CN105188270A - Manufacturing method of circuit board and circuit board manufactured by manufacturing method - Google Patents
Manufacturing method of circuit board and circuit board manufactured by manufacturing method Download PDFInfo
- Publication number
- CN105188270A CN105188270A CN201510548024.5A CN201510548024A CN105188270A CN 105188270 A CN105188270 A CN 105188270A CN 201510548024 A CN201510548024 A CN 201510548024A CN 105188270 A CN105188270 A CN 105188270A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- manufacture method
- copper foil
- base material
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a manufacturing method of a circuit board. By a method of individually processing a copper foil into a required pattern, arbitrary required copper foil thickness can be selected, so that the arbitrary required pattern thickness can be processed; a thick copper circuit board (the copper thickness is 40Z to 200Z) and a super-thick copper circuit board (the copper thickness is greater than 200Z) can be produced; and the technical defects that the thickness of a copper layer cannot reach over 40Z, or the thickness can reach over 40Z, but the processing technology is relatively complicated, and the processing accuracy is relatively poor due to the fact that a base material is electroplated with copper by an electroplating method in the prior art are overcome. According to the manufacturing method, the technology is very simple and easy; and the processing accuracy can be ensured.
Description
Technical field
The manufacture method that the present invention relates to a kind of circuit board and the circuit board utilizing it to prepare, belong to circuit board technology field.
Background technology
At present, what most of commercial circuit board used is all low pressure and low current, copper is thick general within the scope of 1/2OZ ~ 3OZ, but, along with developing rapidly of the technology such as military affairs, aviation, the demand of the heavy copper circuit board (copper is thick in 4OZ ~ 20OZ) of big current, high reliability and super heavy copper circuit board (the thick >20OZ of copper) is increasing, and add the attached value of height that it has, heavy copper circuit board and super heavy copper circuit board have market prospects widely.
The production process of conventional heavy copper circuit board comprises: adopt the sheet material substrate with end copper to carry out sawing sheet; Base material is electroplated, the mode adopting dry film to cover in plating ensures not need copper-plated place can not electric plated with copper, but, due to the finite thickness of dry film, the mode of a dry film covering can only ensure that the copper layer thickness electroplated is between 1/2OZ ~ 3OZ, cannot reach the needs of heavy copper circuit board (copper is thick in 4OZ ~ 20OZ) and super heavy copper circuit board (the thick >20OZ of copper).In prior art, in order to reach heavy copper circuit board (copper is thick in 4OZ ~ 20OZ) and super heavy copper circuit board (the thick >20OZ of copper) the thick needs of copper, need to carry out repeatedly dry film to cover, all need to carry out contraposition between adjacent twice dry film covers, not only ensure that technique is loaded down with trivial details, and cannot aligning accuracy be ensured.
Summary of the invention
Therefore, the technical problem to be solved in the present invention to be to overcome in prior art heavy copper circuit board and the loaded down with trivial details and technological deficiency that production precision is not high of super-thick copper board production technique, thus provide a kind of can ensure heavy copper circuit board and the thick needs of super-thick copper circuit board copper, produce simple and the production method of the circuit board of precision can be ensured.
For this reason, the invention provides a kind of manufacture method of circuit board, comprise the steps:
Copper Foil is processed into prefabricated figure;
Base material processes and the installing hole being suitable for Copper Foil and embedding;
Copper Foil is embedded in installing hole and forms substrate;
Described substrate is utilized to form circuit board.
Utilizing described substrate to be formed in the step of circuit board, adding adhesive board between two adjacent in a thickness direction described substrates, by the mode of pressing, adjacent two substrates being pressed together, utilize the described substrate pressed together to form circuit board.
In the described step pressed together by adjacent two substrates by the mode of pressing, the pressure of employing is not less than 350psi.
In the described step pressed together by adjacent two substrates by the mode of pressing, the dwell time of employing is no less than 60 minutes.
In the described step adjacent two substrates pressed together by the mode of pressing, adopt the mode of heat stepwise to heat described substrate, make described binding material be in molten condition.
