, and another side is without bronzing plate, in the manufacturing process of single sided board, after mechanical pressure and expanded by heating, the stress on single sided board two sides can not get discharging completely, thereby cause single sided board seesaw, thereby cause increasing tin cream cost in the paster of postorder and plug-in unit assembling, maybe can not use and cause pcb board to scrap.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of and can effectively reduce because of mechanical external force or produce and cause single sided board to occur the method that the single sided board plate of seesaw phenomenon sticks up compared with large stress after being heated.
The object of the invention is to be achieved through the following technical solutions: a kind ofly solve the method that single sided board plate sticks up, it comprises the following steps:
(1) cover copper: to after configuration wiring, carry out the circuit scraps of paper and wiring board is covered to copper before making, the described copper that covers adopts grid to cover copper, for grid, cover copper single sided board only cover copper face long-pending>=100cm
2, for grid, covering the sizing grid that copper adopts is 5mm～10mm*5mm～10mm, grid live width>=0.4mm;
(2) baking: after completing and covering copper, carry out blanking, before copper-clad plate blanking, copper-clad plate is being toasted, baking temperature is 150 °, and baking time is 4 hours.
(3) figure shifts: the circuit scraps of paper optical plotter designing is drawn to the corresponding film, then the film is covered in the copper-clad plate after baking and expose;
(4) etching: the pH value of the etching solution of employing is 8.0～9.0, the concentration of the chloride ion in etching solution is 150g/L～190g/L, the concentration of copper ion is 130g/L～170g/L;
(5) boring: the single sided board after adopting drilling machine to etching is holed.
The invention has the beneficial effects as follows:
1) adopt grid to cover the alternative traditional whole plate of copper mode and cover copper mode, effectively reduce because of mechanical external force or after being heated and produce and cause single sided board to occur seesaw phenomenon compared with large stress;
2) between blanking, plate is toasted, can effectively remove the stress in moisture and the sheet material in plate, further avoided stress excessive and cause the situation of single sided board seesaw;
3) adopt grid to cover the weight that copper mode can reduce production costs, alleviate single sided board;
4) cover copper the live width >=0.4MM of the grid of use, can avoid below circuit operation to occur that dry film is broken and affect product quality.
Embodiment
Below in conjunction with specific embodiment, technical scheme of the present invention is described in further detail, but protection scope of the present invention is not limited to the following stated.
Embodiment mono-: a kind ofly solve the method that single sided board plate sticks up, it comprises the following steps:
(1) cover copper: to after configuration wiring, carry out the circuit scraps of paper and wiring board is covered to copper before making, the described copper that covers adopts grid to cover copper, for grid, cover copper single sided board only cover copper face long-pending>=100cm
2, as to only covering the long-pending 100cm that is less than of copper face
2cover copper, while covering copper, easily cause the short circuit between components and parts, meanwhile, not easy to operate; For grid, covering the sizing grid that copper adopts is 5mm～10mm*5mm～10mm, both guaranteed that sizing grid can be not excessive and do not reach the effect of covering copper, and can avoid causing because grid is too small formation to cover copper, thereby there is seesaw phenomenon in the pcb board postorder course of processing comprehensively; Grid live width>=0.4mm, avoids below circuit operation to occur that dry film is broken and affects product quality;
(2) baking: after completing and covering copper, carry out blanking, before copper-clad plate blanking, copper-clad plate is being toasted, baking temperature is 150 °, and baking time is 4 hours; Can effectively remove the stress in moisture and the sheet material in plate.
(3) figure shifts: the circuit scraps of paper optical plotter designing is drawn to the corresponding film, then the film is covered in the copper-clad plate after baking and expose;
(4) etching: the pH value of the etching solution of employing is 8.0, the concentration of the chloride ion in etching solution is 190g/L, the concentration of copper ion is 130g/L; It is that 3%～5% NaOH solution carries out stripping that plank after etching is put into concentration.
(5) boring: the single sided board after adopting drilling machine to etching is holed after to configuration wiring, carries out, before the making of the circuit scraps of paper, wiring board is covered to copper, and the described copper that covers adopts grid to cover copper.
Embodiment bis-: a kind ofly solve the method that single sided board plate sticks up, it comprises the following steps:
(1) cover copper: to after configuration wiring, carry out the circuit scraps of paper and wiring board is covered to copper before making, the described copper that covers adopts grid to cover copper, for grid, cover copper single sided board only cover copper face long-pending>=100cm
2, as to only covering the long-pending 100cm that is less than of copper face
2cover copper, while covering copper, easily cause the short circuit between components and parts, meanwhile, not easy to operate; For grid, covering the sizing grid that copper adopts is 5mm～10mm*5mm～10mm, both guaranteed that sizing grid can be not excessive and do not reach the effect of covering copper, and can avoid causing because grid is too small formation to cover copper, thereby there is seesaw phenomenon in the pcb board postorder course of processing comprehensively; Grid live width>=0.4mm, avoids below circuit operation to occur that dry film is broken and affects product quality;
(2) baking: after completing and covering copper, carry out blanking, before copper-clad plate blanking, copper-clad plate is being toasted, baking temperature is 150 °, and baking time is 4 hours; Can effectively remove the stress in moisture and the sheet material in plate.
(3) figure shifts: the circuit scraps of paper optical plotter designing is drawn to the corresponding film, then the film is covered in the copper-clad plate after baking and expose;
(4) etching: the pH value of the etching solution of employing is 9.0, the concentration of the chloride ion in etching solution is 150g/L, the concentration of copper ion is 170g/L; It is that 3%～5% NaOH solution carries out stripping that plank after etching is put into concentration.
