CN212115993U - Heat pipe type temperature control cabinet using heat pipe as heat conducting element - Google Patents
Heat pipe type temperature control cabinet using heat pipe as heat conducting element Download PDFInfo
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- CN212115993U CN212115993U CN201921730257.7U CN201921730257U CN212115993U CN 212115993 U CN212115993 U CN 212115993U CN 201921730257 U CN201921730257 U CN 201921730257U CN 212115993 U CN212115993 U CN 212115993U
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 47
- 238000001816 cooling Methods 0.000 claims abstract description 41
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 238000012546 transfer Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 238000013461 design Methods 0.000 claims description 6
- 239000000498 cooling water Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Abstract
A heat pipe type temperature control cabinet using a heat pipe as a heat conducting element belongs to the technical field of heat dissipation of electronic equipment. The invention mainly utilizes two times of simple phase changes in the closed space of the heat pipe to absorb heat generated by the electronic element, and combines various heat transfer modes of heat conduction, natural convection and forced convection to efficiently and stably discharge the heat out of the cabinet. The temperature control cabinet mainly comprises a heat conduction substrate (1), a connecting plate (2), a heat pipe (3), radiating fins (4), a groove plate (5), a water cooling plate (6), an electronic fan (7), a guide plate (8), a shell (9), a water inlet (10) of the water cooling plate, a water outlet (11) of the water cooling plate and radiating holes (12). The invention effectively solves the problem of insufficient heat dissipation capability of the traditional cabinet, can meet the use requirements of low, medium and high different power conditions, and has the advantages of strong heat dissipation capability, high working reliability, good stability, modularized operation and the like.
Description
Technical Field
The invention relates to a heat pipe type temperature control cabinet using a heat pipe as a heat conducting element, and belongs to the technical field of heat dissipation of electronic equipment.
Background
Nowadays, the development of the electronic industry is very rapid, more and more electronic elements can be integrated on a circuit board, the performance of electronic equipment is more and more powerful, but the heat productivity of the circuit board is gradually increased due to the circuit densification. The quantity of circuit boards in the existing temperature control cabinet is limited by the heat dissipation capacity of the cabinet, a large space in the cabinet is wasted, the existing cabinet has single heat dissipation mode and poor heat dissipation capacity, local hot spots are easily generated in the cabinet, and the normal work of electronic equipment is easily influenced. Therefore, it is becoming more and more urgent to develop a temperature control cabinet with strong heat dissipation capability.
The heat pipe type temperature control cabinet realizes heat transfer by means of phase change and continuous circulation of working media inside the heat pipe, and the heat transfer efficiency is far higher than that of a cabinet which is generally cooled by a fan. Because the heat pipes are relatively independent, even if a single heat pipe fails, the normal work of other heat pipes cannot be influenced, and the working reliability is higher. In addition, the heat pipe has simple structure, less influence factors influencing the heat transfer effect, good stability of the heat transfer process and strong nonlinear adjustment capability. The cabinet adopts the design that the connecting plate is combined with the heat conducting substrate, and can be operated in a modularized mode. The temperature control cabinet effectively solves the problem that the existing cabinet is insufficient in heat dissipation capacity, and has the advantages of more accommodating quantity, high working reliability, good stability and the like. This patent utilizes the heat that the phase transition high efficiency absorption electronic component of working medium produced in the heat pipe, prevents the production of thermal pile up and local focus, utilizes heat conduction, natural convection, the multiple heat transfer mode of forced convection to combine together, can satisfy the operation requirement of low, well, high different power condition, has effectively ensured electronic component's normal work and the relatively stable of temperature in the rack.
Disclosure of Invention
The invention aims to provide a heat pipe type temperature control cabinet using a heat pipe as a heat conducting element.
The heat dissipation plate is composed of a heat conduction substrate (1), a connecting plate (2), a heat pipe (3), heat dissipation fins (4), a groove plate (5), a water cooling plate (6), an electronic fan (7), a guide plate (8), a shell (9), a water cooling plate water inlet (10), a water cooling plate water outlet (11) and heat dissipation holes (12).
