CN211236817U - CPU radiator capable of radiating for multiple times - Google Patents

Abstract

The utility model discloses a CPU radiator capable of radiating for multiple times, which comprises a base, a first radiator component, a second radiator component, a first heat pipe component, a second heat pipe component and an air cooling mechanism; the first heat sink assembly and the second heat sink assembly are sequentially arranged on the same surface of the base; the first heat conduction pipe assembly is inserted in the first heat sink assembly, one end of the second heat conduction pipe assembly is inserted in the first heat sink assembly, and the other end of the second heat conduction pipe assembly is inserted in the second heat sink assembly; the air cooling mechanism is arranged above the heat sink assembly. The utility model discloses rational in infrastructure, improved radiating efficiency and radiating effect greatly, can in time dispel the heat to CPU effectively, can satisfy CPU's heat dissipation requirement, guarantee CPU's steady operation.

Description

CPU radiator capable of radiating for multiple times

Technical Field

The utility model relates to a CPU heat dissipation equipment field, in particular to can be radiating CPU radiator many times.

Background

The CPU is an ultra-large scale integrated circuit, is an operation core and a control core in a computer, and plays an indispensable role in the computer. However, the CPU generates a large amount of heat during operation, and the heat generated by the CPU needs to be dissipated in time, otherwise the CPU may be halted or burned. At this time, the CPU heat sink is required to dissipate heat of the CPU, and plays an important role in stable operation of the CPU.

The traditional heat dissipation is mostly realized only by heat dissipation modes such as fan heat dissipation or water cooling heat dissipation, the heat dissipation efficiency of the heat dissipation modes is low, the heat dissipation effect is poor, and heat generated by a CPU cannot be dissipated in time.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem to the defect that exists among the above-mentioned prior art, provide a CPU radiator that can dispel the heat many times to solve the problem that proposes among the above-mentioned background art.

In order to solve the technical problem, the technical scheme adopted by the utility model is that the CPU radiator capable of radiating for multiple times comprises a base, a first radiator component, a second radiator component, a first heat conducting pipe component, a second heat conducting pipe component and an air cooling mechanism; the first heat sink assembly and the second heat sink assembly are sequentially arranged on the same surface of the base; the first heat conduction pipe assembly is inserted in the first heat sink assembly, one end of the second heat conduction pipe assembly is inserted in the first heat sink assembly, and the other end of the second heat conduction pipe assembly is inserted in the second heat sink assembly; the air cooling mechanism is arranged above the heat sink assembly.

As a further elaboration of the above technical solution:

in the above technical solution, each of the first heat sink assembly and the second heat sink assembly includes a plurality of heat sink fins, and the left and right sides of each of the heat sink fins are inserted with a connecting member, and the connecting member is fixedly connected with the base through a fixing screw.

In the above technical solution, the left and right sides of the heat dissipating fins are respectively provided with openings, and the connecting member sequentially passes through the openings of the left and right sides of the corresponding heat dissipating fins.

In the above technical solution, the first heat pipe assembly includes two first heat pipes, and the first heat pipes are configured as U-shaped first heat pipes.

In the above technical scheme, the second heat pipe assembly includes two second heat pipes, a Y-shape is formed between the two second heat pipes, a longer end of the second heat pipe is inserted into the first heat sink assembly, and a shorter end of the second heat pipe is inserted into the second heat sink assembly.

In the above technical solution, the air cooling mechanism includes at least one fan.

In the above technical solution, the air cooling mechanism includes two fans and is respectively disposed above the first fin assembly and the second fin assembly.

Compared with the prior art, the beneficial effects of the utility model reside in that: the utility model discloses it is rational in infrastructure, carry out heat conduction for the first time to CPU through first heat pipe subassembly and second heat pipe subassembly, then carry out heat dissipation for the first time to the heat through first fin subassembly, carry out heat conduction for the second time to the surplus heat through second heat pipe subassembly, then dispel the heat to the surplus heat through the second fin subassembly, and simultaneously, air cooling mechanism blows the heat dissipation to CPU, the radiating efficiency and the radiating effect have been improved greatly, can in time dispel the heat to CPU effectively, can satisfy CPU's heat dissipation requirement, guarantee CPU's steady operation.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a portion of the structure at A in FIG. 1;

fig. 3 is a schematic top view of the present invention;

fig. 4 is a schematic structural view of the air-cooling mechanism.

In the figure: 1. a base; 11. a first screw hole; 2. a first fin assembly; 3. a second fin assembly; 21. heat dissipation fins; 22. opening a hole; 4. a first heat pipe assembly; 41. a first heat conductive pipe; 5. a second heat pipe assembly; 51. a second heat conductive pipe; 6. an air cooling mechanism; 61. a fan; 7. a connecting member; 71. a second screw hole; 8. and fixing the screw.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The embodiments described by referring to the drawings are exemplary and intended to be used for explaining the present application and are not to be construed as limiting the present application. In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus should not be considered limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate. In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

As shown in fig. 1 to 4, a CPU heat sink capable of dissipating heat multiple times includes a base 1, a first heat sink assembly 2, a second heat sink assembly 3, a first heat pipe assembly 4, a second heat pipe assembly 5, and an air cooling mechanism 6; the first heat sink assembly 2 and the second heat sink assembly 3 are sequentially arranged on the same surface of the base 1; the first heat pipe assembly 4 is inserted into the first heat sink assembly 2, one end of the second heat pipe assembly 5 is inserted into the first heat sink assembly 2, and the other end is inserted into the second heat sink assembly 3; the air cooling mechanism 6 is disposed above the first fin assembly 2 and the second fin assembly 3.

As shown in fig. 1 and 2, each of the first heat sink assembly 2 and the second heat sink assembly 3 includes a plurality of heat dissipating fins 21, and the left and right sides of the heat dissipating fins 21 are plugged with the connectors 7. Specifically, the connecting member 7 is provided with two connecting members 7 arranged in a strip shape, the left and right sides of the heat dissipating fins 21 are respectively provided with openings 22 through which the connecting members can pass, and each connecting member 7 sequentially passes through the openings 22 on the left and right sides of the corresponding heat dissipating fins 21. In addition, the connecting piece 7 is fixedly connected with the base 1 through a fixing screw 8, a first screw hole 11 is formed in the base 1, a second screw hole 71 corresponding to the first screw hole 11 is formed in the connecting piece 7, the fixing screw 8 penetrates through the second screw hole 71 in the connecting piece 7 to be matched and locked with the first screw hole 11 in the base 1, and therefore the connecting piece 7 is fixedly connected with the base 1, and the first heat sink assembly 2 and the second heat sink assembly 3 are fixed on the base 1. The connecting piece 7 is used for connecting the radiating fins 21, so that the radiating fins 21 and the base do not need to be welded, and the whole assembly and disassembly of the CPU radiator are facilitated.

In the present embodiment, as shown in fig. 3 and 4, the first heat pipe assembly 4 includes two first heat pipes 41, and the first heat pipes 41 are provided as U-shaped first heat pipes. The second heat pipe assembly 5 includes two second heat pipes 51, a Y-shape is formed between the two second heat pipes 51, a longer end of the second heat pipe 51 is inserted into the first heat sink assembly 2 and extends out of the first heat sink assembly 2, and a shorter end of the second heat pipe 51 is inserted into the second heat sink assembly 3 and extends out of the second heat sink assembly 3. The first heat pipe assembly 4 and the second heat pipe assembly 5 are respectively filled with heat conducting liquid, so that heat generated by the CPU can be rapidly transmitted to the first radiator assembly 2 and the second radiator assembly 3, each part of the first radiator assembly 2 and the second radiator assembly 3 is enabled to participate in heat dissipation, the CPU can be subjected to timely heat dissipation, the heat dissipation efficiency is greatly improved, the heat dissipation effect is guaranteed, and the CPU can stably run. The heat conducting liquid is a known technology that should be known to those skilled in the art, and therefore, the description thereof is omitted here.

In the present embodiment, as shown in fig. 3, the air-cooling mechanism 6 includes at least one fan 61. Preferably, the air cooling mechanism 6 includes two fans 61 and is disposed above the first fin assembly 2 and the second fin assembly 3, respectively. The fan 61 is used for continuously blowing air to the CPU and continuously dissipating heat to the CPU, so that the running temperature of the CPU is prevented from being too high, and the running efficiency of the CPU is ensured.

In this embodiment, the first fin assembly 2 and the second fin assembly 3 are both configured as aluminum fin assemblies, so that the production cost can be effectively reduced while the heat dissipation effect is ensured. The first heat pipe assembly 4 and the second heat pipe assembly 5 are provided as copper heat pipe assemblies so that heat conduction is faster and heat transfer can be performed quickly. Of course, the materials of the first fin assembly 2, the second fin assembly 3, the first heat conducting pipe 4 and the second heat conducting pipe 5 can be selected according to practical situations, and are not limited in this embodiment.

During operation, the longer ends of the first heat pipe 41 and the second heat pipe 51 conduct heat to the heat generated by the CPU for the first time, then conduct heat to the heat through the first heat sink assembly 2 for the first time, conduct heat to the residual heat through the shorter end of the second heat pipe 51 for the second time, then conduct heat to the residual heat through the second heat sink assembly 3, and at the same time, the fan 61 conducts heat by blowing continuously to the CPU.

The utility model discloses it is rational in infrastructure, carry out heat conduction for the first time to CPU through first heat pipe subassembly 4 and second heat pipe subassembly 5, then carry out heat dissipation for the first time to the heat through first fin subassembly 2, carry out heat conduction for the second time to the surplus heat through second heat pipe subassembly 5, then dispel the heat to the surplus heat through second fin subassembly 3, and simultaneously, the heat dissipation of blowing is carried out to CPU to air-cooled mechanism 6, the radiating efficiency and the radiating effect have been improved greatly, can in time dispel the heat to CPU effectively, can satisfy CPU's heat dissipation requirement, guarantee CPU's steady operation.

The above is not intended to limit the technical scope of the present invention, and any modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention are all within the scope of the technical solution of the present invention.

Claims (7)

1. A CPU radiator capable of radiating heat for multiple times is characterized by comprising a base, a first radiator component, a second radiator component, a first heat-conducting pipe component, a second heat-conducting pipe component and an air cooling mechanism; the first heat sink assembly and the second heat sink assembly are sequentially arranged on the same surface of the base; the first heat conduction pipe assembly is inserted in the first heat sink assembly, one end of the second heat conduction pipe assembly is inserted in the first heat sink assembly, and the other end of the second heat conduction pipe assembly is inserted in the second heat sink assembly; the air cooling mechanism is arranged above the heat sink assembly.

2. The CPU radiator of claim 1, wherein each of the first and second fin members comprises a plurality of fins, and connecting members are inserted into left and right sides of the fins, and the connecting members are fixedly connected to the base through fixing screws.

3. The CPU heat sink of claim 2, wherein the heat dissipating fins have openings on the left and right sides thereof, and the connecting member sequentially passes through the openings on the left and right sides of the corresponding heat dissipating fins.

4. The CPU heat sink capable of multiple heat rejections according to claim 1, wherein said first heat pipe assembly comprises two first heat pipes, said first heat pipes being configured as U-shaped first heat pipes.

5. The CPU heat sink according to claim 1, wherein the second heat pipe assembly comprises two second heat pipes, the two second heat pipes form a Y shape, a longer end of each of the second heat pipes is inserted into the first heat sink assembly, and a shorter end of each of the second heat pipes is inserted into the second heat sink assembly.

6. The CPU heat sink capable of dissipating heat multiple times as claimed in any one of claims 1 to 5, wherein the air cooling mechanism comprises at least one fan.

7. The CPU heat sink of claim 6 wherein said air cooling mechanism comprises two fans and is disposed above said first and second fin assemblies, respectively.

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