CN103826390A - Thick copper printed circuit board and manufacturing method thereof - Google Patents

Thick copper printed circuit board and manufacturing method thereof Download PDF

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Publication number
CN103826390A
CN103826390A CN201410062749.9A CN201410062749A CN103826390A CN 103826390 A CN103826390 A CN 103826390A CN 201410062749 A CN201410062749 A CN 201410062749A CN 103826390 A CN103826390 A CN 103826390A
Authority
CN
China
Prior art keywords
copper
wiring board
thick
thick copper
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410062749.9A
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Chinese (zh)
Inventor
王雪涛
乔书晓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Fastprint Circuit Tech Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
Original Assignee
Shenzhen Fastprint Circuit Tech Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Fastprint Circuit Tech Co Ltd, Yixing Silicon Valley Electronic Technology Co Ltd filed Critical Shenzhen Fastprint Circuit Tech Co Ltd
Priority to CN201410062749.9A priority Critical patent/CN103826390A/en
Publication of CN103826390A publication Critical patent/CN103826390A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a thick copper printed circuit board and a manufacturing method thereof. The manufacturing method of the thick copper printed circuit board comprises the following steps of board cutting, inner layer film drying, inner layer etching, laminating, ceramic board grinding, heavy copper plate plating, inner layer film drying, pattern plating, outer layer etching, laminating and after process flow. The thick copper printed circuit board and the manufacturing method thereof overcome the defects that the circuit distance of the designed thick copper printed circuit board is insufficient and one-time etching can not be achieved, the modes of filling of pressed flow glue and peeling and board grinding are used for manufacturing, circuit filling is flat and even, and the manufacturing success rate is high. The manufacturing method of the thick copper printed circuit board can be used for manufacturing circuit boards of any copper thicknesses theoretically, the process is simple, and the rate of finished products is high.