Wherein heat conduction base plate (1) and circuit board direct contact, sliding contact between heat conduction base plate (1) and upper and lower connecting plate (2), connecting plate (2) press from both sides tight heat pipe (3), connecting plate (2) both ends are fixed by channel plate (5) level, radiating fin (4) are equipped with to the end of heat pipe (3), channel plate (5) are hugged closely in radiating fin (4), every layer of every side is equipped with water-cooling board (6) between channel plate (5) and casing (9), water-cooling board (6) link to each other with water-cooling board water inlet (10) and water-cooling board delivery port (11), casing (9) top both sides are equipped with two electronic fan (7), guide plate (8) are equipped with to electronic fan (7) top, casing (9) front portion, the rear portion, the top all opens louvre (12).
The electronic element works to generate heat, the heat is transferred to the heat conducting base plate (1) in a heat conducting mode, the heat conducting base plate (1) transfers the heat to the connecting plate (2) connected with the heat conducting base plate, the heat pipe (3) transfers the heat in the connecting plate (2) to the tail end, the radiating fin (4) at the tail end of the heat pipe (3) radiates one part of the heat into the air in the shell (9) and guides the other part of the heat into the groove-shaped plate (5), one part of the heat guided into the groove-shaped plate (5) is absorbed by the water flowing in the water cooling plate (6), the other part of the heat is radiated into the surrounding environment by the outer wall of the shell (9), the electronic fan (7) at the top of the shell (9) works, the fresh air enters the shell (9) from the radiating holes (12) of the front and rear cabinet doors of the shell (9), the air in the shell (9) flows from bottom to top, and in the flowing process, the, the hot air reaches the top of the housing (9) and is sent to the environment outside the housing (9) through the deflector (8).
The heat pipe (3) adopts an L-shaped design, so that heat in the connecting plate (2) is quickly led out, and heat accumulation in the plate is prevented. No wick may be disposed, or a channel wick, a wire mesh wick, a sintered wick, or a combination thereof may be disposed.
The heat radiating fins (4) can be integrally rolled by a pipe, the surface of the heat radiating fins, which is in contact with the groove-shaped plate (5), is as flat as possible, the heat exchange capacity of the heat radiating fins is improved, the heat radiating fins (4) can be made of materials with strong heat conduction capacity such as copper and aluminum, and the heat radiating fins can be longitudinal fins, patterned fins and pin-shaped fins.
The water cooling plates (6) are symmetrically arranged at each layer, cooling water in the water cooling plates (6) adopts a design of entering from bottom to top, and the water cooling plates are arranged at the outer sides of the groove-shaped plates (5) and cannot leak into the cabinet.
The water inlet (10) of the water cooling plate is provided with a water pump capable of adjusting the flow, and the flow of cooling water in the water cooling plate (6) can be adjusted according to actual conditions.
The electronic fan (7) can be arranged on each layer according to the requirement so as to achieve better forced convection effect.
The heat conducting base plate (1) and the connecting plate (2) are in sliding contact with each other in a mode of combining a limiting clamping groove, a fixed clamping groove and a movable clamping groove.
The connecting plate (2) is composed of an upper block and a lower block, the back surface of the connecting plate is processed into a semicircle, and the heat pipe is pressed tightly, or a flat plate type heat pipe can be adopted.
The device mainly realizes heat transfer through two times of simple phase changes in a heat pipe closed space.
Drawings
Fig. 1 is a front view of the present invention, and fig. 2 is an oblique view of the present invention.
Reference numbers in figures 1 and 2: 1. a heat conductive substrate; 2. a connecting plate; 3. a heat pipe; 4. a heat dissipating fin; 5. a trough plate; 6. a water-cooling plate; 7. an electronic fan; 8. a baffle; 9. a housing; 10. a water inlet of the water cooling plate; 11. a water outlet of the water-cooling plate; 12. and (4) heat dissipation holes.
FIG. 3 is a partial schematic view of the present invention.
Reference number designations in FIG. 3: 1. a movable clamping groove; 2. fixing the clamping groove; 3. a board card slot; 4. a heat pipe insulation section; 5. a heat pipe evaporation section; 6. a heat dissipating fin; 7. and a heat pipe condensation section.
Detailed Description
As shown in fig. 1 and 2, a heat pipe type temperature control cabinet using heat pipes as heat conducting elements mainly comprises a heat conducting substrate (1), a connecting plate (2), heat pipes (3), heat radiating fins (4), a trough plate (5), a water cooling plate (6), an electronic fan (7), a flow guiding plate (8), a shell (9), a water cooling plate water inlet (10), a water cooling plate water outlet (11) and heat radiating holes (12).
