CN106163081A - The manufacture method of a kind of PCB and PCB - Google Patents
The manufacture method of a kind of PCB and PCB Download PDFInfo
- Publication number
- CN106163081A CN106163081A CN201510200757.XA CN201510200757A CN106163081A CN 106163081 A CN106163081 A CN 106163081A CN 201510200757 A CN201510200757 A CN 201510200757A CN 106163081 A CN106163081 A CN 106163081A
- Authority
- CN
- China
- Prior art keywords
- groove
- prepreg
- metal
- heat conduction
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The embodiment of the invention discloses a kind of PCB manufacture method, for, while improving heat dispersion, preventing metal level wrinkling, it is ensured that the normal function of PCB.The method comprise the steps that on central layer, offer the first groove；Being embedded in by metal derby in the first groove, the upper surface of metal derby and the upper surface of central layer are in same level, and the lower surface of metal derby and the lower surface of central layer are in same level；Upper surface and lower surface at central layer cover the first prepreg, and the first prepreg offers the second groove, and the first groove in the projection section of vertical direction or all overlaps with the second groove in the projection of vertical direction；First heat conduction adhesive sheet is set in the second groove, and the first metal layer is set on the first prepreg；Central layer, the first prepreg, the first heat conduction adhesive sheet, metal derby and the first metal layer are carried out pressing.The embodiment of the present invention also provides for a kind of PCB, is used for preventing metal level wrinkling, it is ensured that the normal function of PCB.
Description
Technical field
The present invention relates to technical field of integrated circuits, particularly relate to manufacture method and the circuit of a kind of circuit board
Plate.
Background technology
Printed wiring board (English: Printed Circuit Board, to be called for short PCB), at electronic device and be
In system technology, PCB role is more and more important, the trend reduced along with system bulk, IC processing procedure and
Encapsulation technology constantly to more carefully less connection and volume development, connects role's as device and system
PCB also develops, along with constantly carrying of electronic product heat generation density towards the High density of PCB connecting granular
Rising, the demand for PCB heat dissipation design the most increasingly comes into one's own.
For solving PCB heat dissipation problem, in prior art 1, it is common practice to arrange on PCB suitably
The through hole of quantity, utilizes through hole to dispel the heat, and radiating effect is the best.
In order to improve radiating effect, in prior art 2, it is common practice to offering groove at pcb board,
It is embedded in the groove of this PCB through this metal derby of pressing again, owing to needing metal pressing when
Block positions in groove, deviations easily occurs, and after causing pressing, the metal level of PCB surface goes out
Existing wrinkling, affects the normal function of PCB.
Summary of the invention
Embodiments provide manufacture method and the PCB of a kind of PCB, improve the same of heat dispersion
Time, prevent metal level wrinkling, it is ensured that the normal function of PCB.
The manufacture method of a kind of PCB that embodiment of the present invention first aspect provides includes:
Central layer is offered the first groove；
Being embedded in by metal derby in described first groove, the upper surface of described metal derby is upper with described central layer
Surface is in same level, and the lower surface of the lower surface of described metal derby and described central layer is in same level
On face；
Upper surface and lower surface at described central layer cover the first prepreg, on described first prepreg
Offer the second groove, and described first groove in the projection of vertical direction with described second groove vertically
The projection section in direction or all overlap；
First heat conduction adhesive sheet is set in described second groove, and arranges on described first prepreg
The first metal layer；
By described central layer, described first prepreg, described first heat conduction adhesive sheet, described metal derby and
Described the first metal layer carries out pressing.
In conjunction with the first aspect of the embodiment of the present invention, in the first realization of embodiment of the present invention first aspect
In mode, described heat conduction adhesive sheet is the heat-conducting silica gel sheet that heat conductivity is more than or equal to 0.8w/mk.
In conjunction with the first aspect of the embodiment of the present invention, the second in embodiment of the present invention first aspect realizes
In mode, described metal derby is the one in copper billet, aluminium block and molybdenum block, and described metal level is layers of copper or aluminum
Layer.
In conjunction with the first aspect of the embodiment of the present invention, in the third realization of embodiment of the present invention first aspect
In mode, the described mode offering the first groove on central layer is controlled depth milling.