The mode of described heat stepwise is the two-part mode of heating carried out continuously, wherein, first paragraph heating-up temperature is 100-150 degree Celsius, be no less than 20 minutes heating time, second segment heating-up temperature is 150 degrees Celsius-make described binding material be in the temperature of molten condition, be no less than 60 minutes heating time.
Described adhesive board is PP plate, and/or described base material is insulating material.
Described base material is epoxy resin.
The outward flange size 0-1.5 inch larger than the outward flange size of described figure of described adhesive board, the outward flange size 0-1.5 inch less of the outward flange size of described substrate of described adhesive board.
Before Copper Foil is processed into prefabricated figure, in the locating and machining hole, edge of described Copper Foil; Base material processes be suitable for installing hole that Copper Foil embeds before, process the location hole relative with the location hole on Copper Foil at the edge of base material, and with the location hole be positioned on described base material and through the alignment pin of location hole, described Copper Foil and described base material are aimed at by the location hole be positioned on Copper Foil.
A kind of circuit board, adopts the manufacture method described in above-mentioned any one to be prepared from.
The manufacture method of circuit board provided by the invention, tool has the following advantages:
1. the manufacture method of circuit board provided by the invention, adopt the method separately Copper Foil being processed into required figure, copper thickness required arbitrarily can be selected, thus thickness profile required arbitrarily can be processed, and then the thick circuit board of copper (copper is thick all at 4OZ ~ 20OZ) and super heavy copper circuit board (thick more than the >20OZ of copper) can be produced, overcome in prior art and adopt electro-plating method electro-coppering on base material, copper layer thickness is difficult to reach more than 4OZ, although or can more than 4OZ be reached, but processing technology more complicated, and the technological deficiency that machining accuracy is poor.Above-mentioned preparation method's technique is very simple and easy, and can ensure precision machining.
2. the manufacture method of circuit board provided by the invention, adopt Segmented heating mode, first paragraph is short for heating time, rapid temperature increases, second segment is long for heating time, slowly heats up, not only working (machining) efficiency can be ensured, further, adopt slow mode of heating can ensure the stability of binding material pressurized at binding material close to the later stage being in molten condition, and then ensure bonding uniformity.
3. the manufacture method of circuit board provided by the invention, after adjacent two substrates press together by the described mode by pressing, pressurize process is carried out under terminal pressure, the dwell time adopted is no less than 60 minutes, carrying out pressurize process can make the binding material of molten condition flow equably, thus equably by substrate bonding together, and ensure the stability of bonding, avoid delamination.
Accompanying drawing explanation
Fig. 1 is the structural representation of the figure stayed after Copper Foil milling.
Fig. 2 is the structural representation of the installing hole formed after base material milling.
Fig. 3 is the structural representation of the substrate formed after figure embeds installing hole.
Fig. 4 is the structural representation of the two-sided heavy copper circuit board formed after adjacent substrate pressing.
In figure: Reference numeral is expressed as: 1-cylinder paper tinsel; 2-figure; 3-base material; 4-installing hole; 5-substrate; 6-adhesive board.
Embodiment
Below in conjunction with accompanying drawing, the preparation method to a kind of circuit board provided by the invention is described in detail.
Embodiment 1
The present embodiment provides a kind of manufacture method of two-sided heavy copper circuit board, comprises the steps:
S1: process prefabricated figure 2 at Copper Foil 1, as shown in Figure 1;
S2: process the installing hole 4 with described Graphic Pattern Matching on base material 3, as shown in Figure 2;
S3: figure 2 is embedded in installing hole 3 and forms substrate 5, as shown in Figure 3;
S4: add adhesive board 6 between two described substrates 5;
S5: by the mode of pressing, two substrates 5 are pressed together, as shown in Figure 4;
S6: other subsequent steps, to form two-sided heavy copper circuit board.
Above-mentioned preparation method adopts the method separately Copper Foil being processed into required figure, copper thickness required arbitrarily can be selected, thus thickness profile required arbitrarily can be processed, and then the thick circuit board of copper (copper is thick all at 4OZ ~ 20OZ) and super heavy copper circuit board (thick more than the >20OZ of copper) can be produced, overcome in prior art and adopt electro-plating method electro-coppering on base material, copper layer thickness is difficult to reach 4OZ, although or can more than 4OZ be reached, but processing technology more complicated, and the technological deficiency that machining accuracy is poor.Above-mentioned preparation method's technique is very simple and easy, and can ensure precision machining.