Description

Thick copper printed wiring board and preparation method thereof
Technical field
The present invention relates to printed wiring board technical field, particularly relate to a kind of thick copper printed wiring board and preparation method thereof.
Background technology
For part inner-layer thick copper printed wiring board, in the time that the line design spacing deficiency of customer requirement cannot disposable etching draws, industry has following several way to be solved conventionally, and the one, behind seal welding resistance filling circuit gap, add copper facing thick in required thickness, finally return again welding resistance; The 2nd, behind employing resin filling circuit gap, add equally copper facing thick in required thickness.The problem of these two kinds of mode maximums is silk screen printing oil (resin) difficulties at present, especially resin, its viscosity is higher, easily there is the problem such as copper sheet place resin thickness inequality, circuit gap-fill deficiency, and higher stress makes central layer warpage, damage after resin solidification, be successful probability not high.
Also there is report to adopt twice etched mode to make, be that a part of copper is fallen in first acid etching, then after utilizing ink to cover circuit bottom, again circuit top and sidewall are plated to resist layer, then break off the base alkali etching after portion's welding resistance of highly basic bubble removes the copper layer of welding resistance bottom, finally removes resist layer again.The making of the method is in conjunction with welding resistance, twice etching, and first acid etching control etch quantity difficulty is large, and etch uniformity is poor; Secondly, easily also remaining to sidewall when ink covers circuit bottom, thus hindering adhering to of sidewall resist layer, after bubble falls welding resistance, inefficacy against corrosion is prone to the damaged phenomenon of conductor, and integral manufacturing difficulty is larger, and chance of success is low.
Summary of the invention
Based on this, the object of this invention is to provide a kind of manufacture method of thick copper printed wiring board.
Concrete technical scheme is as follows:
A manufacture method for thick copper printed wiring board, comprises the steps:
(1) on central layer, obtain line pattern by dry film, etching operation;
(2) PCB surface obtaining in step (1) covers prepreg and Copper Foil successively, then carries out laminating operation;
(3) wiring board after step (2) lamination is peelled off to Copper Foil, then carry out ceramic nog plate operation until expose internal layer circuit;
(4) wiring board step (3) being obtained sinks copper coin plating operation, then carries out dry film operation, exposes the region that need to make thick copper circuit;
(5) the enterprising electroplating copper operation of the wiring board that obtains in step (4), makes that the copper of thick copper circuit is thick reaches requirement;
(6) on the wiring board obtaining in step (5), carry out zinc-plated operation, and then move back film, etching, move back tin operation;
(7) wiring board step (6) being obtained carries out rear operation making, obtains thick copper printed wiring board.
Therein in an embodiment, the copper of this thick copper printed wiring board is thick >=4oz.(adopt in theory manufacture method of the present invention can obtain the wiring board that any copper is thick, in actual production, made the thick wiring board for 6oz of copper).
In an embodiment, the copper of the middle central layer of step (1) is thick is the 1/3-2/3 that final copper is thick therein.
Therein in an embodiment, in step (2), the operating parameter of lamination is under vacuum state, the pressure of lamination is controlled at 300-400psi, wiring board is risen to 180-190 ℃ from room temperature, wherein the rate of heat addition is controlled at 1.5-3.0 ℃/min within the scope of 80 ℃-140 ℃, high temperature 180-190 ℃ maintains 60-70min, and then is cooled to room temperature, and cooldown rate is less than 3 ℃/min.
Utilize laminating method filling part resin to overcome on the one hand that the thick copper area filling amount that common printing welding resistance, resin bring is inhomogeneous, the large problem of difficulty is controlled in manual operations, first filling part copper is thick on the other hand also can avoid the thick copper of follow-up disposable filling time because plate face difference in height is large, the large lamination fold problem easily occurring of filler amount, has guaranteed quality.
In an embodiment, in step (4), heavy copper coin plates the thick 5-15 μ m of being of the copper obtaining therein.
Another object of the present invention is to provide a kind of thick copper printed wiring board.
Concrete technical scheme is as follows:
Above-mentioned manufacture method is made the thick copper printed wiring board obtaining.
Advantage of the present invention is as follows:
The invention provides the manufacture method of inner-layer thick copper wiring board, the line pitch deficiency of this inner-layer thick copper wiring board, when cannot disposable etching drawing.The problems that overcome common welding resistance, the existence of resin filling circuit gap, look for another way, and adopt pressing gummosis to fill the mode that adds peeling nog plate, and circuit is filled smooth, even, is made into power high.
What manufacture method pressing gummosis of the present invention adopted is half flow model cured sheets, and the pressing material using with rear operation is identical, can also save flow process, has saved the step that needs to remove welding resistance in current industry existing procedure.
Adopt manufacture method of the present invention can make in theory the wiring board that any copper is thick, flow process is simple, and rate of finished products is high.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the wiring board that obtains of step (1);
Fig. 2 is the schematic diagram of the wiring board that obtains of step (2);
Fig. 3 is the schematic diagram of the wiring board that obtains of step (3);
Fig. 4 is the schematic diagram of the wiring board that obtains after the heavy copper coin plating of step (4);
Fig. 5 is the schematic diagram of the wiring board that obtains after step (4) dry film operation;
Fig. 6 is the schematic diagram of the wiring board that obtains after zinc-plated of step (6);
Fig. 7 is the schematic diagram that step (6) is moved back the wiring board obtaining after film;
Fig. 8 is the schematic diagram of the wiring board that obtains after step (6) etching;
Fig. 9 is the schematic diagram of the wiring board that obtains after operation pressing after step (7).