(5) boring: the single sided board after adopting drilling machine to etching is holed after to configuration wiring, carries out, before the making of the circuit scraps of paper, wiring board is covered to copper, and the described copper that covers adopts grid to cover copper.
Embodiment tri-: a kind ofly solve the method that single sided board plate sticks up, it comprises the following steps:
(1) cover copper: to after configuration wiring, carry out the circuit scraps of paper and wiring board is covered to copper before making, the described copper that covers adopts grid to cover copper, for grid, cover copper single sided board only cover copper face long-pending>=100cm
2, as to only covering the long-pending 100cm that is less than of copper face
2cover copper, while covering copper, easily cause the short circuit between components and parts, meanwhile, not easy to operate; For grid, covering the sizing grid that copper adopts is 5mm～10mm*5mm～10mm, both guaranteed that sizing grid can be not excessive and do not reach the effect of covering copper, and can avoid causing because grid is too small formation to cover copper, thereby there is seesaw phenomenon in the pcb board postorder course of processing comprehensively; Grid live width>=0.4mm, avoids below circuit operation to occur that dry film is broken and affects product quality;
(2) baking: after completing and covering copper, carry out blanking, before copper-clad plate blanking, copper-clad plate is being toasted, baking temperature is 150 °, and baking time is 4 hours; Can effectively remove the stress in moisture and the sheet material in plate.
(3) figure shifts: the circuit scraps of paper optical plotter designing is drawn to the corresponding film, then the film is covered in the copper-clad plate after baking and expose;
(4) etching: the pH value of the etching solution of employing is 8.5, the concentration of the chloride ion in etching solution is 170g/L, the concentration of copper ion is 150g/L; It is that 3%～5% NaOH solution carries out stripping that plank after etching is put into concentration.
(5) boring: the single sided board after adopting drilling machine to etching is holed after to configuration wiring, carries out, before the making of the circuit scraps of paper, wiring board is covered to copper, and the described copper that covers adopts grid to cover copper.
Claims (1)
1. solve the method that single sided board plate sticks up, it is characterized in that: it comprises the following steps:
(1) cover copper: to after configuration wiring, carry out the circuit scraps of paper and wiring board is covered to copper before making, the described copper that covers adopts grid to cover copper, for grid, cover copper single sided board only cover copper face long-pending>=100cm
2, for grid, covering the sizing grid that copper adopts is 5mm～10mm*5mm～10mm, grid live width>=0.4mm;
(2) baking: after completing and covering copper, carry out blanking, before copper-clad plate blanking, copper-clad plate is being toasted, baking temperature is 150 °, and baking time is 4 hours;
(3) figure shifts: the circuit scraps of paper optical plotter designing is drawn to the corresponding film, then the film is covered in the copper-clad plate after baking and expose;
(4) etching: the pH value of the etching solution of employing is 8.0～9.0, the concentration of the chloride ion in etching solution is 150g/L～190g/L, the concentration of copper ion is 130g/L～170g/L;
(5) boring: the single sided board after adopting drilling machine to etching is holed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410050056.8A CN103763860A (en) | 2014-02-13 | 2014-02-13 | Method for treating single-sided board warpage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410050056.8A CN103763860A (en) | 2014-02-13 | 2014-02-13 | Method for treating single-sided board warpage |
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| CN103763860A true CN103763860A (en) | 2014-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410050056.8A Pending CN103763860A (en) | 2014-02-13 | 2014-02-13 | Method for treating single-sided board warpage |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104219888A (en) * | 2014-08-15 | 2014-12-17 | 安徽广德威正光电科技有限公司 | BT (bismaleimide triazine) board cutting process |
| US9640492B1 (en) | 2015-12-17 | 2017-05-02 | International Business Machines Corporation | Laminate warpage control |
| US10224269B2 (en) | 2015-12-17 | 2019-03-05 | International Business Machines Corporation | Element place on laminates |
Citations (3)
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| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
| CN102159027A (en) * | 2011-01-17 | 2011-08-17 | 开平依利安达电子第三有限公司 | Method for manufacturing high frequency microwave printed circuit boards with Rogers ceramic wafer laminated copper foils |
| CN103209546A (en) * | 2013-04-03 | 2013-07-17 | 遂宁市广天电子有限公司 | Method for making line in direct negative etching way |
-
2014
- 2014-02-13 CN CN201410050056.8A patent/CN103763860A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
| CN102159027A (en) * | 2011-01-17 | 2011-08-17 | 开平依利安达电子第三有限公司 | Method for manufacturing high frequency microwave printed circuit boards with Rogers ceramic wafer laminated copper foils |
| CN103209546A (en) * | 2013-04-03 | 2013-07-17 | 遂宁市广天电子有限公司 | Method for making line in direct negative etching way |
Non-Patent Citations (2)
| Title |
|---|
| 余皓，韩君，唐建东: "《任务型电子产品案例实践》", 31 December 2011, article ""任务型电子产品案例实践"，余皓等，第124页，西安电子科技大学出版社，2011年12月" * |
| 强娅莉: "多层印制板加工中翘曲的原因分析及改善措施", 《电子工艺技术》, vol. 29, no. 6, 18 November 2008 (2008-11-18), pages 343 - 345 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104219888A (en) * | 2014-08-15 | 2014-12-17 | 安徽广德威正光电科技有限公司 | BT (bismaleimide triazine) board cutting process |
| CN104219888B (en) * | 2014-08-15 | 2017-07-28 | 安徽广德威正光电科技有限公司 | A kind of BT plates sheet material sawing sheet technique |
| US9640492B1 (en) | 2015-12-17 | 2017-05-02 | International Business Machines Corporation | Laminate warpage control |
| US10224269B2 (en) | 2015-12-17 | 2019-03-05 | International Business Machines Corporation | Element place on laminates |
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Application publication date: 20140430 |