CN108024489A - Wiring board air-cooled radiating device - Google Patents
Wiring board air-cooled radiating device Download PDFInfo
- Publication number
- CN108024489A CN108024489A CN201810019546.XA CN201810019546A CN108024489A CN 108024489 A CN108024489 A CN 108024489A CN 201810019546 A CN201810019546 A CN 201810019546A CN 108024489 A CN108024489 A CN 108024489A
- Authority
- CN
- China
- Prior art keywords
- heat
- wiring board
- plate
- conducting plate
- cabinet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Abstract
The present invention relates to a kind of radiator, especially wiring board air-cooled radiating device, including cabinet, wind turbine and heat-conducting plate；The inside of the cabinet is equipped with wiring board, and one end of cabinet is equipped with heat dissipation chamber, partition plate is equipped between cabinet and heat dissipation chamber, partition plate is equipped with heat emission hole and jack, heat emission hole and jack connect cabinet with heat dissipation chamber, air inlet and air outlet are additionally provided with heat dissipation chamber, the assembling is on air outlet；The heat-conducting plate includes thermal conductive zone and radiating area, thermal conductive zone and radiating area are overall structure, and the thermal conductive zone is fixed and contacted in the circuit board with high-power heating element, and radiating area is located at the outside of wiring board, and it is located at away from wiring board, radiating area through jack in heat dissipation chamber.The device forms single heat dissipation channel by extending heat-conducting plate, and convenient concentration is air-cooled, and makes the compact-sized of cabinet, and more wiring boards can be installed in the case of same volume, and heat dissipation effect is more preferable, is not easy dust stratification.
Description
Technical field
The present invention relates to a kind of radiator, especially wiring board air-cooled radiating device.
Background technology
With the progress of production technology, the volume of the control babinet of part numerical control device is less and less, just towards lightening
Development.Due to reduced space, installation space is limited, and the heat that element produces is assembled and is difficult to radiate, and be easy to cause hot-spot
And the problem of damaging, is, it is necessary to be aerated cooling, but the dust in air-flow easily causes element harmful effect, and cause
Heat dissipation effect is deteriorated.
As Chinese patent CN105960154A discloses a kind of air-cooled regulating device of wiring board, including fan and fixed seat,
The fixed seat is arranged on the top of fan, and a through hole is provided with the fixed seat, one is provided through in the through hole
A cross bar, the both ends of the cross bar are respectively arranged with downwardly directed guide sleeve, are provided with the guide sleeve downwardly directed
Column, the bottom of the column are provided with fixed plate, and the top air inlet of the fan is provided with filter screen.Pass through above-mentioned side
Formula, the air-cooled regulating device of wiring board of the present invention, changes the height of fan using moving up and down for guide sleeve, using solid
Reservation moving left and right to adjust the lateral displacement of fan on cross bar so that fan is located at the top of element, carries out air-cooled dissipate
Heat, adjusting convenience is good, improves the stability in use of element.
But the device practicality is not strong, regulating device needs larger installation space, is not suitable for compact-sized field
Institute, and filter screen causes ventilation quantity to diminish using can also accumulate dust after a period of time, and heat dissipation effect is deteriorated, and causes electronics first
Device operation shakiness, while dust can not be avoided to enter on wiring board.
The content of the invention
To solve the above problems, the present invention provides a kind of good heat dissipation effect, heat dissipation is stablized, wiring board is not easy dust stratification, structure
Compact wiring board air-cooled radiating device, concrete technical scheme are：
Wiring board air-cooled radiating device, including cabinet, wind turbine and heat-conducting plate；The inside of the cabinet is equipped with wiring board, machine
One end of case is equipped with heat dissipation chamber, is equipped with partition plate between cabinet and heat dissipation chamber, and partition plate is equipped with heat emission hole and jack, heat emission hole and inserts
Kong Jun connects cabinet with heat dissipation chamber, air inlet and air outlet is additionally provided with heat dissipation chamber, the assembling is on air outlet；Institute
Stating heat-conducting plate includes thermal conductive zone and radiating area, and thermal conductive zone and radiating area are overall structure, and the thermal conductive zone is fixed in the circuit board
Contacted with high-power heating element, radiating area is located at the outside of wiring board, and is located at away from wiring board, radiating area through jack
In heat dissipation chamber.