Description of reference numerals:
101, substrate; 102, base copper; 103, prepreg; 104, Copper Foil; 105, heavy copper coin coating; 106, dry film; 107, copper electroplating layer; 108, tin coating.
Embodiment
Below in conjunction with drawings and Examples, the application is further elaborated.
Embodiment 1
A kind of copper of the present embodiment is thick is the manufacture method of the thick copper printed wiring board of 6oz, comprises the steps:
Sawing sheet → internal layer dry film → internal layer etching → lamination → ceramic nog plate → heavy copper coin plating → internal layer dry film → graphic plating → outer etching → brown → lamination → rear process flow.
(1) above obtain line pattern (as shown in Figure 1) by dry film, etching operation at central layer (copper is thick is 4oz);
(2) PCB surface obtaining in step (1) covers prepreg and Copper Foil successively, then carries out laminating operation (as shown in Figure 2);
The operating parameter of lamination is: under vacuum state, the pressure of lamination is controlled at 355psi, and wiring board is risen to 185 ℃ from room temperature, wherein the rate of heat addition is controlled at 1.8 ℃/min within the scope of 80 ℃-140 ℃, 185 ℃ of high temperature maintain 66min, and then are cooled to room temperature, 1.5 ℃/min of cooldown rate.
(3) wiring board after step (2) lamination is peelled off to Copper Foil, then carry out ceramic nog plate operation until expose internal layer circuit (as shown in Figure 3);
(4) wiring board step (3) being obtained sinks copper coin plating operation, and (object of this step is to obtain one deck to conduct electricity thin copper, as shown in Figure 4), then carries out dry film operation, exposes the region (as shown in Figure 5) that need to make thick copper circuit;
The thickness of heavy copper coin coating 105 is: 7um
(5) the enterprising electroplating copper operation of the wiring board that obtains in step (4), makes that the copper of thick copper circuit is thick reaches requirement (add and be plating to 6oz);
(6) on the wiring board obtaining in step (5), carry out zinc-plated operation (as shown in Figure 6), and then move back film (as shown in Figure 7), etching (as shown in Figure 8), move back tin operation;
(7) wiring board step (6) being obtained carries out rear operation making, obtains thick copper printed wiring board (as shown in Figure 9).
The copper of the thick copper printed wiring board of the present embodiment is thick is 6oz, and the thickness of base copper 102 is 4oz, and the thickness of copper electroplating layer is 2oz.
The thick 6oz that requires of the present embodiment internal layer copper, but its actual line design cannot meet the making ability that 6oz copper is thick.The line pitch of inner-layer thick copper wiring board is designed to before 11.8mil(compensation), cannot disposable etching draw, adopt pressing gummosis to fill the mode that adds peeling nog plate, circuit is filled smooth, even, is made into power high.
Embodiment 2
A kind of copper of the present embodiment is thick is the manufacture method of the thick copper printed wiring board of 5oz, comprises the steps:
Sawing sheet → internal layer dry film → internal layer etching → lamination → ceramic nog plate → heavy copper coin plating → internal layer dry film → graphic plating → outer etching → brown → lamination → rear process flow.
(1) above obtain line pattern (as shown in Figure 1) by dry film, etching operation at central layer (copper is thick is 3oz);
(2) PCB surface obtaining in step (1) covers prepreg and Copper Foil successively, then carries out laminating operation (as shown in Figure 2);
The operating parameter of lamination is: under vacuum state, the pressure of lamination is controlled at 345psi, and wiring board is risen to 184 ℃ from room temperature, wherein the rate of heat addition is controlled at 2.0 ℃/min within the scope of 80 ℃-140 ℃, 184 ℃ of high temperature maintain 64min, and then are cooled to room temperature, 1.8 ℃/min of cooldown rate.
(3) wiring board after step (2) lamination is peelled off to Copper Foil, then carry out ceramic nog plate operation until expose internal layer circuit (as shown in Figure 3);
(4) wiring board step (3) being obtained sinks copper coin plating operation, and (object of this step is to obtain one deck to conduct electricity thin copper, as shown in Figure 4), then carries out dry film operation, exposes the region (as shown in Figure 5) that need to make thick copper circuit;
The thickness of heavy copper coin coating 105 is: 9um
(5) the enterprising electroplating copper operation of the wiring board that obtains in step (4), makes that the copper of thick copper circuit is thick reaches requirement (add and be plating to 5oz);
(6) on the wiring board obtaining in step (5), carry out zinc-plated operation (as shown in Figure 6), and then move back film (as shown in Figure 7), etching (as shown in Figure 8), move back tin operation;
(7) wiring board step (6) being obtained carries out rear operation making, obtains thick copper printed wiring board (as shown in Figure 9).
The copper of the thick copper printed wiring board of the present embodiment is thick is 5oz, and the thickness of base copper 102 is 3oz, and the thickness of copper electroplating layer is 2oz.
The thick 5oz that requires of the present embodiment internal layer copper, but its actual line design cannot meet the making ability that 5oz copper is thick.The line pitch of inner-layer thick copper wiring board is designed to before 10mil(compensation), cannot disposable etching draw, adopt pressing gummosis to fill the mode that adds peeling nog plate, circuit is filled smooth, even, is made into power high.
What in the manufacture method of above-mentioned two embodiment, pressing gummosis adopted is all half mobility cured sheets, and the pressing material using with rear operation is identical, can also save flow process, has saved the step that needs to remove welding resistance in existing procedure.Utilize laminating method filling part resin to overcome on the one hand that the thick copper area filling amount that common printing welding resistance, resin bring is inhomogeneous, the large problem of difficulty is controlled in manual operations, first filling part copper is thick on the other hand also can avoid the thick copper of follow-up disposable filling time because plate face difference in height is large, the large lamination fold problem easily occurring of filler amount, guarantees the quality of product.
Adopt manufacture method of the present invention can make in theory the wiring board that any copper is thick, flow process is simple, and rate of finished products is high.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.