In conjunction with the first aspect of the embodiment of the present invention or the first implementation of first aspect or first aspect
The second implementation or the third implementation of first aspect, in embodiment of the present invention first aspect
The 4th kind of implementation in, by bonding to described central layer, described first prepreg, described first heat conduction
After sheet, described metal derby and described the first metal layer carry out pressing, also include:
Described the first metal layer covers the second prepreg, described second prepreg offers
Three grooves, the projection of described 3rd groove in the vertical direction and described second groove in the vertical direction
Projection section or all overlap；
Second heat conduction adhesive sheet is set in described 3rd groove, and arranges on described second prepreg
Second metal level；
Described second prepreg, described second heat conduction adhesive sheet and the second metal level are carried out pressing.
A kind of PCB of embodiment of the present invention second aspect, including:
Central layer, the first prepreg and the first metal layer, described central layer and described the first metal layer pass through institute
State the first prepreg bonding；
Wherein, described central layer offering the first groove, described first groove has been embedded in metal derby, institute
State the upper surface of metal derby and the upper surface of described central layer in same level, the following table of described metal derby
The lower surface of face and described central layer is in same level；
Offer the second groove on described first prepreg, and described first groove is in the throwing of vertical direction
Shadow or all overlaps in the projection section of vertical direction with described second groove, arranges in described second groove
There is the first heat conduction adhesive sheet；
Described the first metal layer and described metal derby are bonding by described first heat conduction adhesive sheet.
In conjunction with the second aspect of the embodiment of the present invention, in the first realization of embodiment of the present invention second aspect
In mode, described heat conduction adhesive sheet is the heat-conducting silica gel sheet that heat conductivity is more than or equal to 0.8w/mk.
In conjunction with the second aspect of the embodiment of the present invention, the second in embodiment of the present invention second aspect realizes
In mode, described metal derby is the one in copper billet, aluminium block and molybdenum block, and described metal level is layers of copper or aluminum.
In conjunction with the second aspect of the embodiment of the present invention or the first implementation of second aspect or second aspect
The second implementation, in the third implementation of embodiment of the present invention second aspect, described PCB
Also include:
Second prepreg and the second metal level, described second metal level by described second prepreg with
Described the first metal layer is bonding；
Wherein, described second prepreg offers the 3rd groove, in described 3rd groove, is provided with second
Heat conduction adhesive sheet, the upper and lower surface of described second heat conduction adhesive sheet bonding described the first metal layer and institute respectively
State the second metal level.
The embodiment of the present invention has the advantage that
First on central layer, offer a groove, then metal derby is embedded in this groove, then by this central layer
Bonding by prepreg with metal level, this prepreg offers another groove, in this another groove
Being provided with heat conduction adhesive sheet, this metal derby, by this heat conduction adhesive sheet and this metal bonding layer, eventually passes pressure
Close and prepare pcb board, owing to the metal derby in this PCB, heat conduction adhesive sheet and metal level constitute passage of heat,
Such that it is able to raising radiating effect, and this metal derby is without being embedded in this metal level, can avoid metal
Layer is wrinkling, it is ensured that the normal function of PCB.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of a kind of PCB manufacture method in the embodiment of the present invention；
Fig. 2 a is the schematic flow sheet of a kind of PCB manufacture method in the embodiment of the present invention；
Fig. 2 b is central layer fluting schematic diagram in the embodiment of the present invention；
Fig. 2 c is that in the embodiment of the present invention, central layer embeds metal derby schematic diagram；
Fig. 2 d is that in the embodiment of the present invention, central layer covers prepreg schematic diagram；
Fig. 2 e is to arrange heat conduction adhesive sheet schematic diagram in the embodiment of the present invention；
Fig. 2 f is that in the embodiment of the present invention, prepreg covers metal level schematic diagram；
Fig. 2 g is that in the embodiment of the present invention, metal level covers second half cured sheets schematic diagram；
Fig. 2 h is PCB cross-sectional view in the embodiment of the present invention；
Fig. 3 a is the cross-sectional view of a kind of PCB in the embodiment of the present invention；
Fig. 3 b is the cross-sectional view of another kind of PCB in the embodiment of the present invention.
Detailed description of the invention
Embodiments provide manufacture method and the PCB of a kind of PCB, for improving heat dispersion
While, prevent metal level wrinkling, it is ensured that the normal function of PCB.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the present invention, and
It is not all, of embodiment.Based on the embodiment in the present invention, those skilled in the art are not making wound
The every other embodiment obtained under the property made work premise, broadly falls into the scope of protection of the invention.