By using above-mentioned technical proposal, heat dissipation chamber is set in cabinet inside, heat dissipation chamber is independent heat-dissipating space, not shadow
Ring wiring board.The radiating area of heat-conducting plate is located in heat dissipation chamber, and the cooling air-flow that wind turbine is formed is not easy without wiring board, wiring board
Dust stratification, improves the stability in use and service life of wiring board.
The heat that high-power heating element is sent is transmitted to radiating area, the radiating area of heat-conducting plate by the thermal conductive zone of heat-conducting plate
Radiate positioned at heat dissipation chamber, realize and concentrate heat dissipation, each wiring board is not required single wind turbine to radiate, simplifies cabinet inside
Radiating layout, make compact-sized, facilitate cabinet inside that more wiring boards are installed, while improve heat dissipation effect.Heat emission hole
Cooling air-flow can be formed in cabinet, reduces the temperature of cabinet inside.
Wind turbine accelerates air flow, and inspiration cold air, blows out hot-air.
Preferably, the wiring board in the cabinet is no less than two, and multiple circuit board levelings are laminated or are arranged side by side vertically；
The heat-conducting plate quantity is consistent with circuit board quantity.
By using above-mentioned technical proposal, circuit board leveling stacking or vertical be arranged side by side make the indoor radiating area rule of heat dissipation
Then arrange, conveniently form cooling air channel, heat dissipation effect and radiating efficiency can be improved.
Preferably, multiple slots are equipped with the cabinet, the both sides of the wiring board are inserted in slot；The air inlet and
Air outlet is vertical with the radiating area of heat-conducting plate, and the air-flow of wind turbine is parallel with the radiating area of heat-conducting plate.
By using above-mentioned technical proposal, slot facilitates the installation of wiring board, especially the stacking of multiple circuit board levelings or
It is arranged side by side vertically.The air-flow heat Quick diffusing made on radiating area parallel with radiating area that wind turbine is formed falls, and will not make
Into the reflux of hot wind, good heat dissipation effect.
Preferably, the heat-conducting plate is composite plate, including conductive base plate and heat-conducting plate no less than one, conductive base plate
It is stacked together with heat-conducting plate, heat-conducting work medium is housed between conductive base plate and heat-conducting plate.
By using above-mentioned technical proposal, the receiving that conductive base plate and heat-conducting plate are laminated together to form heat-conducting work medium is empty
Between, heat-conducting work medium further improves heat transfer rate.
Preferably, the thermal trough of closing is equipped between the heat-conducting plate and conductive base plate, thermal trough extends from thermal conductive zone
To radiating area, heat-conducting work medium is housed in thermal trough；The thermal trough is equipped with one or no less than two, and thermal trough is no less than two
When thermal trough rule or irregular distribution.
By using above-mentioned technical proposal, thermal trough is used to accommodate more heat-conducting work mediums.Thermal trough can be according to big work(
The position of rate heating element is arranged.
Preferably, the thermal trough includes multiple parallel transverse grooves or cannelure, and the transverse groove or cannelure are envelope
The groove closed.
Preferably, the thermal trough is equipped with multiple, thermal trough regular distribution, and adjacent thermal trough is interconnected.
By using above-mentioned technical proposal, thermal trough, which is interconnected, makes heat-conducting work medium form entirety, can realize quick biography
Heat.
Preferably, the thermal trough includes multiple transverse grooves and cannelure, and transverse groove is crossed to form overall mutual with cannelure
Logical is latticed；Or thermal trough is polygon groove, multiple polygon grooves be interconnected to be formed it is netted or cellular.
By using above-mentioned technical proposal, thermal trough forms latticed, netted or cellular, and structure is beautiful, improves at the same time
The capacity of heat-conducting work medium, and all heat-conducting work mediums is linked to be entirety, heat transfer is fast.
