CN101384134A - Method for embedding heat conductive element on circuit board - Google Patents
Method for embedding heat conductive element on circuit board Download PDFInfo
- Publication number
- CN101384134A CN101384134A CNA200810155583XA CN200810155583A CN101384134A CN 101384134 A CN101384134 A CN 101384134A CN A200810155583X A CNA200810155583X A CN A200810155583XA CN 200810155583 A CN200810155583 A CN 200810155583A CN 101384134 A CN101384134 A CN 101384134A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- conducting strip
- installing hole
- electrodeposited coating
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to a method for inserting a heat-conducting element in a circuit board, belonging to the technical field of the circuit board processing and comprising the following steps: a circuit board is provided, and a mounting hole is processed on the circuit board; first-time electroplating is carried out, namely, the inner wall and the periphery of the mounting hole are electroplated to form a first electroplated layer; a metal heat-conducting strip with wedge blocks arranged at the peripheral lateral edge at intervals is inserted in the mounting hole though a guiding device, and the outer edges of the wedge blocks are inserted in the first electroplated layer on the wall of the mounting hole and tightly abuts against the first electroplated layer; the second time electroplating is carried out, namely, the inner wall of the mounting hole is electroplated for coating the first electroplated layer and a second electroplated layer of the exposed parts of the wedge blocks not being inserted in the first electroplated layer, so that the wedge blocks and the second electroplated layer are closely connected, and a clearance is left between the heat-conducting strip and the second electroplated layer on the inner wall of the mounting hole in a part between adjacent two wedge blocks.
Description
Technical field
The invention belongs to the processing technique field of circuit board, be specifically related to the embedding grammar of a kind of heat conducting element on circuit board.
Background technology
Along with automobile product constantly advances towards the exquisiteness direction, the degree that makes electronic semi-conductor's technology incorporate automobile product improves day by day, the existing electronic semiconductor components of many functions of automobile product is filled the post of, and that is to say that electronic component occupies certain ratio on automobile product.With regard at present widely with regard to the employed braking automobile control system of automobile production manufacturer (ABS), its major function is to utilize electronic installation to control hydraulic pressure, uses with the staged braking pressure control and avoids wheel locking, and promptly people are accustomed to alleged anti-lock.Because the ABS brake control system can be with the frequency start of per second more than 10 times, use and keep wheel to shorten braking distance with the adhesive force (also claiming earth-grasping force) on ground, therefore, the electronic installation of ABS brake control system requires extremely strictness in safety and heat radiation.
At present, being provided with conducting strip with mosaic mode on the employed circuit board of the electronic installation of aforesaid ABS brake control system is heat conducting element, by conducting strip the electronic component on the circuit board is dispelled the heat, specifically heat is conducted to heat dissipation element by conducting strip, and in the existing technology conducting strip is mounted on the circuit board mosaic mode as shown in Figure 6 and Figure 7, elder generation is at the inner surface that defaults in the hole 82 on the circuit board 80 and form electrodeposited coating 81 all around, again with metal and around be formed with several clamp holders 91 conducting strip 90 compel to be incorporated in the hole 82 on the corresponding circuit board 80, and a part that makes the clamp holder 91 of conducting strip 90 is the electrodeposited coating 81 of peripheral edge portion embedding hole 82 inner surfaces of clamp holder 91, and the remainder in the electrodeposited coating that is not embedded in hole 82 81 of clamp holder 91 is used for for forming slit 83 between the electrodeposited coating 81 of conducting strip 90 and hole 82 inner surfaces, make between conducting strip 90 and the circuit board 80 by slit 83 and all not contact, specifically illustrate by Fig. 8, on circuit board 80, carry semiconductor wafer again through subsequent process steps, this semiconductor wafer directly contacts with a side surface of conducting strip 90, and the opposite side of conducting strip 90 surface contacts with heat dissipation element, when semiconductor wafer is worked, the heat that semiconductor wafer produced can conduct to heat dissipation element by conducting strip 90 and carry out heat exchange, cross the due operating efficiency of thermal impact to avoid semiconductor wafer, and, slit 83 can all not contact because of making between conducting strip 90 and the circuit board 80, so the temperature of conducting strip 90 can't be directly passed to circuit board 80, can't have influence on hole 82 work of other element on every side on the circuit board 80.