As the preferred scheme of one, described base material is epoxy resin, and certainly, described base material can also be other resinae base materials, and further, in fact described base material can select other Ins. ulative material to prepare.
As the preferred scheme of one, described adhesive board is PP plate, or other are easy to melting in a heated state, and the good adhesive board of adhesive property, certainly, described adhesive board can also adopt soft, can enter the material of flow regime under pressure.
As the preferred scheme of one, in the described step pressed together by adjacent two substrates 5 by the mode of pressing, the pressure of employing is not less than 350psi, such as, is 350psi, 360psi, 370psi etc.
As the preferred scheme of one, in the process of pressing, when the adhesive board adopted be need to reach in a heated state molten condition could realize the sheet material of attachment function time, in the process of pressing, described substrate 5 is heated, further, adopt the mode of heat stepwise to heat described substrate 5, make described adhesive board 6 be in molten condition.
As the preferred scheme of one, the mode of described heat stepwise is the two-part mode of heating carried out continuously, what is called carries out referring to continuously after first paragraph heating reaches heating-up temperature, carry out second segment heating immediately, wherein, first paragraph heating-up temperature be 100-150 degree Celsius (such as, can be 100 degrees Celsius, 110 degrees Celsius, 120 degrees Celsius, 125 degrees Celsius, 130 degrees Celsius, 150 degrees Celsius), being no less than 20 minutes heating time (can be such as 20 minutes, 30 minutes, 40 minutes etc.), second segment heating-up temperature is 150 degrees Celsius-make described adhesive board 6 be in the temperature of molten condition, when the adhesive board adopted is PP plate of material, the final temperature of second segment heating is 190 degrees centigrade, being no less than 60 minutes heating time (can be such as 60 minutes, 65 minutes, 70 minutes etc.).Adopt Segmented heating mode, first paragraph is short for heating time, rapid temperature increases, second segment is long for heating time, slow intensification, not only can ensure working (machining) efficiency, and, adopt slow mode of heating can ensure the stability of binding material pressurized at binding material close to the later stage being in molten condition, and then ensure bonding uniformity.
As further improved plan, after adjacent two substrates 5 press together by the described mode by pressing, pressurize process is carried out under terminal pressure, the dwell time adopted is no less than 60 minutes, such as, can be 60 minutes, 65 minutes, 70 minutes etc., carrying out pressurize process can make the binding material of molten condition flow equably, thus equably substrate 5 is bonded together, and ensure the stability of bonding, avoid delamination.
As further improved plan, before Copper Foil 1 is processed into prefabricated figure 2, in the locating and machining hole, edge of described Copper Foil 1; Base material 3 processes be suitable for installing hole 4 that Copper Foil 1 embeds before, the location hole relative with the location hole on Copper Foil 1 is processed at the edge of base material 3, and described Copper Foil 1 and described base material 3 are aimed at the location hole be positioned on described base material 3 and alignment pin by the location hole be positioned on Copper Foil 1, can ensure after aligning that Copper Foil 1 and base material 3 embed accuracy when being mutually fitted together to, and ensure not offset in bonding processes.
As the preferred technical scheme of one, the outward flange size 0-1.5 inch larger than the outward flange size of described figure 2 of described adhesive board 6, the outward flange size 0-1.5 inch less of the outward flange size of described substrate 5 of described adhesive board 6, thus ensure the processing planarization of profile and the stability of bonding.
Embodiment 2
The present embodiment provides a kind of production method of multiaspect heavy copper circuit board, comprises the steps:
S1: process prefabricated figure 2 at Copper Foil 1, as shown in Figure 1;
S2: process the installing hole 4 with described Graphic Pattern Matching on base material 3, as shown in Figure 2;
S3: figure 2 is embedded in installing hole 3 and forms substrate 5, as shown in Figure 3;
Adhesive board 6 is added between S4: adjacent in a thickness direction two described substrates 5;
S5: by the mode of pressing, adjacent two substrates 5 are pressed together, as shown in Figure 4;
S6: utilize the mode of step S4-S5 to press together further the substrate obtained in the substrate obtained in S5 step and at least one S3 step;
S6: other subsequent steps, to form four sides, six or more face heavy copper circuit boards.
