CN106163081B - A kind of production method and PCB of PCB - Google Patents
A kind of production method and PCB of PCB Download PDFInfo
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- CN106163081B CN106163081B CN201510200757.XA CN201510200757A CN106163081B CN 106163081 B CN106163081 B CN 106163081B CN 201510200757 A CN201510200757 A CN 201510200757A CN 106163081 B CN106163081 B CN 106163081B
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Abstract
The embodiment of the invention discloses a kind of PCB production methods, for preventing metal layer from wrinkling, guaranteeing the normal function of PCB while improving heat dissipation performance.The method comprise the steps that opening up the first through slot on core plate；Metal block is embedded in the first through slot, the upper surface of metal block and the upper surface of core plate are in same level, and the lower surface of metal block and the lower surface of core plate are in same level；The first prepreg is covered in the upper surface and the lower surface of core plate, the second through slot is offered on the first prepreg, and the first through slot is overlapped with the second through slot in the projection section of vertical direction or all in the projection of vertical direction；First thermally conductive adhesive sheet is set in the second through slot, and the first metal layer is set on the first prepreg；Core plate, the first prepreg, the first thermally conductive adhesive sheet, metal block and the first metal layer are pressed.The embodiment of the present invention also provides a kind of PCB, for preventing metal layer from wrinkling, guarantees the normal function of PCB.
Description
Technical field
The present invention relates to technical field of integrated circuits more particularly to the production methods and circuit board of a kind of circuit board.
Background technique
Printed wiring board (English: Printed Circuit Board, abbreviation PCB), in electronic device and systems technology
PCB role is more and more important, and with the trend that system bulk reduces, IC processing procedure and encapsulation technology are constantly to thinner smaller
Connection and volume development, as device and system connection role PCB also towards connection imperceptibility High density of PCB development,
With the continuous promotion of electronic product heat generation density, also increasingly it is taken seriously for the demand of PCB heat dissipation design.
To solve PCB heat dissipation problem, in the prior art 1, it is common practice to an appropriate number of through-hole is set on PCB,
It is radiated using through-hole, heat dissipation effect is bad.
In order to improve heat dissipation effect, in the prior art 2, it is common practice to through slot is being opened up in pcb board, using pressing
The metal block is embedded in the through slot of the PCB, due to needing to position metal block in through slot when pressing, is easy
Existing deviations cause the metal layer of PCB surface after pressing wrinkling occur, influence the normal function of PCB.
Summary of the invention
The embodiment of the invention provides the production method of PCB a kind of and PCB to prevent gold while improving heat dissipation performance
Belong to layer corrugation, guarantees the normal function of PCB.
The production method of a kind of PCB that first aspect of the embodiment of the present invention provides includes:
The first through slot is opened up on core plate；
Metal block is embedded in first through slot, the upper surface of the upper surface of the metal block and the core plate is same
On one horizontal plane, the lower surface of the lower surface of the metal block and the core plate is in same level；
The first prepreg is covered in the upper surface and the lower surface of the core plate, the is offered on first prepreg
Two through slots, and first through slot is in the projection section or whole of vertical direction projected with second through slot in vertical direction
It is overlapped；
First thermally conductive adhesive sheet is set in second through slot, and the first metal is set on first prepreg
Layer；
By the core plate, first prepreg, the first thermally conductive adhesive sheet, the metal block and first gold medal
Belong to layer to be pressed.
In conjunction with the embodiment of the present invention in a first aspect, in the first implementation of first aspect of the embodiment of the present invention,
The thermally conductive adhesive sheet is the heat-conducting silica gel sheet that thermal coefficient is greater than or equal to 0.8w/mk.
In conjunction with the embodiment of the present invention in a first aspect, in second of implementation of first aspect of the embodiment of the present invention,
The metal block is one of copper billet, aluminium block and molybdenum block, and the metal layer is layers of copper or aluminium layer.
In conjunction with the embodiment of the present invention in a first aspect, in the third implementation of first aspect of the embodiment of the present invention,
The mode that the first through slot is opened up on core plate is controlled depth milling.
