CN211792634U - Air-cooled case using vapor chamber technology - Google Patents
Air-cooled case using vapor chamber technology Download PDFInfo
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- CN211792634U CN211792634U CN202020492115.8U CN202020492115U CN211792634U CN 211792634 U CN211792634 U CN 211792634U CN 202020492115 U CN202020492115 U CN 202020492115U CN 211792634 U CN211792634 U CN 211792634U
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Abstract
The utility model discloses an air-cooled case using vapor chamber technology, which comprises a shell (1), side plates (2), a front baffle (3), a middle baffle (4), a module (5) and a fan (6); the module consists of a PCB (51) and a heat dissipation plate (52), wherein the heat dissipation plate (52) is arranged on the PCB (51), and a heating element on the PCB (51) is tightly attached to the heat dissipation plate (52); the front clapboard (3) and the middle clapboard (4) are provided with groove positions, and the module (5) is inserted into the groove positions of the front clapboard (3) and the middle clapboard (4); the left side and the right side of the front partition plate (3) and the middle partition plate (4) are connected to the side plates (2), a certain distance is reserved between the side plates (2) and the shell (1) to form an air channel, air blown out by the fan (6) circulates in the air channel, and the heat dissipation plate (52) and the middle partition plate (4) are soaking plates. The utility model discloses use soaking plate technique and other heat dissipation techniques rationally and comprehensively, improved the heat-sinking capability of forced air cooling machine case greatly.
Description
Technical Field
The utility model belongs to the electronic mechanical engineering field relates to an use forced air cooling machine case of vapor chamber technique.
Background
With the rapid development of electronic technology, the volume of electronic equipment tends to be miniaturized, and the density of printed circuit boards also becomes higher and higher, so that the temperature of components rises, and the reliability of the components is reduced due to overhigh temperature of the components. When the temperature of the electronic original device rises by 2 ℃, the overall reliability is reduced by 10 percent, and the failure rate is doubled when the temperature rises by 10 ℃. Therefore, thermal design of electronic products is becoming more and more important, and how to reduce the operating temperature of microprocessors in electronic products is always a concern for thermal designers at home and abroad.
The heat of a module in a traditional air cooling case is firstly conducted to the heat dissipation side wall of the case through the module heat dissipation plate, and then is taken away by forced cooling air. Traditional heat dissipation machine parts are all formed by machining aluminum plates, the heat conductivity coefficient is not high, and heat conduction is limited. The thermal design of the avionics equipment is always a key technology of the structural design of the avionics equipment, and the research and application of the characteristics of the novel heat dissipation technology have great significance.
Disclosure of Invention
The invention aims to provide a novel air-cooled case using a vapor chamber technology, which reasonably and comprehensively uses the vapor chamber technology and other heat dissipation technologies and greatly improves the heat dissipation capacity of the air-cooled case.
The invention purpose of the utility model is realized by the following technical scheme:
an air-cooled chassis using vapor chamber technology comprises a shell 1, two side plates 2, a front partition plate 3, a middle partition plate 4, a module 5 and a fan 6; the module consists of a PCB (printed circuit board) 51 and a heat dissipation plate 52, wherein the heat dissipation plate 52 is arranged on the PCB 51, and a heating element on the PCB 51 is tightly attached to the heat dissipation plate 52; the front clapboard 3 and the middle clapboard 4 are provided with groove positions, and the module 5 is inserted into the groove positions of the front clapboard 3 and the middle clapboard 4; the left side and the right side of the front partition plate 3 and the middle partition plate 4 are connected to the side plates 2, the side plates 2 and the shell 1 are separated by a certain distance to form an air channel, and air blown out by the fan 6 circulates in the air channel; the heat radiating plate 52 and the intermediate plate 4 are soaking plates.
Preferably, the vapor chamber is manufactured using all aluminum sintering.
Preferably, the side plate 2 is designed with heat dissipation fins.
The beneficial effects of the utility model reside in that:
the power consumption of a single module in the common air cooling case is about 30 watts generally, and the utility model provides an use limit power consumption of the power consumption of a single module in the case of air cooling case of vapor chamber technique promotes 60 watts.
Drawings
Fig. 1 is a whole machine appearance diagram of a case of an air-cooled case using a vapor chamber technology.
Fig. 2 is a schematic structural diagram of a module.
Fig. 3 is a schematic diagram of the internal structure of an air-cooled cabinet using vapor chamber technology.