Above-mentioned preparation method adopts the method separately Copper Foil being processed into required figure, copper thickness required arbitrarily can be selected, thus thickness profile required arbitrarily can be processed, and then the thick circuit board of copper (copper is thick all at 4OZ ~ 20OZ) and super heavy copper circuit board (thick more than the >20OZ of copper) can be produced, overcome in prior art and adopt electro-plating method electro-coppering on base material, copper layer thickness is difficult to reach 4OZ, although or can more than 4OZ be reached, but processing technology more complicated, and the technological deficiency that machining accuracy is poor.Above-mentioned preparation method's technique is very simple and easy, and can ensure precision machining.
As the preferred scheme of one, described base material is epoxy resin, and certainly, described base material can also be other resinae base materials, and further, in fact described base material can select other Ins. ulative material to prepare.
As the preferred scheme of one, described adhesive board is PP plate, or other are easy to melting in a heated state, and the good adhesive board of adhesive property, certainly, described adhesive board can also adopt soft, can enter the material of flow regime under pressure.
As the preferred scheme of one, in the described step pressed together by adjacent two substrates 5 by the mode of pressing, the pressure of employing is not less than 350psi, such as, is 350psi, 360psi, 370psi etc.
As the preferred scheme of one, in the process of pressing, when the adhesive board adopted be need to reach in a heated state molten condition could realize the sheet material of attachment function time, in the process of pressing, described substrate 5 is heated, further, adopt the mode of heat stepwise to heat described substrate 5, make described adhesive board 6 be in molten condition.
As the preferred scheme of one, the mode of described heat stepwise is the two-part mode of heating carried out continuously, what is called carries out referring to continuously after first paragraph heating reaches heating-up temperature, carry out second segment heating immediately, wherein, first paragraph heating-up temperature be 100-150 degree Celsius (such as, can be 100 degrees Celsius, 110 degrees Celsius, 120 degrees Celsius, 125 degrees Celsius, 130 degrees Celsius, 150 degrees Celsius), being no less than 20 minutes heating time (can be such as 20 minutes, 30 minutes, 40 minutes etc.), second segment heating-up temperature is 150 degrees Celsius-make described adhesive board 6 be in the temperature of molten condition, when the adhesive board adopted is PP plate of material, the final temperature of second segment heating is 190 degrees centigrade, being no less than 60 minutes heating time (can be such as 60 minutes, 65 minutes, 70 minutes etc.).Adopt Segmented heating mode, first paragraph is short for heating time, rapid temperature increases, second segment is long for heating time, slow intensification, not only can ensure working (machining) efficiency, and, adopt slow mode of heating can ensure the stability of binding material pressurized at binding material close to the later stage being in molten condition, and then ensure bonding uniformity.
As further improved plan, after adjacent two substrates 5 press together by the described mode by pressing, pressurize process is carried out under terminal pressure, the dwell time adopted is no less than 60 minutes, such as, can be 60 minutes, 65 minutes, 70 minutes etc., carrying out pressurize process can make the binding material of molten condition flow equably, thus equably substrate 5 is bonded together, and ensure the stability of bonding, avoid delamination.
As the preferred technical scheme of one, the outward flange size 0-1.5 inch larger than the outward flange size of described figure 2 of described adhesive board 6, the outward flange size 0-1.5 inch less of the outward flange size of described substrate 5 of described adhesive board 6, thus ensure the processing planarization of profile and the stability of bonding.Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (11)
1. a manufacture method for circuit board, is characterized in that, comprises the steps:
Copper Foil (1) is processed into prefabricated figure (2);
Base material (3) processes and the installing hole (4) being suitable for Copper Foil (1) and embedding;
Copper Foil (1) is embedded in installing hole (3) and forms substrate (5);
Described substrate (5) is utilized to form circuit board.
2. the manufacture method of circuit board according to claim 1, it is characterized in that, formed in the step of circuit board utilizing described substrate (5), adhesive board (6) is added between two adjacent in a thickness direction described substrates (5), by the mode of pressing, adjacent two substrates (5) are pressed together, utilize the described substrate (5) pressed together to form circuit board.
