CN202565654U - Heat dissipation device and heat conduction structure thereof - Google Patents
Heat dissipation device and heat conduction structure thereof Download PDFInfo
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- CN202565654U CN202565654U CN2012201905322U CN201220190532U CN202565654U CN 202565654 U CN202565654 U CN 202565654U CN 2012201905322 U CN2012201905322 U CN 2012201905322U CN 201220190532 U CN201220190532 U CN 201220190532U CN 202565654 U CN202565654 U CN 202565654U
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- heat
- heat pipe
- evaporation ends
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Abstract
The utility model discloses a heat dissipation device and a heat conduction structure thereof. The heat dissipation device comprises the heat conduction structure connected to a heat conduction plate, wherein the heat conduction structure comprises a heat pipe of which two ends are closed; the heat pipe comprises two evaporation ends and a condensation section; the two evaporation ends are respectively positioned at the two closed ends of the heat pipe; the condensation section is positioned between the two evaporation ends; the heat pipe is bent, so that the two evaporation ends are adjacent to each other; and furthermore, the number of evaporation ends is increased, and the condensation distance of working fluid in the heat pipe is shortened, so that the heat dissipation efficiency is improved.
Description
Technical field
The utility model relates to a kind of heat abstractor, and particularly a kind of have two heat abstractors of the heat pipe of evaporation ends side by side.
Background technology
Its usefulness is increasingly high because the development of electronic apparatus drives that gesture is that volume is more and more littler, and in narrow space, how the great amount of heat energy that produces during the high-power die running discharges outside the electronic apparatus, is the problem that the designer often faces.
Therefore heat pipe often is applied in the cooling system of electronic apparatus, and it is the closed metal pipe that an inwall has capillary structure, the general end in contact pyrotoxin of heat pipe, and the other end then is provided with fin.Working fluid in the heat pipe flows to an other end of heat pipe after the wherein end heat absorption vaporization of heat pipe, through fin heat energy is dissipated in the surrounding air.Though insufficient space still can dispel the heat heat guiding structure to suitable position through heat pipe pyrotoxin is done direct force air heat radiation again.
The shortcoming that existing heat pipe exists is that the distance between the heat pipe two ends is oversize, makes the working fluid return time too of a specified duration, and the diffusing rate of heat radiation is still not satisfactory.
The utility model content
One purpose of the utility model is to provide a kind of heat pipe conductive structure that interior refrigerant can reflux fast.
For reaching above-mentioned purpose, the utility model provides a kind of conductive structure, and it comprises a heat pipe; Heat pipe system is the sealing two ends shape; Heat pipe comprises two evaporation ends and a condensation segment, and two evaporation ends lay respectively at the two ends of heat pipe sealing, and condensation segment is between two evaporation ends; Heat pipe is bending, and makes the adjacent setting of part and contact at least one pyrotoxin at least of two evaporation ends.
Preferably, aforesaid conductive structure also comprises a plurality of fins and is connected in condensation segment.
Preferably, aforesaid conductive structure, its heat pipe vertically is connected in series those fins.
Preferably, aforesaid conductive structure, its two evaporation ends are adjacent setting side by side at least at a pyrotoxin place.
Preferably, aforesaid conductive structure, its two evaporation ends are parallel adjacent side by side setting at this pyrotoxin place at least.
Another purpose of the utility model is to provide a kind of heat abstractor, and the refrigerant in its heat pipe can reflux fast.
For reaching above-mentioned purpose, the utility model also provides a kind of heat abstractor, and it comprises a conductive structure and a heat-conducting plate.Conductive structure comprises a plurality of heat pipes; Each heat pipe is the sealing two ends shape; Each heat pipe comprises two evaporation ends and a condensation segment respectively, and two evaporation ends lay respectively at the two ends of heat pipe sealing, and condensation segment is between two evaporation ends; Each heat pipe is bending, and makes the adjacent setting of part and contact at least one pyrotoxin at least of two evaporation ends.Heat-conducting plate links evaporation ends and pyrotoxin.
Preferably, aforesaid heat abstractor, its conductive structure also comprise a plurality of fins and are connected in condensation segment.
Preferably, aforesaid heat abstractor, its each heat pipe vertically is connected in series those fins.
Preferably, aforesaid heat abstractor, its two evaporation ends are adjacent setting side by side at least at a pyrotoxin place.
Preferably, aforesaid heat abstractor, its two evaporation ends are parallel adjacent side by side setting at this pyrotoxin place at least.
The heat abstractor of the utility model is arranged side by side through two evaporation ends that are positioned at hot tongue two ends and the backflow of refrigerant distance is reduced by half, and has effectively improved the long shortcoming of prior art refrigerant return time.
Below in conjunction with accompanying drawing and specific embodiment the utility model is described in detail, but not as the qualification to the utility model.
Description of drawings
The three-dimensional exploded view of the heat abstractor of Fig. 1 the utility model first embodiment;
The schematic perspective view of the heat abstractor of Fig. 2 the utility model first embodiment;
The working state schematic representation of the heat abstractor of Fig. 3 the utility model first embodiment;
Another aspect sketch map of the heat abstractor of Fig. 4 the utility model first embodiment;
The working state schematic representation of another aspect of the heat abstractor of Fig. 5 the utility model first embodiment;
The sketch map of the heat abstractor of Fig. 6 the utility model second embodiment.
Wherein, Reference numeral
100 conductive structures
110/120 heat pipe
111/112/121/122 evaporation ends
113/123 condensation segment
210/220/230/240 fin
300 heat-conducting plates
310/320/330/340 storage tank
400 circuit boards
410/420/430 chip
Embodiment
Below in conjunction with accompanying drawing the structural principle and the operation principle of the utility model are done concrete description:
Consult Fig. 1 and Fig. 2; First embodiment of the utility model provides a kind of heat abstractor; It is used for connecting a pyrotoxin so that the spontaneous thermal source guiding of heat energy is dissipated into surrounding air; Pyrotoxin is a cpu chip or display chip (the utility model is not limited thereto) for example, and the heat abstractor of the utility model comprises: a conductive structure 100 and a heat-conducting plate 300.Wherein, conductive structure 100 comprises at least one heat pipe 110/120 and a plurality of fin 210.
Each heat pipe 110/120 is processed for metal; Preferably heat pipe 110/120 is the crooked copper pipe of sealing two ends; But the utility model does not limit the material of heat pipe 110/120; Refrigerant or other lower boiling working fluids are filled in the inside of heat pipe 110/120, absorb heat energy through the spontaneous thermal source of the phase change of working fluid, and flowing the heat energy band from pyrotoxin through working fluid.In present embodiment, each heat pipe 110 (120) is preferably crooked and be enclosed to form a rectangle (the utility model is not limited to its shape that encloses), and it comprises two evaporation ends 111/112 (121/122) and a condensation segment 113 (123).Two evaporation ends 111/112 (121/122) lay respectively at the two ends of heat pipe 110 (120) sealings; Heat pipe 110 (120) bendings make 111/112 (121/122) the adjacent setting of two evaporation ends; Two evaporation ends, 111/112 (121/122) parallel being arranged side by side, condensation segment 113 (123) then is positioned between two evaporation ends 111/112 (121/122).
In present embodiment, the heat abstractor of the utility model preferably comprises two heat pipes 110/120.Two heat pipes 110/120 are all crooked and be enclosed to form rectangle, and two heat pipe 110/120 isoplanars are provided with (the utility model is not limited thereto), and the rectangle that encloses of one of them heat pipe 120 is compassingly set at the periphery of the rectangle that another heat pipe 110 encloses.Four evaporation ends, 111/112/121/122 parallel being arranged side by side of two heat pipes 110/120, four evaporation ends 111/112/121/122 are linked to heat-conducting plate 300.
Each fin 210 is a sheet metal, preferably for copper (the utility model is not limited thereto), and settings that be arranged in parallel of a plurality of fins 210, each heat pipe 110/120 vertically is connected in series many fins 210, makes each fin 210 link each condensation segment 113/123 respectively.The function of fin 210 be with the steam state refrigerant in the heat pipe 110/120 with heat energy be dissipated in the surrounding air.
