CN203814047U

CN203814047U - Electroplating floating frame

Info

Publication number: CN203814047U
Application number: CN201420171577.4U
Authority: CN
Inventors: 马卓; 李成; 王一雄
Original assignee: SHENZHEN XUNJIEXING CIRCUIT TECH Co Ltd
Current assignee: Shenzhen Xunjiexing Technology Corp ltd
Priority date: 2014-04-10
Filing date: 2014-04-10
Publication date: 2014-09-03
Anticipated expiration: 2024-04-10

Abstract

The utility model provides an electroplating floating frame. The electroplating floating frame includes two first shielding plates, a plurality of connecting plates and a second shielding plate; the two first shielding plates are arranged in parallel; the plurality of connecting plates are arranged in parallel and are located between the two first shielding plates; one end of each of the plurality of connecting plates is connected with one first shielding plate, and the other end of each of the plurality of connecting plates is connected with the other first shielding plate; the second shielding plate is connected with the plurality of connecting plates and is located between the two first shielding plates; gaps exist between the second shielding plate and the first shielding plates; and the second shielding plate is perpendicular to the first shielding plates and the connecting plates simultaneously. According to the electroplating floating frame of the utility model, the second shielding plate is additionally arranged at the bottom of the electroplating floating frame, and the gaps exist between the second shielding plate and the first shielding plates, and therefore, the bottom of the electroplating floating frame can shield at least part of current, and thus, the uniformity of copper plating of small plates can be improved, and etching yield in a negative sheet production process can be improved.

Description

Electroplate scaffold

Technical field

The utility model belongs to printed wiring board and manufactures field, relates in particular to a kind of plating scaffold.

Background technology

In wiring board production process, when electro-coppering, because the size of plank differs, and the size of anode titanium basket is fixed, so need to apply scaffold, makes.

Fig. 1 shows the schematic diagram of plating scaffold of the prior art.As shown in Figure 1, electroplate scaffold 7 between two titanium indigo plant 9, and be positioned at liquid level below 10.Although electroplating the two sides, left and right of scaffold 7 can bucking current, wherein, electric current formed power line is as shown in 8 in Fig. 1, and its bottom can not bucking current.When the large plate of effect, its uniformity is better, and still, when making platelet with it, copper-plated uniformity is very poor.

Under the pressure of environmental protection pressure, more and more printed wiring board manufacturer starts to look for the negative film of more environmental protection to cover hole manufacture method, the thick once plating of copper is enough, and then press dry film and develop to cover and need the copper that retains, acid etching loses circuit again, and the even property of the copper thickness ununiformity of platelet is restricting the expansion of the method always.

Utility model content

The utility model provides a kind of plating scaffold, to solve the problem of the copper facing lack of homogeneity of platelet in prior art.

For addressing the above problem, as an aspect of the present utility model, provide a kind of plating scaffold, comprising: two the first shutters, two the first shutters arrange abreast; A plurality of connecting plates, a plurality of connecting plates arrange abreast and between two the first shutters, one end of a plurality of connecting plates is connected with first shutter, and the other end of a plurality of connecting plates is connected with another first shutter; The second shutter, is connected with a plurality of connecting plates, and the second shutter, between two the first shutters, has gap between the second shutter and the first shutter, and the second shutter is simultaneously perpendicular to the first shutter and connecting plate.

Further, on connecting plate, be provided with for the mounting groove of the second shutter is installed.

Further, connecting plate has the opening of V font.

Further, the opening of V font is extended to the downside of mounting groove by the upside of mounting groove.

Further, the number of connecting plate is 5 to 10.

Further, gap is 2 centimetres.

Further, on the first shutter, offer a plurality of holes.

Plating scaffold in the utility model has increased by the second shutter in its bottom, and between the second shutter and the first shutter, have gap, therefore, its bottom can shield at least a portion electric current, so improved the copper facing uniformity of platelet, can promote etching yield in negative film manufacture craft.

Accompanying drawing explanation

Fig. 1 schematically shows the schematic diagram of plating scaffold of the prior art;

Fig. 2 schematically shows stereogram of the present utility model; And

Fig. 3 schematically shows end view of the present utility model.

Reference numeral in figure: 1, the first shutter; 2, connecting plate; 3, the second shutter; 4, gap; 5, hole; 6, opening; 7, electroplate scaffold; 8, power line; 9, titanium is blue; 10, liquid level.

Embodiment

Below in conjunction with accompanying drawing, embodiment of the present utility model is elaborated, but the multitude of different ways that the utility model can be defined by the claims and cover is implemented.

Plating scaffold uniformity when doing platelet general in prior art is very poor, and main cause is while doing platelet, and the power line of bottom is intensive, and in prior art, general plating scaffold bottom is hollow, can not play bucking current.

Please refer to Fig. 2 and Fig. 3, the utility model provides a kind of plating scaffold, and it is specially adapted to gantry line electroplating work procedure and makes, and comprising: 1, two the first shutter 1 of two the first shutters arranges abreast; A plurality of connecting plates 2, a plurality of connecting plates 2 arrange abreast and between two the first shutters 1, one end of a plurality of connecting plates 2 is connected with first shutter 1, and the other end of a plurality of connecting plates 2 is connected with another first shutter 1; The second shutter 3, is connected with a plurality of connecting plates 2, and the second shutter 3, between two the first shutters 1, has gap 4, the second shutters 3 simultaneously perpendicular to the first shutter 1 and connecting plate 2 between the second shutter 3 and the first shutter 1.Preferably, the number of connecting plate 2 is 5 to 10.Preferably, gap 4 is 2 centimetres.

Plating scaffold in the utility model has increased by the second shutter 3 in its bottom, and there is gap 4 between the second shutter 3 and the first shutter 1, therefore, its bottom can shield at least a portion electric current, so improved the copper facing uniformity of platelet, can promote etching yield in negative film manufacture craft.

Preferably, on connecting plate 2, be provided with for the mounting groove of the second shutter 3 is installed.By mounting groove, the second shutter 3 can be stuck on connecting plate 2.

Preferably, connecting plate 2 has the opening 6 of V font, thus " recessed " type of formation piece.Preferably, the opening 6 of V font is extended to the downside of mounting groove by the upside of mounting groove.

Preferably, on the first shutter 1, offer a plurality of holes 5.

The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.

Claims

1. electroplate a scaffold, it is characterized in that, comprising: two the first shutters (1), described two the first shutters (1) arrange abreast; A plurality of connecting plates (2), described a plurality of connecting plate (2) arranges abreast and is positioned between described two the first shutters (1), one end of described a plurality of connecting plate (2) is connected with described first shutter (1), and the other end of described a plurality of connecting plates (2) is connected with the first shutter (1) described in another; The second shutter (3), be connected with described a plurality of connecting plates (2), described the second shutter (3) is positioned between described two the first shutters (1), between described the second shutter (3) and described the first shutter (1), have gap (4), described the second shutter (3) is simultaneously perpendicular to described the first shutter (1) and described connecting plate (2).

2. plating scaffold according to claim 1, is characterized in that, is provided with for the mounting groove of described the second shutter (3) is installed on described connecting plate (2).

3. plating scaffold according to claim 2, is characterized in that, described connecting plate (2) has the opening (6) of V font.

4. plating scaffold according to claim 3, is characterized in that, the opening of described V font (6) is extended to the downside of described mounting groove by the upside of described mounting groove.

5. plating scaffold according to claim 1, is characterized in that, the number of described connecting plate (2) is 5 to 10.

6. plating scaffold according to claim 1, is characterized in that, described gap (4) are 2 centimetres.

7. plating scaffold according to claim 1, is characterized in that, offers a plurality of holes (5) on described the first shutter (1).