3. the manufacture method of circuit board according to claim 2, is characterized in that, in the step that adjacent two substrates (5) press together by the described mode passing through pressing, the pressure of employing is not less than 350psi.
4. the manufacture method of the circuit board according to Claims 2 or 3, is characterized in that, in the step that adjacent two substrates (5) press together by the described mode passing through pressing, the dwell time of employing is no less than 60 minutes.
5. the manufacture method of the circuit board according to any one of claim 2-4, it is characterized in that, in the step that adjacent two substrates (5) press together by the described mode passing through pressing, adopt the mode of heat stepwise to heat described substrate (5), make described adhesive board (6) be in molten condition.
6. the manufacture method of circuit board according to claim 5, it is characterized in that, the mode of described heat stepwise is the two-part mode of heating carried out continuously, wherein, first paragraph heating-up temperature is 100-150 degree Celsius, being no less than 20 minutes heating time, second segment heating-up temperature is 150 degrees Celsius-make described adhesive board (6) be in the temperature of molten condition, be no less than 60 minutes heating time.
7. the manufacture method of circuit board according to claim 6, is characterized in that, described adhesive board (6) is PP plate, and/or described base material (3) is insulating material.
8. the manufacture method of circuit board according to claim 7, is characterized in that, described base material (3) is epoxy resin.
9. the manufacture method of the circuit board according to any one of claim 2-8, it is characterized in that, the outward flange size 0-1.5 inch larger than the outward flange size of described figure (2) of described adhesive board (6), the outward flange size 0-1.5 inch less of the outward flange size of described substrate (5) of described adhesive board (6).
10. the manufacture method of the circuit board according to any one of claim 1-8, is characterized in that, before Copper Foil (1) is processed into prefabricated figure (2), in the locating and machining hole, edge of described Copper Foil (1); Base material (3) processes be suitable for installing hole (4) that Copper Foil (1) embeds before, process the location hole relative with the location hole on Copper Foil (1) at the edge of base material (3), and with the location hole be positioned on described base material (3) and through the alignment pin of location hole, described Copper Foil (1) and described base material (3) are aimed at by the location hole be positioned on Copper Foil (1).
11. 1 kinds of circuit boards, is characterized in that, adopt the manufacture method according to any one of claim 1-10 to be prepared from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510548024.5A CN105188270A (en) | 2015-08-31 | 2015-08-31 | Manufacturing method of circuit board and circuit board manufactured by manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510548024.5A CN105188270A (en) | 2015-08-31 | 2015-08-31 | Manufacturing method of circuit board and circuit board manufactured by manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| CN105188270A true CN105188270A (en) | 2015-12-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510548024.5A Pending CN105188270A (en) | 2015-08-31 | 2015-08-31 | Manufacturing method of circuit board and circuit board manufactured by manufacturing method |
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| Country | Link |
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| CN (1) | CN105188270A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107718579A (en) * | 2017-10-30 | 2018-02-23 | 珠海杰赛科技有限公司 | A kind of cold drawing preparation method and mould |
| CN110996510A (en) * | 2019-12-31 | 2020-04-10 | 生益电子股份有限公司 | Manufacturing method of stepped groove |
| CN114466528A (en) * | 2022-02-16 | 2022-05-10 | 江苏大学 | Rapid preparation method of flexible conductive circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107718579A (en) * | 2017-10-30 | 2018-02-23 | 珠海杰赛科技有限公司 | A kind of cold drawing preparation method and mould |
| CN110996510A (en) * | 2019-12-31 | 2020-04-10 | 生益电子股份有限公司 | Manufacturing method of stepped groove |
| CN110996510B (en) * | 2019-12-31 | 2021-04-23 | 生益电子股份有限公司 | Manufacturing method of stepped groove |
| CN114466528A (en) * | 2022-02-16 | 2022-05-10 | 江苏大学 | Rapid preparation method of flexible conductive circuit board |
| CN114466528B (en) * | 2022-02-16 | 2023-12-15 | 江苏大学 | Rapid preparation method of flexible conductive circuit board |
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