CN105491785A - Phase-change heat conduction circuit board module and circuit board structure thereof - Google Patents
Phase-change heat conduction circuit board module and circuit board structure thereof Download PDFInfo
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- CN105491785A CN105491785A CN201410531062.5A CN201410531062A CN105491785A CN 105491785 A CN105491785 A CN 105491785A CN 201410531062 A CN201410531062 A CN 201410531062A CN 105491785 A CN105491785 A CN 105491785A
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Abstract
The invention relates to a phase-change heat conduction circuit board module and a circuit board structure thereof. The phase-change heat conduction circuit board module comprises the circuit board structure, a heating element and a cooling element, wherein the circuit board structure comprises a plate and a heat-conducting element; the heat-conducting element is buried in the plate and comprises a heat tube and resin which does not contain a glass fiber; the heat tube is arranged in the plate and does not stick out of a surface of the plate; the resin is filled into a gap between the heat tube and the plate; the resin is roughly seamlessly connected to the heat tube and the plate; the heating element abuts onthe heat-conducting element of the circuit board structure; the part, close to the heating element, of the heat tube is defined as a heat absorption end part; the cooling element abuts onthe heat-conducting element of the circuit board structure; and the part, close to the cooling element, of the heat tube is defined as a heat release end part. Therefore, the circuit board module provided by the invention is relatively good in cooling efficiency.
Description
Technical field
The present invention relates to a kind of circuit board, and particularly relate to a kind of circuit board module and board structure of circuit thereof of phase change heat-conducting.
Background technology
Electronic product common at present, such as mobile phone and notebook computer, under the trend of microminiaturization, overall package module storehouse density is more and more higher.Therefore, the function of electronic product gets more and more, and the power consumed is also increasing, to such an extent as to electronic product can produce a lot of heat energy when operating, thus increases the temperature of electronic product.Accordingly, causing the reliability of electronic product to decline to reduce electronic product because temperature is too high, on circuit board, usually designing the heat dissipation path of copper post as electronic building brick.
But the radiating efficiency that the above-mentioned circuit board being provided with copper post possesses does not apply gradually and uses, and therefore, the radiating efficiency how promoting circuit board has become one of major subjects researched and developed in the industry.So the above-mentioned disappearance of the present inventor's thoughts can be improved, Gu Te concentrates on studies and coordinates the utilization of scientific principle, finally proposes a kind of reasonable in design and effectively improve the present invention of above-mentioned disappearance.
Summary of the invention
The embodiment of the present invention is the circuit board module and the board structure of circuit thereof that provide a kind of phase change heat-conducting, and it can promote the radiating efficiency of board structure of circuit effectively.
The embodiment of the present invention provides a kind of circuit board module of phase change heat-conducting, comprising: a board structure of circuit, comprises: a plate, and it has two plate faces and at least one signal transmission line, and this plate is formed with a storage tank; And a heat-conducting piece, comprise: the heat pipe of a closed, be provided with a working fluid in it, this heat pipe to be arranged in this storage tank and not to stretch out this two plates face of this plate, leaves a space between this heat pipe and this storage tank; And the resin that does not comprise glass fibre, it is filled in this space between this heat pipe and this storage tank, and this resin is roughly seamlessly connected in this heat pipe and this storage tank, and this heat pipe and this signal transmission line are in being electrically insulated from each other; One heat generating member, it is connected to the heat-conducting piece of this board structure of circuit, and the position that this heat pipe is adjacent to this heat generating member is defined as a heat absorption end; And a cooling piece, it is connected to the heat-conducting piece of this board structure of circuit, and the position that this heat pipe is adjacent to this cooling piece is defined as a heat release end; Wherein, the working fluid in this heat absorption end is liquid phase and in order to absorb heat energy that this heat generating member produces and to flash to gas phase working fluid, to make to produce partial high pressure in this heat pipe, orders about this gas phase working fluid and flow to this heat release end; This gas phase workflow physical efficiency condenses into liquid phase working fluid in this heat release end by the cooling of this cooling piece, and is back to this heat absorption end.
