CN110730559A

CN110730559A - PCB heat dissipation assembly and server with same

Info

Publication number: CN110730559A
Application number: CN201910912667.1A
Authority: CN
Inventors: 胡航空
Original assignee: Beijing Bitmain Technology Co Ltd
Current assignee: Bitmain Technologies Inc; Beijing Bitmain Technology Co Ltd
Priority date: 2019-09-25
Filing date: 2019-09-25
Publication date: 2020-01-24

Abstract

The invention discloses a PCB heat radiation component and a server with the same, wherein the PCB heat radiation component comprises: the PCB comprises a PCB board, wherein at least two chips which are connected in series for power supply are arranged on the surface of one side of the PCB board; heat abstractor, heat abstractor includes heat-conducting plate and flat pipe, the first surface subsides of heat-conducting plate are established at least two the surface of chip, the second of heat-conducting plate is equipped with on the surface and holds the slot part, hold the slot part with the chip is relative, a side surface of flat pipe with hold the diapire contact in the slot part. According to the PCB heat dissipation assembly, the heat conduction plate can separate the PCB from the flat tube, so that the phenomenon that the flat tube deforms towards the direction of the chip to damage the chip when the pressure of a liquid cooling medium entering the flat tube is too high under the condition that the flat tube is in direct contact with the chip can be effectively prevented, and the normal work of the chip is ensured. Moreover, the contact area between the flat tube and the heat conducting plate is increased, so that the heat dissipation efficiency of the PCB heat dissipation assembly is improved.

Description

PCB heat dissipation assembly and server with same

Technical Field

The invention relates to the technical field of PCB heat dissipation, in particular to a PCB heat dissipation assembly and a server with the same.

Background

A plurality of electronic components connected to a PCB (Printed Circuit Board, also called Printed Circuit Board, is an important electronic component, is a support for the electronic components, and is a carrier for electrical connection of the electronic components) Board generate heat during operation, and in order to discharge the heat in time, a heat sink is usually disposed on the PCB Board for heat dissipation, wherein the liquid cooling heat sink has a stronger heat dissipation capability compared with a conventional air cooling heat sink.

In the related art, the processing methods of the liquid cooling plate in the liquid cooling radiator generally include the following two methods:

firstly, an upper metal cover plate and a lower metal cover plate are adopted, at least one metal cover plate is carved or punched to form a groove, and then the two metal cover plates are connected by welding or using a screw and a sealing ring to enable the groove to form a closed cooling flow channel;

secondly, the metal pipe is embedded into a channel formed in advance on the cover plate, and then the heat dissipation cold plate is formed through welding or crimping and the like.

However, the two liquid cooling plates are complex in processing mode, and can be produced only by opening the die, so that the processing cost is high.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, an object of the present invention is to provide a PCB heat dissipation assembly, which has a simple structure, low cost and high heat dissipation efficiency.

Another object of the present invention is to provide a server having the PCB heat dissipation assembly.

According to the PCB heat dissipation assembly of the embodiment of the first aspect of the invention, the PCB heat dissipation assembly comprises: the PCB comprises a PCB board, wherein at least two chips which are connected in series for power supply are arranged on the surface of one side of the PCB board; heat abstractor, heat abstractor includes heat-conducting plate and flat pipe, the first surface subsides of heat-conducting plate are established at least two the surface of chip, the second of heat-conducting plate is equipped with on the surface and holds the slot part, hold the slot part with the chip is relative, a side surface of flat pipe with hold the diapire contact in the slot part.