Fig. 4 is a schematic view of a heat dissipating fin on a side plate.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Referring to fig. 1 to 4, the whole air-cooled chassis includes a housing 1, two side plates 2, a front partition plate 3, a middle partition plate 4, a plurality of modules 5 and a fan 6, wherein the modules are composed of a PCB 51 and a heat dissipation plate 52, the heat dissipation plate 52 is installed on the PCB 51, and heat generating components on the PCB 51 are tightly attached to the heat dissipation plate 52. The front clapboard 3 and the middle clapboard 4 are provided with groove positions, and the module 5 is inserted into the groove positions of the front clapboard 3 and the middle clapboard 4. The left and right sides of the front partition plate 3 and the middle partition plate 4 are connected to the side plate 2, and the side plate 2 is provided with heat radiating fins. The side plates 2 and the shell 1 are separated by a certain distance to form an air channel, and air blown out by the fan 6 circulates in the air channel.
The heat transfer path of the case is as follows: the heat generated by the heat generating component is first transferred to the heat dissipating plate 52. The two sides of the heat dissipation plate 52 are tightly attached to the front partition plate 3 and the middle partition plate 4, and the heat is transferred to the front partition plate 3 and the middle partition plate 4 and then transferred to the side plates 2 and the heat dissipation fins. The fan blows air to the inside of the case, the direction of the air flow is shown in fig. 3, and the air flow blows the radiating fins on the side wall of the case to take heat out of the case.
The most critical part of the heat transfer path of the cabinet is the heat conduction in the heat dissipation plate 52, the middle partition plate 4 and the front partition plate 3. Because the heat of the module is large, the heat transfer path of the heat dissipation plate is long, and the heat conduction contact area of the module with the middle partition plate 4 and the front partition plate 3 is small, if the heat cannot be quickly transferred to the side plates to be dissipated, heat can be accumulated, and the temperature of the module rises.
Most of the structural materials of the common case are common aluminum alloy, and heat is conducted through the properties of the aluminum alloy materials. In this embodiment, the heat dissipation plate 52 of the module and the middle partition plate 4 of the chassis are designed using the vapor chamber technology.
The soaking plate is made of all-aluminum sintering, and heat is transferred by evaporation and condensation of a liquid medium in the vacuum cavity, so that a large amount of heat is diffused and transferred in a short time. The all-aluminum phase change soaking plate technology is a passive heat conducting element, has no energy consumption, no moving part, high reliability and no maintenance, and is applied to the market at present.
The heat conductivity coefficient of the common aluminum material is about 180W/MK, the heat conductivity coefficient of the soaking plate can be 2000W/MK, and the heat of the module is easily conducted to the side wall of the case. The heat dissipation capability of the case is greatly improved by matching with the air cooling design of the heat dissipation fins on the side wall. The power consumption of a single module in a common air-cooled case is about 30 watts generally, and the limit power consumption of the single module in the case is improved to 60 watts by the novel air-cooled case design.
Claims (3)
1. An air-cooled chassis using a vapor chamber technology comprises a shell (1), two side plates (2), a front partition plate (3), a middle partition plate (4), a module (5) and a fan (6); the module consists of a PCB (51) and a heat dissipation plate (52), wherein the heat dissipation plate (52) is arranged on the PCB (51), and a heating element on the PCB (51) is tightly attached to the heat dissipation plate (52); the front clapboard (3) and the middle clapboard (4) are provided with groove positions, and the module (5) is inserted into the groove positions of the front clapboard (3) and the middle clapboard (4); the left side and the right side of the front partition plate (3) and the middle partition plate (4) are connected to the side plates (2), a certain distance is reserved between the side plates (2) and the shell (1) to form an air channel, and air blown out by the fan (6) circulates in the air channel, and the heat dissipation plate (52) and the middle partition plate (4) are soaking plates.
2. An air-cooled cabinet using soaking plate technology according to claim 1, characterized in that said soaking plate is made by using all-aluminum sintering.
3. An air-cooled cabinet using soaking plate technology according to claim 1, characterized in that the side plates (2) are designed with heat radiating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020492115.8U CN211792634U (en) | 2020-04-07 | 2020-04-07 | Air-cooled case using vapor chamber technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020492115.8U CN211792634U (en) | 2020-04-07 | 2020-04-07 | Air-cooled case using vapor chamber technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211792634U true CN211792634U (en) | 2020-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202020492115.8U Active CN211792634U (en) | 2020-04-07 | 2020-04-07 | Air-cooled case using vapor chamber technology |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114269112A (en) * | 2021-12-09 | 2022-04-01 | 海鹰企业集团有限责任公司 | Radiating case for underwater cylindrical electronic cabin |
-
2020
- 2020-04-07 CN CN202020492115.8U patent/CN211792634U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114269112A (en) * | 2021-12-09 | 2022-04-01 | 海鹰企业集团有限责任公司 | Radiating case for underwater cylindrical electronic cabin |
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