Wherein heat conduction base plate (1) and circuit board direct contact, sliding contact between heat conduction base plate (1) and upper and lower connecting plate (2), connecting plate (2) press from both sides tight heat pipe (3), connecting plate (2) both ends are fixed by channel plate (5) level, radiating fin (4) are equipped with to the end of heat pipe (3), channel plate (5) are hugged closely in radiating fin (4), every layer of every side is equipped with water-cooling board (6) between channel plate (5) and casing (9), water-cooling board (6) link to each other with water-cooling board water inlet (10) and water-cooling board delivery port (11), casing (9) top both sides are equipped with two electronic fan (7), guide plate (8) are equipped with to electronic fan (7) top, casing (9) front portion, the rear portion, the top all opens louvre (12).
The electronic element works to generate heat, the heat is transferred to the heat conducting base plate (1) in a heat conducting mode, the heat conducting base plate (1) transfers the heat to the connecting plate (2) connected with the heat conducting base plate, the heat pipe (3) transfers the heat in the connecting plate (2) to the tail end, the radiating fin (4) at the tail end of the heat pipe (3) radiates one part of the heat into the air in the shell (9) and guides the other part of the heat into the groove-shaped plate (5), one part of the heat guided into the groove-shaped plate (5) is absorbed by the water flowing in the water cooling plate (6), the other part of the heat is radiated into the surrounding environment by the outer wall of the shell (9), the electronic fan (7) at the top of the shell (9) works, the fresh air enters the shell (9) from the radiating holes (12) of the front and rear cabinet doors of the shell (9), the air in the shell (9) flows from bottom to top, and in the flowing process, the, the hot air reaches the top of the housing (9) and is sent to the environment outside the housing (9) through the deflector (8).
According to the invention, the heat generated by the circuit board is rapidly led out by utilizing two times of simple phase changes in the heat pipe closed space, and is efficiently and stably discharged out of the cabinet by matching with a series of heat transfer modes, so that the normal work of electronic elements in the cabinet is ensured, and the problems of insufficient heat dissipation capacity and unstable work of the traditional cabinet are effectively solved. The heat pipe is used as a main heat conducting element, and theoretical design and experimental verification prove that a brand-new solution can be provided for the high-density and high-power temperature control cabinet.
Claims (9)
1. The utility model provides an use heat pipe formula temperature control rack of heat pipe as heat-conducting element which characterized in that:
the heat dissipation device is composed of a heat conduction substrate (1), a connecting plate (2), a heat pipe (3), a heat dissipation fin (4), a groove plate (5), a water cooling plate (6), an electronic fan (7), a guide plate (8), a shell (9), a water inlet (10) of the water cooling plate, a water outlet (11) of the water cooling plate and a heat dissipation hole (12);
heat conduction base plate (1) and circuit board direct contact, sliding contact between heat conduction base plate (1) and upper and lower connecting plate (2), connecting plate (2) press from both sides tight heat pipe (3), connecting plate (2) both ends are fixed by channel plate (5) level, radiating fin (4) are equipped with to the end of heat pipe (3), channel plate (5) are hugged closely in radiating fin (4), every layer of every side is equipped with water-cooling board (6) between channel plate (5) and casing (9), water-cooling board (6) link to each other with water-cooling board water inlet (10) and water-cooling board delivery port (11), casing (9) top both sides are equipped with two electronic fan (7), electronic fan (7) top is equipped with guide plate (8), casing (9) front portion, the rear portion, the top all opens there is louvre (12).
2. A heat pipe type temperature control cabinet using a heat pipe as a heat conducting element according to claim 1, comprising the following steps:
electronic elements in the cabinet work to generate heat, the heat is transferred to the heat conducting base plate (1) in a heat conducting mode, the heat conducting base plate (1) transfers the heat to the connecting plate (2) connected with the heat conducting base plate, the heat pipe (3) transfers the heat in the connecting plate (2) to the tail end, the radiating fin (4) at the tail end of the heat pipe (3) radiates one part of the heat into the air in the shell (9) and guides the other part of the heat into the groove-shaped plate (5), one part of the heat guided into the groove-shaped plate (5) is absorbed by water flowing in the water cooling plate (6), the other part of the heat is radiated into the surrounding environment by the outer wall of the shell (9), the electronic fan (7) at the top of the shell (9) works, fresh air enters the shell (9) from the radiating holes (12) of front and rear cabinet doors of the shell (9), the air in the shell (9) flows from bottom to top, and in the flowing process, the water cooling plate (, the hot air reaches the top of the housing (9) and is sent to the environment outside the housing (9) through the deflector (8).