In conjunction with the second of the first aspect of the embodiment of the present invention or the first implementation of first aspect or first aspect
The third implementation of kind implementation or first aspect, in the 4th kind of implementation of first aspect of the embodiment of the present invention
In, by the core plate, first prepreg, the first thermally conductive adhesive sheet, the metal block and the first metal layer
After being pressed, further includes:
The second prepreg is covered on the first metal layer, offers third through slot on second prepreg,
The projection of the third through slot in the vertical direction is overlapped with second through slot projection section in the vertical direction or whole；
Second thermally conductive adhesive sheet is set in the third through slot, and the second metal is set on second prepreg
Layer；
Second prepreg, the second thermally conductive adhesive sheet and second metal layer are pressed.
A kind of PCB of second aspect of the embodiment of the present invention, comprising:
Core plate, the first prepreg and the first metal layer, the core plate and the first metal layer pass through described the first half
Cured sheets bonding；
Wherein, the first through slot is offered on the core plate, first through slot has been embedded in metal block, the metal block
In same level, the lower surface of the lower surface of the metal block and the core plate exists for upper surface and the upper surface of the core plate
In same level；
Offer the second through slot on first prepreg, and first through slot vertical direction projection with it is described
Second through slot is overlapped in the projection section or whole of vertical direction, is provided with the first thermally conductive adhesive sheet in second through slot；
The first metal layer and the metal block are bonded by the described first thermally conductive adhesive sheet.
In conjunction with the second aspect of the embodiment of the present invention, in the first implementation of second aspect of the embodiment of the present invention,
The thermally conductive adhesive sheet is the heat-conducting silica gel sheet that thermal coefficient is greater than or equal to 0.8w/mk.
In conjunction with the second aspect of the embodiment of the present invention, in second of implementation of second aspect of the embodiment of the present invention,
The metal block is one of copper billet, aluminium block and molybdenum block, and the metal layer is layers of copper or aluminium.
In conjunction with the second of the second aspect of the embodiment of the present invention or the first implementation of second aspect or second aspect
Kind implementation, in the third implementation of second aspect of the embodiment of the present invention, the PCB further include:
Second prepreg and second metal layer, the second metal layer pass through second prepreg and described first
Metal bonding layer；
Wherein, third through slot is offered on second prepreg, is equipped with the second thermally conductive bonding in the third through slot
The upper and lower surface of piece, the second thermally conductive adhesive sheet is bonded the first metal layer and the second metal layer respectively.
The embodiment of the present invention has the advantages that
A through slot is first opened up on core plate, then metal block is embedded in a through slot, then by the core plate and metal layer
It is bonded by prepreg, another through slot is offered in the prepreg, thermally conductive adhesive sheet, the metal are equipped in another through slot
Pcb board finally is made by pressing by the thermally conductive adhesive sheet and the metal bonding layer in block, due in the PCB metal block, lead
Hot sticky contact pin and metal layer constitute passage of heat, and so as to improve heat dissipation effect, and the metal block is without being embedded into the metal
In layer, it can wrinkle to avoid metal layer, guarantee the normal function of PCB.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of PCB production method in the embodiment of the present invention；
Fig. 2 a is a kind of flow diagram of PCB production method in the embodiment of the present invention；
Fig. 2 b is core plate fluting schematic diagram in the embodiment of the present invention；
Fig. 2 c is that core plate is embedded in metal block schematic diagram in the embodiment of the present invention；
Fig. 2 d is that core plate covers prepreg schematic diagram in the embodiment of the present invention；
Fig. 2 e is that thermally conductive adhesive sheet schematic diagram is arranged in the embodiment of the present invention；
Fig. 2 f is that prepreg covers metal layer schematic diagram in the embodiment of the present invention；
Fig. 2 g is that metal layer covers another prepreg schematic diagram in the embodiment of the present invention；
Fig. 2 h is PCB the schematic diagram of the section structure in the embodiment of the present invention；
Fig. 3 a is a kind of the schematic diagram of the section structure of PCB in the embodiment of the present invention；
Fig. 3 b is the schematic diagram of the section structure of another kind PCB in the embodiment of the present invention.
Specific embodiment
The embodiment of the invention provides the production method of PCB a kind of and PCB, for preventing while improving heat dissipation performance
Only metal layer wrinkles, and guarantees the normal function of PCB.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those skilled in the art's every other implementation obtained without creative efforts
Example, shall fall within the protection scope of the present invention.
