CN103813648A - Circuit board capable of bearing large currents and processing method thereof - Google Patents
Circuit board capable of bearing large currents and processing method thereof Download PDFInfo
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- CN103813648A CN103813648A CN201210459989.3A CN201210459989A CN103813648A CN 103813648 A CN103813648 A CN 103813648A CN 201210459989 A CN201210459989 A CN 201210459989A CN 103813648 A CN103813648 A CN 103813648A
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- copper
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Abstract
The invention discloses a method for manufacturing a circuit board capable of bearing large currents. The method comprises the following steps: manufacturing a first line pattern for bearing signals and a second line pattern for bearing the large currents on a copper-clad board; printing copper paste or silver paste on the surface of the second line pattern, and arranging a copper block for assisting the second line pattern in bearing the large currents on the surface of the second line pattern, where the copper paste or the silver paste is printed; pressing and fitting a half curing lamella on the copper-clad board, and forming a storage slot for containing the copper block in the position on the half curing lamella corresponding to the second line pattern. The embodiment of the invention also provides the corresponding circuit board. Through the adoption of the technical scheme of the invention, the circuit board itself can bear the large currents and the signals at the same time, the design can reduce the occupation for assembly space, the circuit board is simple to assemble, the reliability of the circuit board is high, and the cost of the circuit board is also reduced.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of circuit board and processing method thereof that can bearing great current.
Background technology
Current circuit board can carry little electric current and signal simultaneously, still, just helpless for the large electric current that is greater than 5A, and this is because large electric current needs the copper face of larger sectional area.Need the product of while bearing great current and signal for high-power power amplifier plate, automotive electronics circuit board etc., in prior art, conventionally adopt the mode that large electric current and signal are separated to realize, for example, the pilot wire that adheres to certain diameter at circuit board surface carrys out bearing great current.This mode that large electric current and signal are separated can take larger assembly space, and assembling is complicated, and reliability is not high yet.
Summary of the invention
The embodiment of the present invention provides a kind of circuit board and processing side thereof that can bearing great current, can take larger assembly space to solve prior art, and assembling is complicated, also not high technical problem of reliability.
A manufacture method for circuit board that can bearing great current, comprising: in copper-clad plate, produce for the first line pattern of carrying signal with for the second line pattern of bearing great current; At described the second line pattern surface printing copper slurry or silver slurry; On the second line pattern surface of having printed copper slurry or silver slurry, be provided for the copper billet of auxiliary the second line pattern bearing great current; Pressing layer of prepreg in described copper-clad plate, offers the accommodating groove for holding described copper billet corresponding to the position of described the second line pattern in described layer of prepreg.
A kind of circuit board that can bearing great current, comprise: copper-clad plate and be pressed together on the layer of prepreg in described copper-clad plate, in described copper-clad plate, be manufactured with for the first line pattern of carrying signal with for the second line pattern of bearing great current, described the second line pattern surface is provided with by copper and starches or silver slurry is fixing, for the copper billet of auxiliary the second line pattern bearing great current, in described layer of prepreg, offer corresponding to the position of described the second line pattern the accommodating groove that holds described copper billet.
The embodiment of the present invention adopts the second line pattern surface for bearing great current in copper-clad plate, starch or silver slurry arranges copper billet by copper, to assist the technical scheme of the second line pattern bearing great current, make circuit board bearing great current and signal simultaneously itself, this kind of design can reduce taking assembly space, and assembling is simple, and reliability is high, and cost also decreases.
Accompanying drawing explanation
Fig. 1 be the embodiment of the present invention can bearing great current the flow chart of manufacture method of circuit board;
Fig. 2-8th, the schematic diagram of the circuit board of each step in the employing embodiment of the present invention method course of processing.
Embodiment
The embodiment of the present invention provides a kind of manufacture method of circuit board that can bearing great current, can solve prior art and can take larger assembly space, and assembling is complicated, also not high technical problem of reliability.The embodiment of the present invention also provides corresponding circuit board.Below be elaborated respectively.
Embodiment mono-,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of manufacture method of circuit board that can bearing great current, comprising:
110, in copper-clad plate, produce for the first line pattern of carrying signal with for the second line pattern of bearing great current.
The copper-clad plate 200 of the embodiment of the present invention based on as shown in Figure 2 starts to make circuit board, in this copper-clad plate 200, design and be manufactured with for the first line pattern 201 of carrying signal with for the second line pattern 202 of bearing great current, said large electric current exceedes 5 amperes (A).The width of said the second line pattern 202 is greater than the width of the first line pattern 201, and the size of the large electric current that concrete width numerical value carries as required determines.
120,, at described the second line pattern surface printing copper slurry or silver slurry, on the second line pattern surface of having printed copper slurry or silver slurry, be provided for the copper billet of auxiliary the second line pattern bearing great current.
This step is starched at described the second line pattern surface printing copper slurry or silver, and the copper billet of additional conductive effect has been set.First, as shown in Figure 3, at described the second line pattern surface printing copper slurry or silver slurry 203.Then, as shown in Figure 4, the copper billet of making in advance 204 is fitted in to second line pattern 202 surfaces of having printed copper slurry or silver slurry 203, and adopt the melting temperature of copper slurry or silver slurry to toast 10 to 60 minutes, described copper slurry or silver slurry 203 are solidified, and copper billet 204 is bonded on copper slurry or silver slurry 203, starch or silver slurry 203 and the second line pattern 202 conduct by copper.The process of making copper billet 204 comprises: the size of the large electric current first carrying as required, and the space of circuit board, the size of copper-clad plate, the factors such as the width of the second line pattern, determine the length of copper billet, the parameters such as width and height, then make corresponding copper billet with reference to this parameter by ready Copper Foil.Conventionally, the height of this copper billet is greater than 5OZ.
130, pressing layer of prepreg in described copper-clad plate, offers the accommodating groove for holding described copper billet corresponding to the position of described Current Zone in described layer of prepreg.
As shown in Figure 5, in this step in copper-clad plate pressing layer of prepreg 205.This layer of prepreg 205 comprises the above prepreg of one deck, and the concrete number of plies is according to the height decision of copper billet 204, and the thickness of layer of prepreg 205 should exceed the height of copper billet 204.Accommodating groove 206 need to be offered in position corresponding to the second line pattern 202 in layer of prepreg 205, size, shape and the degree of depth and the copper billet 204 of this accommodating groove 206 match, and for example, can be the square grooves of certain depth, so that in the time of pressing, copper billet 204 is received wherein.
So far, circuit board is tentatively made, and has formed the first line pattern for carrying signal in same copper-clad plate, and for the second line pattern and the copper billet of bearing great current, and utilize layer of prepreg to carry out covering protection.
In concrete application, after 130, can also comprise:
As shown in Figure 6, pressing the second copper foil layer 207 in described layer of prepreg 205.As shown in Figure 7, in described the second copper foil layer 207 and layer of prepreg 205, be drilled with the blind hole 208 that arrives at described copper billet 204, and described blind hole is electroplated.This blind hole 208 can be used as large electric current and imports and leading-out terminal.As shown in Figure 8, make outer-layer circuit at the second copper foil layer 207.And, other processing steps such as solder mask are set.
To sum up, the embodiment of the present invention provides a kind of manufacture method of circuit board that can bearing great current, the method adopts the second line pattern surface for bearing great current in copper-clad plate, starch or silver slurry arranges copper billet by copper, to assist the technical scheme of the second line pattern bearing great current, circuit board bearing great current and the signal simultaneously that makes to adopt the method to make, thus can reduce the taking of assembly space, and the form, fit, and function that is conducive to other module discharges; And the circuit board utilization that the method is made is fixed on the copper billet bearing great current on circuit board, reliability is high, and assembling is simple, and efficiency of assembling is high, and cost also decreases; The method technique is simple, is applicable to producing in enormous quantities.