The shortcoming that above-mentioned clamp holder 91 with conducting strip 90 compels to be incorporated into the technological means existence that is formed at accordingly in circuit board 80 and the hole 82 that have electrodeposited coating 81 is: because the size of clamp holder 91 can there are differences, thereby often be difficult to ensure the effect that combines between conducting strip 90 and the circuit board 80, thereby cause conducting strip 90 from the hole 82 of circuit board 80, to come off, influence the following process operation of circuit board 80.
Summary of the invention
Task of the present invention is to provide a kind of can guarantee combining effect and use the embedding grammar of heat conducting element on circuit board of avoiding conducting strip to come off between conducting strip and the circuit board.
Task of the present invention is finished like this, the embedding grammar of a kind of heat conducting element on circuit board, and this method may further comprise the steps:
A) provide a circuit board, an installing hole is provided on the circuit board that is provided;
B) once electroplate, the inwall of installing hole and the plating all around of installing hole are formed first electrodeposited coating;
C) embed the installation conducting strip, the conducting strip that one metal and lateral margin is intervally distributed with outwards outstanding clamp holder all around embeds by guiding device and is installed in the installing hole, and make the peripheral edge portion of described clamp holder enter in first electrodeposited coating on the hole wall of installing hole with first electrodeposited coating urgent mutually against;
D) second time electroplating, plating is used to cover described first electrodeposited coating and second electrodeposited coating that is used to cover described conducting strip and be used to cover the exposed part that is not inserted into the clamp holder in first electrodeposited coating to the installing hole inwall, clamp holder closely is connected with second electrodeposited coating, and makes at the position between the adjacent clamp holder between second electrodeposited coating on the inwall of conducting strip and installing hole and keep the slit.
In a specific embodiment of the present invention, step B) first electrodeposited coating described in is a copper.
In another specific embodiment of the present invention, step C) first electrodeposited coating described in is a copper.
The external diameter of the conducting strip in also specific embodiment of the present invention, step C) is bigger than the internal diameter that is electroplate with the installing hole behind first electrodeposited coating.
In another specific embodiment of the present invention, step C) guiding device described in comprises a guide plate and a guide bar, on guide plate, offer the inner chamber that is used to hold described conducting strip, below inner chamber, constitute and be used to guide conducting strip and enter into guiding channel in the described installing hole, be formed with an annular shoulder between this guiding channel and the described inner chamber, make the diameter of guiding channel littler than the diameter of inner chamber by this annular shoulder, described guide bar matches with described guide plate, and it is corresponding with described inner chamber, wherein, the external diameter of guide bar is littler than the diameter of described guiding channel.
In another specific embodiment of the present invention, the diameter of described inner chamber is bigger than the external diameter of described conducting strip, and the internal diameter of described guiding channel equates substantially with the internal diameter of described installing hole.
More of the present invention and in specific embodiment, step D) second electrodeposited coating described in is a copper.
The technical scheme that the present invention recommended, carrying out the second time after being embedded in installing hole electroplates, clamp holder in the installing hole further closely is connected with second electrodeposited coating, thereby can guarantees the steadiness of conducting strip on circuit board, avoid conducting strip to come off from circuit board.
Description of drawings
Fig. 1 is the stereogram of circuit board of the present invention.
Fig. 2 is the cutaway view after being electroplate with first electrodeposited coating on the circuit board shown in Figure 1.
Fig. 3 A is the stereogram of conducting strip of the present invention.
Fig. 3 B is the cutaway view that conducting strip prepares to embed the installing hole on the circuit board.
Fig. 3 C is embedded in cutaway view in the installing hole on the circuit board for preparing by guiding device with conducting strip.
Fig. 3 D is the cutaway view after conducting strip is embedded in installing hole on the circuit board.
Fig. 3 E is the vertical view of Fig. 3 D.
Fig. 4 is the vertical view after the present invention carries out electroplating for the second time to circuit board.
Fig. 5 is put to the partial sectional view of working procedure processing separately for conducting strip embeds after operation in the installing hole on the circuit board is finished.