Claims (6)

1. a manufacture method for thick copper printed wiring board, is characterized in that, comprises the steps:
(1) on central layer, obtain line pattern by dry film, etching operation;
(2) PCB surface obtaining in step (1) covers prepreg and Copper Foil successively, then carries out laminating operation;
(3) wiring board after step (2) lamination is peelled off to Copper Foil, then carry out nog plate operation until expose internal layer circuit;
(4) wiring board step (3) being obtained sinks copper coin plating operation, then carries out dry film operation, exposes the region that need to make thick copper circuit;
(5) the enterprising electroplating copper operation of the wiring board that obtains in step (4), makes that the copper of thick copper circuit is thick reaches requirement;
(6) on the wiring board obtaining in step (5), carry out zinc-plated operation, and then move back film, etching, move back tin operation;
(7) wiring board step (6) being obtained carries out rear operation making, obtains thick copper printed wiring board.
2. the manufacture method of thick copper printed wiring board according to claim 1, is characterized in that, the copper of this thick copper printed wiring board is thick >=and 4oz.
3. the manufacture method of thick copper printed wiring board according to claim 1, is characterized in that, in step (1) copper of central layer thick be the 1/3-2/3 that final copper is thick.
4. the manufacture method of thick copper printed wiring board according to claim 1, it is characterized in that, in step (2), the operating parameter of lamination is under vacuum state, the pressure of lamination is controlled at 300-400psi, wiring board is risen to 180-190 ℃ from room temperature, and wherein the rate of heat addition is controlled at 1.5-3.0 ℃/min within the scope of 80 ℃-140 ℃, and high temperature 180-190 ℃ maintains 60-70min, and then being cooled to room temperature, cooldown rate is less than 3 ℃/min.
5. the manufacture method of thick copper printed wiring board according to claim 1, is characterized in that, in step (4), heavy copper coin plates the thick 5-15 μ m of being of the copper obtaining.
6. the thick copper printed wiring board that claim 1-5 any one manufacture method obtains.
CN201410062749.9A 2014-02-24 2014-02-24 Thick copper printed circuit board and manufacturing method thereof Pending CN103826390A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410062749.9A CN103826390A (en) 2014-02-24 2014-02-24 Thick copper printed circuit board and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410062749.9A CN103826390A (en) 2014-02-24 2014-02-24 Thick copper printed circuit board and manufacturing method thereof

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CN103826390A true CN103826390A (en) 2014-05-28

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107172822A (en) * 2017-06-02 2017-09-15 江门崇达电路技术有限公司 A kind of method for lifting acid etching uniformity
CN109275287A (en) * 2018-09-28 2019-01-25 宜兴硅谷电子科技有限公司 A kind of production method of thickness copper printed wiring board
CN110248503A (en) * 2019-06-11 2019-09-17 深圳市星河电路股份有限公司 A kind of novel compression method of super thick copper circuit board production

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101697661A (en) * 2009-11-11 2010-04-21 深南电路有限公司 Methods for plugging hole of PCB and manufacturing double-sided PCB
JP2010141164A (en) * 2008-12-12 2010-06-24 Shinko Electric Ind Co Ltd Method of manufacturing multilayer wiring board
CN102056413A (en) * 2010-12-23 2011-05-11 北大方正集团有限公司 Method for manufacturing printed circuit board
CN102548254A (en) * 2010-12-30 2012-07-04 北大方正集团有限公司 Nuclear-free preparation method of chip carrier
CN102548216A (en) * 2010-12-09 2012-07-04 北大方正集团有限公司 Method for manufacturing initial layer core veneer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010141164A (en) * 2008-12-12 2010-06-24 Shinko Electric Ind Co Ltd Method of manufacturing multilayer wiring board
CN101697661A (en) * 2009-11-11 2010-04-21 深南电路有限公司 Methods for plugging hole of PCB and manufacturing double-sided PCB
CN102548216A (en) * 2010-12-09 2012-07-04 北大方正集团有限公司 Method for manufacturing initial layer core veneer
CN102056413A (en) * 2010-12-23 2011-05-11 北大方正集团有限公司 Method for manufacturing printed circuit board
CN102548254A (en) * 2010-12-30 2012-07-04 北大方正集团有限公司 Nuclear-free preparation method of chip carrier

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107172822A (en) * 2017-06-02 2017-09-15 江门崇达电路技术有限公司 A kind of method for lifting acid etching uniformity
CN109275287A (en) * 2018-09-28 2019-01-25 宜兴硅谷电子科技有限公司 A kind of production method of thickness copper printed wiring board
CN110248503A (en) * 2019-06-11 2019-09-17 深圳市星河电路股份有限公司 A kind of novel compression method of super thick copper circuit board production

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Application publication date: 20140528