CN105034479A - Metallized layer dielectric plate of polymethacrylimide foam base material - Google Patents
Metallized layer dielectric plate of polymethacrylimide foam base material Download PDFInfo
- Publication number
- CN105034479A CN105034479A CN201510291116.XA CN201510291116A CN105034479A CN 105034479 A CN105034479 A CN 105034479A CN 201510291116 A CN201510291116 A CN 201510291116A CN 105034479 A CN105034479 A CN 105034479A
- Authority
- CN
- China
- Prior art keywords
- polymethacrylimide foam
- metal layer
- layer dielectric
- tack coat
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/046—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention provides a metallized layer dielectric plate of a polymethacrylimide foam base material. The metallized layer dielectric plate comprises a first metal layer, a first protective bonding layer and polymethacrylimide foam, wherein the first protective bonding layer is located between the first metal layer and the polymethacrylimide foam. The metallized layer dielectric plate product of the polymethacrylimide foam base material, provided by the invention, has the characteristics of low dielectric constants, low loss, low cost and light weight and the like, and can be used as a material for designing a high-performance radio frequency system.
Description
Technical field
The present invention relates to Material Field, particularly, relate to a kind of coating metal layer dielectric-slab of polymethacrylimide foam base material.
Background technology
With application request such as radio system ultra-wide working band, low-loss, low cost, lightweights, radio circuit design is day by day urgent to the demand of advanced low-k materials.
Lack a kind of low-k, low-loss, low cost and light-weighted material in the market, for all kinds of circuit board of processing and fabricating, antenna, microwave device and multilayer circuit board (being generally 2-20 layer), and through-hole structure between plate, can be used to carry out interlayer connection.Therefore, what the present invention will solve is just to provide a kind of novel material for all kinds of circuit board of processing and fabricating, antenna, microwave device and multilayer circuit board.
Summary of the invention
For defect of the prior art; the object of this invention is to provide a kind of coating metal layer dielectric-slab of polymethacrylimide foam base material; it is characterized in that; comprise the first metal layer; first protection tack coat and polymethacrylimide foam, described first protection tack coat is between described the first metal layer and described polymethacrylimide foam.
Preferably, also comprise the second protection tack coat and the second metal level, described second protection tack coat is between described polymethacrylimide foam and described second metal level.
Preferably, described the first metal layer and the second metal level are the one of following material:
-copper;
The alloy of-copper;
-nickel;
The alloy of-nickel;
The copper of-nickel plating; Or
The copper of-nickel plating alloy.
Preferably, described first protection tack coat and the second protection tack coat are one or more of following material:
-epoxy;
-cyanate;
-acrylic resin;
-urethane;
-rubber; Or
-cyanoacrylate.
The coating metal layer dielectric-slab of polymethacrylimide foam base material involved in the present invention possesses following characteristics and advantage:
-low-k: usually between 1-2.17, can be used for ultra-wide band radio-frequency system;
-low-loss: loss tangent angle, between 0.0001-0.05, can be used for low-loss system;
-low price: reduce costs;
-low weight density: be applicable to light-weight design.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, other features, objects and advantages of the present invention will become more obvious:
Fig. 1 illustrates according to a specific embodiment of the present invention, the structure chart of the coating metal layer dielectric-slab of the polymethacrylimide foam base material of three-decker; And
Fig. 2 shows according to an embodiment of the invention, the structure chart of the coating metal layer dielectric-slab of the polymethacrylimide foam base material of five-layer structure;
Detailed description of the invention
Fig. 1 shows a specific embodiment of the present invention; a kind of coating metal layer dielectric-slab of polymethacrylimide foam base material; it is characterized in that; comprise the first metal layer; first protection tack coat and polymethacrylimide foam, described first protection tack coat is between described the first metal layer and described polymethacrylimide foam.
Further, those skilled in the art understand, the natural colour of polymethacrylimide foam is white or faint yellow, has good mechanical property, high-temperature stability, heat endurance and chemical-resistance, also has very low thermal conductivity at low temperatures.In equal densities situation, the stretching of polymethacrylimide foam, modulus of shearing and intensity etc. are exhibits excellent all, polymethacrylimide foam layer involved in the present invention is the supporting construction of described coating metal layer dielectric-slab, can need selected various depth of foam and density according to design, foam attribute determines the key property such as dielectric constant, weight, environmental suitability of dielectric-slab simultaneously.It needs to be connected with metal level by protection tack coat.
Further, those skilled in the art understand, in order to satisfied different circuit design needs, the outermost surface of described coating metal layer dielectric-slab is covered with thickness and all assignable metal level of material, for etching the circuitous pattern of needs, and as required, can one side coating metal layer, also can double-sided metal layer.Described metal level requires, for the good conductor of electricity, comprise but be not limited only to following material: the copper of the alloy of the alloy of copper or copper, nickel or nickel, nickel plating or nickel alloy, or some combinations etc. of above-mentioned material.
Further, it will be appreciated by those skilled in the art that described protection tack coat is for the protection in the connection between described metal level and described polymethacrylimide foam and circuit etching process.The material requirements of described protection tack coat can antiacid, alkali and organic liquor be corroded, and also can be used for the bonding between the surface of not gluing.The optional material of described protection tack coat comprises but is not limited only to following material: epoxy, cyanate, acrylic resin, urethane, rubber, cyanoacrylate or the combination between them.
As a preferred embodiment of the present invention, described coating metal layer dielectric-slab also comprises the second protection tack coat and the second metal level, and described second protection tack coat is between described polymethacrylimide foam and described second metal level.It will be appreciated by those skilled in the art that described second protection tack coat is identical with the design principle of above-mentioned detailed description of the invention with described second metal level, the needs just in order to meet concrete etched circuit, do not repeat them here.
Set forth a kind of method of processing described coating metal layer dielectric-slab below:
1. pair polymethacrylimide foam, metal level and protection tack coat carry out surface treatment, comprise the surface cleaning and layer on surface of metal deoxidation process etc. of polymethacrylimide foam.
2. according to the structure of Fig. 1 or Fig. 2, polymethacrylimide foam, metal level and protection tack coat are arranged, then carry out pressing.
Below a kind of described coating metal layer dielectric-slab more specifically process embodiment:
Polymethacrylimide foam selects the ROHACELL71HF of German Ying Chuan company, and metal level selects the cathode copper Copper Foil of 0.5oz, and protection tack coat selects cyanate glued membrane.Concrete manufacturing process is as follows:
Material prepares and process → material is cut out → by the structure laying → matched moulds → heating cure → cooling demoulding → refine process.Wherein solidification temperature and order are: insulation 30 minutes → 190 DEG C pressure heat-preservings 4 hours after room temperature → 110 DEG C insulation micro-pressurization → 180 DEG C pressurization in 1 hour → cool to room temperature the demoulding → product completes.
Above specific embodiments of the invention are described.It is to be appreciated that the present invention is not limited to above-mentioned particular implementation, those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.
Claims (4)
1. the coating metal layer dielectric-slab of a polymethacrylimide foam base material; it is characterized in that; comprise the first metal layer; first protection tack coat and polymethacrylimide foam, described first protection tack coat is between described the first metal layer and described polymethacrylimide foam.
2. coating metal layer dielectric-slab according to claim 1, is characterized in that, also comprises the second protection tack coat and the second metal level, and described second protection tack coat is between described polymethacrylimide foam and described second metal level.
3. coating metal layer dielectric-slab according to claim 2, is characterized in that, described the first metal layer and the second metal level are the combination of one or more of following material:
-copper;
The alloy of-copper;
-nickel;
The alloy of-nickel;
The copper of-nickel plating; Or
The copper of-nickel plating alloy.
4. coating metal layer dielectric-slab according to claim 3, is characterized in that, described first protection tack coat and the second protection tack coat are the combination of one or more of following material:
-epoxy;
-cyanate;
-acrylic resin;
-urethane;
-rubber; Or
-cyanoacrylate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510291116.XA CN105034479A (en) | 2015-05-29 | 2015-05-29 | Metallized layer dielectric plate of polymethacrylimide foam base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510291116.XA CN105034479A (en) | 2015-05-29 | 2015-05-29 | Metallized layer dielectric plate of polymethacrylimide foam base material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105034479A true CN105034479A (en) | 2015-11-11 |
Family
ID=54441714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510291116.XA Pending CN105034479A (en) | 2015-05-29 | 2015-05-29 | Metallized layer dielectric plate of polymethacrylimide foam base material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105034479A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109687159A (en) * | 2018-12-27 | 2019-04-26 | 上海复合材料科技有限公司 | Ultralight high-precision rapid shaping antenna reflective face and preparation method thereof |
| CN110216890A (en) * | 2018-10-29 | 2019-09-10 | 株式会社午星显示 | The compression-moulding methods of composite material |
| CN114552198A (en) * | 2022-04-25 | 2022-05-27 | 中国电子科技集团公司第二十九研究所 | Precise preparation method of light high-performance circuit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5541366A (en) * | 1994-12-12 | 1996-07-30 | M-Rad Electromagnetic Technology Ltd. | Foam printed circuit substrates |
| CN104497343A (en) * | 2014-12-15 | 2015-04-08 | 浙江中科恒泰新材料科技有限公司 | Preparation method of polymethacrylimide micro-foaming material and product thereof |
-
2015
- 2015-05-29 CN CN201510291116.XA patent/CN105034479A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5541366A (en) * | 1994-12-12 | 1996-07-30 | M-Rad Electromagnetic Technology Ltd. | Foam printed circuit substrates |
| CN104497343A (en) * | 2014-12-15 | 2015-04-08 | 浙江中科恒泰新材料科技有限公司 | Preparation method of polymethacrylimide micro-foaming material and product thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110216890A (en) * | 2018-10-29 | 2019-09-10 | 株式会社午星显示 | The compression-moulding methods of composite material |
| CN109687159A (en) * | 2018-12-27 | 2019-04-26 | 上海复合材料科技有限公司 | Ultralight high-precision rapid shaping antenna reflective face and preparation method thereof |
| CN114552198A (en) * | 2022-04-25 | 2022-05-27 | 中国电子科技集团公司第二十九研究所 | Precise preparation method of light high-performance circuit |
| CN114552198B (en) * | 2022-04-25 | 2022-07-08 | 中国电子科技集团公司第二十九研究所 | Precise preparation method of light high-performance circuit |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151111 |