CN102711377A - Circuit board for transmitting high current - Google Patents
Circuit board for transmitting high current Download PDFInfo
- Publication number
- CN102711377A CN102711377A CN2012101416231A CN201210141623A CN102711377A CN 102711377 A CN102711377 A CN 102711377A CN 2012101416231 A CN2012101416231 A CN 2012101416231A CN 201210141623 A CN201210141623 A CN 201210141623A CN 102711377 A CN102711377 A CN 102711377A
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- conducting element
- circuit board
- conducting
- board body
- electric current
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Abstract
The invention discloses a circuit board for transmitting high current and belongs to the technical field of circuit boards. The circuit board for transmitting high current comprises a circuit board body, wherein one or more first conducting elements and one or more second conducting elements are arranged on the circuit board body; the first conducting elements and the second conducting elements are spaced from one another. The circuit board for transmitting high current is characterized by also comprising a conducting bridge, wherein one end of the conducting bridge is connected with the first conducting elements; the other end of conducting bridge is connected with the second conducting elements; and the first conducting elements and the second conducting elements are embedded on the circuit board body. The circuit board has the advantages that a fixing column and a connecting plate in the prior art are replaced by the conducting bridge, and the two ends of the conducting bridge are respectively connected with the first conducting elements and the second conducting elements, thereby meeting the rapid assembly requirement and improving the production efficiency, and the consumption of auxiliary materials can be saved, which is economic.
Description
Technical field
The invention belongs to the circuit board technology field, be specifically related to a kind of circuit board that is used to transmit big electric current
Background technology
circuit board is the carrier of electronic component, and the circuit that is provided with on the circuit board can realize being electrically connected between the electronic component, to satisfy the requirement of current delivery and signal transmission.In order to cooperate the running demand of various electronic equipments, circuit board must have the function that can transmit big electric current.
The circuit board that is used to transmit big electric current can be seen in
in disclosed patent documentation; " the high-current circuit plate " typically recommended like TaiWan, China patent announcement TW330754; This board structure of circuit is by shown in Figure 8: comprise circuit board body 5, be fixed on the plurality of fixed post 51 on the circuit board body 5 and through screw 53 two ends be fixed on the connecting plate 52 at the top of two fixed legs 51; By this; Big electric current can transmit through fixed leg 51 and connecting plate 52; And because connecting plate 52 shows as airborne for circuit board body 5, therefore can the electronic component that be arranged on the circuit board body 5 not exerted an influence, promptly can not produce interference.
still; There are following 2 shortcoming in " the high-current circuit plate " that above-mentioned TW330754 provides: one of which; Assembling trouble because will be a plurality of except needs promptly one group of fixed leg 51 and circuit board body 5 fixing, also need in advance the central part on the top of fixed leg 51 is processed screw hole; And need on connecting plate 52 and process the screw resigning hole in position corresponding to the said screw hole on the top of fixed leg 51; Be screwed into by screw 53 contraposition screw resigning holes in the aforementioned screw hole on top of fixed leg 51 and use and make connecting plate 52 with the top of airborne corresponding to circuit board body 5, visible, operator's assembling work is very loaded down with trivial details; Need the tediously long time could accomplish assembling, be unfavorable for the raising of industrial amplification production efficient; Its two owing to need to rely on the fixed leg 51 as accessory, so auxiliary material consumption is big, and assembly cost is significantly improved, and runs counter to the economizing economy spirit that the present whole society advocates.
In view of above-mentioned prior art, be necessary rationally to improve, for this reason, the applicant has done useful design, and the technical scheme that will introduce below produces under this background
Summary of the invention
task of the present invention is to provide a kind of and helps to abandon fixed leg and can realize each other being electrically connected and use and embody quick assembling, promote production efficiency and practice thrift the circuit board that is used to transmit big electric current of auxiliary material consumption being arranged at two conducting elements on the circuit board body.
task of the present invention is accomplished like this; A kind of circuit board that is used to transmit big electric current; Comprise the circuit board body, this circuit board body is provided with one or above first conducting element and one or the second above conducting element, wherein: first, second conducting element each interval; Be characterised in that: also include a conducting bridge; One end of this conducting bridge is connected with said first conducting element, and the other end is connected with said second conducting element, and first conducting element and second conducting element are embedded on the described circuit board body.
are in a concrete embodiment of the present invention; Described conducting bridge be embedded at described circuit board body on said first conducting element and with said second conducting element be connected to that scarf is connected, securing member connects or be welded to connect, and conducting bridge is the conductive plate or a cable of a rectangle.
are in another concrete embodiment of the present invention; When described conducting bridge is the conductive plate of a rectangle; And when conductive plate be embedded at said circuit board body on said first conducting element and described second conducting element be connected to scarf when being connected; Then constitute one first embedding pin towards the end bending of first conducting element at conductive plate; And constitute one second embedding pin towards the bending of an end of second conducting element at conductive plate; On first conducting element and in position, offer the first adaptive inlaid foot groove of the one and first embedding pin corresponding to the described first embedding pin; And on second conducting element and in position, offering the second adaptive inlaid foot groove of the one and second embedding pin corresponding to the described second embedding pin, the first embedding pin is embedded in first inlaid foot groove, and the second embedding pin is embedded in second inlaid foot groove.
are fixed with a feet at the middle part of the length direction of described conductive plate and towards a side of said circuit board body in another concrete embodiment of the present invention, this feet is supported on the described circuit board body.
are in another concrete embodiment of the present invention; When described conducting bridge is a cable; Then this cable is embedded on the described circuit board body; And an end of this cable is welded to connect with described first conducting element or is connected by securing member, and the other end is welded to connect with described second conducting element or is connected by securing member.
also have among the concrete embodiment of the present invention, and described first, second conducting element and conducting bridge are made by electric conducting material, and described electric conducting material is a copper.
are more of the present invention and among concrete embodiment, on described circuit board body, be provided with the IC signal circuit.
are in of the present invention and then concrete embodiment; On described circuit board body, offer that quantity equates with the quantity of described first conducting element and second conducting element and position and first, second conducting element conducting element corresponding and big or small and that first, second conducting element is suitable are set the hole; And set at conducting element on the hole wall in hole and be combined with an electrodeposited coating, described first conducting element and second conducting element are embedded at conducting element and set in the hole.
are of the present invention again more and among concrete embodiment; Respectively constituting at least one first packing bead on the sidewall around described first conducting element; Constitute one group of second packing bead at interval and on the sidewall of described second conducting element and around the circumference of sidewall, divide equally with 360 °; The said electrodeposited coating that the first packing bead and described conducting element are set on the hole wall in hole closely contacts, and the second packing bead closely contacts with the said electrodeposited coating that said conducting element is set on the hole wall in hole equally.
in again of the present invention and then concrete embodiment, the shape of cross section of described first, second packing bead all is the C font.
The advantage of
technical scheme provided by the invention is: replace fixed leg and connecting plate in the prior art by conducting bridge; And the two ends of conducting bridge are connected with first, second conducting element respectively; Thereby not only can satisfy quick matching requirements and enhance productivity, and can practice thrift the consumption of auxiliary material and embody economy.
Description of drawings
Fig. 1 is the schematic top plan view of the first embodiment of the present invention.
Fig. 2 is the cutaway view of Fig. 1.
Fig. 3 is the schematic top plan view of the second embodiment of the present invention.
Fig. 4 is the schematic top plan view of the third embodiment of the present invention.
Fig. 5 is the cutaway view of Fig. 4.
Fig. 6 is an example structure figure of first conducting element of the present invention.
Fig. 7 is an example structure figure of second conducting element of the present invention.
Fig. 8 is the sketch map of the high-current circuit plate in the prior art.
Embodiment
can be expressly understood technical spirit of the present invention and beneficial effect more for the auditor that the makes Patent Office especially public; The applicant general elaborates with the mode of embodiment below; But the description to embodiment all is not the restriction to the present invention program, any according to the present invention design done only for pro forma but not substantial equivalent transformation all should be regarded as technical scheme category of the present invention.
see also Fig. 1 and Fig. 2; Provided a circuit board body 1; Be provided with each one first conducting element 11 and second conducting element 12 that is not limited to illustrate quantity at circuit board body 1; Wherein, first, second conducting element 11,12 all is embedded in the conducting element that is opened on the circuit board body 1 with the mode of setting and sets in the hole 13.Undoubtedly, it is suitable that conducting element is set shape, size and the thickness of shape, size and the degree of depth and first, second conducting element 11 in hole 13.In the present embodiment; Because first conducting element 11 is a cuboid; And second conducting element 12 is a disc, and the conducting element that therefore supplies first conducting element 11 to set is set the rectangular opening that is shaped as in hole 13, and the conducting element that supplies second conducting element 12 to be embedded is set hole 13 and is circular port; That is to say that conducting element is set the shape in hole 13 and the relation that 11,12 maintenances of first, second conducting element are followed in sb's footsteps.Again, to set the quantity in hole 13 be first, second conducting element 11,12 sums to conducting element.
in the present embodiment, the sidewall of aforesaid first, second conducting element 11,12 is level and smooth, but need to guarantee that setting hole 13 with conducting element closely contacts, in order to avoid the play situation in use occurs.
also are provided with conducting bridge 2 on circuit board body 1, by illustrated in figures 1 and 2, an end of conducting bridge 2 is connected with aforesaid first conducting element 11, and the other end is connected with aforesaid second conducting element 12.
in the present embodiment; Aforesaid conducting bridge 2 is the conductive plate 21 of a rectangle; And conducting bridge 2 is that scarf is connected with the connected mode of first, second conducting element 11,12; Specific as follows: as to constitute one first embedding pin 211 towards the bending of an end of first conducting element 11 at conductive plate 21; And conductive plate 21 constitutes one second embedding pin 212 towards the bending of an end of second conducting element 12, therewith adaptably, i.e. and first, second embedding pin 211,212 by way of compensation; So on first conducting element 11 and in position, offer one first inlaid foot groove 111 (Fig. 2 sign) corresponding to the first embedding pin 211; And be embedded in first inlaid foot groove 111 offering one second inlaid foot groove, 121, the first embedding pin 211 on second conducting element 12 and in the position corresponding to the second embedding pin 212, and the second embedding pin 212 is embedded in second inlaid foot groove 121.In the course of processing of reality, should guarantee that first, second embedding pin 211,212 and conductive plate 21 constitute 90 ° right-angle relationship.
are when the length of conductive plate 21 is longer, then preferably in the middle position of the length direction of conductive plate 2 and towards the fixing support foot 213 of a side of circuit board body 1, the distal end faces of this support foot 213 is bearing on the circuit board body 1.
are by illustrated in figures 1 and 2; When the present invention puts into using; Circuit board body 1 is provided with electronic component, and electronic component comprises wafer 3 and electric connector 4, and wafer 3 can reach the purpose of transmission IC signal through circuit board body 1 set transmission circuit; And wafer 3 is connected with first conducting element 11; And electric connector 4 is connected with second conducting element 12, thereby reaches the effect of transmitting big electric current by wafer 3 and electric connector 4 through first, second conducting element 11,12 and conducting bridge 2, to satisfy the running demand of distinct electronic apparatuses.In addition, according to common practise, on circuit board body 1, also be provided with IC (integrated circuit) signal circuit (not shown), this IC signal circuit also can be described as the accurate transmission circuit of IC signal.
aforesaid conducting bridge 2 is a conductive plate 21 and first, second conducting element 11,12 is made by copper material.
Embodiment 2:
see also Fig. 3, and only the shape with aforesaid conductive plate 21 changes 7 fonts L shaped or the title Arabic numerals into, and all the other are all with the description to embodiment 1.
Embodiment 3:
see also Fig. 4 and Fig. 5; Use conducting bridge 2 instead cable 22, and cable 22 is embedded in the circuit board body 1, and an end of cable 22 and 11 welding of first conducting element; Perhaps be fixedly connected with first conducting element 11 with securing member such as screw; The other end of cable 22 and 12 welding of second conducting element perhaps are fixedly connected with second conducting element 12 with securing member such as screw, and all the other are all with the description to embodiment 1.
Embodiment 4:
see also Fig. 6 and Fig. 7 and still combine Fig. 1 to Fig. 5; The inwall of setting hole 13 at aforesaid conducting element is electroplate with a conductive coating; And on each sidewall of first conducting element 11 of cuboid is that the lateral margin position constitutes the first packing bead 112 that a shape of cross section is the C font, and the lateral margin position of second conducting element 12 is constituted one group of second packing bead 122 at interval to divide equally for 360 ° around the circumferencial direction of second conducting element 12.After first conducting element 11 and second conducting element 12 be embedded into conducting element set in the hole 13; Then play the effect that closely contacts with aforesaid electrodeposited coating, loosening and even play phenomenon in use can not occur by first, second packing bead 112,122.All the other are all with the description to embodiment 1.
In sum, technical scheme provided by the invention has been eliminated the shortcoming in the prior art, has accomplished the invention task, has embodied the technique effect described in the superincumbent technique effect of the applicant hurdle, thereby to can yet be regarded as be a ultimate attainment scheme
Claims (10)
1.
a kind of circuit board that is used to transmit big electric current; Comprise circuit board body (1); This circuit board body (1) is provided with one or above first conducting element (11) and one or above second conducting element (12); Wherein: first, second conducting element (11,12) each interval is characterized in that: also include a conducting bridge (2), an end of this conducting bridge (2) is connected with said first conducting element (11); And the other end is connected with said second conducting element (12), and first conducting element (11) and second conducting element (12) are embedded on the described circuit board body (1).
2.
circuit board that is used to transmit big electric current according to claim 1; Said first conducting element (11) on it is characterized in that described conducting bridge (2) and being embedded at described circuit board body (1) and with said second conducting element (12) be connected to that scarf is connected, securing member connects or be welded to connect, and conducting bridge (2) is the conductive plate (21) or a cable (22) of a rectangle.
3.
circuit board that is used to transmit big electric current according to claim 2; It is characterized in that when described conducting bridge (2) is the conductive plate (21) of a rectangle; And when conductive plate (21) be embedded at said circuit board body (1) on said first conducting element (11) and described second conducting element (12) be connected to scarf when being connected; Then constitute one first embedding pin (211) towards the end bending of first conducting element (11) at conductive plate (21); And constitute one second embedding pin (212) towards the bending of an end of second conducting element (12) at conductive plate (21); On first conducting element (11) and in position, offer adaptive first inlaid foot groove (111) of the one and first embedding pin (211) corresponding to the described first embedding pin (211); And go up and offer adaptive second inlaid foot groove (121) of the one and second embedding pin (212) in position corresponding to the described second embedding pin (212) at second conducting element (12); The first embedding pin (211) is embedded in first inlaid foot groove (111), and the second embedding pin (212) is embedded in second inlaid foot groove (121).
4.
circuit board that is used to transmit big electric current according to claim 3; It is characterized in that at the middle part of the length direction of described conductive plate (21) and be fixed with a feet (213) that this feet (213) is supported on the described circuit board body (1) towards a side of said circuit board body (1).
5.
circuit board that is used to transmit big electric current according to claim 2; It is characterized in that when described conducting bridge (2) is a cable (22); Then this cable (22) is embedded on the described circuit board body (1); And an end of this cable (22) is welded to connect with described first conducting element (11) or is connected by securing member, and the other end is welded to connect with described second conducting element (12) or is connected by securing member.
6.
are according to claim 1 to 3 or the described circuit board that is used to transmit big electric current of 5 arbitrary claims; It is characterized in that described first, second conducting element (11,12) and conducting bridge (2) by the electric conducting material making, described electric conducting material is a copper.
7.
is characterized in that on described circuit board body (1), being provided with the IC signal circuit according to the described circuit board that is used to transmit big electric current of the arbitrary claim of claim 1-5.
8.
are according to claim 1 to 3 or the described circuit board that is used to transmit big electric current of 5 arbitrary claims; It is characterized in that on described circuit board body (1), offering that quantity equates with the quantity of described first conducting element (11) and second conducting element (12) and position and first, second conducting element (11,12) is corresponding and big or small and the suitable conducting element of first, second conducting element (11,12) is set hole (13); And set at conducting element on the hole wall of hole (13) and be combined with an electrodeposited coating, described first conducting element (11) and second conducting element (12) are embedded at conducting element and set in the hole (13).