Fig. 6 is the stereogram of known conducting strip.
Fig. 7 is the cutaway view after the conducting strip in the prior art embeds installing hole on the circuit board.
Fig. 8 is the vertical view after the conducting strip in the prior art embeds installing hole on the circuit board.
Embodiment
The embedding grammar of heat conducting element of the present invention on circuit board comprises the following steps, promptly comprises: circuit board is provided, once electroplates, embed conducting strip and second time electroplating are installed, specific as follows:
A) provide a circuit board 10, ask for an interview Fig. 1, an installing hole 11 that promptly connects that runs through is provided on the circuit board 10 that is provided;
B) once electroplate, ask for an interview Fig. 2, to electro-coppering around the inwall of installing hole 11 and the installing hole 11, forming coating is first electrodeposited coating 15 of copper, be meant around the installing hole 11 described here around installing hole 11 proper area surface on every side, and described suitable surface be according to different require determined, for example in the 1-2cm scope of installing hole 11;
C) embed the installation conducting strip, ask for an interview Fig. 3 A to 3E, conducting strip 20 is embedded in the installing hole 11 on the circuit board 10 in packing pressing mode, wherein, the material of conducting strip 20 is that copper or aluminium or other similarly have the metal of desirable heat conductivity, conducting strip 20 be shaped as disc, the outwards outstanding one group of clamp holder 21 that is formed with each interval around conducting strip 20, there are 6 though show the quantity of clamp holder 21 among Fig. 3 A, but be not subjected to the restriction of this quantity, it can be according to needing increase and decrease, these clamp holders 21 are resisted against first electrodeposited coating 15 on the inwall of installing hole 11, wherein the outer diameter D of conducting strip 20 is slightly larger than installing hole 11 internal diameter L behind first electrodeposited coating 15 on electroplating, by this, when conducting strip 20 is embedded in installing hole 11, clamp holder 21 be subjected to first electrodeposited coating 15 compression and with first electrodeposited coating 15 mutually against, just make the peripheral edge portion of the clamp holder 21 of conducting strip 20 embed first electrodeposited coating 15 of installing hole 11 inner surfaces, and the parts in first electrodeposited coating 15 that is not embedded into installing hole 11 of clamp holder 21 constitute several slits 22 of formation between first electrodeposited coating 15 of conducting strip 20 and installing hole 11 inner surfaces, as described above, because the clamp holder 21 that present embodiment exemplifies has 6, therefore the slit 22 that constitutes should have 6 mutually.
Preferably, embed in the step of conducting strip 20 at this, conducting strip 20 can be embedded in the installing hole 11 by means of guiding device, shown in Fig. 3 C, guiding device comprises a guide plate 30 and a guide bar 40, on guide plate 30, offer an inner chamber 31 that is used for holding conducting strip 20, the internal diameter of inner chamber 31 should be greater than the outer diameter D of conducting strip 20, and narrow the contracting of the below inwall of inner chamber 30 is formed with an annular shoulder 32, use further formation one guiding channel 33, the diameter of guiding channel 33 is littler than inner chamber 31, and guiding channel 33 aligns with installing hole 11 on the circuit board 10, in the step of this embedding conducting strip 20, enter in the installing hole 11 by guiding channel 33 for conducting strip 20, the internal diameter A of guiding channel 33 equals to be electroplate with the internal diameter L of the installing hole 11 of first electrodeposited coating 15 substantially, but also can be bigger or be slightly less than the internal diameter L of installing hole 11, thereby guarantee conducting strip 20 axially successfully to move into the installing hole 11 of circuit board 10 by guiding channel 33, avoid conducting strip 20 radially traversing and cause embedding the step failure.The external diameter of guide bar 40 is less than the internal diameter A of guiding channel 33, and the effect of guide bar 40 is to take on conducting strip 20 compressings are entered guiding channel 33 up to conducting strip 20 is pursued into installing hole 11 in the step that embeds conducting strip 20;
D) second time electroplating, ask for an interview Fig. 4, to the inwall of installing hole 11 also be inner surface and around electroplate second electrodeposited coating 17 that one deck covers first electrodeposited coating 15 on proper area and the conducting strip 20, cover conducting strips 20 and cover the surface that is coated with first electrodeposited coating 15 on the remainder of the clamp holder that does not abut to first electrodeposited coating 15 21 that is arranged in installing hole 11 by this second electrodeposited coating 17, clamp holder 20 closely is connected with second electrodeposited coating 17, and still remain with less slit 22 between adjacent clamp holder 21 between the conducting strip 20 and second electrodeposited coating 17, the notion in the less slit of being said here 22 is meant slit, and conducting strip 20 still can all directly not contacted with circuit board 10.