Referring to Fig. 1, in the embodiment of the present invention, an embodiment of a kind of PCB of making method includes:
S101, on central layer, offer the first groove.
It should be noted that central layer is to be resin bed by intermediate layer, levels is that metal layer combination is formed
Composite plate, can make line pattern, this line pattern in advance on the upper and lower surface metal level of this central layer
As the internal wiring figure in multi-layer PCB.
Wherein, this resin bed can be epoxy resin layer, and this metal level can be layers of copper.
S102, metal derby is embedded in described first groove, the upper surface of described metal derby and described core
The upper surface of plate is in same level, and the lower surface of described metal derby and the lower surface of described central layer are same
On one horizontal plane.
It is understood that metal derby is embedded in the first groove, this metal derby and this first groove phase
When in interference fit, and this groove the degree of depth equal with the length of this metal derby, therefore at this metal derby
After being embedded in this first groove so that the upper surface of this metal derby and the upper surface of this central layer are at same water
In plane, the lower surface of this metal derby and the lower surface of this central layer are in same level.
S103, cover the first prepreg at the upper surface of described central layer and lower surface, described the first half solid
Change and offer the second groove on sheet, and described first groove is at the projection of vertical direction and described second groove
In the projection section of vertical direction or all overlap.
It is understood that in order at this core plate surface superposition metal level, need the upper following table at this central layer
Face is covered each by prepreg, in order to avoid this metal derby is covered by this prepreg, at this prepreg
On offer the second groove, this second groove, just to this metal derby, leads to owing to this metal derby is embedded in first
In groove, therefore this second groove in the projection of vertical direction with described first groove in the projection of vertical direction
Partly or entirely overlap.
S104, the first heat conduction adhesive sheet is set in described second groove, and at described first prepreg
On the first metal layer is set.
Wherein, the thickness of this heat conduction adhesive sheet is not less than the degree of depth of this second groove.
S105, by described central layer, described first prepreg, described first heat conduction adhesive sheet, described gold
Belong to block and described the first metal layer carries out pressing, prepare described multi-layer PCB board.
It is understood that in order to make metal derby and heat conduction adhesive sheet, heat conduction adhesive sheet and metal level, core
Preferably contact between plate with metal level, by described central layer, described first prepreg, described first
Heat conduction adhesive sheet, described metal derby and described the first metal layer carry out pressing.
The embodiment of the present invention, by first offering the first groove on central layer, is then embedded in this by metal derby
In first groove then this central layer is bonding by prepreg with metal level, this prepreg offers
Second groove, is provided with heat conduction adhesive sheet in this second groove, and this metal derby is by this heat conduction adhesive sheet and is somebody's turn to do
Metal bonding layer, eventually passes pressing and prepares pcb board, owing to the metal derby in this PCB, heat conduction are bonding
Sheet and metal level constitute passage of heat, such that it is able to improve radiating effect, and this metal derby is without being embedded into
In this metal level, metal level can be avoided wrinkling, it is ensured that the normal function of PCB.
Below in conjunction with having application scenarios, the PCB method that makes a kind of in the embodiment of the present invention is carried out in detail
Illustrating, referring to Fig. 2-a to Fig. 2-h, the method specifically includes:
S201, as shown in Fig. 2-b, on central layer 202, offer the first groove 201 by controlled depth milling.
Optionally, the position that this central layer 202 is offered the first groove 201 can preset, this position
Preferably need high power device or the position of high-power chip are installed, because high power device or high-power
The power consumption of chip is big, and the heat of generation is most, needs preferential its radiating efficiency of raising.
S202, as shown in fig. 2-c, is embedded in copper billet 204 in described first groove 201, described copper billet
The upper surface of the upper surface of 204 and described central layer 202 in same level, the following table of described copper billet 204
The lower surface of face and described central layer 202 is in same level.
It should be noted that in the present embodiment, this metal derby 204 is copper billet, in actual applications, should
Metal derby 204 can also be aluminium block or molybdenum block, or this metal derby 204 can also be copper billet, aluminium block,
In molybdenum block, at least one alloy constituted, is not construed as limiting the most herein.
S203, as shown in Fig. 2-d, upper surface and lower surface at described central layer 202 cover the first semi-solid preparation
Sheet 205, described first prepreg 205 offers the second groove 206, and described first groove 201
Projection at vertical direction all overlaps in the projection of vertical direction with described second groove 206.