9.
circuit board that is used to transmit big electric current according to claim 8; It is characterized in that respectively constituting at least one first packing bead (112) on the sidewall around described first conducting element (11); Constitute one group of second packing bead (122) at interval and on the sidewall of described second conducting element (12) and around the circumference of sidewall, divide equally with 360 °; The said electrodeposited coating that the first packing bead (112) and described conducting element are set on the hole wall of hole (13) closely contacts, and the second packing bead (122) closely contacts with the said electrodeposited coating that said conducting element is set on the hole wall of hole (13) equally.
10.
The circuit board that is used to transmit big electric current according to claim 9 is characterized in that the shape of cross section of described first, second packing bead (112,122) all is the C font
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101416231A CN102711377A (en) | 2012-05-09 | 2012-05-09 | Circuit board for transmitting high current |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101416231A CN102711377A (en) | 2012-05-09 | 2012-05-09 | Circuit board for transmitting high current |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102711377A true CN102711377A (en) | 2012-10-03 |
Family
ID=46903873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101416231A Pending CN102711377A (en) | 2012-05-09 | 2012-05-09 | Circuit board for transmitting high current |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102711377A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103813656A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| CN103813648A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| CN106159581A (en) * | 2015-04-23 | 2016-11-23 | 中芯国际集成电路制造(上海)有限公司 | A kind of connecting device for line |
| WO2021103575A1 (en) * | 2019-11-29 | 2021-06-03 | 华为技术有限公司 | Power supply apparatus and single board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0590643A2 (en) * | 1992-09-30 | 1994-04-06 | Mitsubishi Denki Kabushiki Kaisha | Large-current circuit board and method therefor |
| CN1222824A (en) * | 1998-01-09 | 1999-07-14 | 模帝科技株式会社 | Heavy-current flowing circuit substrate, and assembled unit and manufacturing method thereof |
| WO2008157143A2 (en) * | 2007-06-12 | 2008-12-24 | Clear Electronics Inc. | Edge connection structure for printed circuit boards |
| CN101384134A (en) * | 2008-10-09 | 2009-03-11 | 敬鹏(常熟)电子有限公司 | Method for embedding heat conductive element on circuit board |
| CN101719604A (en) * | 2010-02-01 | 2010-06-02 | 曙光信息产业(北京)有限公司 | Connector for large-current transmission based on single circuit board |
-
2012
- 2012-05-09 CN CN2012101416231A patent/CN102711377A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0590643A2 (en) * | 1992-09-30 | 1994-04-06 | Mitsubishi Denki Kabushiki Kaisha | Large-current circuit board and method therefor |
| CN1222824A (en) * | 1998-01-09 | 1999-07-14 | 模帝科技株式会社 | Heavy-current flowing circuit substrate, and assembled unit and manufacturing method thereof |
| WO2008157143A2 (en) * | 2007-06-12 | 2008-12-24 | Clear Electronics Inc. | Edge connection structure for printed circuit boards |
| CN101384134A (en) * | 2008-10-09 | 2009-03-11 | 敬鹏(常熟)电子有限公司 | Method for embedding heat conductive element on circuit board |
| CN101719604A (en) * | 2010-02-01 | 2010-06-02 | 曙光信息产业(北京)有限公司 | Connector for large-current transmission based on single circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103813656A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| CN103813648A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| CN106159581A (en) * | 2015-04-23 | 2016-11-23 | 中芯国际集成电路制造(上海)有限公司 | A kind of connecting device for line |
| CN106159581B (en) * | 2015-04-23 | 2018-11-27 | 中芯国际集成电路制造(上海)有限公司 | A kind of connecting device for line |
| WO2021103575A1 (en) * | 2019-11-29 | 2021-06-03 | 华为技术有限公司 | Power supply apparatus and single board |
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| PB01 | Publication | ||
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Application publication date: 20121003 |