The embodiment of the present invention also provides a kind of board structure of circuit, comprising: a plate, and it has two plate faces and at least one signal transmission line, and this plate is formed with a storage tank; And a heat-conducting piece, comprise: the heat pipe of a closed, be provided with a working fluid in it, this heat pipe to be arranged in this storage tank and not to stretch out this two plates face of this plate, leave a space between this heat pipe and this storage tank, and the definition of this heat pipe there are a heat absorption end and a heat release end; And the resin that does not comprise glass fibre, it is filled in this space between this heat pipe and this storage tank, and this resin is roughly seamlessly connected in this heat pipe and this storage tank, and this heat pipe and this signal transmission line are in being electrically insulated from each other; Wherein, the working fluid in this heat absorption end is liquid phase and flashes to gas phase working fluid in order to absorb heat energy, to make to produce partial high pressure in this heat pipe, orders about this gas phase working fluid and flows to this heat release end; This gas phase workflow physical efficiency is caught a cold but in this heat release end and condenses into liquid phase working fluid, and is back to this heat absorption end.
In sum, the circuit board module of the phase change heat-conducting that the embodiment of the present invention provides and board structure of circuit thereof, its heat energy that heat generating member is produced can be delivered to cooling piece rapidly via the heat pipe be embedded in board structure of circuit, and then promotes the radiating efficiency of board structure of circuit.
Further understand feature of the present invention and technology contents for enable, refer to following detailed description for the present invention and accompanying drawing, but these illustrate and institute's accompanying drawings is only used to the present invention is described, but not any restriction is done to interest field of the present invention.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the circuit board module of phase change heat-conducting of the present invention.
Fig. 2 is the cross-sectional schematic of Fig. 1 along A-A hatching line.
Fig. 3 is the cross-sectional schematic of Fig. 1 along B-B hatching line.
Fig. 4 is the schematic diagram of the step S101 of board structure of circuit manufacture method of the present invention.
Fig. 5 is the schematic diagram of the step S103 of board structure of circuit manufacture method of the present invention.
Fig. 6 is the schematic diagram of the step S105 of board structure of circuit manufacture method of the present invention.
Fig. 7 is the schematic diagram of the step S107 of board structure of circuit manufacture method of the present invention.
Fig. 8 is the schematic diagram of the step S109 of board structure of circuit manufacture method of the present invention.
Fig. 9 is the schematic diagram of another enforcement aspect of board structure of circuit of the present invention.
Figure 10 is the schematic perspective view of the circuit board module corresponding to Fig. 7.
Figure 11 is the schematic perspective view at another visual angle of circuit board module corresponding to Fig. 7.
Figure 12 is the cross-sectional schematic of Figure 10 along C-C hatching line.
Figure 13 is the schematic diagram of another enforcement aspect of circuit board module of the present invention.
Figure 14 is the schematic diagram of the circuit board module corresponding to Fig. 8.
[the symbol simple declaration of figure]:
The circuit board module of 100 phase change heat-conductings
1 board structure of circuit
11 plates
111 first plate faces
112 second plate faces
113 signal transmission lines
12 heat-conducting pieces
121 heat pipes
121a absorbs heat end
121b heat release end
122 resins
2 heat generating members
3 cooling pieces
Embodiment
Refer to Fig. 1 to Fig. 3, it is one embodiment of the invention, and what need first illustrate is, correlated measure mentioned by the present embodiment correspondence pattern and external form, only in order to specifically describe embodiments of the present invention, so that understand its content, and be not used to limit to interest field of the present invention.
The present embodiment is a kind of circuit board module 100 of phase change heat-conducting, comprises a board structure of circuit 1 and is installed on heat generating member 2 and the cooling piece 3 on board structure of circuit 1.Above-mentioned heat generating member 2 is installed on board structure of circuit 1, the heat energy that heat generating member 2 produces is sent to cooling piece 3 through board structure of circuit 1 with cooling piece 3.Wherein, described heat generating member 2 can be the heat generating component such as chip or resistance, and cooling piece 3 can be the cooling package such as radiating fin or cooling chip, is not limited at this.
Followingly the concrete structure of board structure of circuit 1 will be first described, then put off until some time later the relativeness that bright board structure of circuit 1 corresponds to heat generating member 2 and cooling piece 3.