Embodiment bis-,
Please refer to Fig. 5, the embodiment of the present invention also provides a kind of circuit board that can bearing great current, this circuit board comprises: copper-clad plate 200 and be pressed together on the layer of prepreg 205 in described copper-clad plate, in described copper-clad plate 200, be manufactured with for the first line pattern 201 of carrying signal with for the second line pattern 202 of bearing great current, described the second line pattern 202 surfaces are provided with by copper and starch or silver slurry 203 is fixing, for the copper billet 204 of auxiliary the second line pattern 202 bearing great currents, in described layer of prepreg 205, offer corresponding to the position of described the second line pattern 202 accommodating groove 206 that holds described copper billet 204.
Optionally, as shown in Figure 8, in described layer of prepreg 205, also pressing has copper foil layer 207, is drilled with the blind hole 208 that arrives at described copper billet in described copper foil layer 207 and layer of prepreg 205.
To sum up, the embodiment of the present invention provides a kind of circuit board that can bearing great current, this circuit board comprises a copper-clad plate, on the second line pattern surface for bearing great current of copper-clad plate, starches or silver slurry is provided with copper billet to assist the second line pattern bearing great current by copper.This circuit board is bearing great current and signal simultaneously, can reduce the taking of assembly space, and the form, fit, and function that is conducive to other module discharges; This circuit board utilization is fixed on the copper billet bearing great current in its copper-clad plate, and reliability is high, and assembling is simple, and efficiency of assembling is high, and cost also decreases.
Above the embodiment of the present invention is provided can bearing great current circuit board and preparation method thereof be described in detail, but the explanation of above embodiment is just understood method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.In the technical scope that those skilled in the art disclose in the present invention, the variation that can expect easily or replacement, within all should being encompassed in protection scope of the present invention.
Claims (6)
1. a manufacture method for circuit board that can bearing great current, is characterized in that, comprising:
In copper-clad plate, produce for the first line pattern of carrying signal with for the second line pattern of bearing great current;
At described the second line pattern surface printing copper slurry or silver slurry, on the second line pattern surface of having printed copper slurry or silver slurry, be provided for the copper billet of auxiliary the second line pattern bearing great current;
Pressing layer of prepreg in described copper-clad plate, offers the accommodating groove for holding described copper billet corresponding to the position of described the second line pattern in described layer of prepreg.
2. method according to claim 1, is characterized in that, also comprises:
Pressing copper foil layer in described layer of prepreg is drilled with the blind hole that arrives at described copper billet in described copper foil layer and layer of prepreg, and described blind hole is electroplated.
3. method according to claim 1, is characterized in that, on the second line pattern surface of having printed copper slurry or silver slurry, the copper billet that is provided for auxiliary the second line pattern bearing great current also comprises before:
The size of the large electric current of carrying is produced described copper billet as required.
4. method according to claim 1, is characterized in that, on the second line pattern surface of having printed copper slurry or silver slurry, the copper billet that is provided for auxiliary the second line pattern bearing great current comprises:
Copper billet that can bearing great current in the second line pattern surface laminating of having printed copper slurry or silver slurry, then, adopt the melting temperature of copper slurry or silver slurry to toast 10 to 60 minutes, described copper slurry or silver slurry are solidified, and make described copper billet be bonded in copper slurry or silver slurry is upper, starch or silver slurry and the second line pattern conduct by copper.
One kind can bearing great current circuit board, it is characterized in that, comprise: copper-clad plate and be pressed together on the layer of prepreg in described copper-clad plate, in described copper-clad plate, be manufactured with for the first line pattern of carrying signal with for the second line pattern of bearing great current, described the second line pattern surface is provided with by copper and starches or silver slurry is fixing, for the copper billet of auxiliary the second line pattern bearing great current, in described layer of prepreg, offer corresponding to the position of described the second line pattern the accommodating groove that holds described copper billet.
6. circuit board according to claim 5, is characterized in that:
In described layer of prepreg, also pressing has copper foil layer, is drilled with the blind hole that arrives at described copper billet in described copper foil layer and layer of prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210459989.3A CN103813648A (en) | 2012-11-15 | 2012-11-15 | Circuit board capable of bearing large currents and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210459989.3A CN103813648A (en) | 2012-11-15 | 2012-11-15 | Circuit board capable of bearing large currents and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103813648A true CN103813648A (en) | 2014-05-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201210459989.3A Pending CN103813648A (en) | 2012-11-15 | 2012-11-15 | Circuit board capable of bearing large currents and processing method thereof |
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| CN (1) | CN103813648A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103906377A (en) * | 2012-12-28 | 2014-07-02 | 深南电路有限公司 | Method for manufacturing circuit board bearing large current, and circuit board bearing large current |
| CN105491793A (en) * | 2014-09-15 | 2016-04-13 | 深南电路有限公司 | Circuit board machining method and circuit board |
| CN108282967A (en) * | 2018-01-25 | 2018-07-13 | 鹤山市中富兴业电路有限公司 | A kind of locally thickness copper PCB and its manufacture craft |
| CN108323038A (en) * | 2018-01-22 | 2018-07-24 | 广州兴森快捷电路科技有限公司 | Thick copper PCB and preparation method thereof, bomb shelter method |
| CN112867270A (en) * | 2021-02-02 | 2021-05-28 | 沪士电子股份有限公司 | Method for printing high-speed circuit board by using conductive paste and high-speed circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5493263A (en) * | 1991-07-19 | 1996-02-20 | Fujitsu Limited | Microstrip which is able to supply DC bias current |
| JP2000124561A (en) * | 1998-10-21 | 2000-04-28 | Canon Inc | Printed wiring board |
| EP1174310A1 (en) * | 2000-07-18 | 2002-01-23 | Delphi Technologies, Inc. | Electric current and signal conductor |
| US20020112882A1 (en) * | 2001-02-21 | 2002-08-22 | Kyocera Corporation | Ceramic circuit board |
| CN1679380A (en) * | 2002-08-23 | 2005-10-05 | 日本瑞翁株式会社 | Circuit substrate, electronic apparatus employing circuit substrate, and process for producing circuit substrate |
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN102711377A (en) * | 2012-05-09 | 2012-10-03 | 敬鹏(常熟)电子有限公司 | Circuit board for transmitting high current |
-
2012
- 2012-11-15 CN CN201210459989.3A patent/CN103813648A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5493263A (en) * | 1991-07-19 | 1996-02-20 | Fujitsu Limited | Microstrip which is able to supply DC bias current |
| JP2000124561A (en) * | 1998-10-21 | 2000-04-28 | Canon Inc | Printed wiring board |
| EP1174310A1 (en) * | 2000-07-18 | 2002-01-23 | Delphi Technologies, Inc. | Electric current and signal conductor |
| US20020112882A1 (en) * | 2001-02-21 | 2002-08-22 | Kyocera Corporation | Ceramic circuit board |
| CN1679380A (en) * | 2002-08-23 | 2005-10-05 | 日本瑞翁株式会社 | Circuit substrate, electronic apparatus employing circuit substrate, and process for producing circuit substrate |
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN102711377A (en) * | 2012-05-09 | 2012-10-03 | 敬鹏(常熟)电子有限公司 | Circuit board for transmitting high current |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103906377A (en) * | 2012-12-28 | 2014-07-02 | 深南电路有限公司 | Method for manufacturing circuit board bearing large current, and circuit board bearing large current |
| CN105491793A (en) * | 2014-09-15 | 2016-04-13 | 深南电路有限公司 | Circuit board machining method and circuit board |
| CN105491793B (en) * | 2014-09-15 | 2018-05-29 | 深南电路有限公司 | The processing method and circuit board of a kind of circuit board |
| CN108323038A (en) * | 2018-01-22 | 2018-07-24 | 广州兴森快捷电路科技有限公司 | Thick copper PCB and preparation method thereof, bomb shelter method |
| CN108282967A (en) * | 2018-01-25 | 2018-07-13 | 鹤山市中富兴业电路有限公司 | A kind of locally thickness copper PCB and its manufacture craft |
| CN112867270A (en) * | 2021-02-02 | 2021-05-28 | 沪士电子股份有限公司 | Method for printing high-speed circuit board by using conductive paste and high-speed circuit board |
| CN112867270B (en) * | 2021-02-02 | 2023-01-24 | 沪士电子股份有限公司 | Method for printing high-speed circuit board by using conductive paste and high-speed circuit board |
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Application publication date: 20140521 |
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