Heat-conducting plate 300 is a metal plate, and it preferably is a copper, but the utility model does not limit its material, and heat-conducting plate 300 covers at least one pyrotoxin of contact.Preferably the number of corresponding evaporation ends 111/112/121/122 offers a plurality of parallel storage tanks arranged side by side 310/320/330/340 on the heat-conducting plate 300, and aforesaid each evaporation ends 111/112/121/122 is placed in respectively in the corresponding storage tank 310/320/330/340 and is linked to heat-conducting plate 300.
Consult Fig. 3, heat-conducting plate 300 is arranged on the circuit board 400, and circuit board 400 is provided with three chips 410/420/430 (the utility model is not limited thereto), and heat-conducting plate 300 covers these three chips 410/420/430 and is provided with.When 410/420/430 running of three chips; The heat energy that it produced diffuses to whole heat-conducting plate 300; Four evaporation ends 111/112/121/122 are by heat-conducting plate 300 heating; Be positioned at the refrigerant heat absorption back vaporization of two evaporation ends 111/112 (121/122) of each heat pipe 110 (120), and flow to condensation segment 113 (123) directions of each heat pipe 110 (120).When the steam state refrigerant in each heat pipe 110 (120) flows to the condensation segment 113 (123) of heat pipe 110 (120) under it; Going up set fin 210 through condensation segment 113 (123) is dissipated into the heat energy that refrigerant absorbed in the surrounding air; Just revert to liquid state after the refrigerant heat release cooling and in the two ends of heat pipe 110 (120) are back to each evaporation ends 111/112 (121/122), vaporize to absorb heat once more.
Consult another aspect that fin 210 is provided with in Fig. 4 and the utility model shown in Figure 5; All can be used as condensation segment 113 (123) in the utility model between 110 (120) two evaporation ends 111/112 (121/122) of heat pipe uses; Fin 210 can be arranged at the optional position of condensation segment 113/123, is not limited to the stage casing part of heat pipe 110/120.Heat pipe 110/120 major function is a transporting heat energy; And the major function of fin 210 is for to be dissipated into heat energy in the atmosphere; Therefore can in condensation segment 113/123, fin 220 be set near the increase of evaporation ends 111/112/121/122 place; Make the steam state refrigerant can carry out heat release ahead of time, and shorten the distance of simple heat energy transmission.
The utility model does not limit the number that is provided with of heat pipe 110/120 and fin 210/220, can dispose different heat pipes 110/120 number and required corresponding fin 210/220 number according to the heating power difference of pyrotoxin.
Consult Fig. 6; Second embodiment of the utility model provides a kind of heat abstractor; It is used for connecting a pyrotoxin so that the spontaneous thermal source guiding of heat energy is dissipated into surrounding air; Pyrotoxin is a cpu chip or display chip (the utility model is not limited thereto) for example, and the heat abstractor of the utility model comprises: a conductive structure 100 and a heat-conducting plate 300.Wherein, conductive structure 100 comprises at least one heat pipe 110/120 and a plurality of fin 210.Its structure is roughly as aforementioned first embodiment.
The present embodiment and the first embodiment difference be, each heat pipe 110 (120) is preferably crooked and be enclosed to form a rectangle (the utility model is not limited to its shape that encloses), and it comprises two evaporation ends 111/112 (121/122) and a condensation segment 113 (123).Two evaporation ends 111/112 (121/122) lay respectively at the two ends of heat pipe 110 (120) sealings; Heat pipe 110 (120) bendings make 111/112 (121/122) the adjacent setting of two evaporation ends, and condensation segment 113 (123) then is positioned between two evaporation ends 111/112 (121/122).
Heat-conducting plate 300 is arranged on the circuit board 400, and circuit board 400 is provided with three pyrotoxins, and in present embodiment, pyrotoxin is chip 410/420/430 (the utility model is not limited thereto), and heat-conducting plate 300 covers these three chips 410/420/430 and is provided with.Four evaporation ends 111/112/121/122 are linked to heat-conducting plate 300; And adjacent setting; Wherein chip 410 place are for being arranged side by side therein for two of a heat pipe 110 evaporation ends 111/112, but one of them evaporation ends 111 is crooked and further extend to another chip 420 places.Chip 410 place are for being arranged side by side therein for two evaporation ends 121/122 of another heat pipe 120, but (may extend to heat-conducting plate 300 outer thermal contact conductance plate 300 outer unlapped other pyrotoxins that are used for) extended in one of them evaporation ends 122 crooked back.