Described board structure of circuit 1 includes a plate 11 and the heat-conducting piece 12 be embedded in plate 11.Wherein, the plate 11 of the present embodiment refers to not bent hardboard, that is mainly formed with the prepreg bed of material (PreimpregnatedMaterial), and divide according to different reinforcing materials, the prepreg bed of material can be the materials such as glass fibre prepreg (Glassfiberprepreg), carbon fibre initial rinse material (Carbonfiberprepreg), epoxy resin (Epoxyresin).Moreover above-mentioned plate 11 being for laminated plates in the present embodiment, and for ease of illustrating, followingly laminated plates being considered as solid memder being described, but plate of the present invention 11 is not limited with laminated plates.
Described plate 11 have be arranged in opposition side two plate faces 111,112 (as plate 11 end face and the bottom surface of Fig. 1, followingly be referred to as the first plate face 111 and the second plate face 112, so that illustrate), and plate 11 has at least one signal transmission line 113, in order to the use as signal transmission.
Moreover described plate 11 is formed with a storage tank 114, above-mentioned storage tank 114 one of them recessedly can be formed from the first plate face 111 and the second plate face 112, and the storage tank 114 in Fig. 2 is for recessed from the first plate face 111.And storage tank 114 is in strip, and the long axis direction of storage tank 114 (horizontal direction as Fig. 2) is roughly parallel to above-mentioned first plate face 111 and the second plate face 112.In addition, due to other features (as: perforation (via), configuration) of plate 11 and non-invention technical characteristic for emphasizing, thus not in this to go forth.
The heat pipe (heatpipe) 121 and one that described heat-conducting piece 12 includes a closed does not include the resin 122 of glass fibre.Wherein, above-mentioned heat pipe 121 is roughly in flat, and its profile roughly corresponds to the storage tank 114 of sheet material 110, but the size of heat pipe 121 need be slightly less than the storage tank 114 of described sheet material 110.And described heat pipe 121 has a tubing 1211 (as: copper pipe), is located at a capillary structure 1212 of tubing 1211 inwall and is placed in the working fluid 1213 (as: water) in tubing 1211.Should be noted that, heat pipe 121 is for vertical bar shape in the present embodiment, but when practical application, the external form of heat pipe 121 can be adjusted according to designer's demand, and for example, heat pipe 121 is bent l-shaped (figure slightly) also.
The first plate face 111 and the second plate face 112 of plate 11 is not stretched out in the storage tank 114 that described heat pipe 121 is arranged at plate 11.Moreover, leave a space between heat pipe 121 and storage tank 114, and heat pipe 121 electrically completely cuts off with the signal transmission line 113 of plate 11.Described resin 122 is filled in the space between heat pipe 121 and storage tank 114, and resin 122 is roughly seamlessly connected in heat pipe 121 and storage tank 114, can stably be embedded in plate 11 to make heat pipe 121.
In more detail, described heat pipe 121 definition has an a heat absorption end 121a and heat release end 121b.Wherein, above-mentioned heat absorption end 121a refers in the present embodiment: when heat generating member 2 is installed on heat-conducting piece 12, and heat pipe 121 is adjacent to the position (the left end position as heat pipe in Fig. 2 121) of heat generating member 2.And described heat release end 121b refers in the present embodiment: when cooling piece 3 is installed on heat-conducting piece 12, heat pipe 121 is adjacent to the position (the right-hand member position as heat pipe in Fig. 2 121) of cooling piece 3.
Change angle, the outer surface of described heat pipe 121 includes two relative first type surfaces 1214,1215 and around the ring side 1216 being connected to above-mentioned two first type surface 1214,1215 peripheries.For ease of illustrating, this two first type surface 1214,1215 is referred to as the first first type surface 1214 and the second first type surface 1215 in following.Wherein, the first first type surface 1214 of heat pipe 121 is revealed in outside the first plate face 111 of plate 11, and the second first type surface 1215 of heat pipe 121 is then coated on resin 122 with ring side 1216 and is embedded among plate 11.
Moreover, above-mentioned heat pipe 121 first first type surface 1214 be revealed in outside plate 11 first plate face 111 is surperficial with resin 122, first plate face 111 of itself and plate 11 is roughly arranged in copline, that is, first first type surface 1214 position of the heat absorption end 121a of heat pipe 121 and resin 122 are exposed to outer surface and all roughly roughly arrange in copline with the first plate face 111 of plate 11, and first first type surface 1214 position of described heat release end 121b and resin 122 are exposed to outer surface and also roughly roughly arrange in copline with the first plate face 111 of plate 11.