According to the PCB heat dissipation assembly provided by the embodiment of the invention, the first surface of the heat conduction plate is attached to the surfaces of at least two chips which are connected in series and supply power, and the accommodating groove part which is opposite to the chips is arranged on the second surface of the heat conduction plate, so that the heat conduction plate can separate the PCB from the flat pipe, the phenomenon that the flat pipe deforms towards the direction of the chips to damage the chips when the pressure of a liquid cooling medium entering the flat pipe is too high under the condition that the flat pipe is in direct contact with the chips can be effectively prevented, and the normal work of the chips is ensured. Moreover, through the contact of a side surface of the flat pipe and the bottom wall in the containing groove part, the heat exchange path between the chip and the flat pipe is short, heat generated during the operation of the chip can be fully conducted to the flat pipe through the containing groove part, the contact area between the flat pipe and the heat conducting plate is increased, and therefore the heat dissipation efficiency of the PCB heat dissipation assembly is improved. In addition, the heat conducting plate has a simple structure, and the workload and the process steps in the process of forming the flow channel are reduced, so that the production cost of the whole PCB heat dissipation assembly is reduced.

According to some embodiments of the present invention, the side surface of the flat tube contacts with the side wall in the accommodating groove portion, the flat tube includes a plurality of parallel tube segments arranged in parallel and sequentially communicated, the heat conducting plate is provided with a plurality of accommodating groove portions arranged in parallel and used for accommodating the plurality of parallel tube segments, and two side walls adjacent to each other of two adjacent accommodating groove portions gradually approach each other along a direction away from the chip.

According to some embodiments of the invention, the free ends of two side walls adjacent to each other of two adjacent receiving groove portions are connected by a connecting section having a width smaller than that of the bottom of the receiving groove portion.

According to some embodiments of the invention, the other side surface of the flat tube is flush with the surface of the connecting section.

According to some embodiments of the invention, each of the accommodation groove portions has a cross-sectional shape of an isosceles trapezoid.

According to some embodiments of the invention, a width of a bottom of the housing groove portion is equal to or greater than a width of the chip in a lateral direction of the housing groove portion.

According to some embodiments of the present invention, heat conductive materials are respectively filled between the flat tubes and the inner walls of the accommodating groove portions, and between the heat conductive plate and the chip.

According to some embodiments of the invention, the thermally conductive material is a thermally conductive gel or a thermally conductive silicone grease.

According to some embodiments of the invention, one of the heat-conducting plate and the PCB board is provided with a plurality of studs or nuts to connect with the other of the heat-conducting plate and the PCB board.

According to some embodiments of the invention, the thermally conductive plate is a metal plate.

A server according to an embodiment of the second aspect of the present invention comprises a PCB heat sink assembly according to the above-described embodiment of the first aspect of the present invention.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a perspective view of a PCB heat sink assembly according to an embodiment of the present invention;

FIG. 2 is an exploded view of the PCB heat sink assembly shown in FIG. 1;

fig. 3 is a cross-sectional view of the PCB heat sink assembly shown in fig. 1.

Reference numerals:

100: a PCB heat dissipation assembly;

1: a PCB board; 11: a chip;

2: a heat sink; 21: a heat conducting plate;

211: an accommodation groove portion; 212: a connecting section;

213: a first surface of the heat-conducting plate; 214: a second surface of the thermally conductive plate;

22: flat tubes; 221: parallel tube sections.

Detailed Description

Embodiments of the present invention will be described in detail below, the embodiments described with reference to the drawings being illustrative, and the embodiments of the present invention will be described in detail below.

A PCB heat sink assembly 100 according to an embodiment of the first aspect of the present invention is described below with reference to fig. 1-3.

As shown in fig. 1 to 3, a PCB heat dissipation assembly 100 according to an embodiment of the first aspect of the present invention includes a PCB board 1 and a heat dissipation device 2.

Specifically, at least two chips 11 powered in series are disposed on one surface (for example, the upper side in fig. 2) of the PCB 1, and the specifications and functions of the chips 11 are the same, and are both used for data calculation, which may be further referred to as a calculation chip.

The heat dissipation device 2 includes a heat conduction plate 21 and flat tubes 22, a first surface 213 of the heat conduction plate 21 is attached to the surfaces of the at least two chips 11, a second surface 214 opposite to the first surface 213 of the heat conduction plate 21 is provided with a receiving groove portion 211, the receiving groove portion 211 is opposite to the chip 11, and a surface of one side (e.g., a lower side in fig. 1) of the flat tube 22 is in contact with a bottom wall in the receiving groove portion 211. The PCB board 1 and the flat tubes 22 are separated by a heat conductive plate 21. Here, it should be noted that the direction "inside" can be understood as a direction toward the center of the accommodation groove portion 211, and the opposite direction thereof is defined as "outside", i.e., a direction away from the center of the accommodation groove portion 211.

For example, in the example of fig. 1 to 3, a plurality of chips 11 are disposed on the upper surface of the PCB board 1, the plurality of chips 11 may be arranged in an array on the PCB board 1, and the chips 11 may be connected in series to each other to cooperate with each other. The first surface 213 of the heat conducting plate 21 is attached to the upper surface of each chip 11, so that heat generated during operation of the chip 11 can be directly and fully conducted to the heat conducting plate 21, the accommodating groove 211 is disposed on the second surface 214 of the heat conducting plate 21, the accommodating groove 211 is vertically opposite to the chip 11, the flat tube 22 is accommodated in the accommodating groove 211, the lower surface of the flat tube 22 is in contact with the bottom wall in the accommodating groove 211, so that heat generated during operation of the chip 11 can be fully conducted to the flat tube 22 through the accommodating groove 211, and a liquid cooling medium (such as water and the like) in the flat tube 22 can absorb and discharge the heat, so as to reduce the temperature of the chip 11 on the PCB 1, thereby ensuring that the chip 11 can stably and normally operate for a long time.

From this, through set up on heat-conducting plate 21 and hold slot part 211 and make a side surface of flat pipe 22 and the diapire contact that holds in the slot part 211, heat-conducting plate 21 separates PCB board 1 and flat pipe 22, thereby can prevent effectively that under flat pipe 22 and the condition of chip 11 direct contact, when the liquid cooling medium pressure that enters into in flat pipe 22 was too big, flat pipe 22 warp towards the direction of chip 11, and then the phenomenon that the chip 11 was damaged to appear, the normal work of chip 11 has been guaranteed. Moreover, since the flat tubes 22 are in direct contact with the inner wall surface (i.e., the above-mentioned bottom wall) of the heat conductive plate 21 adjacent to the chip 11, the heat exchange path between the chip 11 and the flat tubes 22 is short, thereby improving the heat dissipation efficiency of the PCB heat dissipation assembly 100. Moreover, the heat conducting plate 21 thus arranged has a simple processing technology and a low molding difficulty, reduces the requirement of adding specific molds for different heat conducting plates 21, and reduces the workload and process steps in the process of forming the flow channel, thereby reducing the production cost of the whole PCB heat dissipation assembly 100.

According to the PCB heat sink assembly 100 of the embodiment of the present invention, the first surface 213 of the heat conducting plate 21 is attached to the surfaces of at least two chips 11 of the PCB 1, which are powered in series, and the accommodating groove 211 opposite to the chip 11 is disposed on the second surface 214 of the heat conducting plate 21, so that the heat conducting plate 21 can separate the PCB 1 from the flat tube 22, thereby effectively preventing the phenomenon that the flat tube 22 deforms toward the chip 11 to damage the chip 11 when the pressure of the liquid cooling medium entering the flat tube 22 is too high under the condition that the flat tube 22 is in direct contact with the chip 11, and ensuring the normal operation of the chip 11. Moreover, through making a side surface of flat pipe 22 and the contact of the diapire in the groove portion 211 holds, make the heat transfer route between chip 11 and the flat pipe 22 short, the heat that chip 11 during operation produced can fully conduct to flat pipe 22 through holding the groove portion 211, and has increased the area of contact of flat pipe 22 with heat-conducting plate 21 to the radiating efficiency of PCB radiator unit 100 has been improved. In addition, the heat conductive plate 21 has a simple structure, and reduces the workload and process steps in forming the flow channel, thereby reducing the production cost of the entire PCB heat dissipation assembly 100.

In some embodiments of the present invention, as shown in fig. 1 to 3, the side surface of the flat tube 22 is in contact with the side wall in the accommodating groove portion 211 or the side surface of the flat tube 22 is in contact with the side wall in the accommodating groove portion 211 through filled solder or a heat conductive material, the flat tube 22 includes a plurality of parallel tube sections 221 arranged in parallel and sequentially communicated, the heat conducting plate 21 is provided with a plurality of accommodating groove portions 211 for accommodating the plurality of parallel tube sections 221 and arranged in parallel with each other, and two side walls adjacent to each other of two adjacent accommodating groove portions 211 are gradually close to each other in a direction away from the chip 11. In the description of the present invention, "a plurality" means two or more.

For example, in the example of fig. 1 to 3, the flat tube 22 is accommodated in the accommodation groove portion 211, the bottom wall in the accommodation groove portion 211 contacts the lower surface of the flat tube 22, and the side wall in the accommodation groove portion 211 contacts the side surface of the flat tube 22, the flat tube 22 includes eight parallel tube segments 221, the eight parallel tube segments 221 are arranged in parallel and sequentially communicate, accordingly, eight accommodation groove portions 211 are provided on the heat conduction plate 21 in parallel with each other, one parallel tube segment 221 is accommodated in each accommodation groove portion 211, and two side walls adjacent to each other of two adjacent accommodation groove portions 211 are gradually close to each other from bottom to top. Accordingly, the side surfaces of the flat tubes 22 are brought into contact with the side walls in the accommodation groove portions 211, so that the contact area between the heat conduction plate 21 and the flat tubes 22 is further increased, and the heat radiation efficiency of the heat radiation device 2 can be improved. Moreover, in the actual use process, there is a large temperature difference between the eight parallel tube segments 221 from the water inlet to the water outlet, and by making the two side walls, adjacent to each other, of the two adjacent accommodating groove portions 211 gradually approach each other in the direction away from the chip 11, the heat conduction path of the flat tube 22 between the two adjacent parallel tube segments 221 is shortened, so that the temperature uniformity of the whole flat tube 22 is improved.

While eight parallel tube segments 221 and eight receiving slot portions 211 are shown in fig. 1-3 for illustrative purposes, it will be apparent to one of ordinary skill in the art after reading the teachings herein that the teachings herein can be applied to other numbers of parallel tube segments 221 and receiving slot portions 211 while remaining within the scope of the present invention.

Alternatively, the flat tubes 22 may be integrally bent into an S-shape. Therefore, the processing is simple and the cost is low. Further, the flat pipe 22 can be obtained by flattening standard metal pipelines, so that the universality of the flat pipe 22 can be further improved, and the cost is saved.

Further, referring to fig. 1 to 3, the free ends (e.g., upper ends in fig. 1) of two side walls adjacent to each other of two adjacent receiving groove portions 211 are connected by a connecting section 212, and the width of the connecting section 212 is smaller than that of the bottom of the receiving groove portion 211. Therefore, the heat conduction path of the flat tube 22 can be further shortened, and the temperature uniformity among the plurality of parallel tube sections 221 can be further improved.

Further, as shown in fig. 1 and 3, the other side (e.g., upper side in fig. 1) surface of the flat tube 22 is flush with the surface of the connection section 212. Specifically, referring to fig. 3 in combination with fig. 1, the lower surface of the flat tube 22 contacts the bottom wall in the accommodating groove portion 211, the upper surface of the flat tube 22 and the surface of the connecting section 212 are located in the same horizontal plane, and the thickness dimension of the flat tube 22 is consistent with the height dimension of the accommodating groove portion 211, so that the structure of the heat sink 2 is simpler and more compact while the contact area between the flat tube 22 and the accommodating groove portion 211 is ensured to be sufficiently large.

Alternatively, as shown in fig. 1 to 3, it is preferable that the cross-sectional shape of each accommodation groove portion 211 is an isosceles trapezoid, but the cross-sectional shape may be a common shape such as a rectangle. From this, the side of parallel pipe section 221 and two lateral walls that hold in the slot part 211 can all fully contact and area of contact the same, have improved the radiating efficiency of whole PCB radiator unit 100, and the slot part 211 that holds that so sets up can increase the structural strength and the plane degree of heat-conducting plate 21. In addition, the flat tube 22 can be easily put into the accommodation groove portion 211.

In some embodiments of the present invention, referring to fig. 3 in combination with fig. 1 and 2, the width of the bottom of the accommodating groove portion 211 is equal to or greater than the width of the chip 11 in the lateral direction of the accommodating groove portion 211. For example, in the example of fig. 1-3, eight rows of chips 11 are disposed on the PCB board 1, correspondingly, eight accommodating groove portions 211 are disposed on the heat conducting plate 21, the bottom portions of the eight accommodating groove portions 211 are respectively attached to the eight rows of chips 11, the width of the chips 11 in each row in the transverse direction of the accommodating groove portion 211 is smaller than the width of the bottom portion of the corresponding accommodating groove portion 211, and at this time, the chips 11 on the PCB board 1 can be completely covered by the heat conducting plate 21. Therefore, the heat generated by the chip 11 in the working process can be fully conducted to the heat conducting plate 21, so that the heat radiating efficiency of the heat radiating device 2 is further improved, the heat conducting plate 21 can be conveniently assembled on the PCB 1, and the assembling efficiency is high. Of course, the width of the bottom of the accommodation groove portion 211 may also be equal to the width of the chip 11 in the lateral direction of the accommodation groove portion 211 (not shown), and the heat dissipation efficiency of the heat dissipation device 2 may also be further improved.

Optionally, heat conduction materials are respectively filled between the flat tubes 22 and the inner wall of the accommodating groove portion 211 and between the heat conduction plate 21 and the chip 11. From this, the heat conduction material can fill between flat pipe 22 and the inner wall that holds slot part 211, and the clearance between heat-conducting plate 21 and the chip 11, increase between flat pipe 22 and the inner wall that holds slot part 211, area of contact between heat-conducting plate 21 and the chip 11, air resistance has been reduced, thereby make heat-conducting plate 21 can more fully and conduct the heat that chip 11 produced to flat pipe 22 fast, and then further improved whole PCB heat dissipation component 100's radiating efficiency, and the temperature uniformity between a plurality of parallel pipe section 221.

Further alternatively, the thermally conductive material may be a thermally conductive gel or a thermally conductive silicone grease. Therefore, the heat conducting gel or the heat conducting silicone grease has good heat conducting performance, high temperature resistance and low cost, so that the cost is reduced while the whole PCB heat dissipation assembly 100 has high heat dissipation efficiency. But is not limited thereto.

In some embodiments of the present invention, one of the heat conductive plate 21 and the PCB board 1 is provided with a plurality of studs or nuts to connect with the other of the heat conductive plate 21 and the PCB board 1. That is, a plurality of studs or nuts may be provided on the heat conductive plate 21 to be connected with the PCB board 1, or a plurality of studs or nuts may be provided on the PCB board 1 to be connected with the heat conductive plate 21. For example, a stud or a nut may be press-fitted to the PCB board 1 or the heat conductive plate 21 in advance. Therefore, the structure is simple, the heat conducting plate 21 and the PCB 1 can be firmly connected, good contact between the heat conducting plate 21 and the chip 11 on the PCB 1 is ensured, and the heat dissipation efficiency of the PCB heat dissipation assembly 100 is improved. Moreover, the heat conducting plate 21 and the PCB 1 are convenient to assemble and disassemble.

In some embodiments of the present invention, the thermally conductive plate 21 is a metal plate. For example, the heat conductive plate 21 may be an aluminum plate, an aluminum alloy plate, a copper plate, or the like. But is not limited thereto. Therefore, the heat conducting plate 21 has good heat conducting performance, heat generated by the chip 11 can be timely led out, and the heat radiating efficiency of the PCB heat radiating assembly 100 is ensured.

Alternatively, the flat tubes 22 and the receiving groove portions 211 of the heat conductive plate 21 may be welded. Therefore, the flat tube 22 and the heat conducting plate 21 can be firmly connected, and the cost is low.

Optionally, two ends of the flat tube 22 are respectively provided with a joint. For example, the connectors may be sealed and connected to the two ends of the flat tubes 22 by welding or the like. The free end of the connector can be standard thread or adopt other quick-plug sealing modes to facilitate the connection with a pipeline or a standard connector, so that the disassembly and the maintenance of the external hose are facilitated. But is not limited thereto.

A server (not shown) according to an embodiment of the second aspect of the present invention includes the PCB heat sink assembly 100 according to the above-described embodiment of the first aspect of the present invention.

According to the server provided by the embodiment of the invention, by adopting the PCB heat dissipation assembly 100, the overall heat dissipation performance of the server is more excellent, and the cost of the server is reduced.

Other constructions and operations of servers according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

In the description of the present invention, "the first feature" and "the second feature" may include one or more of the features.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A PCB heat dissipation assembly, comprising:

the PCB comprises a PCB board, wherein at least two chips which are connected in series for power supply are arranged on the surface of one side of the PCB board;

heat abstractor, heat abstractor includes heat-conducting plate and flat pipe, the first surface subsides of heat-conducting plate are established at least two the surface of chip, the second of heat-conducting plate is equipped with on the surface and holds the slot part, hold the slot part with the chip is relative, a side surface of flat pipe with hold the diapire contact in the slot part.

2. The PCB heat dissipation assembly of claim 1, wherein side surfaces of the flat tubes are in contact with side walls in the receiving groove portion,

the flat pipe comprises a plurality of parallel pipe sections which are arranged in parallel and are sequentially communicated,

the heat conducting plate is provided with a plurality of parallel pipe sections which are parallel to each other, and the two adjacent side walls of the two adjacent accommodating groove parts are gradually close to each other along the direction far away from the chip.

3. The PCB heat dissipation assembly of claim 2, wherein the free ends of two adjacent side walls of two adjacent receiving groove portions are connected by a connecting section, and the width of the connecting section is smaller than the width of the bottom of the receiving groove portion.

4. The PCB heat dissipation assembly of claim 3, wherein another side surface of the flat tube is flush with a surface of the connection section.

5. The PCB heat sink assembly of claim 2, wherein each of the receiving groove portions has an isosceles trapezoid cross-sectional shape.

6. The PCB heat dissipation assembly of claim 1, wherein a width of the bottom of the receiving slot portion is greater than or equal to a width of the chip in a lateral direction of the receiving slot portion.

7. The PCB heat sink assembly of any one of claims 1-6, wherein heat conductive materials are respectively filled between the flat tubes and the inner wall of the receiving slot portion, and between the heat conductive plate and the chip.

8. The PCB heat sink assembly of claim 7, wherein the thermally conductive material is a thermally conductive gel or a thermally conductive silicone grease.

9. The PCB heatsink assembly of claim 1, wherein one of the thermal plate and the PCB is provided with a plurality of studs or nuts to connect with the other of the thermal plate and the PCB.

10. The PCB heat sink assembly of claim 1, wherein the thermally conductive plate is a metal plate.

11. A server, comprising a PCB heat sink assembly according to any of claims 1-10.