Ask for an interview Fig. 5, through above-mentioned steps, promptly finished conducting strip 20 has been installed on process in the installing hole 11 of circuit board 10, thereafter, circuit board 10 can be through subsequent process steps and carry semiconductor wafer 50, this semiconductor wafer 50 directly and a side contacts of conducting strip 20, and the opposite side of conducting strip 20 contacts with radiating block 60, carry out heat exchange by radiating block 60 by 20 pairs of semiconductor wafers of conducting strip 50, avoid semiconductor wafer 50 overheated.
In sum, the inventive method has solved the conducting strip in the prior art effectively and had the phenomenon that comes off from installing hole, has reached alleged technique effect in the applicant advantageous effect hurdle in front.
Claims (7)
1, the embedding grammar of a kind of heat conducting element on circuit board is characterized in that this method may further comprise the steps:
A) provide a circuit board, an installing hole is provided on the circuit board that is provided;
B) once electroplate, the inwall of installing hole and the plating all around of installing hole are formed first electrodeposited coating;
C) embed the installation conducting strip, the conducting strip that one metal and lateral margin is intervally distributed with outwards outstanding clamp holder all around embeds by guiding device and is installed in the installing hole, and make the peripheral edge portion of described clamp holder enter in first electrodeposited coating on the hole wall of installing hole with first electrodeposited coating urgent mutually against;
D) second time electroplating, plating is used to cover described first electrodeposited coating and second electrodeposited coating that is used to cover described conducting strip and be used to cover the exposed part that is not inserted into the clamp holder in first electrodeposited coating to the installing hole inwall, clamp holder closely is connected with second electrodeposited coating, and makes at the position between the adjacent clamp holder between second electrodeposited coating on the inwall of conducting strip and installing hole and keep the slit.
2, the embedding grammar of heat conducting element according to claim 1 on circuit board is characterized in that step B) described in first electrodeposited coating be copper.
3, the embedding grammar of heat conducting element according to claim 1 on circuit board is characterized in that step C) described in first electrodeposited coating be copper.
4, the embedding grammar of heat conducting element according to claim 1 on circuit board is characterized in that step C) described in the external diameter of conducting strip bigger than the internal diameter that is electroplate with the installing hole behind first electrodeposited coating.
5, the embedding grammar of heat conducting element according to claim 1 on circuit board, it is characterized in that step C) described in guiding device comprise a guide plate and a guide bar, on guide plate, offer the inner chamber that is used to hold described conducting strip, below inner chamber, constitute and be used to guide conducting strip and enter into guiding channel in the described installing hole, be formed with an annular shoulder between this guiding channel and the described inner chamber, make the diameter of guiding channel littler than the diameter of inner chamber by this annular shoulder, described guide bar matches with described guide plate, and it is corresponding with described inner chamber, wherein, the external diameter of guide bar is littler than the diameter of described guiding channel.
6, the embedding grammar of heat conducting element according to claim 5 on circuit board it is characterized in that the diameter of described inner chamber is bigger than the external diameter of described conducting strip, and the internal diameter of described guiding channel equates substantially with the internal diameter of described installing hole.
7, the embedding grammar of heat conducting element according to claim 1 on circuit board is characterized in that step D) described in second electrodeposited coating be copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200810155583XA CN100571485C (en) | 2008-10-09 | 2008-10-09 | The embedding grammar of heat conducting element on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200810155583XA CN100571485C (en) | 2008-10-09 | 2008-10-09 | The embedding grammar of heat conducting element on circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101384134A true CN101384134A (en) | 2009-03-11 |
| CN100571485C CN100571485C (en) | 2009-12-16 |
Family
ID=40463684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200810155583XA Expired - Fee Related CN100571485C (en) | 2008-10-09 | 2008-10-09 | The embedding grammar of heat conducting element on circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100571485C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711365A (en) * | 2012-05-09 | 2012-10-03 | 敬鹏(常熟)电子有限公司 | Circuit board provided with embedded type conducting element and application thereof |
| CN102711377A (en) * | 2012-05-09 | 2012-10-03 | 敬鹏(常熟)电子有限公司 | Circuit board for transmitting high current |
| CN111132454A (en) * | 2020-03-30 | 2020-05-08 | 江西科技学院 | Spliced printed circuit board structure |
| CN111465168A (en) * | 2020-03-05 | 2020-07-28 | 珠海崇达电路技术有限公司 | Method for improving deviation of pressed buried copper block |
-
2008
- 2008-10-09 CN CNB200810155583XA patent/CN100571485C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711365A (en) * | 2012-05-09 | 2012-10-03 | 敬鹏(常熟)电子有限公司 | Circuit board provided with embedded type conducting element and application thereof |
| CN102711377A (en) * | 2012-05-09 | 2012-10-03 | 敬鹏(常熟)电子有限公司 | Circuit board for transmitting high current |
| CN111465168A (en) * | 2020-03-05 | 2020-07-28 | 珠海崇达电路技术有限公司 | Method for improving deviation of pressed buried copper block |
| CN111132454A (en) * | 2020-03-30 | 2020-05-08 | 江西科技学院 | Spliced printed circuit board structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100571485C (en) | 2009-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100571485C (en) | The embedding grammar of heat conducting element on circuit board | |
| DE112013007318B4 (en) | STRUCTURE AND MANUFACTURING PROCESS OF A THREE-DIMENSIONAL SYSTEM OF A METAL CIRCUIT BOARD ETCHED BEFORE THE HORIZONTAL EQUIPMENT | |
| US9627303B2 (en) | Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological method | |
| CN103489792B (en) | First be honored as a queen and lose three-dimensional systematic flip chip encapsulation structure and process | |
| CN102544310B (en) | Mounting substrate and manufacturing method thereof | |
| DE112014003622B4 (en) | Three-dimensional system-in-package metal circuit board structure for first packaged and later etched normal chips and methods for processing them | |
| GB2369245B (en) | Method for forming a resin-encapsulated semiconductor device | |
| US20110088936A1 (en) | Method for manufacturing an electronic assembly | |
| CN1156948A (en) | Method of making circuitized substrate using two different metallization processes | |
| US8296942B2 (en) | Process for preparing a heatsink system and heatsink system obtainable by said process | |
| CN103137572A (en) | Chip-package and a method for forming a chip-package | |
| CN103400775B (en) | First it is honored as a queen and loses three-dimensional systematic flip-chip bump packaging structure and process | |
| CN211639546U (en) | Electroplated steel wire tooth split type peripheral grinding wheel | |
| CN1307386A (en) | Electric connector terminal making process and die | |
| US20130285223A1 (en) | Method for manufacturing electronic devices | |
| CN105097757A (en) | Chip packaging substrate, chip packaging structure and manufacturing method | |
| DE102008040727A1 (en) | Method and device for determining the rotor temperature of a permanent-magnet synchronous machine | |
| CN1510746A (en) | Circuit device and manufacturing method thereof | |
| CN103413803B (en) | A kind of hybrid integrated circuit and manufacture method thereof | |
| CN1174481C (en) | Burless castellation via process and product for plastic chip carrier | |
| CN103515249B (en) | First be honored as a queen and lose three-dimensional systematic chip formal dress bump packaging structure and process | |
| CN105188270A (en) | Manufacturing method of circuit board and circuit board manufactured by manufacturing method | |
| KR20100095913A (en) | Method for fabricating metal board of metal pcb with improved operation efficiency and the metal pcb thereof | |
| CN104080274B (en) | A kind of base plate for packaging and preparation method thereof and board unit | |
| CN102111983A (en) | Adhered radiator and production method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091216 Termination date: 20141009 |
|
| EXPY | Termination of patent right or utility model |