Be more than the technical characteristic explanation of the present embodiment board structure of circuit 1, below the manufacture method of summary board structure of circuit 1 and the part of foregoing circuit plate structure 1 changed aspect, so that understand the board structure of circuit 1 of the present embodiment indication further.Refer to shown in Fig. 4 to Fig. 6, it carrys out the correlation step of aid illustration board structure of circuit 1 manufacture method with the cross section of board structure of circuit 1 (be equivalent in Fig. 1 board structure of circuit 1 along the schematic diagram of B-B hatching line).
Moreover for ease of understanding, later each the graphic heat pipe 121 of Fig. 4 presents with monomer, no longer show its detail structure, that is, tubing 1211, capillary structure 1212 and working fluid 1213 no longer specially show and indicate, and are not easy to understand to avoid graphic entirety too complicated.
Step S101: as shown in Figure 4, by the several laminate materials 110 in order to pressing and forming plate 11, wherein part sheet material 110 leaves hole in advance in the position corresponded to each other.The sheet material 110 of those layers is after being stacked into described plate 11, and above-mentioned hole is interconnected and makes plate 11 be formed with the structure of described storage tank 114, and that is, the hole wall of described hole forms the sidewall of storage tank 114.Thereafter, heat pipe 121 is placed in the storage tank 114 of described plate 11.
Step S103: as shown in Figure 5, resin by injection 122 between heat pipe 121 and the storage tank 114 of plate 11, with to make between the storage tank 114 of heat pipe 121 and plate 11 fill up by resin 122.Thereafter, resin 122 is cooled to reach the effect getting rid of bubble in it.Then, in the process of high-temperature laminating board structure of circuit 1, apply pressure to the first plate face 111 of plate 11 and the second plate face 112 and heat pipe 121 with a pressing mold 200 simultaneously and be exposed to the first first type surface 1214 outside the first plate face 111, and hard pressed plate 11 will make part resin 122 flow out with heat pipe 121, and then described board structure of circuit 1 entirety is made not easily in the process of high-temperature laminating, to produce warpage.
Step S105: as shown in Figure 6, at the various circuit structures of the shaping acquiescence of board structure of circuit 1, as: at the first plate face 111 of board structure of circuit 1 or the line pattern of the second shaping acquiescence in plate face 112, or form perforation at board structure of circuit 1.By this, Fig. 6 present board structure of circuit 1 section be namely equivalent to the section of the board structure of circuit 1 in Fig. 1 along B-B hatching line.That is, board structure of circuit 1 shaping after implementation step S105, it can be applied to install heat generating member 2 and cooling piece 3.But board structure of circuit 1 also by processing further, and presents different enforcement kenels, following with Fig. 7 and Fig. 8 as an example, but be not limited to this.
Step S107: as shown in Figure 7, after completion of step s 105, in the second plate face 112 away from heat pipe 121, the position of its corresponding heat absorption end 121a is towards heat absorption end 121a second first type surface 1215 direction machine-shaping one groove 115, in other words, board structure of circuit 1 is formed with above-mentioned groove 115 between second first type surface 1215 and the second plate face 112 of plate 11 of the heat absorption end 121a of heat pipe 121, and the size of this groove 115 need make heat generating member 2 can put in the inner.
Wherein, the processing mode of foregoing circuit plate structure 1 groove 115 can be chemical etching or non-chemically etch (as: Laser drill, electric paste etching or milling machine), is not limited at this.Moreover board structure of circuit 1 shaping after implementation step S107, it can be applied to install heat generating member 2 and cooling piece 3.
Step S109: as shown in Figure 8, after completing steps S107, a conductor 123 is filled in the groove 115 of described board structure of circuit 1, above-mentioned conductor 123 refers in the present embodiment to be located in groove 115 by metal ion (as: copper ion) plating, forms solid prismatical structure according to this.That is, described heat-conducting piece 12 can have conductor 123 further.Similarly, board structure of circuit 1 shaping after implementation step S109, it can be applied to install heat generating member 2 and cooling piece 3.
A bit, each step described in the present embodiment, the order of step can be adjusted, in other words, the present embodiment is not limited with above-mentioned sequence of steps supplementary notes.For example, above-mentioned groove 115 can be formed in heat release end 121b by designer accordingly, or, the structure that board structure of circuit 1 is shaped to as shown in Figure 9 by suitably changing above-mentioned steps by designer.