Optionally, first groove 201 of the present embodiment is at projection and described second groove 206 of vertical direction
Projection at vertical direction all overlaps, and this first groove 201 and size chi of the second groove 206 is described
Very little identical, and this first groove 201 in the vertical direction is just to this second groove 206, so can make this
Two end faces of copper billet 204 are not covered by this first prepreg 205.
It should be noted that this first groove 201 is at projection and described second groove 206 of vertical direction
Projection at vertical direction can also partially overlap, as long as making this copper billet 204 not by this first prepreg
205 are completely covered, and are not construed as limiting the most herein.
S204, as shown in Fig. 2-e, in described second groove 206, the first heat-conducting silica gel sheet 207 is set,
And the first layers of copper 208 is set on described first prepreg 205.
Optionally, the heat conduction adhesive sheet in the present embodiment is heat-conducting silica gel sheet, the heat conduction of this heat-conducting silica gel sheet
Coefficient is more than or equal to 0.8w/mk, is mainly made up of hydroxyl-terminated injecting two methyl siloxane, and high temperature performance is good,
Can long-term work at-50 DEG C～+200 DEG C, electrical insulation properties includes volume resistance, breakdown voltage, merit
Rate loss, arc resistance etc. are the most excellent, and are susceptible to temperature, the impact of frequency change, have excellent
Heat transfer performance and weather resistance.
Optionally, the metal level in the present embodiment is layers of copper, and in actual applications, this metal level can be also
Other metal levels such as aluminium lamination, are not construed as limiting the most herein.
S205, as shown in Fig. 2-f, described central layer, described first prepreg, described first heat conduction are glued
Contact pin, described metal derby and described the first metal layer carry out pressing.
Optionally, after step 205 in the present embodiment, also include step 206 and step 207.
S206, as shown in Fig. 2-g, described first layers of copper 208 covers the second prepreg 209, institute
State and on the second prepreg 209, offer the 3rd groove 210, described 3rd groove 210 in the vertical direction
Projection all overlap with the projection of described second groove 206 in the vertical direction.
Optionally, in the present embodiment, the projection of the 3rd groove 210 in the vertical direction is led to described second
The projection of groove 206 in the vertical direction all overlaps, and the heat that beneficially components and parts produce is delivered to copper billet
On 204, improving radiating effect, in actual applications, the projection of the 3rd groove 210 in the vertical direction
Projection with described second groove 206 in the vertical direction can also partially overlap, as long as components and parts can be made
The heat produced is not intercepted by the second prepreg 209 in transmittance process, does not limits
Fixed.
S207, as shown in Fig. 2-h, in described 3rd groove 210, the second heat-conducting silica gel sheet 211 is set,
And the second layers of copper 212 is set on described second prepreg 209, and by described second prepreg 209,
Described second heat-conducting silica gel sheet 211 and the second layers of copper 212 carry out pressing, prepare described PCB.
It is understood that the heat that components and parts on PCB produce can sequentially pass through in this PCB the
Two layers of copper the 212, second heat-conducting silica gel sheet the 211, first heat-conducting silica gel sheet the 207, first layers of copper 208 and copper
Block 204 dispels the heat.
Wherein, after obtaining PCB through pressing, it is also possible to offer through hole on the pcb, by hole wall
Metallization, and through filling holes with resin, make to electrically connect between PCB ectonexine circuit.
The embodiment of the present invention, during making PCB by pressing, metal derby only need to be embedded into central layer
In, therefore in bonding processes the metal level of this PCB surface and metal derby without para-position, such that it is able to
Avoid the metal level caused because of para-position deviation wrinkling bad.
Further, the first groove on central layer is in the projection and the second of the first prepreg of vertical direction
Groove all overlaps in the projection of vertical direction, and this second groove and the threeway of the second prepreg
Groove all overlaps in the projection of vertical direction, and the heat that the components and parts on PCB can be made to produce is quicker
Be delivered on metal derby, it is provided that radiating effect.
Further, copper metal derby and heat conductivity is used to be more than 0.8w/mk silica gel piece, further
Improving radiating effect.
