CN206563932U - Processor heat abstractor - Google Patents
Processor heat abstractor Download PDFInfo
- Publication number
- CN206563932U CN206563932U CN201720105845.6U CN201720105845U CN206563932U CN 206563932 U CN206563932 U CN 206563932U CN 201720105845 U CN201720105845 U CN 201720105845U CN 206563932 U CN206563932 U CN 206563932U
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- Prior art keywords
- processor
- hole
- heat pipe
- heat abstractor
- radiator
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Abstract
The utility model is related to a kind of processor heat abstractor, including processor, in the porous heat pipe and radiator of flat, the porous heat pipe has multiple microchannel pores, the bottom of the radiator is provided with groove, the bottom of the groove is provided with multiple through holes, one end sealing of the porous heat pipe is plugged in the groove, the other end closing of the porous heat pipe, one end of the multiple through hole is connected with the multiple microchannel pore, the other end of the multiple through hole is interconnected or closed, be filled with the microchannel pore can phase transformation refrigerant, the other end of the porous heat pipe is attached on the top surface of the processor.The processor heat abstractor of the utility model above-described embodiment, water cooling method air-cooled relative to traditional CPU, radiating efficiency is greatly promoted.Also, the processor heat abstractor is easily achieved, can commercially it use on a large scale.
Description
Technical field
The utility model belongs to processor technical field of heat dissipation, more particularly to a kind of processor heat abstractor.
Background technology
The PC of modern electronics industry and its making rapid progress for server, CPU (processor) heat dissipation problem is serious
Hinder super high performance CPU development.At present, traditional heat dissipation technology, such as air-cooled, water cooling is still in CPU field of radiating
Play main role.This is mainly due to these technologies, and simple in construction, cost is low.Traditional CPU is air-cooled, water-cooling
Its radiating efficiency of mode is not high.
Thus, the heat dissipation technology of current a series of new and higher level is being emerged in large numbers, such as, microchannel, ion wind,
Piezoelectric type fin, magnetic polarization nano-fluid and micro-inclusion phase change fluid etc., these new heat dissipation technologys are applied to CPU and dissipated
Heat may have more preferable radiating efficiency, still, due to these new heat dissipation technologys exist complicated manufacturing process, high cost and
The problems such as low reliability, the space that still has greatly improved is used from large-scale business.
Utility model content
Technical problem to be solved in the utility model is to be directed to existing heat loss through conduction device, and heat conduction is passed through in radiating end
The mode that silica gel is pasted realizes the combination of heat pipe and fin so that there is provided one kind processing for the defect that radiating efficiency is substantially reduced
Device heat abstractor.
The utility model solve the technical scheme that is used of above-mentioned technical problem for：
A kind of processor heat abstractor, including processor, porous heat pipe and radiator in flat are provided, it is described porous
Heat pipe has multiple microchannel pores, and the bottom of the radiator is provided with groove, and the bottom of the groove is provided with multiple through holes, described
One end sealing of porous heat pipe is plugged in the groove, the other end closing of the porous heat pipe, one end of the multiple through hole
Connected with the multiple microchannel pore, the other end of the multiple through hole is interconnected or closed, and is filled in the microchannel pore
Have can phase transformation refrigerant, the other end of the porous heat pipe is attached on the top surface of the processor.
Alternatively, the shape of cross section of the groove is consistent with the shape of cross section of the porous heat pipe, the groove it is transversal
Face size is slightly larger than the cross sectional dimensions of the porous heat pipe.
Alternatively, the processor heat abstractor also includes the fan just dried the radiator, and the radiator is
Fin, copper coin or aluminium sheet.
Alternatively, the processor heat abstractor also includes coolant circulation system, and the radiator is the coolant
Liquid cool-heat-exchanger or cooled plate in the circulatory system.
Alternatively, the other end of the porous heat pipe is attached at by heat-conducting glue or soldering on the top surface of the processor.
Alternatively, the multiple through hole is provided with to seal in sealing hole, the sealing hole relative to the side of the groove and inserted
Connect a sprue.
Alternatively, it is provided with dentalation on the madial wall of the microchannel pore.
Alternatively, the multiple microchannel pore is corresponded with the multiple through hole and connected.
Alternatively, the multiple microchannel pore connection corresponding with one through hole.
Alternatively, one microchannel pore connection corresponding with the multiple through hole.
According to processor heat abstractor of the present utility model, the bottom of radiator is provided with groove, and trench bottom is provided with multiple
Through hole, one end sealing of porous heat pipe is plugged in groove, and one end of multiple through holes is connected with multiple microchannel pores, multiple through holes
The other end is interconnected or closed, be filled with microchannel pore can phase transformation refrigerant.So, the bottom of radiator have with it is many
The similar characteristic of hole heat pipe.Because the other end (heat absorbing end) of porous heat pipe is attached on the top surface of processor, processor work
When the heat that produces conduct to porous heat pipe so that the refrigerant heats vaporization in porous heat pipe heat absorbing end, form gas,
Absorb substantial amounts of heat in vaporescence, gas enters the another of porous heat pipe from the heat absorbing end of porous heat pipe through multiple microchannel pores
One end (radiating end), and contacted by multiple through holes with the bottom of radiator, gas cooling liquefies and discharges heat, and heat is dissipating
Taken away by fan or coolant hot device position., water cooling method air-cooled relative to traditional CPU, radiator and porous heat
Thermal resistance between pipe can be reduced to relatively low level so that radiating efficiency is greatly promoted.And, can under identical radiating efficiency
To reduce the area of radiator or reduce the flow of refrigerant, be conducive to the reduction of cost, and it is scattered beneficial to the processor is realized
The miniaturization of thermal.Also, the processor heat abstractor is easily achieved, can commercially it use on a large scale.
Brief description of the drawings
Fig. 1 is the schematic diagram for the processor heat abstractor that the embodiment of the utility model one is provided；
Fig. 2 is the exploded view for the processor heat abstractor that the embodiment of the utility model one is provided；
Fig. 3 is the schematic diagram (perspective) of its porous heat pipe of the processor heat abstractor of the embodiment of the utility model one offer；
Fig. 4 is the end view of its porous heat pipe of the processor heat abstractor of the embodiment of the utility model one offer；
Fig. 5 is the enlarged drawing at a in Fig. 4；
Fig. 6 is the schematic diagram (side perspective) for the processor heat abstractor that the embodiment of the utility model one is provided；
Fig. 7 is the exploded view (side perspective) for the processor heat abstractor that the embodiment of the utility model one is provided；
Fig. 8 is the schematic diagram of its radiator (fin) of the processor heat abstractor of the embodiment of the utility model one offer.
Reference in specification is as follows：
1st, porous heat pipe；11st, microchannel pore；111st, dentalation；
2nd, radiator；21st, groove；22nd, through hole；23rd, sealing hole；
3rd, sprue；
4th, processor；
5th, fan.
Embodiment
In order that technical problem, technical scheme and beneficial effect that the utility model is solved are more clearly understood, below
With reference to drawings and Examples, the utility model is described in further detail.It should be appreciated that specific reality described herein
Example is applied only to explain the utility model, is not used to limit the utility model.
As shown in figures 1-8, the processor heat abstractor that the embodiment of the utility model one is provided, including processor 4, porous heat
Pipe 1 and radiator 2, the porous heat pipe 1 have multiple microchannel pores 11, and the bottom of the radiator 2 is provided with groove 21, described
The bottom of groove 21 is provided with multiple through holes 22, and one end (radiating end) sealing of the porous heat pipe 1 is plugged in the groove 21, institute
State the other end (heat absorbing end) closing of porous heat pipe 1, be filled with the microchannel pore 11 can phase transformation refrigerant, it is the multiple
One end of through hole 22 is connected with the multiple microchannel pore 11, and the other end of the multiple through hole 22 is interconnected or closed.
In the present embodiment, the other end (heat absorbing end) of the porous heat pipe 1 is by welding lid cap closure, or flattens weldering
Connect closing.After the other end of porous heat pipe 1 is closed by block, a chamber connected with the other end of multiple through holes 22 can be reserved
Room, so that the other ends for obtaining multiple logical 22 holes are interconnected.Certainly, block can also close the other end in multiple logical 22 holes.
In the present embodiment, the other end (heat absorbing end) of the porous heat pipe 1 is attached at the processor 4 by heat-conducting glue
On top surface.So, the heat of processor 4 passes to the heat absorbing end of porous heat pipe 1 by heat-conducting glue.Certainly, porous heat pipe 1 is another
One end (heat absorbing end) can also be attached at by way of soldering on the top surface of the processor 4.
In the present embodiment, the shape of cross section of the groove 21 is consistent with the shape of cross section of the porous heat pipe 1, the groove
21 cross sectional dimensions is slightly larger than the cross sectional dimensions of the porous heat pipe 1, so that institute can be inserted with gap by obtaining porous heat pipe 1
State in groove 21.One end of porous heat pipe 1 is inserted after the groove 21, and the porous one end periphery of heat pipe 1 is interior with the groove 21
It is tightly connected between wall by welding or gluing mode.
In the present embodiment, as shown in Figures 4 and 8, porous heat pipe 1 is in flat, i.e., porous heat pipe 1 is that microchannel is porous flat
Load a certain amount of refrigerant in pipe, porous heat pipe 1 and be used as working media.Refrigerant has lower boiling characteristic, to absorb
It can be vaporized during the heat of heater element.
In the present embodiment, as shown in Fig. 1 and Fig. 8, the radiator 2 is fin, accordingly, the processor heat abstractor
Also include the fan 5 just dried the radiator 2 (fin).When the processor heat abstractor is arranged on mainboard, place
Reason device 3 is inserted in the CPU slots on mainboard, and fan 5 is arranged on mainboard by blower tray, and is dried to radiator 2.
However, in other embodiments, radiator can also can distribute the member of heat using copper coin or aluminium sheet etc. are other
Part.Accordingly, fan is just dried copper coin or aluminium sheet.
However, in other embodiments, radiator can be the liquid cool-heat-exchanger or water cooling in coolant circulation system
Plate.
As shown in Fig. 1-2, Fig. 6-7, the multiple through hole 22 is provided with sealing hole 23, institute relative to the side of the groove 21
State the sealing sprue 3 of grafting one in sealing hole 23.Pass through welding or gluing between the sprue 3 and the inwall of the sealing hole 23
Mode be tightly connected, sprue 3 can be with the end contact of the other end of multiple through holes 22 with by the another of the multiple through hole 22
Close one end；Certain sprue 3 can also be the multiple to cause with the end surfaces certain distance of the other end of multiple through holes 22
The other end of through hole 22 is interconnected.
Certainly, the other end of the multiple through hole 22 also can directly be closed by way of gluing or welding.
As shown in figure 5, being provided with dentalation 111 on the madial wall of the microchannel pore 11.On the one hand, dentalation
In the case that 111 can not increase in the aperture of microchannel pore 11, the contact area of increase refrigerant and microchannel pore 11 enters one
Step lifting heat conduction efficiency.On the other hand, the dentalation 111 of the madial wall of microchannel pore 11 is similar to capillary structure so that
Microchannel pore 11 forms similar pore, is conducive to liquefied refrigerant to be back to heat absorbing end by radiating end, to form circulation.
In the present embodiment, the single tooth of dentalation 111 is curved, the whole undulate channel-shaped of dentalation 111.
However, such as in other embodiments, the single tooth of dentalation 111 can also be other shapes, triangle, ladder
Shape etc..
Also, in other embodiments, can also be without dentalation 111, i.e., the madial wall light of described microchannel pore 11
It is sliding.
In the present embodiment, the multiple microchannel pore 11 is corresponded with the multiple through hole 22 and connected.Corresponding one
Microchannel pore 11 and a through hole 22 are on same straight line, and shape is consistent.
However, in other embodiments or, the multiple microchannel pore 11 it is corresponding with a through hole 22 connection.
For example, the connection corresponding with a through hole 22 of two microchannel pores 11.
Also, in other embodiments or, one microchannel pore 11 it is corresponding with multiple through holes 22 connection.
For example, the connection corresponding with two through holes 22 of a microchannel pore 11.
Its operation principle of the processor heat abstractor of above-described embodiment is as follows：
The heat that processor 4 is produced when working is conducted to porous heat pipe 1, so as to obtain the refrigeration in the porous heat absorbing end of heat pipe 1
The heated vaporization of agent, forms gas, absorbs substantial amounts of heat in vaporescence, and gas is from the heat absorbing end of porous heat pipe 1 through multiple
Microchannel pore 11 enters the radiating end of porous heat pipe 1, and is contacted by multiple through holes 22 with the bottom of radiator 2, gas cooling
Liquefy and discharge heat, heat is conducted to radiator 2, and radiator 2 is blown by fan 5 so that the surface heat of radiator 2 distribute to
In air.Liquid refrigerant after cooling is back to the heat absorbing end of porous heat pipe 1.So circulate repeatedly, by the heat of processor 3
After amount is conducted by porous heat pipe 1, persistently distributed through radiator 2.
According to the processor heat abstractor of the utility model above-described embodiment, water-cooling air-cooled relative to traditional CPU
Mode, the thermal resistance between radiator and porous heat pipe can be reduced to relatively low level so that radiating efficiency is greatly promoted.And
Under identical radiating efficiency, the area of radiator can be reduced or the flow of refrigerant is reduced, be conducive to the reduction of cost, and
Beneficial to the miniaturization for realizing the processor heat abstractor., being capable of business on a large scale also, the processor heat abstractor is easily achieved
Industry is used.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Any modifications, equivalent substitutions and improvements made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (10)
1. a kind of processor heat abstractor, it is characterised in that including processor, in the porous heat pipe and radiator of flat, institute
Stating porous heat pipe has multiple microchannel pores, and the bottom of the radiator is provided with groove, and the bottom of the groove is provided with multiple lead to
Hole, one end sealing of the porous heat pipe is plugged in the groove, the other end closing of the porous heat pipe, the multiple through hole
One end connected with the multiple microchannel pore, the other end of the multiple through hole is interconnected or closed, the microchannel pore
Inside be filled with can phase transformation refrigerant, the other end of the porous heat pipe is attached on the top surface of the processor.
2. processor heat abstractor according to claim 1, it is characterised in that the shape of cross section of the groove with it is described many
The shape of cross section of hole heat pipe is consistent, and the cross sectional dimensions of the groove is slightly larger than the cross sectional dimensions of the porous heat pipe.
3. processor heat abstractor according to claim 1, it is characterised in that the processor heat abstractor is also included just
The fan dried the radiator, the radiator is fin, copper coin or aluminium sheet.
4. processor heat abstractor according to claim 1, it is characterised in that the processor heat abstractor also includes cold
But fluid circulation, the radiator is liquid cool-heat-exchanger or cooled plate in the coolant circulation system.
5. processor heat abstractor according to claim 1, it is characterised in that the other end of the porous heat pipe is by leading
Hot glue or soldering are attached on the top surface of the processor.
6. processor heat abstractor according to claim 5, it is characterised in that the multiple through hole is relative to the groove
Side is provided with the sealing sprue of grafting one in sealing hole, the sealing hole.
7. processor heat abstractor according to claim 1, it is characterised in that set on the madial wall of the microchannel pore
There is dentalation.
8. the processor heat abstractor according to claim 1-7 any one, it is characterised in that the multiple microchannel pore
Correspond and connect with the multiple through hole.
9. the processor heat abstractor according to claim 1-7 any one, it is characterised in that the multiple microchannel pore
Connection corresponding with one through hole.
10. the processor heat abstractor according to claim 1-7 any one, it is characterised in that one microchannel
Hole connection corresponding with the multiple through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720105845.6U CN206563932U (en) | 2017-01-23 | 2017-01-23 | Processor heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720105845.6U CN206563932U (en) | 2017-01-23 | 2017-01-23 | Processor heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206563932U true CN206563932U (en) | 2017-10-17 |
Family
ID=60029140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720105845.6U Active CN206563932U (en) | 2017-01-23 | 2017-01-23 | Processor heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206563932U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979962A (en) * | 2018-01-09 | 2018-05-01 | 无锡巨日电子科技有限公司 | Water-cooled circuit plate heat dissipating device |
| CN107977064A (en) * | 2017-12-29 | 2018-05-01 | 华南理工大学 | The water-cooling heat radiating device and its heat dissipating method of a kind of server |
| CN108024488A (en) * | 2018-01-09 | 2018-05-11 | 无锡巨日电子科技有限公司 | Water-jacket typ circuit plate heat dissipating device |
| CN108024489A (en) * | 2018-01-09 | 2018-05-11 | 无锡巨日电子科技有限公司 | Wiring board air-cooled radiating device |
| CN108235653A (en) * | 2017-12-29 | 2018-06-29 | 华南理工大学 | A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method |
-
2017
- 2017-01-23 CN CN201720105845.6U patent/CN206563932U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107977064A (en) * | 2017-12-29 | 2018-05-01 | 华南理工大学 | The water-cooling heat radiating device and its heat dissipating method of a kind of server |
| CN108235653A (en) * | 2017-12-29 | 2018-06-29 | 华南理工大学 | A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method |
| CN107979962A (en) * | 2018-01-09 | 2018-05-01 | 无锡巨日电子科技有限公司 | Water-cooled circuit plate heat dissipating device |
| CN108024488A (en) * | 2018-01-09 | 2018-05-11 | 无锡巨日电子科技有限公司 | Water-jacket typ circuit plate heat dissipating device |
| CN108024489A (en) * | 2018-01-09 | 2018-05-11 | 无锡巨日电子科技有限公司 | Wiring board air-cooled radiating device |
| CN108024489B (en) * | 2018-01-09 | 2023-09-26 | 无锡巨日电子科技有限公司 | Circuit board air-cooled heat abstractor |
| CN108024488B (en) * | 2018-01-09 | 2023-10-17 | 无锡巨日电子科技有限公司 | Water jacket type circuit board heat abstractor |
| CN107979962B (en) * | 2018-01-09 | 2024-02-20 | 无锡巨日电子科技有限公司 | Water-cooled circuit board heat abstractor |
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