Be more than the general description of the present embodiment board structure of circuit 1, followingly then will introduce the relativeness that board structure of circuit 1 corresponds to heat generating member 2 and cooling piece 3.Further, the structure presented with Fig. 1, Fig. 7 and Fig. 8 is respectively used as the relativeness explanation of board structure of circuit 1 and heat generating member 2, cooling piece 3 by board structure of circuit 1.And the something in common of the structure that Fig. 1, Fig. 7 and Fig. 8 present will no longer be repeated.
Refer to Fig. 1, Fig. 2 and Fig. 3, described heat generating member 2 and cooling piece 3 are connected to the heat-conducting piece 12 of board structure of circuit 1, and heat generating member 2 is by being such as the mode of routing and reaching electric connection with number transmission line 113 of board structure of circuit 1.Say further, described heat generating member 2 is connected to the heat pipe 121 end 121a that absorbs heat and is exposed to the first first type surface 1214 outside the first plate face 111, cooling piece 3 is then connected to heat pipe 121 heat release end 121b and is exposed to the first first type surface 1214 outside the first plate face 111, and is separated with a preset distance between heat generating member 2 and cooling piece 3.In more detail, described heat generating member 2 is together connected to the first plate face 111 of the first first type surface 1214 on the heat absorption end 121a of heat pipe 121 and other coplanar plate 11 thereof.And described cooling piece is together connected to the first plate face 111 of the first first type surface 1214 on the heat release end 121b of heat pipe 121 and other coplanar plate 11 thereof.
Should be noted that, about " abutting " mode of the heat generating member 2 described in the present embodiment, both cooling pieces 3 and heat pipe 121, can be directly be connected to heat pipe 121, or there is the inter-module grounding connection of gluing effect in heat pipe 121 by heat-conducting glue etc., do not limited at this.
Refer to Fig. 7, Figure 10 and Figure 12, described heat generating member 2 is embedded in the groove 115 of board structure of circuit 1 at least partly, and then the second first type surface 1215 be connected on the heat absorption end 121a of heat pipe 121, use the effect reaching and reduce described circuit board module 100 height.And heat generating member 2 is by being such as the mode of routing and reaching electric connection with the signal transmission line 113 of board structure of circuit 1.Cooling piece 3 is then connected to heat pipe 121 heat release end 121b and is exposed to the first first type surface 1214 outside the first plate face 111.
In addition, as shown in figure 13, board structure of circuit 1 also can in the position of the second corresponding heat release end, plate face 112 121b towards second another groove 115 ' of first type surface 1215 direction machine-shaping on the 121b of heat release end, and described cooling piece 3 is embedded in this groove 115 ' at least partly, and then be connected to the second first type surface 1215 on the heat release end 121b of heat pipe 121.Moreover storage tank 114 can design between the first plate face 111 and the second plate face 112, and to make the heat pipe 121 of heat-conducting piece 12 can be buried in plate 11.
Refer to Fig. 8 and Figure 14, described heat generating member 2 is connected to conductor 123, uses the thermal energy transfer that it produced by the conductor 123 heat absorption end 121a to heat pipe 121.And heat generating member 2 is by being such as the mode of routing and reaching electric connection with the signal transmission line 113 of board structure of circuit 1.
Must it is emphasised that, no matter be the board structure of circuit 1 of which kind of aspect of the present invention, it all has following characteristics (refer to Fig. 2 shown in): the working fluid 1213 that heat pipe 121 absorbs heat in the 121a of end is in liquid phase and flash to gas phase working fluid 1213b in order to absorb heat energy that heat generating member 2 produces, to make to produce partial high pressure in heat pipe 121, order about the spatial flow of gas phase working fluid 1213b inside capillary structure 1212 to heat release end 121b; Described gas phase working fluid 1213b can condense into liquid phase working fluid 1213a in heat release end 121b by the cooling of cooling piece 3, and is back to heat absorption end 121a along capillary structure 1212.
[the possible effect of the embodiment of the present invention]
In sum, the circuit board module of the phase change heat-conducting that the embodiment of the present invention provides, it has heat pipe by board structure of circuit is embedding, and the heat energy that heat generating member is produced can be delivered to cooling piece rapidly via heat pipe, and then promotes the radiating efficiency of board structure of circuit.
Moreover, connected the storage tank of heat pipe and plate by the resin not comprising glass fibre, to enable heat pipe stably be embedded in plate, and not easily make that board structure of circuit is whole produces warpage in the process of high-temperature laminating.
The foregoing is only better possible embodiments of the present invention, it is also not used to limit to the scope of the claims of the present invention, and all equalizations done according to the present patent application the scope of the claims change and modify, and all should belong to covering scope of the present invention.
[symbol description]
The circuit board module of 100 phase change heat-conductings
1 board structure of circuit
11 plates
110 sheet materials
111 first plate faces
112 second plate faces
113 signal transmission lines
114 storage tanks
115,115 ' groove
12 heat-conducting pieces
121 heat pipes
121a absorbs heat end
121b heat release end
1211 tubing
1212 capillary structures
1213 working fluids
1213a liquid phase working fluid
1213b gas phase working fluid
1214 first first type surfaces
1215 second first type surfaces
1216 ring sides
122 resins
123 conductors
2 heat generating members
3 cooling pieces
200 pressing molds
Claims (10)
1. a circuit board module for phase change heat-conducting, is characterized in that, comprising:
One board structure of circuit, comprises:
One plate, described plate has two plate faces and at least one signal transmission line, and described plate is formed with a storage tank; And
One heat-conducting piece, comprises:
The heat pipe of one closed, is provided with a working fluid in described heat pipe, described heat pipe to be arranged in described storage tank and not to stretch out the described two plate faces of described plate, leaves a space between described heat pipe and described storage tank; And
One resin not comprising glass fibre, the described space of described resin filling between described heat pipe and described storage tank, and described resin is roughly seamlessly connected in described heat pipe and described storage tank, and described heat pipe and described signal transmission line are in being electrically insulated from each other;
One heat generating member, described heat generating member is connected to the heat-conducting piece of described board structure of circuit, and the position that described heat pipe is adjacent to described heat generating member is defined as a heat absorption end; And
One cooling piece, described cooling piece is connected to the heat-conducting piece of described board structure of circuit, and the position that described heat pipe is adjacent to described cooling piece is defined as a heat release end;
Wherein, the working fluid in described heat absorption end is liquid phase and in order to absorb heat energy that described heat generating member produces and to flash to gas phase working fluid, to make to produce partial high pressure in described heat pipe, orders about described gas phase working fluid and flow to described heat release end; Described gas phase workflow physical efficiency condenses into liquid phase working fluid in described heat release end by the cooling of described cooling piece, and is back to described heat absorption end.
2. the circuit board module of phase change heat-conducting according to claim 1, wherein, described board structure of circuit is wherein formed with a groove between a plate face in the heat absorption end surface of described heat pipe and described plate, and described heat generating member is embedded in the heat absorption end being connected to described heat pipe in described groove at least partly.
3. the circuit board module of phase change heat-conducting according to claim 1, wherein, described board structure of circuit is wherein formed with a groove between a plate face in the heat absorption end surface of described heat pipe and described plate, described heat-conducting piece has a column conductor, described conductor is filled in described groove, and described euthermic chip is connected to described conductive post.
4. the circuit board module of phase change heat-conducting according to claim 1, wherein, the heat absorption end surface of described heat pipe is roughly roughly arranged in copline with a wherein plate face of described plate, and described heat generating member is together connected to the plate face of the heat absorption end surface of described heat pipe and the other coplanar plate of heat absorption end surface of described heat pipe.
5. the circuit board module of phase change heat-conducting according to claim 1, wherein, described plate is laminated plates, described storage tank between described two plate faces, and in the embedding described plate of described heat-conducting piece.
6. the circuit board module of phase change heat-conducting according to any one of claim 1 to 5, wherein, the heat release end surface of described heat pipe is roughly roughly arranged in copline with a wherein plate face of described plate, and described cooling piece is connected to the heat release end surface of described heat pipe.
7. a board structure of circuit, is characterized in that, comprising:
One plate, described plate has two plate faces and at least one signal transmission line, and described plate is formed with a storage tank; And
One heat-conducting piece, comprises:
The heat pipe of one closed, a working fluid is provided with in described heat pipe, described heat pipe to be arranged in described storage tank and not to stretch out the described two plate faces of described plate, leave a space, and the definition of described heat pipe has a heat absorption end and a heat release end between described heat pipe and described storage tank; And
One resin not comprising glass fibre, the described space of described resin filling between described heat pipe and described storage tank, and described resin is roughly seamlessly connected in described heat pipe and described storage tank, and described heat pipe and described signal transmission line are in being electrically insulated from each other;
Wherein, the working fluid in described heat absorption end is liquid phase and flashes to gas phase working fluid in order to absorb heat energy, to make to produce partial high pressure in described heat pipe, orders about described gas phase working fluid and flows to described heat release end; Described gas phase workflow physical efficiency is caught a cold but in described heat release end and condenses into liquid phase working fluid, and is back to described heat absorption end.
8. board structure of circuit according to claim 7, wherein, described board structure of circuit is wherein formed with a groove between a plate face in the heat absorption end surface of described heat pipe and described plate, and the heat release end surface of described heat pipe is roughly roughly arranged in copline with wherein another plate face of described plate.
9. board structure of circuit according to claim 7, wherein, the heat absorption end surface of described heat pipe is roughly roughly arranged in copline with a wherein plate face of described plate, and the heat release end surface of described heat pipe is roughly roughly arranged in copline with a wherein plate face of described plate.
10. the board structure of circuit according to any one of claim 7 to 9, wherein, described plate is laminated plates, described storage tank between described two plate faces, and in the embedding described plate of described heat-conducting piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410531062.5A CN105491785A (en) | 2014-10-10 | 2014-10-10 | Phase-change heat conduction circuit board module and circuit board structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410531062.5A CN105491785A (en) | 2014-10-10 | 2014-10-10 | Phase-change heat conduction circuit board module and circuit board structure thereof |
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| CN105491785A true CN105491785A (en) | 2016-04-13 |
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| CN201410531062.5A Pending CN105491785A (en) | 2014-10-10 | 2014-10-10 | Phase-change heat conduction circuit board module and circuit board structure thereof |
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| CN106061095A (en) * | 2016-06-24 | 2016-10-26 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board and preparation method thereof |
| CN108617081A (en) * | 2018-06-11 | 2018-10-02 | Oppo广东移动通信有限公司 | A kind of electronic device and a kind of circuit board assemblies |
| CN108777255A (en) * | 2018-06-11 | 2018-11-09 | Oppo广东移动通信有限公司 | A kind of radiating subassembly and electronic equipment |
| CN109714885A (en) * | 2019-02-26 | 2019-05-03 | 力普士科技（珠海）有限公司 | Composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof |
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
| CN110113867A (en) * | 2019-05-31 | 2019-08-09 | 维沃移动通信有限公司 | Radiator structure and mobile terminal |
| CN112512201A (en) * | 2020-11-24 | 2021-03-16 | 鹤山市世拓电子科技有限公司 | Printed circuit board with embedded phase change heat dissipation device |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106061095A (en) * | 2016-06-24 | 2016-10-26 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board and preparation method thereof |
| CN106061095B (en) * | 2016-06-24 | 2018-09-18 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board and preparation method thereof |
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
| CN108617081A (en) * | 2018-06-11 | 2018-10-02 | Oppo广东移动通信有限公司 | A kind of electronic device and a kind of circuit board assemblies |
| CN108777255A (en) * | 2018-06-11 | 2018-11-09 | Oppo广东移动通信有限公司 | A kind of radiating subassembly and electronic equipment |
| CN108617081B (en) * | 2018-06-11 | 2019-09-20 | Oppo广东移动通信有限公司 | A kind of electronic device and a kind of circuit board assemblies |
| CN109714885A (en) * | 2019-02-26 | 2019-05-03 | 力普士科技（珠海）有限公司 | Composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof |
| CN110113867A (en) * | 2019-05-31 | 2019-08-09 | 维沃移动通信有限公司 | Radiator structure and mobile terminal |
| CN112512201A (en) * | 2020-11-24 | 2021-03-16 | 鹤山市世拓电子科技有限公司 | Printed circuit board with embedded phase change heat dissipation device |
| CN112512201B (en) * | 2020-11-24 | 2022-07-05 | 鹤山市世拓电子科技有限公司 | Printed circuit board with embedded phase change heat dissipation device |
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