Above the method for a kind of PCB of making in the embodiment of the present invention is described, below to this
A kind of PCB in bright embodiment is described, and refers to Fig. 3-a, a kind of PCB in the embodiment of the present invention
One embodiment includes:
Central layer the 302, first prepreg 305 and the first metal layer 308, described central layer 302 and described the
One metal level 308 is bonding by described first prepreg 305；
Wherein, described central layer 302 offering the first groove 301, described first groove 301 has been embedded in
The upper surface of metal derby 304, the upper surface of described metal derby 304 and described central layer 302 is in same level
On, the lower surface of the lower surface of described metal derby 304 and described central layer 302 is in same level；
Offer the second groove 306 on described first prepreg 305, and described first groove 301 is perpendicular
Nogata to projection or all overlap in the projection section of vertical direction with described second groove 306, described
The first heat conduction adhesive sheet 307 it is provided with in second groove；
Wherein, described the first metal layer 308 and described metal derby 304 are by described first heat conduction adhesive sheet
Bonding.
Optionally, in the present embodiment, described first heat conduction adhesive sheet 307 is heat-conducting silica gel sheet, described in lead
The heat conductivity of hot silica gel piece is more than 0.8w/mk.
It should be noted that in actual applications, this first heat conduction adhesive sheet 307 can be also other heat conduction
Performance is good, have the material of cementability, and the heat conductivity of this first heat conduction adhesive sheet 307 is all right
More than 0.8w/mk, it is not construed as limiting the most herein.
Optionally, described metal derby 304 is copper billet, and in actual applications, this metal derby 204 is all right
For aluminium block, molybdenum block, or other comprise the alloying metal block of Determination of multiple metal elements, do not limit
Fixed.
Optionally, described the first metal layer 308 is layers of copper, and in actual applications, this first metal layer is also
Can be aluminium lamination or other metal levels, be not construed as limiting the most herein.
Optionally, described PCB also includes the second prepreg 309 and the second metal level 312, the second gold medal
Belong to layer 312 bonding with described the first metal layer 308 by described second prepreg 309；
Wherein, described second prepreg 309 offers the 3rd groove 310, described 3rd groove 310
Inside it is provided with the second heat conduction adhesive sheet 311, the upper and lower surface of described second heat conduction adhesive sheet 311 bonding institute respectively
State the first metal layer 308 and described second metal level 312.
Optionally, described in the present embodiment, the second metal level 312 is layers of copper, and in actual applications, this is years old
Two metal levels 312 can also be aluminium lamination or other metal levels, is not construed as limiting the most herein.
Optionally, described in the present embodiment, the second heat conduction adhesive sheet 311 is heat-conducting silica gel sheet, described heat conduction
The heat conductivity of silica gel piece is more than 0.8w/mk.
It should be noted that in actual applications, this second heat conduction adhesive sheet 311 can be also other heat conduction
Performance is good, have the material of cementability, and the heat conductivity of this second heat conduction adhesive sheet 311 is all right
More than 0.8w/mk, it is not construed as limiting the most herein.
Those skilled in the art is it can be understood that arrive, and for convenience and simplicity of description, above-mentioned retouches
The specific works process of the circuit board stated, is referred to the corresponding process in preceding method embodiment, at this
Repeat no more.
In several embodiments provided herein, it should be understood that disclosed circuit board and system thereof
Make method, can realize by another way.Such as, circuit board embodiment described above is only
Being schematic, actual can have other dividing mode when realizing.
The above, above example only in order to technical scheme to be described, is not intended to limit；
Although being described in detail the present invention with reference to previous embodiment, those of ordinary skill in the art should
Work as understanding: the technical scheme described in foregoing embodiments still can be modified by it, or to it
Middle part technical characteristic carries out equivalent；And these amendments or replacement, do not make appropriate technical solution
Essence depart from various embodiments of the present invention technical scheme spirit and scope.
Claims (9)
1. the manufacture method of a PCB, it is characterised in that including:
Central layer is offered the first groove；
Being embedded in by metal derby in described first groove, the upper surface of described metal derby is upper with described central layer
Surface is in same level, and the lower surface of the lower surface of described metal derby and described central layer is in same level
On face；
Upper surface and lower surface at described central layer cover the first prepreg, on described first prepreg
Offer the second groove, and described first groove in the projection of vertical direction with described second groove vertically
The projection section in direction or all overlap；
First heat conduction adhesive sheet is set in described second groove, and arranges on described first prepreg
The first metal layer；
By described central layer, described first prepreg, described first heat conduction adhesive sheet, described metal derby and
Described the first metal layer carries out pressing.