3. A heat pipe type temperature control cabinet using a heat pipe as a heat conducting element according to claim 1, wherein:
the heat pipe (3) adopts an L-shaped design, heat in the connecting plate (2) is quickly led out, heat in the plate is prevented from being accumulated, no wick can be arranged, and channel wick, silk screen wick, sintered wick or the combination thereof can also be arranged.
4. A heat pipe type temperature control cabinet using a heat pipe as a heat conducting element according to claim 1, wherein:
the heat dissipation fins (4) can be integrally rolled by a pipe, the surface of the heat dissipation fins, which is in contact with the groove-shaped plate (5), is as flat as possible, the heat exchange capacity of the heat dissipation fins is improved, the heat dissipation fins (4) can be made of copper and aluminum materials, and the heat dissipation fins can be longitudinal fins, patterned fins and pin-shaped fins.
5. A heat pipe type temperature control cabinet using a heat pipe as a heat conducting element according to claim 1, wherein:
the water cooling plates (6) are symmetrically arranged at each layer, cooling water in the water cooling plates (6) adopts a design of entering from bottom to top, and the water cooling plates are arranged on the outer sides of the groove-shaped plates (5) and cannot leak into the cabinet.
6. A heat pipe type temperature control cabinet using a heat pipe as a heat conducting element according to claim 1, wherein:
the water inlet (10) of the water cooling plate is provided with a water pump capable of adjusting the flow, and the flow of cooling water in the water cooling plate (6) can be adjusted according to actual conditions.
7. A heat pipe type temperature control cabinet using a heat pipe as a heat conducting element according to claim 1, wherein:
the electronic fan (7) can be arranged on each layer according to the requirement so as to achieve better forced convection effect.
8. A heat pipe type temperature control cabinet using a heat pipe as a heat conducting element according to claim 1, wherein:
the heat conducting base plate (1) and the connecting plate (2) are in sliding contact with each other in a limiting clamping groove, a fixed clamping groove and a movable clamping groove.
9. A heat pipe type temperature control cabinet using a heat pipe as a heat conducting element according to claim 1, wherein:
the connecting plate (2) is composed of an upper block and a lower block, the back surface of the connecting plate is processed into a semicircle, and the heat pipe is pressed tightly, or a flat plate type heat pipe can be adopted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921730257.7U CN212115993U (en) | 2019-10-15 | 2019-10-15 | Heat pipe type temperature control cabinet using heat pipe as heat conducting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921730257.7U CN212115993U (en) | 2019-10-15 | 2019-10-15 | Heat pipe type temperature control cabinet using heat pipe as heat conducting element |
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| Publication Number | Publication Date |
|---|---|
| CN212115993U true CN212115993U (en) | 2020-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921730257.7U Active CN212115993U (en) | 2019-10-15 | 2019-10-15 | Heat pipe type temperature control cabinet using heat pipe as heat conducting element |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110582189A (en) * | 2019-10-15 | 2019-12-17 | 南京工业大学 | Heat pipe type temperature control cabinet using heat pipe as heat conducting element |
| CN113329591A (en) * | 2021-05-08 | 2021-08-31 | 江西源能电气技术有限公司 | Frequency converter with cooling function |
-
2019
- 2019-10-15 CN CN201921730257.7U patent/CN212115993U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110582189A (en) * | 2019-10-15 | 2019-12-17 | 南京工业大学 | Heat pipe type temperature control cabinet using heat pipe as heat conducting element |
| CN110582189B (en) * | 2019-10-15 | 2024-05-21 | 南京工业大学 | Heat pipe type temperature control cabinet using heat pipe as heat conducting element |
| CN113329591A (en) * | 2021-05-08 | 2021-08-31 | 江西源能电气技术有限公司 | Frequency converter with cooling function |
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