Referring to Fig. 1, a kind of one embodiment for making PCB method includes: in the embodiment of the present invention
S101, the first through slot is opened up on core plate.
It should be noted that it is resin layer by middle layer that core plate, which is, upper and lower level is the composite plate that metal layer combination is formed, can
To make line pattern on the upper and lower surface metal layer of the core plate in advance, the line pattern is as the inner wire in multi-layer PCB
Road figure.
Wherein, which can be epoxy resin layer, which can be layers of copper.
S102, metal block is embedded in first through slot, the upper table of the upper surface of the metal block and the core plate
Face is in same level, and the lower surface of the lower surface of the metal block and the core plate is in same level.
It is understood that metal block is embedded in the first through slot, the metal block and first through slot are equivalent to interference
Cooperation, and the equal length of the depth of the through slot and the metal block, therefore after the metal block is embedded in first through slot,
So that the upper surface of the upper surface of the metal block and the core plate is in same level, the lower surface of the metal block and the core plate
Lower surface is in same level.
S103, the first prepreg is covered in the upper surface and the lower surface of the core plate, opened on first prepreg
Equipped with the second through slot, and first through slot is in the projection section of vertical direction projected with second through slot in vertical direction
Or it is all overlapped.
It is understood that needing to cover respectively in the upper and lower surface of the core plate to be superimposed metal layer in the core plate surface
Lid prepreg offers the second through slot in order to avoid the metal block is covered by the prepreg on the prepreg, this
The two through slot face metal blocks, since the metal block is embedded in the first through slot, throwing of second through slot in vertical direction
Shadow is overlapped with first through slot in the projection section of vertical direction or all.
S104, the first thermally conductive adhesive sheet is set in second through slot, and is arranged on first prepreg the
One metal layer.
Wherein, the thickness of the thermally conductive adhesive sheet is not less than the depth of second through slot.
S105, by the core plate, first prepreg, the first thermally conductive adhesive sheet, the metal block and described
The first metal layer is pressed, and the multi-layer PCB board is made.
It is understood that in order to make metal block and thermally conductive adhesive sheet, thermally conductive adhesive sheet and metal layer, core plate and metal layer
Between preferably contact, by the core plate, first prepreg, the first thermally conductive adhesive sheet, the metal block and
The first metal layer is pressed.
The embodiment of the present invention opens up the first through slot by elder generation on core plate, and metal block is then embedded in first through slot
In, then the core plate is Nian Jie by prepreg with metal layer, the second through slot is offered in the prepreg, in second through slot
Equipped with thermally conductive adhesive sheet, which is finally made pcb board by pressing by the thermally conductive adhesive sheet and the metal bonding layer,
Since metal block, thermally conductive adhesive sheet and the metal layer in the PCB constitute passage of heat, so as to improve heat dissipation effect, and should
Metal block can wrinkle to avoid metal layer without being embedded into the metal layer, guarantee the normal function of PCB.
Below with reference to application scenarios, production PCB method a kind of in the embodiment of the present invention is described in detail, please be join
Fig. 2-a is read to Fig. 2-h, this method specifically includes:
S201, as shown in Fig. 2-b, the first through slot 201 is opened up on core plate 202 by controlled depth milling.
Optionally, the position that the first through slot 201 is opened up on the core plate 202 can be preset, which preferably needs
The position for installing high power device or high-power chip, because the power consumption of high power device or high-power chip is big, the heat of generation
Amount at most, needs preferentially to improve its radiating efficiency.
S202, as shown in fig. 2-c, copper billet 204 is embedded in first through slot 201, the upper surface of the copper billet 204
Upper surface with the core plate 202 is in same level, the lower surface of the lower surface of the copper billet 204 and the core plate 202
In same level.
It should be noted that the metal block 204 is copper billet in the present embodiment, in practical applications, the metal block 204 is also
Can be aluminium block or molybdenum block or the metal block 204 can also be at least one of copper billet, aluminium block, molybdenum block constitute alloy, tool
Body is not construed as limiting herein.
S203, as shown in Fig. 2-d, the core plate 202 the upper surface and the lower surface cover the first prepreg 205, institute
State and offer the second through slot 206 on the first prepreg 205, and first through slot 201 vertical direction projection with it is described
Second through slot 206 is all overlapped in the projection of vertical direction.
Optionally, first through slot 201 of the present embodiment is in the projection of vertical direction and second through slot 206 in vertical side
To projection all be overlapped, illustrate that first through slot 201 is identical as the size dimension of the second through slot 206, and first through slot 201
Face second through slot 206 in the vertical direction can make two end faces of the copper billet 204 not by first prepreg in this way
205 coverings.
It should be noted that first through slot 201 is in the projection of vertical direction and second through slot 206 in vertical direction
Projection can also partially overlap, as long as the copper billet 204 is completely covered by first prepreg 205, it is specific this
Place is not construed as limiting.
S204, as shown in Fig. 2-e, the first heat-conducting silica gel sheet 207 is set in second through slot 206, and described
First layers of copper 208 is set on one prepreg 205.
Optionally, the thermally conductive adhesive sheet in the present embodiment is heat-conducting silica gel sheet, and the thermal coefficient of the heat-conducting silica gel sheet is greater than
Or it is equal to 0.8w/mk, it is mainly made of hydroxyl-terminated injecting two methyl siloxane, high temperature performance is good, can be at -50 DEG C~+200 DEG C
Long-term work, electrical insulation properties include that volume resistance, breakdown voltage, power loss, arc resistance etc. are very excellent, and are not easy
It is influenced by temperature, frequency variation, there is excellent heat transfer performance and weather resistance.
Optionally, the metal layer in the present embodiment is layers of copper, in practical applications, the metal layer can also for aluminium layer etc. other
Metal layer, this is not limited here.
S205, as shown in Fig. 2-f, by the core plate, first prepreg, the first thermally conductive adhesive sheet, described
Metal block and the first metal layer are pressed.
It optionally, further include step 206 and step 207 after step 205 in the present embodiment.
S206, as shown in Fig. 2-g, cover the second prepreg 209 in first layers of copper 208, described the second half is solid
Change and offers third through slot 210, the projection of the third through slot 210 in the vertical direction and second through slot 206 on piece 209
Projection in the vertical direction is all overlapped.
Optionally, in the present embodiment, the projection of third through slot 210 in the vertical direction and second through slot 206 are perpendicular
The upward projection of histogram is all overlapped, in the heat transfer to copper billet 204 for being conducive to component generation, improving radiating effect,
In practical application, the projection and the projection of second through slot 206 in the vertical direction of the third through slot 210 in the vertical direction
It can also partially overlap, as long as the heat that component can be made to generate is not obstructed i.e. in transmittance process by the second prepreg 209
Can, this is not limited here.
S207, as shown in Fig. 2-h, the second heat-conducting silica gel sheet 211 is set in the third through slot 210, and described
Second layers of copper 212 is set on two prepregs 209, and by second prepreg 209, second heat-conducting silica gel sheet 211
It is pressed with the second layers of copper 212, the PCB is made.
It is understood that the heat that generates of the component on PCB can successively by the PCB the second layers of copper 212,
Second heat-conducting silica gel sheet 211, the first heat-conducting silica gel sheet 207, the first layers of copper 208 and copper billet 204 radiate.
Wherein, after obtaining PCB by pressing, through-hole can also be opened up on the pcb, by the via hole, and is passed through
Filling holes with resin is crossed, makes to be electrically connected between sandwich circuit inside and outside PCB.
The embodiment of the present invention, during through pressing production PCB, metal block need to only be embedded into core plate, therefore
In bonding processes the metal layer of the PCB surface and metal block without contraposition, so as to avoid because of contraposition deviation caused by gold
It is bad to belong to layer corrugation.
Further, the first through slot on core plate is in the projection of vertical direction and the second through slot of the first prepreg perpendicular
Histogram to projection be all overlapped, and the third through slot of second through slot and the second prepreg is complete in the projection of vertical direction
Portion is overlapped, and the heat that the component on PCB can be made to generate more quickly is transmitted on metal block, provides heat dissipation effect.
Further, 0.8w/mk silica gel piece, further heat radiation effect are greater than using copper metal block and thermal coefficient
Fruit.
The method of one of embodiment of the present invention production PCB is described above, below to the embodiment of the present invention
One of PCB be described, please refer to Fig. 3-a, a kind of PCB one embodiment includes: in the embodiment of the present invention
Core plate 302, the first prepreg 305 and the first metal layer 308, the core plate 302 and the first metal layer 308
It is bonded by first prepreg 305；
Wherein, the first through slot 301 is offered on the core plate 302, first through slot 301 has been embedded in metal block 304,
The upper surface of the metal block 304 and the upper surface of the core plate 302 are in same level, the following table of the metal block 304
Face and the lower surface of the core plate 302 are in same level；
The second through slot 306 is offered on first prepreg 305, and first through slot 301 is in vertical direction
Projection is overlapped with second through slot 306 in the projection section of vertical direction or all, is provided with first in second through slot
Thermally conductive adhesive sheet 307；
Wherein, the first metal layer 308 and the metal block 304 are bonded by the described first thermally conductive adhesive sheet.
Optionally, in the present embodiment, the first thermally conductive adhesive sheet 307 is heat-conducting silica gel sheet, the heat-conducting silica gel sheet
Thermal coefficient is greater than 0.8w/mk.
It should be noted that in practical applications, which can be also other good heat conductivities, tool
There is the material of cementability, and the thermal coefficient of the first thermally conductive adhesive sheet 307 can also be greater than 0.8w/mk, specifically herein not
It limits.
Optionally, the metal block 304 be copper billet, in practical applications, the metal block 204 can also be aluminium block, molybdenum block,
Or other include the alloying metal block of Determination of multiple metal elements, this is not limited here.
Optionally, the first metal layer 308 is layers of copper, and in practical applications, which can also be aluminium layer
Or other metal layers, this is not limited here.
Optionally, the PCB further includes the second prepreg 309 and second metal layer 312, and second metal layer 312 passes through
Second prepreg 309 is Nian Jie with the first metal layer 308；
Wherein, third through slot 310 is offered on second prepreg 309, is equipped with second in the third through slot 310
Thermally conductive adhesive sheet 311, the upper and lower surface of the second thermally conductive adhesive sheet 311 are bonded the first metal layer 308 and described respectively
Second metal layer 312.
Optionally, second metal layer 312 described in the present embodiment is layers of copper, in practical applications, the second metal layer 312
It can also be aluminium layer or other metal layers, this is not limited here.
Optionally, the second thermally conductive adhesive sheet 311 described in the present embodiment is heat-conducting silica gel sheet, and the heat-conducting silica gel sheet is led
Hot coefficient is greater than 0.8w/mk.
It should be noted that in practical applications, which can be also other good heat conductivities, tool
There is the material of cementability, and the thermal coefficient of the second thermally conductive adhesive sheet 311 can also be greater than 0.8w/mk, specifically herein not
It limits.
It is apparent to those skilled in the art that for convenience and simplicity of description, the circuit of foregoing description
The specific work process of plate, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
In several embodiments provided herein, it should be understood that disclosed circuit board and preparation method thereof, it can
To realize by another way.For example, circuit board embodiment described above is only schematical, in actual implementation may be used
To there is other division mode.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although referring to before
Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding
Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
It modifies or replaces, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (7)
1. a kind of production method of PCB characterized by comprising
The first through slot is opened up on core plate；
Metal block is embedded in first through slot, the upper surface of the upper surface of the metal block and the core plate is in same water
In plane, the lower surface of the lower surface of the metal block and the core plate is in same level；
The first prepreg is covered in the upper surface and the lower surface of the core plate, it is logical that second is offered on first prepreg
Slot, and first through slot is in the projection section of vertical direction or all heavy in the projection of vertical direction and second through slot
It closes；
First thermally conductive adhesive sheet is set in second through slot, and in first prepreg and described first thermally conductive viscous
The first metal layer is set in contact pin, wherein the thermally conductive adhesive sheet is the heat conductive silica gel that thermal coefficient is greater than or equal to 0.8w/mk
Piece；
By the core plate, first prepreg, the first thermally conductive adhesive sheet, the metal block and the first metal layer
It is pressed.
2. the method according to claim 1, wherein the metal block is one of copper billet, aluminium block and molybdenum block,
The metal layer is layers of copper or aluminium layer.
3. the method according to claim 1, wherein the mode for opening up the first through slot on core plate is that control is deep
Milling.
4. according to the method in any one of claims 1 to 3, which is characterized in that by the core plate, first semi-solid preparation
After piece, the first thermally conductive adhesive sheet, the metal block and the first metal layer are pressed, further includes:
The second prepreg is covered on the first metal layer, and third through slot is offered on second prepreg, it is described
The projection of third through slot in the vertical direction is overlapped with second through slot projection section in the vertical direction or whole；
Second thermally conductive adhesive sheet is set in the third through slot, and second metal layer is set on second prepreg；
Second prepreg, the second thermally conductive adhesive sheet and second metal layer are pressed.
5. a kind of PCB characterized by comprising
Core plate, the first prepreg and the first metal layer, the core plate and the first metal layer pass through first semi-solid preparation
Piece bonding；
Wherein, the first through slot is offered on the core plate, first through slot has been embedded in metal block, the upper table of the metal block
The upper surface of face and the core plate is in same level, and the lower surface of the lower surface of the metal block and the core plate is same
On horizontal plane；
The second through slot is offered on first prepreg, and first through slot is in the projection and described second of vertical direction
Through slot is overlapped in the projection section or whole of vertical direction, is provided with the first thermally conductive adhesive sheet in second through slot, wherein institute
Stating the first thermally conductive adhesive sheet is the heat-conducting silica gel sheet that thermal coefficient is greater than or equal to 0.8w/mk；
The first metal layer and the metal block are bonded by the described first thermally conductive adhesive sheet.
6. PCB according to claim 5, which is characterized in that the metal block is one of copper billet, aluminium block and molybdenum block,
The metal layer is layers of copper or aluminium.
7. the PCB according to any one of claim 5 to 6, which is characterized in that the PCB further include:
Second prepreg and second metal layer, the second metal layer pass through second prepreg and first metal
Layer bonding；
Wherein, third through slot is offered on second prepreg, is equipped with the second thermally conductive adhesive sheet, institute in the third through slot
The upper and lower surface for stating the second thermally conductive adhesive sheet is bonded the first metal layer and the second metal layer respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510200757.XA CN106163081B (en) | 2015-04-24 | 2015-04-24 | A kind of production method and PCB of PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510200757.XA CN106163081B (en) | 2015-04-24 | 2015-04-24 | A kind of production method and PCB of PCB |
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| CN106163081B true CN106163081B (en) | 2019-06-28 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110139462B (en) * | 2018-02-09 | 2024-06-07 | 深南电路股份有限公司 | Printed circuit board, manufacturing method thereof and electronic device |
| TWI713419B (en) | 2018-02-09 | 2020-12-11 | 大陸商深南電路股份有限公司 | Printed circuit board and method of manufacturing the same and electronic apparatus |
| CN109327966B (en) * | 2018-11-23 | 2021-05-14 | 开平依利安达电子有限公司 | Method for improving resin filling in groove of circuit board |
| CN111683475B (en) * | 2020-06-29 | 2022-08-26 | 四川海英电子科技有限公司 | Production method of composite high-frequency circuit board |
| CN114449746B (en) * | 2021-11-09 | 2023-11-03 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | PCB test board and design method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079364A (en) * | 2012-12-27 | 2013-05-01 | 深圳市五株科技股份有限公司 | Manufacturing process of partial laminating copper block high-heat-dissipation metal-base circuit board |
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| JP2005072184A (en) * | 2003-08-22 | 2005-03-17 | Osamu Nagai | Compound substrate of metal core and multilayer substrate |
| US8148647B2 (en) * | 2006-08-23 | 2012-04-03 | Mitsubishi Electric Corporation | Printed circuit board and method of manufacturing the same |
| CN201114990Y (en) * | 2007-08-01 | 2008-09-10 | 锐德科无线通信技术(上海)有限公司 | Printed circuit board with heat radiation structure |
| CN103369820B (en) * | 2013-07-25 | 2016-04-20 | 东莞生益电子有限公司 | Possesses pcb board of high density interconnect designs and radiator structure and preparation method thereof |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079364A (en) * | 2012-12-27 | 2013-05-01 | 深圳市五株科技股份有限公司 | Manufacturing process of partial laminating copper block high-heat-dissipation metal-base circuit board |
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