Method the most according to claim 1, it is characterised in that described heat conduction adhesive sheet is heat conduction system
The number heat-conducting silica gel sheet more than or equal to 0.8w/mk.
Method the most according to claim 1, it is characterised in that described metal derby is copper billet, aluminium block
With the one in molybdenum block, described metal level is layers of copper or aluminium lamination.
Method the most according to claim 1, it is characterised in that described offer on central layer first lead to
The mode of groove is controlled depth milling.
Method the most according to any one of claim 1 to 4, it is characterised in that by described central layer,
Described first prepreg, described first heat conduction adhesive sheet, described metal derby and described the first metal layer enter
After row pressing, also include:
Described the first metal layer covers the second prepreg, described second prepreg offers
Three grooves, the projection of described 3rd groove in the vertical direction and described second groove in the vertical direction
Projection section or all overlap；
Second heat conduction adhesive sheet is set in described 3rd groove, and arranges on described second prepreg
Second metal level；
Described second prepreg, described second heat conduction adhesive sheet and the second metal level are carried out pressing.
6. a PCB, it is characterised in that including:
Central layer, the first prepreg and the first metal layer, described central layer and described the first metal layer pass through institute
State the first prepreg bonding；
Wherein, described central layer offering the first groove, described first groove has been embedded in metal derby, institute
State the upper surface of metal derby and the upper surface of described central layer in same level, the following table of described metal derby
The lower surface of face and described central layer is in same level；
Offer the second groove on described first prepreg, and described first groove is in the throwing of vertical direction
Shadow or all overlaps in the projection section of vertical direction with described second groove, arranges in described second groove
There is the first heat conduction adhesive sheet；
Described the first metal layer and described metal derby are bonding by described first heat conduction adhesive sheet.
PCB the most according to claim 6, it is characterised in that described heat conduction adhesive sheet is heat conduction system
The number heat-conducting silica gel sheet more than or equal to 0.8w/mk.
PCB the most according to claim 6, it is characterised in that described metal derby is copper billet, aluminium block
With the one in molybdenum block, described metal level is layers of copper or aluminum.
9. according to the PCB according to any one of claim 6 to 8, it is characterised in that described PCB
Also include:
Second prepreg and the second metal level, described second metal level by described second prepreg with
Described the first metal layer is bonding；
Wherein, described second prepreg offers the 3rd groove, in described 3rd groove, is provided with second
Heat conduction adhesive sheet, the upper and lower surface of described second heat conduction adhesive sheet bonding described the first metal layer and institute respectively
State the second metal level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510200757.XA CN106163081B (en) | 2015-04-24 | 2015-04-24 | A kind of production method and PCB of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510200757.XA CN106163081B (en) | 2015-04-24 | 2015-04-24 | A kind of production method and PCB of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106163081A true CN106163081A (en) | 2016-11-23 |
| CN106163081B CN106163081B (en) | 2019-06-28 |
Family
ID=57346554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510200757.XA Active CN106163081B (en) | 2015-04-24 | 2015-04-24 | A kind of production method and PCB of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106163081B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109327966A (en) * | 2018-11-23 | 2019-02-12 | 开平依利安达电子有限公司 | A kind of wiring board application technology improving groove internal plug resin |
| WO2019153452A1 (en) * | 2018-02-09 | 2019-08-15 | 深南电路股份有限公司 | Printed circuit board and manufacturing method therefor and electronic device |
| US10652992B2 (en) | 2018-02-09 | 2020-05-12 | Shennan Circuits Co., Ltd. | Printed circuit board, method for manufacturing the same and electronic device |
| CN111683475A (en) * | 2020-06-29 | 2020-09-18 | 四川海英电子科技有限公司 | Production method of composite high-frequency circuit board |
| CN114449746A (en) * | 2021-11-09 | 2022-05-06 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | PCB test board and design method thereof |
| CN114980573A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005072184A (en) * | 2003-08-22 | 2005-03-17 | Osamu Nagai | Compound substrate of metal core and multilayer substrate |
