CN209897348U - PCB (printed circuit board) conducting hole for enhancing hole wall combination effect - Google Patents
PCB (printed circuit board) conducting hole for enhancing hole wall combination effect Download PDFInfo
- Publication number
- CN209897348U CN209897348U CN201821978150.XU CN201821978150U CN209897348U CN 209897348 U CN209897348 U CN 209897348U CN 201821978150 U CN201821978150 U CN 201821978150U CN 209897348 U CN209897348 U CN 209897348U
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- CN
- China
- Prior art keywords
- pcb
- hole
- wall
- conducting hole
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000694 effects Effects 0.000 title claims abstract description 23
- 230000002708 enhancing effect Effects 0.000 title description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 239000011148 porous material Substances 0.000 claims abstract description 25
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 14
- 230000032683 aging Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model provides a PCB conducting hole of reinforcing pore wall combination effect, the inner wall of conducting hole is equipped with the recess, the recess has certain interior extension to the PCB board along the inner wall of conducting hole, and the copper layer is laminated on conducting hole and recess inner wall. The utility model is used for solve the problem that pore wall copper and pore wall separated easily after being heated, increase the area of contact on pore wall and copper layer, and then the combination effect of reinforcing pore wall and copper layer to avoid the PCB board ageing, make the PCB board can use for a long time, increased the reliability that the PCB board used, the cost is reduced.
Description
Technical Field
The utility model belongs to the technical field of the PCB conducting hole technique and specifically relates to a PCB conducting hole of reinforcing pore wall combination effect.
Background
There will be many conducting holes on the PCB board, and the aperture size that has some conducting holes can be very big, and these conducting holes mostly adopt milling cutter shaping, forms through the electro-coppering, often can take place the problem of separation after pore wall copper layer and the pore wall is heated in customer end SMT assembling process, in case take place the pore wall separation, can accelerate the PCB board ageing, influence the long-term use of PCB board, has reduced the reliability that the PCB board used, has increased the cost.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a PCB conducting hole of reinforcing pore wall combination effect for solve the problem of easy separation after pore wall copper and pore wall are heated.
The utility model provides a technical scheme that its technical problem adopted is:
the utility model provides a PCB conducting hole of reinforcing pore wall combination effect, the inner wall of conducting hole is equipped with the recess, the recess has certain interior extension to the PCB board along the inner wall of conducting hole, and the copper layer is laminated on conducting hole and recess inner wall.
The recess is provided with a plurality ofly, and all sets up at the via hole level, a plurality of the vertical equipartition of recess in the inside of via hole.
The groove is a circular groove which is concentrically arranged in the through hole, and the radius of the circular groove is larger than that of the through hole.
The radial dimension of the groove is 2-4 mil larger than the radial dimension of the via.
The groove is provided with a certain thickness, and the thickness is 1.38mil-2.76 mil.
The thickness of the groove was 2.5 mils.
The distance between two adjacent grooves is 10-30 mil.
The distance between two adjacent grooves is 14-26 mil.
The effect provided in the present invention is only the effect of the embodiment, not all the effects of the present invention, and the following advantages or beneficial effects are provided in the above technical solution:
1. the utility model provides a pair of PCB conducting hole of reinforcing pore wall combination effect is equipped with the recess in the conducting hole, and the recess can increase the area of contact of pore wall and copper layer, and then strengthens the combination effect of pore wall and copper layer to avoid the PCB board ageing, make the PCB board can use for a long time, increased the reliability that the PCB board used, the cost is reduced.
2. The utility model provides a pair of PCB conducting hole of reinforcing pore wall combination effect, recess are the circular slot, and the circular slot is endocentric to be established in the conducting hole, and the diameter size of circular slot is greater than the diameter size of conducting hole, and the circular slot is convenient for process reduce cost.
3. The utility model provides a pair of PCB conducting hole of reinforcing pore wall combination effect, circular slot are equipped with a plurality ofly in the conducting hole, have further increased the area of contact on pore wall and copper layer, better reinforcing the combination effect on pore wall and copper layer.
4. The utility model provides a pair of PCB conducting hole of reinforcing pore wall combination effect, circular slot set up at the downthehole level of conducting hole, and the vertical equipartition of a plurality of circular slots has further increased the area of contact on pore wall and copper layer in the conducting hole, the combination effect on reinforcing pore wall and copper layer.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a schematic view of a structure for removing a copper layer.
In the figure: the PCB comprises a PCB board 1, a via hole 11, an electrical groove 12, a copper layer 2 and a groove 3.
Detailed Description
In order to clearly illustrate the technical features of the present invention, the present invention will be explained in detail by the following embodiments with reference to the attached drawings 1-2. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and techniques are omitted so as to not unnecessarily limit the invention.
The utility model provides a PCB conducting hole of reinforcing pore wall combination effect, the inner wall of conducting hole 11 is equipped with recess 3, recess 3 has certain interior extension to PCB board 1 along the inner wall of conducting hole 11, and copper layer 2 is laminated on the inner wall of conducting hole 11 and recess 3.
Be equipped with a plurality of conducting holes 11 on the PCB board 1, the both ends of each conducting hole 11 all are equipped with an electric tank 12, be equipped with electric cable in the electric tank 12, be equipped with copper layer 2 on the inner wall of conducting hole 11, copper layer 2 can avoid conducting hole 11 on the PCB board 1 to receive external corruption, and then plays fine guard action to PCB board 1.
The inner wall of the conducting hole 11 between the two electric grooves 12 is provided with a plurality of grooves 3, and the contact area between the inner wall of the conducting hole 11 and the copper layer 2 can be increased by the grooves 3, so that the combination effect with the copper layer 2 is enhanced.
The grooves 3 are horizontally arranged in the through hole 11, and the grooves 3 are uniformly distributed in the through hole 11 vertically.
The groove 3 is a circular groove, the circular groove is concentrically arranged in the conducting hole 11, the radius size of the circular groove is larger than that of the conducting hole 11, and the circular groove is convenient to process.
The radius size of the groove 3 is 2-4 mil larger than that of the via hole 11, because the number of the via holes 11 on the PCB board 1 is large, the minimum electrical clearance is set between the via holes 11 according to the requirement, and the size difference between the groove 3 and the via hole 11 needs to meet the requirement of the minimum electrical clearance.
The groove 3 is provided with a certain thickness, and the thickness is 1.38-2.76 mil.
To satisfy the requirement of better stability between the inner wall of the via hole 11 and the copper layer 2, the thickness of the groove 3 can be set to 2.5 mil.
The distance between two adjacent grooves 3 is 10-30 mil.
To better increase the bonding effect between the inner wall of the via hole 11 and the copper layer 2, the distance between two adjacent grooves 3 is 14mil to 26 mil.
The utility model discloses a theory of operation:
be equipped with recess 3 in conducting hole 11, recess 3 can increase the inner wall of conducting hole 11 and copper layer 2's area of contact, and then reinforcing and copper layer 2's combination effect, and recess 3 is the circular slot, and the circular slot is all endocentric be equipped with a plurality ofly in conducting hole 11, and a plurality of circular slots have further increased the inner wall of conducting hole 11 and copper layer 2's area of contact, the better combination effect of the inner wall of conducting hole 11 with copper layer 2 that has strengthened.
In addition to the technical features described in the specification, the technology is known to those skilled in the art.
Although the specific embodiments of the present invention have been described with reference to the drawings, the present invention is not limited thereto, and various modifications or variations that can be made by those skilled in the art without inventive labor are still within the scope of the present invention.
Claims (8)
1. The utility model provides a PCB conducting hole of reinforcing pore wall combination effect, characterized by, the inner wall of conducting hole is equipped with the recess, the recess extends to the PCB inboard along the inner wall of conducting hole, and the copper layer is laminated on conducting hole and recess inner wall.
2. The PCB via hole of claim 1, wherein a plurality of grooves are formed and horizontally arranged in the via hole, and the plurality of grooves are vertically and uniformly distributed in the via hole.
3. The PCB via hole of claim 1 wherein the recess is a circular groove concentrically disposed within the via hole, the circular groove having a radius greater than a radius of the via hole.
4. The PCB via of claim 3 wherein the radius of the recess is 2mil to 4mil greater than the radius of the via.
5. The PCB via of claim 1 wherein said groove has a thickness of 1.38mil to 2.76 mil.
6. The PCB via of claim 5 wherein the groove has a thickness of 2.5 mils.
7. The PCB via of claim 1 wherein adjacent grooves are spaced apart from each other by a distance of 10mil to 30 mil.
8. The PCB via of claim 7 wherein adjacent grooves are spaced apart from each other by a distance of 14-26 mils.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821978150.XU CN209897348U (en) | 2018-11-28 | 2018-11-28 | PCB (printed circuit board) conducting hole for enhancing hole wall combination effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821978150.XU CN209897348U (en) | 2018-11-28 | 2018-11-28 | PCB (printed circuit board) conducting hole for enhancing hole wall combination effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209897348U true CN209897348U (en) | 2020-01-03 |
Family
ID=69015183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821978150.XU Expired - Fee Related CN209897348U (en) | 2018-11-28 | 2018-11-28 | PCB (printed circuit board) conducting hole for enhancing hole wall combination effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209897348U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312652A (en) * | 2020-10-27 | 2021-02-02 | 惠州市特创电子科技有限公司 | Multilayer circuit board and mobile communication device |
-
2018
- 2018-11-28 CN CN201821978150.XU patent/CN209897348U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312652A (en) * | 2020-10-27 | 2021-02-02 | 惠州市特创电子科技有限公司 | Multilayer circuit board and mobile communication device |
| CN112312652B (en) * | 2020-10-27 | 2022-09-02 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board and mobile communication device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200103 Termination date: 20201128 |