Preferably, the thermal trough is to be opened on heat-conducting plate or conductive base plate or heat-conducting plate and conductive base plate
Groove；Or thermal trough is protrusion, the accommodation space of heat-conducting work medium is convexed to form, protrusion is located at heat-conducting plate or conductive base plate or heat conduction
On top plate and conductive base plate, the raised outside to heat-conducting plate is convex.
By using above-mentioned technical proposal, groove can be processed by milling cutter at the top of heat conduction or in conductive base plate, be added
Work cost is higher, is applicable in small lot production.Protrusion is processed by the way of punching press or inflation, and raised processing cost is low, is applicable in
Batch production.
Preferably, the conductive base plate and heat-conducting plate are one kind in aluminium sheet, copper coin or stainless steel plate；The aluminium sheet or
The surface of copper coin is equipped with anodic oxide coating；The heat-conducting work medium is the mixture of gas, liquid, gas and liquid, phase transformation suppression
One kind in material.
By using above-mentioned technical proposal, aluminium sheet, copper coin or stainless steel plate good heat conductivity, using table when aluminium sheet or copper coin
Face carries out preservative treatment by anodic oxidation, if spray painting can influence heat dissipation effect.
The heat-conducting work medium of gas can be hydrogen.
The heat-conducting work medium of liquid can be mixing more than one or both of distilled water, ammonia, glycerine, methanol or acetone
Thing.
Phase transformation suppresses mixture of the material for solid-state and liquid, into jelly or gel shape.Phase transformation suppresses the liquid in material
Part can be the one or more in the multiple materials such as distilled water, ammonia, glycerine, methanol or acetone, and solid portion can be stone
Ink.Phase transformation suppress material it is heated when, boiling phenomenon is suppressed, so that efficient heat transfer phenomenon be presented, i.e. the temperature of heat source distant place
It is nearby higher than heat source on the contrary；At the same time, generate heat and distal end is passed to from heating end with extraordinary high-speed, and heating end is kept low
Temperature state.Phase transformation, which suppresses material, has the characteristics of high heat transfer rate, high heat transfer density, efficient thermal conductivity 6000W/m.K；Heat transfer
Density is that actual measurement is 100-1000W/cm2；Uniform temperature is good, can under -20 DEG C of environment using, can realize antigravity heat transfer and horse
Saddle type is conducted heat.
Compared with prior art the invention has the advantages that：
Wiring board air-cooled radiating device provided by the invention forms single heat dissipation channel, convenient collection by extending heat-conducting plate
In it is air-cooled, and make the compact-sized of cabinet, more wiring boards can be installed in the case of same volume, and heat dissipation effect is more
Well, it is not easy dust stratification.
Brief description of the drawings
Fig. 1 is the structure diagram of the present invention；
Fig. 2 is schematic cross-sectional view；
Fig. 3 is the structure diagram that heat-conducting plate is equipped with thermal trough；
Fig. 4 is the enlarged partial sectional view of the line A-A along Fig. 3；
Fig. 5 is that heat-conducting plate is equipped with raised structure diagram；
Fig. 6 is the enlarged partial sectional view of the line B-B along Fig. 5.
Embodiment
In conjunction with attached drawing, the invention will be further described.
Embodiment one
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, wiring board air-cooled radiating device, including cabinet 11, wind turbine 19 and heat-conducting plate 2.
Slot 15 is equipped with cabinet 11, the both sides of wiring board 12 are inserted in slot 15；Wiring board 12 is multiple no less than two
Wiring board 12 is arranged side by side vertically.One end of cabinet 11 is equipped with heat dissipation chamber 16, and partition plate 14 is equipped between cabinet 11 and heat dissipation chamber 16,
Partition plate 14 is equipped with heat emission hole and jack, and cabinet 11 is connected, also set in heat dissipation chamber 16 by heat emission hole and jack with heat dissipation chamber 16
There are air inlet 18 and air outlet 17, wind turbine 19 is installed on air outlet 17.
Heat-conducting plate 2 is housed, heat-conducting plate 2 includes thermal conductive zone 21 and radiating area 22, thermal conductive zone 21 and radiating area on wiring board 12
22 be overall structure, and thermal conductive zone 21 is fixed in assist side 12 and contacted with high-power heating element 13, and radiating area 22 is located at line
The outside of road plate 12, and be located at away from wiring board 12, radiating area 22 through jack in heat dissipation chamber 16.Heat-conducting plate 2 and high-power hair
Heat-conducting silicone grease is also equipped between hot component 13.Heat-conducting silicone grease reduces 13 skies between heat-conducting plate 2 of high-power fever member device
Gap, makes the conduction of heat more smooth, improves heat-conducting effect.
Air inlet 18 and air outlet 17 are vertical with the radiating area 22 of heat-conducting plate 2, the air-flow of wind turbine 19 and dissipating for heat-conducting plate 2
Hot-zone 22 is parallel.
Heat-conducting plate 2 is composite plate, including conductive base plate 32 and heat-conducting plate 31, conductive base plate 32 and heat-conducting plate 31 are laminated
Together.The thermal trough of closing is equipped between heat-conducting plate 31 and conductive base plate 32, thermal trough extends to heat dissipation from thermal conductive zone 21
Area 22, thermal trough is interior to be equipped with heat-conducting work medium.Heat-conducting work medium suppresses material for phase transformation.
Thermal trough includes multiple transverse grooves 51 and cannelure 52, and transverse groove 51 is crossed to form overall intercommunication with cannelure 52
It is latticed.Thermal trough is opened on heat-conducting plate 31.
Conductive base plate 32 and heat-conducting plate 31 are aluminium sheet, and surface is equipped with anodic oxide coating.
Embodiment two
As shown in Figure 1, Figure 2, shown in Fig. 5 and Fig. 6, wiring board air-cooled radiating device, including cabinet 11, wind turbine 19 and heat-conducting plate 2.
Slot 15 is equipped with cabinet 11, the both sides of wiring board 12 are inserted in slot 15；Wiring board 12 is multiple no less than two
Wiring board 12 is arranged side by side vertically.One end of cabinet 11 is equipped with heat dissipation chamber 16, and partition plate 14 is equipped between cabinet 11 and heat dissipation chamber 16,
Partition plate 14 is equipped with heat emission hole and jack, and cabinet 11 is connected, also set in heat dissipation chamber 16 by heat emission hole and jack with heat dissipation chamber 16
There are air inlet 18 and air outlet 17, wind turbine 19 is installed on air outlet 17.
Heat-conducting plate 2 is housed, heat-conducting plate 2 includes thermal conductive zone 21 and radiating area 22, thermal conductive zone 21 and radiating area on wiring board 12
22 be overall structure, and thermal conductive zone 21 is fixed in assist side 12 and contacted with high-power heating element 13, and radiating area 22 is located at line
The outside of road plate 12, and be located at away from wiring board 12, radiating area 22 through jack in heat dissipation chamber 16.
Air inlet 18 and air outlet 17 are vertical with the radiating area 22 of heat-conducting plate 2, the air-flow of wind turbine 19 and dissipating for heat-conducting plate 2
Hot-zone 22 is parallel.
Heat-conducting plate 2 is composite plate, including conductive base plate 32 and heat-conducting plate 31, conductive base plate 32 and heat-conducting plate 31 are laminated
Together.The thermal trough of closing is equipped between heat-conducting plate 31 and conductive base plate 32, thermal trough extends to heat dissipation from thermal conductive zone 21
Area 22, thermal trough is interior to be equipped with heat-conducting work medium.Heat-conducting work medium suppresses material for phase transformation.
Thermal trough is the protrusion 41 of polygon, and protrusion 41 is convex to the outside of heat-conducting plate 31, and protrusion 41 forms heat-conducting work medium
Accommodation space.Multiple raised 41 be interconnected formed it is netted or cellular.
Conductive base plate 32 and heat-conducting plate 31 are aluminium sheet, and surface is equipped with anodic oxide coating.
Claims (10)
1. wiring board air-cooled radiating device, it is characterised in that including cabinet (11), wind turbine (19) and heat-conducting plate (2)；The cabinet
(11) inside is equipped with wiring board (12), and one end of cabinet (11) is equipped with heat dissipation chamber (16), cabinet (11) and heat dissipation chamber (16) it
Between be equipped with partition plate (14), partition plate (14) is equipped with heat emission hole and jack, and heat emission hole and jack are by cabinet (11) and heat dissipation chamber
(16) connect, be additionally provided with air inlet (18) and air outlet (17) in heat dissipation chamber (16), the wind turbine (19) is installed on air outlet
(17) on；
The heat-conducting plate (2) includes thermal conductive zone (21) and radiating area (22), and thermal conductive zone (21) and radiating area (22) are overall structure,
Contacted on the fixed assist side (12) of the thermal conductive zone (21) with high-power heating element (13), radiating area (22) is located at circuit
The outside of plate (12), and be located at away from wiring board (12), radiating area (22) through jack in heat dissipation chamber (16).
2. wiring board air-cooled radiating device according to claim 1, it is characterised in that the wiring board in the cabinet (11)
(12) two are no less than, multiple wiring board (12) horizontal stackings or is arranged side by side vertically；Heat-conducting plate (2) quantity and wiring board
(12) quantity is consistent.
3. wiring board air-cooled radiating device according to claim 2, it is characterised in that be equipped with the cabinet (11) multiple
Slot (15), the both sides of the wiring board (12) are inserted in slot (15)；The air inlet (18) and air outlet (17) are with leading
Vertically, the air-flow of wind turbine (19) is parallel with the radiating area (22) of heat-conducting plate (2) for the radiating area (22) of hot plate (2).
4. wiring board air-cooled radiating device according to claim 1 or 2, it is characterised in that the heat-conducting plate (2) is compound
Plate, including conductive base plate (32) and heat-conducting plate (31) no less than one, conductive base plate (32) and heat-conducting plate (31) stacking
Together, heat-conducting work medium is housed between conductive base plate (32) and heat-conducting plate (31).
5. wiring board air-cooled radiating device according to claim 4, it is characterised in that the heat-conducting plate (31) and heat conduction
The thermal trough of closing is equipped between bottom plate (32), thermal trough extends to radiating area (22) from thermal conductive zone (21), is equipped with thermal trough
Heat-conducting work medium；The thermal trough is equipped with one or no less than two, thermal trough rule or irregular when thermal trough is no less than two
Distribution.
6. wiring board air-cooled radiating device according to claim 5, it is characterised in that the thermal trough includes multiple parallel
Transverse groove (51) or cannelure (52), the transverse groove (51) or cannelure (52) for closing groove.
7. wiring board air-cooled radiating device according to claim 5, it is characterised in that the thermal trough be equipped with it is multiple, lead
Heat channel regular distribution, and adjacent thermal trough is interconnected.
8. wiring board air-cooled radiating device according to claim 7, it is characterised in that the thermal trough includes multiple transverse directions
Groove (51) and cannelure (52), transverse groove (51) are crossed to form the latticed of overall intercommunication with cannelure (52)；Or thermal trough is
Polygon groove, multiple polygon grooves be interconnected to be formed it is netted or cellular.
9. according to claim 5 to 8 any one of them wiring board air-cooled radiating device, it is characterised in that the thermal trough is
The groove being opened on heat-conducting plate (31) or conductive base plate (32) or heat-conducting plate (31) and conductive base plate (32)；Or thermal trough is
Raised (41), raised (41) form the accommodation space of heat-conducting work medium, and raised (41) are located at heat-conducting plate (31) or conductive base plate
(32) or on heat-conducting plate (31) and conductive base plate (32), the protrusion (41) is convex to the outside of heat-conducting plate (2).