| US20080047742A1 (en) * | 2006-08-23 | 2008-02-28 | Mitsubishi Electric Corporation | Printed circuit board and method of manufacturing the same |
| CN201114990Y (en) * | 2007-08-01 | 2008-09-10 | 锐德科无线通信技术(上海)有限公司 | Printed circuit board with heat radiation structure |
| CN103079364A (en) * | 2012-12-27 | 2013-05-01 | 深圳市五株科技股份有限公司 | Manufacturing process of partial laminating copper block high-heat-dissipation metal-base circuit board |
| CN103369820A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
-
2015
- 2015-04-24 CN CN201510200757.XA patent/CN106163081B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005072184A (en) * | 2003-08-22 | 2005-03-17 | Osamu Nagai | Compound substrate of metal core and multilayer substrate |
| US20080047742A1 (en) * | 2006-08-23 | 2008-02-28 | Mitsubishi Electric Corporation | Printed circuit board and method of manufacturing the same |
| CN201114990Y (en) * | 2007-08-01 | 2008-09-10 | 锐德科无线通信技术(上海)有限公司 | Printed circuit board with heat radiation structure |
| CN103079364A (en) * | 2012-12-27 | 2013-05-01 | 深圳市五株科技股份有限公司 | Manufacturing process of partial laminating copper block high-heat-dissipation metal-base circuit board |
| CN103369820A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019153452A1 (en) * | 2018-02-09 | 2019-08-15 | 深南电路股份有限公司 | Printed circuit board and manufacturing method therefor and electronic device |
| US10652992B2 (en) | 2018-02-09 | 2020-05-12 | Shennan Circuits Co., Ltd. | Printed circuit board, method for manufacturing the same and electronic device |
| CN109327966A (en) * | 2018-11-23 | 2019-02-12 | 开平依利安达电子有限公司 | A kind of wiring board application technology improving groove internal plug resin |
| CN109327966B (en) * | 2018-11-23 | 2021-05-14 | 开平依利安达电子有限公司 | Method for improving resin filling in groove of circuit board |
| CN111683475A (en) * | 2020-06-29 | 2020-09-18 | 四川海英电子科技有限公司 | Production method of composite high-frequency circuit board |
| CN114980573A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
| CN114449746A (en) * | 2021-11-09 | 2022-05-06 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | PCB test board and design method thereof |
| CN114449746B (en) * | 2021-11-09 | 2023-11-03 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | PCB test board and design method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106163081B (en) | 2019-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106163081A (en) | The manufacture method of a kind of PCB and PCB | |
| CN102307429B (en) | Embedded high-thermal conductive PCB and manufacturing method thereof | |
| CN104900609A (en) | Package structure | |
| CN105792504B (en) | A kind of holes PCB embedding device and preparation process with shielding measure | |
| CN105491822B (en) | Multilayer printed circuit board integrates liquid cold passage preparation method | |
| CN102056425A (en) | Method for manufacturing multilayer printed circuit board (PCB) | |
| CN105188318A (en) | Heat radiation device, electronic equipment and manufacturing method | |
| CN104779228A (en) | Three-dimensional packaging structure and method for power semiconductor module | |
| CN105430865B (en) | A kind of manufacturing method and printed circuit board of printed circuit board radiator structure | |
| CN105491785A (en) | Phase-change heat conduction circuit board module and circuit board structure thereof | |
| CN105578735A (en) | High-heat-conduction multilayer circuit board | |
| CN105163485A (en) | Heat conducting substrate for heating device and heating device and manufacturing method thereof | |
| CN110268520A (en) | Method for integrated power chip and the busbar for forming radiator | |
| CN100596255C (en) | Making method and structure for high power thin line carrier board | |
| CN206004999U (en) | Pcb board | |
| KR20080071494A (en) | Heat conductive paste, light emitting diode substrate using the same and manufacturing method thereof | |
| CN102088825A (en) | Multilayered circuit board, method for manufacturing the same, and electronic apparatus | |
| CN203482489U (en) | Multilayer printed circuit board (PCB) | |
| CN203934231U (en) | A kind of large thickness heat-conducting interface material of composition metal heat-conducting layer | |
| WO2016197789A1 (en) | Liquid-cooled heat sink, and processing and assembly method therefor | |
| CN207766641U (en) | A kind of multi-layer H DI plates of high stability | |
| CN104735904A (en) | Heat dissipation printed circuit board and manufacturing method thereof | |
| CN105128454A (en) | Double-sided aluminum-based copper-clad plate for LED lamp and manufacturing method for double-sided aluminum-based copper-clad plate | |
| CN101945543B (en) | Method for repairing open circuit of thick copper lead wire and repairing structure thereof | |
| CN205071456U (en) | Multilayer circuit plate structure with embedded connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |