JP2005072184A - Compound substrate of metal core and multilayer substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compound substrate of a metal core and a multilayer substrate wherein compound multilayer substrate structure in which the metal core is embedded into only a required portion is installed, various kinds of plating such as through-hole plating is enabled without needing resin charge processing of the metal core, and heat dissipating property can be improved by exposing the metal core to which heat dissipation is necessary, at a low cost by using conventional equipment and method. <P>SOLUTION: The multilayer substrate 3 uses the multilayer substrates of high temperature conductivity. IVH connection are performed between the multilayer substrates and hole processing of a through-hole 5 for heat conduction, through-hole plating is performed, and formation of a pattern 13 for heat conduction and formation of a signal line pattern of the multilayer substrate 3 are performed by etching. After that, treatment for increasing lamination strength is performed simultaneously with extracting the metal core embedding portion 8 of a multilayer substrate 7 which is previously laminated to the same thickness as the metal core 9 more largely than the metal core 9 by using an outline router. The multilayer substrate 7 and the metal core 9 are subjected to treatment which improves degree of adhesion. Furthermore, the exposed side of the metal core 9 is subjected to chemical treatment which reduces degree of adhesion. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a composite substrate of a metal core and a multilayer substrate.

  The single-sided metal core substrate of Conventional Example 1 is described in Japanese Patent Laid-Open No. 09-326536 and is a single-sided metal core substrate that does not require plating as shown in FIG. 3, or Japanese Patent Laid-Open No. 05-121852 of Conventional Example 2 As shown in FIG. 4, the metal core was resin-filled and then laminated, then through-holes were processed and through-hole plating was performed. .

However, the manufacturing method of Conventional Example 1 cannot achieve through-hole plating, and the manufacturing method of Conventional Example 2 has a structure in which the portions unnecessary for heat dissipation are laminated based on the entire metal core, and the metal core cannot be easily exposed, and the metal core is not exposed. Therefore, the heat dissipation effect cannot be expected, and it is necessary to fill the metal core with resin for the purpose of insulating the metal core and preventing the plating solution contamination due to the contact between the metal core and the plating solution. Due to the high density of holes for processing and the difficulty in drilling holes, it was not possible to manufacture a composite substrate consisting of a high-density multilayer substrate using a high-density connection such as a small-diameter through hole and a metal core substrate. Moreover, even if the resin is filled, the problem of the plating solution contamination from the crack of the resin and the problem that the metal core and the through hole are short-circuited cannot be solved.
JP 09-326536 A JP 05-121852 A

  Therefore, the present invention has a composite multilayer substrate structure in which a metal core is partially embedded immediately below a heat generating component, and the metal core and the multilayer substrate are laminated in a conventional facility, so that the cost and time of the through-hole portion of the metal core are increased. It does not require resin filling hole processing and resin filling processing for insulation and plating solution protection, and enables various types of plating such as through-hole plating by the ordinary method, and is embedded in a metal core embedded directly under heat conduction from a heat generating component With the conventional equipment, a metal core that requires heat dissipation can be easily exposed by conventional equipment to enhance the heat dissipation effect, and a composite board composed of high-density multilayer boards using high-density connections such as IVH connections and small-diameter through-holes. The problem is to provide it cheaply by the construction method.

  In order to solve the above problems, the invention of claim 1 is a multilayer substrate using IVH connection, small-diameter through-holes, etc., wherein the multilayer substrate is an outer layer material, and the metal core is partially embedded directly under the heat-generating component. Is used as an inner layer material, laminated with a multilayer press with a composite multi-layer board structure with a metal core sandwiched between adhesive resins, heat generated from the component is thermally transferred to the heat conduction pattern through the heat conduction through hole, and the metal core is bonded with the adhesive resin. This is a composite substrate of a metal core and a multilayer substrate characterized in that the metal core is partially embedded and laminated in a multilayer substrate, which can transmit heat of the component to the metal core.

  Further, in the invention of claim 2, it is impossible to apply various types of plating with the metal core exposed, since it is impossible to bring in contaminants into the plating solution. To avoid this, the composite substrate of claim 1 is used. And the process that requires plating, such as through-hole connection, is performed not on the inner metal core part but on the inner multilayer board part, so that the contact between the metal core and the plating solution is cut off and the metal core through hole part is removed. Multi-layer substrates that can be used for small-diameter through-hole plating connections, etc. without the need for resin filling to protect the plating and protect the plating solution, can be plated with various methods such as through-hole plating without the problem of plating solution contamination by ordinary methods. It is a composite substrate of a metal core and a multilayer substrate characterized by the above.

  According to the third aspect of the present invention, in order to dissipate heat from the heat-generating component, the heat generated from the heat-generating component is obtained by conducting heat from the heat-generating component to the metal core through a heat conduction through hole, a pattern for heat conduction, and an adhesive resin. It is advantageous to expose the metal core embedded immediately below, but since the metal core cannot be easily exposed by the adhesive resin, the composite substrate of claim 1 is subjected to a chemical treatment for reducing the adhesion degree on the exposed side of the metal core. V-groove from the exposed side of the metal core to the depth of the metal core by the external router or V-cut machine during the final outline processing of the substrate manufacturing process after the harmful chemical treatment process such as plating caused by the exposure of the metal core is completed. By processing, only the metal core necessary for heat dissipation can be easily exposed and the heat dissipation effect can be enhanced. Composite board of metal core and multilayer board A.

  According to the composite substrate of the metal core and the multilayer substrate of the invention 1, the multilayer substrate using the IVH connection between the multilayer substrates and the connection such as the small-diameter through hole, and the composite substrate multilayer substrate in which the metal core is embedded are the conventional manufacturing method and equipment. Easy to manufacture.

  According to the composite substrate of the metal core and the multilayer substrate of the invention 2, it has been impossible in the past to apply the plating while the metal core is exposed. There is no need for through hole resin filling and resin filling, and there is an effect that various kinds of plating can be performed at a low cost by a normal method without causing a problem of plating solution contamination.

  According to the composite substrate of the metal core and the multilayer substrate of the invention 3, only the metal core on the surface necessary for heat dissipation of the metal core that cannot be easily exposed by the adhesive resin is easily exposed by the external router or the V-cut machine of the conventional equipment. , There is an effect of enhancing the heat dissipation effect.

  In order to prevent heat collapse of the component due to heat generation of the component, a multilayer substrate structure in which the metal core is embedded in the multilayer substrate only directly under the heat generating component, and the metal core is covered and laminated with adhesive resin and outer layer copper foil or multilayer substrate Insulating the through hole part of the metal core of the conventional construction method and resin filling hole processing and resin filling processing for plating solution protection are not required, and various plating such as through through hole plating is not a metal core part but a multilayer board part In this way, various plating is performed without any problem of plating solution contamination by the usual construction method, and the multi-layer substrate part other than the metal core is a composite substrate of a metal core and high-density multi-layer substrate using IVH, small-diameter through holes, etc. Only a metal core necessary for heat dissipation, which is embedded in a multilayer substrate that is laminated at low cost by the construction method and equipment and is thermally conducted from the heat-generating components, is accommodated by a conventional outline processing machine. It is exposed to obtain a composite substrate of a metal core and a multilayer substrate for improved heat dissipation efficiency.

  Example 1 generated heat from the heat-generating component, and a metal core was used as a heat sink to prevent thermal collapse of the component. The metal core needs to be exposed for heat dissipation. If the metal core is exposed in advance, through-through-hole plating for connecting to the motherboard and gold plating for bonding cannot be performed. It was used. A conventionally well-known thing, such as aluminum, copper, iron, nickel, or these alloys, can be used for a metal core.

  The multilayer substrate 3 of Example 1 uses a multilayer substrate having a high thermal conductivity. After the IVH connection between the multilayer substrates and the drilling of the through hole 5 for heat conduction, through hole plating is performed and a pattern 13 for heat conduction is formed by etching. After forming the signal line pattern of the multilayer substrate 3, a process for increasing the degree of adhesion is performed. At the same time, the metal core embedded portion 8 of the multilayer substrate 7 having the same thickness as that of the metal core 9 is previously cut out larger than the metal core 9 by the external router, and the multilayer substrate 7 and the metal core 9 are subjected to a process for increasing the degree of adhesion. Further, the exposed side of the metal core 9 portion that needs to be exposed is subjected to a chemical treatment that reduces the degree of adhesion. More specifically, the exposed side of the metal core can be freely selected depending on the surface subjected to the chemical treatment for reducing the degree of adhesion.

  When laminating the composite substrate, the multilayer substrate 3 having a high thermal conductivity, the filler-based adhesive resin 6 having a high thermal conductivity, the multilayer substrate 7 in which the metal core 9 portion is embedded in the metal core embedded portion 8 of the multilayer substrate 7, and the adhesive having a high resin content The resin 10 and the outer layer copper foil 11 are stacked in this order, and a composite substrate of a metal core and a multilayer substrate is stacked by a stacking press. More specifically, as the adhesive resin 6 and the adhesive resin 10, conventionally known multilayer substrate laminating materials such as various prepregs for laminating multilayer substrates in which glass fibers are impregnated with an epoxy-based resin and filler-based adhesive sheets can be used. Furthermore, when the outer layer copper foil 11 is replaced with a multilayer substrate and subjected to a process of increasing the adhesion degree and laminated, the wiring density of the composite substrate of the metal core and the multilayer substrate can be increased.

  After drilling through-holes 4 such as small-diameter through holes in the multilayer substrate 7 other than the inner-layer metal core 9 of the composite substrate of the laminated metal core and multilayer substrate, through-hole plating, The outer layer copper foil 11 side is patterned by etching. After that, solder resist processing and gold plating for bonding for component mounting are performed.

  After the harmful chemical treatment process such as plating due to the exposure of the metal core is completed, the metal core is removed to the depth at which the metal core 9 is exposed only to the metal core that needs to be exposed from the outer layer copper foil 11 side in the final outline processing of the substrate manufacturing process. V-groove processing 12 to be exposed is processed with an external router or V-cut machine to expose the metal core, and then the composite substrate is processed with the external router to expose the metal core for heat dissipation and multilayer A composite substrate of the substrate was obtained.

Example 1 perspective view Example 1 Side view Conventional single-sided board Side view Conventional multilayer substrate side view

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat generating component 2 Heat generating area 3 Multilayer board 4 Through-through hole 5 Through hole for heat conduction 6 Adhesive resin 7 Multilayer board 8 Metal core embedding part 9 Metal core 10 Adhesive resin 11 Outer copper foil 12 V groove processing 13 Pattern for heat conduction

Claims (3)

  In the multilayer substrate, the multilayer substrate is an outer layer material, the multilayer substrate in which the metal core is partially embedded is the inner layer material, a composite multilayer substrate structure in which the metal core is sandwiched between adhesive resins, and is heated and pressed with a lamination press to obtain a laminate. A composite substrate of a metal core and a multilayer substrate, characterized in that a metal core is partially embedded in a multilayer substrate and laminated.   It is impossible to apply various types of plating while the metal core is exposed due to the problem of contamination of the plating solution. However, the composite substrate according to claim 1 is laminated, and various types of plating processes are performed on the multilayer substrate instead of the metal core portion of the inner layer. A composite substrate of a metal core and a multi-layer substrate, characterized in that the metal core and the plating solution are not contacted with each other, the resin filling process is not required, and various plating is possible without the problem of plating solution contamination. In order to dissipate the heat generating component, it is advantageous to expose the metal core embedded in the heat conduction of the heat generating component, but the metal core cannot be easily exposed by the adhesive resin. At the time of the outer shape processing at the end of the substrate manufacturing process in which harmful chemical processing steps such as plating caused by exposure of the metal core are finished by laminating the composite substrate of claim 1 by performing chemical treatment to reduce the adhesion on the side, A composite substrate of a metal core and a multi-layer substrate, characterized in that by performing V-groove processing from the exposed side of the metal core to the depth of the metal core, only the metal core necessary for heat dissipation can be easily exposed to enhance the heat dissipation effect.

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