10. wiring board air-cooled radiating device according to claim 4, it is characterised in that the conductive base plate (32) and lead
Hot top plate (31) is one kind in aluminium sheet, copper coin or stainless steel plate；The surface of the aluminium sheet or copper coin is equipped with anodic oxide coating；Institute
It is one kind in the mixture of gas, liquid, gas and liquid, phase transformation suppression material to state heat-conducting work medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810019546.XA CN108024489B (en) | 2018-01-09 | 2018-01-09 | Circuit board air-cooled heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810019546.XA CN108024489B (en) | 2018-01-09 | 2018-01-09 | Circuit board air-cooled heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108024489A true CN108024489A (en) | 2018-05-11 |
| CN108024489B CN108024489B (en) | 2023-09-26 |
Family
ID=62072502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810019546.XA Active CN108024489B (en) | 2018-01-09 | 2018-01-09 | Circuit board air-cooled heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108024489B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108925123A (en) * | 2018-09-14 | 2018-11-30 | 成都爱米瑞科技有限公司 | A kind of totally-enclosed conduction air-cooled case of completely new heat-transfer path |
| CN111417258A (en) * | 2020-05-15 | 2020-07-14 | 汪向丽 | Anti-aging circuit board |
| CN111538384A (en) * | 2020-04-26 | 2020-08-14 | 南京安元科技有限公司 | High-efficiency heat dissipation Internet of things host integrating safety data acquisition, analysis and early warning |
| CN114258215A (en) * | 2021-12-23 | 2022-03-29 | 苏州汇川控制技术有限公司 | Control device |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080218980A1 (en) * | 2007-03-05 | 2008-09-11 | Tracewell Systems, Inc. | Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology |
| CN201590983U (en) * | 2010-01-04 | 2010-09-22 | 山东超越数控电子有限公司 | Multi-air duct radiation device for ATR sealed case |
| CN202005099U (en) * | 2010-11-01 | 2011-10-05 | 国营第三八八厂 | Portable full-sealing radiating machine case of high frequency ground wave radar |
| CN204392754U (en) * | 2015-02-10 | 2015-06-10 | 中兴通讯股份有限公司 | Coldplate, cooling device and communication apparatus |
| US20160033208A1 (en) * | 2014-07-29 | 2016-02-04 | Phi Hung Thanh | Fluid Flow Channel For Enhanced Heat Transfer Efficiency |
| US20160219755A1 (en) * | 2015-01-23 | 2016-07-28 | Tai-Sol Electronics Co., Ltd. | Thermoelectric-cooling-chip-based heat-disspating system |
| CN205847314U (en) * | 2016-07-12 | 2016-12-28 | 江西工业工程职业技术学院 | Heat radiating type switch |
| CN206115385U (en) * | 2016-08-16 | 2017-04-19 | 南京普道电子技术有限公司 | Blade server |
| WO2017113571A1 (en) * | 2015-12-31 | 2017-07-06 | 浙江嘉熙科技有限公司 | Integrated phase-change inhibition heat transfer and heat exchange plate structure and manufacturing method thereof |
| CN206563932U (en) * | 2017-01-23 | 2017-10-17 | 深圳市迈安热控科技有限公司 | Processor heat abstractor |
| CN207820430U (en) * | 2018-01-09 | 2018-09-04 | 无锡巨日电子科技有限公司 | Wiring board air-cooled radiating device |
-
2018
- 2018-01-09 CN CN201810019546.XA patent/CN108024489B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080218980A1 (en) * | 2007-03-05 | 2008-09-11 | Tracewell Systems, Inc. | Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology |
| CN201590983U (en) * | 2010-01-04 | 2010-09-22 | 山东超越数控电子有限公司 | Multi-air duct radiation device for ATR sealed case |
| CN202005099U (en) * | 2010-11-01 | 2011-10-05 | 国营第三八八厂 | Portable full-sealing radiating machine case of high frequency ground wave radar |
| US20160033208A1 (en) * | 2014-07-29 | 2016-02-04 | Phi Hung Thanh | Fluid Flow Channel For Enhanced Heat Transfer Efficiency |