Owing to evaporation ends 111 bending extensions contact two chips 410/420, therefore preferably, fin 210/220/230/240 number that on condensation segment 113/123, is provided with in the present embodiment increases the pyrotoxin number of contact also more than first embodiment with correspondence.
Compared to the prior art steam state refrigerant whole heat pipe of need flowing through, through the structure of the utility model, the distance that the steam state refrigerant flows can reduce half the, so the return time of refrigerant also reduces half thely, makes the big spoke of heat transfer efficiency increase.
Certainly; The utility model also can have other various embodiments; Under the situation that does not deviate from the utility model spirit and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.
Claims (10)
1. a conductive structure is characterized in that, comprises:
One heat pipe; This heat pipe is the sealing two ends shape; This heat pipe comprises two evaporation ends and a condensation segment, and this two evaporation ends lays respectively at the two ends of this heat pipe sealing, and this condensation segment is between this two evaporation ends; This heat pipe is bending, and makes the adjacent setting of part and contact at least one pyrotoxin at least of this two evaporation ends.
2. conductive structure according to claim 1 is characterized in that, also comprises a plurality of fins, is connected in this condensation segment.
3. conductive structure according to claim 2 is characterized in that this heat pipe vertically is connected in series those fins.
4. conductive structure according to claim 1 is characterized in that, this two evaporation ends is adjacent setting side by side at this pyrotoxin place at least.
5. conductive structure according to claim 1 is characterized in that, this two evaporation ends is parallel adjacent side by side setting at this pyrotoxin place at least.
6. a heat abstractor is characterized in that, comprises:
One conductive structure; This conductive structure comprises a plurality of heat pipes, and respectively this heat pipe is the sealing two ends shape, and respectively this heat pipe comprises two evaporation ends and a condensation segment respectively; This two evaporation ends lays respectively at the two ends of this heat pipe sealing; This condensation segment is between this two evaporation ends, and respectively this heat pipe is bending, and makes the adjacent setting of part and contact at least one pyrotoxin at least of this two evaporation ends; And
One heat-conducting plate links this evaporation ends and this pyrotoxin.
7. heat abstractor according to claim 6 is characterized in that this conductive structure also comprises a plurality of fins, is connected in this condensation segment.
8. heat abstractor according to claim 7 is characterized in that respectively this heat pipe vertically is connected in series those fins.
9. heat abstractor according to claim 6 is characterized in that, this two evaporation ends is adjacent setting side by side at this pyrotoxin place at least.
10. heat abstractor according to claim 6 is characterized in that, this two evaporation ends is parallel adjacent side by side setting at this pyrotoxin place at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201905322U CN202565654U (en) | 2012-04-28 | 2012-04-28 | Heat dissipation device and heat conduction structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201905322U CN202565654U (en) | 2012-04-28 | 2012-04-28 | Heat dissipation device and heat conduction structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202565654U true CN202565654U (en) | 2012-11-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201905322U Expired - Lifetime CN202565654U (en) | 2012-04-28 | 2012-04-28 | Heat dissipation device and heat conduction structure thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN202565654U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110730559A (en) * | 2019-09-25 | 2020-01-24 | 北京比特大陆科技有限公司 | PCB heat dissipation assembly and server with same |
| CN111867320A (en) * | 2019-04-29 | 2020-10-30 | 昆山广兴电子有限公司 | Heat radiation module |
-
2012
- 2012-04-28 CN CN2012201905322U patent/CN202565654U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867320A (en) * | 2019-04-29 | 2020-10-30 | 昆山广兴电子有限公司 | Heat radiation module |
| CN110730559A (en) * | 2019-09-25 | 2020-01-24 | 北京比特大陆科技有限公司 | PCB heat dissipation assembly and server with same |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121128 |