| US20160219755A1 (en) * | 2015-01-23 | 2016-07-28 | Tai-Sol Electronics Co., Ltd. | Thermoelectric-cooling-chip-based heat-disspating system |
| CN204392754U (en) * | 2015-02-10 | 2015-06-10 | 中兴通讯股份有限公司 | Coldplate, cooling device and communication apparatus |
| WO2017113571A1 (en) * | 2015-12-31 | 2017-07-06 | 浙江嘉熙科技有限公司 | Integrated phase-change inhibition heat transfer and heat exchange plate structure and manufacturing method thereof |
| CN205847314U (en) * | 2016-07-12 | 2016-12-28 | 江西工业工程职业技术学院 | Heat radiating type switch |
| CN206115385U (en) * | 2016-08-16 | 2017-04-19 | 南京普道电子技术有限公司 | Blade server |
| CN206563932U (en) * | 2017-01-23 | 2017-10-17 | 深圳市迈安热控科技有限公司 | Processor heat abstractor |
| CN207820430U (en) * | 2018-01-09 | 2018-09-04 | 无锡巨日电子科技有限公司 | Wiring board air-cooled radiating device |
Non-Patent Citations (1)
| Title |
|---|
| 诸邦田;: "电子设备的几种散热设计", 电子制作 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108925123A (en) * | 2018-09-14 | 2018-11-30 | 成都爱米瑞科技有限公司 | A kind of totally-enclosed conduction air-cooled case of completely new heat-transfer path |
| CN108925123B (en) * | 2018-09-14 | 2024-02-13 | 成都爱米瑞科技有限公司 | Totally-enclosed conduction air-cooled machine case with brand-new heat transfer path |
| CN111538384A (en) * | 2020-04-26 | 2020-08-14 | 南京安元科技有限公司 | High-efficiency heat dissipation Internet of things host integrating safety data acquisition, analysis and early warning |
| CN111417258A (en) * | 2020-05-15 | 2020-07-14 | 汪向丽 | Anti-aging circuit board |
| CN111417258B (en) * | 2020-05-15 | 2022-12-06 | 安徽全照电子有限公司 | Anti-aging circuit board |
| CN114258215A (en) * | 2021-12-23 | 2022-03-29 | 苏州汇川控制技术有限公司 | Control device |
| CN114258215B (en) * | 2021-12-23 | 2024-02-23 | 苏州汇川控制技术有限公司 | Control device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108024489B (en) | 2023-09-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108024489A (en) | Wiring board air-cooled radiating device | |
| CN107979962A (en) | Water-cooled circuit plate heat dissipating device | |
| CN101031195B (en) | A heat sink with a centrifugal fan | |
| CN105704984B (en) | A kind of integral type cooling device | |
| CN107211556B (en) | Cooling system and aircraft with cooling system | |
| JP4913333B2 (en) | Heat sink and uniform cooling method | |
| CN106208496A (en) | A kind of fluid-cooled electrical machine housing | |
| CN207820430U (en) | Wiring board air-cooled radiating device | |
| CN212115993U (en) | Heat pipe type temperature control cabinet using heat pipe as heat conducting element | |
| CN207820429U (en) | Water-jacket typ circuit plate heat dissipating device | |
| CN108024488A (en) | Water-jacket typ circuit plate heat dissipating device | |
| CN207820432U (en) | Water-cooled circuit plate heat dissipating device | |
| CN206060428U (en) | A kind of fluid-cooled electrical machine housing | |
| CN205611139U (en) | Radiator with high -efficient capacity of heat transmission | |
| CN205491614U (en) | Integral type cooling device | |
| CN209784925U (en) | Computer heat abstractor | |
| CN217064366U (en) | Fan multi-air-duct structure | |
| CN212435573U (en) | Inverter capable of dissipating heat quickly for electric locomotive | |
| CN201894036U (en) | Honeycomb water-cooling radiator | |
| CN106888566A (en) | Cooling device and power inverter | |
| CN208029293U (en) | A kind of high-efficiency radiator | |
| CN110582189A (en) | Heat pipe type temperature control cabinet using heat pipe as heat conducting element | |
| CN103188914A (en) | Radiating module | |
| CN213270386U (en) | Heat-insulation vortex air pump | |
| CN213586760U (en) | High-efficient aluminothermic tube radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |