CN216451715U - Air cooling and cold guiding combined heat dissipation type case structure - Google Patents

Abstract

The utility model discloses an air-cooling and cold-guiding combined radiating type case structure, which comprises a case, wherein a plurality of module assembling boxes are arranged in the case in an up-down stacked manner, the side walls of the module assembling boxes are contacted with radiating fins arranged on the inner side wall of the case, a fan is arranged on the inner side wall of the case, which is close to the radiating fins but far away from the module assembling boxes, and an air outlet is arranged on the case, which is opposite to the fan, wherein: the module assembling box for placing the electronic module is made of heat conducting materials, and the heat conducting pipe is embedded on the outer wall of the module assembling box. The utility model has high heat dissipation efficiency, good electromagnetic compatibility, light weight and low cost, and can meet the heat dissipation requirements of high-power and low-power electronic equipment.

Description

Air cooling and cold guiding combined heat dissipation type case structure

Technical Field

The present invention relates to electronic device enclosures, and particularly to an air-cooled, and heat-guided combined heat dissipation enclosure structure.

Background

With the rapid development of electronic technology, the power of electronic equipment is larger and larger, but the physical size is smaller and smaller, and the problems brought by the power are that the heat flux density is increased sharply, the heat dissipation risk is increased, and particularly when the electronic equipment is operated in a high-temperature working environment, the reliable operation of the electronic equipment cannot be well heat dissipation.

At present, three main heat dissipation methods are used for a case for placing electronic equipment: air cooling, liquid cooling and lead cold heat dissipation, wherein: the heat dissipation efficiency of air cooling heat dissipation is moderate, and the electromagnetic heat dissipation device is suitable for equipment with low heat dissipation requirements, but the electromagnetic compatibility is poor. The liquid cooling heat dissipation has high heat dissipation efficiency, but needs secondary cooling equipment, thus the weight (hundreds of kilograms) and the cost of the whole case are increased invisibly. The electromagnetic compatibility of cold conduction and heat dissipation is good, but the heat dissipation efficiency is low, and the cold conduction and heat dissipation device is generally used for low-power consumption equipment (below 50 watts). Therefore, for high-power consumption equipment (more than 50 watts), a case structure with high heat dissipation efficiency, good electromagnetic compatibility, light weight and low cost does not exist at present, and needs to be solved urgently.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an air-cooling and cold-guiding combined heat dissipation type case structure which is high in heat dissipation efficiency, good in electromagnetic compatibility, light in weight and low in cost and can meet the heat dissipation requirements of high-power and low-power electronic equipment.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a cold combination heat dissipation formula quick-witted case structure is led in air-cooling which characterized in that: it includes quick-witted case, and a plurality of module assembly boxes are located quick-witted incasement range upon range of from top to bottom, and the radiating fin contact that sets up on the lateral wall of module assembly box and the quick-witted incasement wall, the fan is installed to the position that is close to radiating fin but keeps away from the module assembly box on the inside wall of machine case, and is equipped with the air exit on the relative position with the fan on the quick-witted case, wherein: the module assembling box for placing the electronic module is made of heat conducting materials, and a heat conducting pipe is embedded on the outer wall of the module assembling box.

The utility model has the advantages that:

the utility model adopts a heat dissipation mode combining cold conduction and forced air cooling, has high heat dissipation efficiency, good electromagnetic compatibility, light weight and low cost, and can meet the requirement of long-time reliable operation of high-power consumption electronic equipment (more than 50 watts) in a working environment below 40 ℃.

Drawings

Fig. 1 is a schematic view of the air-cooling and cold-guiding combined heat dissipation type chassis structure of the present invention.

Fig. 2 is a schematic left side view of fig. 1.

Fig. 3 is a schematic view of a module assembly cassette.

Detailed Description

As shown in fig. 1 to 3, the air-cooled, cold-guided, combined and heat-dissipating type chassis structure of the present invention includes a rectangular chassis 10, a plurality of module assembling boxes 30 are arranged in the chassis 10 in an up-down stacked manner, the side walls of the module assembling boxes 30 are in contact with aluminum heat dissipating fins 20 arranged on the inner side walls of the chassis 10 (for example, fig. 1 shows a case where the two side walls of the module assembling boxes 30 are in contact with the heat dissipating fins 20 on the two inner side walls of the chassis 10, respectively), a fan 40 is installed on the inner side walls of the chassis 10 at a position close to the heat dissipating fins 20 but far away from the module assembling boxes 30, and an air outlet 12 is arranged on the chassis 10 at a position opposite to the fan 40, wherein: the module assembling box 30 for accommodating an electronic module (or electronic device, not shown in the figures) is made of a heat conducting material (such as aluminum), and a heat conducting pipe 33 is embedded on the outer wall of the module assembling box 30.

As shown in fig. 1, the module assembling boxes 30 adjacent to each other are detachably snap-fitted.

Referring to fig. 3, the module assembling case 30 is composed of a case body 31 with an upper opening and an upper cover 32, and a heat pipe 33 is provided on the case body 31 and/or the upper cover 32, wherein: the higher the heat dissipation of the electronic module placed in the module assembling case 30, the denser the heat conduction pipe 33 is arranged on the module assembling case 30.

In practical use, as shown in fig. 3, the thickness, length, and orientation of the heat transfer pipe 33 are not limited. In the present invention, the heat conductive pipe 33 for rapidly dissipating heat is an existing component in the art. Generally, the heat transfer pipe 33 includes a copper pipe in which a copper mesh is provided, and industrial pure water is poured and air in the pipe is drawn out to be in a near vacuum state. When the heat is conducted to the heat pipe 33, the industrial pure water in the pipe reaches the boiling point to generate a gasification phenomenon, so that the gas formed by the absorbed heat energy rapidly expands, and when the gas contacts a cold area, a condensation phenomenon is generated, and then the absorbed heat is released. The condensed liquid returns to the heat source due to the capillary phenomenon of the microstructure, and the heat dissipation effect of reducing heat is achieved in a repeated way.

In practical design, a gap between a chip (generally referred to as a chip which needs to operate at high speed and is easy to heat) on an electronic module disposed in the module assembly box 30 and the upper cover plate 32 is filled with a heat conductive silicone grease (also referred to as a thermal grease) to reduce thermal contact resistance and improve heat conductivity.

In general, the thermal conductivity of the thermally conductive silicone grease is preferably designed to be 5W/mK.

In practical design, the fan 40 may be designed as a fan with controllable wind speed, and the fan 40 is connected to a temperature sensor (not shown) installed in the housing 10, and the temperature sensor controls the operation speed of the fan 40 according to the temperature inside the housing measured by the temperature sensor.

In practical applications, a heat dissipation window 11 is disposed on the chassis 10 opposite to the heat dissipation fins 20, which can be understood by referring to the heat dissipation window 11 disposed on the front wall of the chassis 10 in fig. 1.

Of course, other components, such as a door, a handle, etc., can be designed on the casing 10 according to actual requirements, without limitation.

When in use, the utility model adopts a heat dissipation mode of taking forced air cooling heat dissipation as a main part and cold conduction heat dissipation as an auxiliary part, and particularly comprises the following steps: the electronic module in the module assembling box 30, especially the chip thereon, can emit a large amount of heat during operation, so, on one hand, the emitted heat is conducted to the heat conducting pipe 33 through the module assembling box 30 (the chip conducts the heat through the heat conducting silicone grease contacted with the chip), and part of the heat is rapidly emitted by the heat conducting pipe 33, so that the heat flux density can be rapidly reduced, namely, the electronic module in the module assembling box 30 is subjected to heat dissipation treatment by adopting a cold conduction heat dissipation mode, on the other hand, the emitted heat is conducted to the heat dissipating fins 20 on the inner side wall of the case 10 through the module assembling box 30, and then the purpose of carrying out convection heat exchange on the inside of the case 10 is achieved through the fan 40, the heat on the surface of the heat dissipating fins 20 is pumped out of the case 10, namely, the whole case is subjected to heat dissipation treatment by adopting a forced air cooling mode.

The utility model has short heat dissipation path, small thermal resistance and short conduction time, achieves good heat dissipation effect, and can meet the requirement of long-time reliable operation of high-power consumption electronic equipment (electronic equipment with power of more than 50 watts) in a working environment below 40 ℃.

The utility model has the advantages that:

the utility model adopts a heat dissipation mode combining cold conduction and forced air cooling, has high heat dissipation efficiency, good electromagnetic compatibility, light weight and low cost, and can meet the requirement of long-time reliable operation of high-power consumption electronic equipment (more than 50 watts) in a working environment below 40 ℃.

The above description is of the preferred embodiment of the present invention and the technical principles applied thereto, and it will be apparent to those skilled in the art that any changes and modifications based on the equivalent changes and simple substitutions of the technical solutions of the present invention are within the protection scope of the present invention without departing from the spirit and scope of the present invention.

Claims (7)

1. The utility model provides a cold combination heat dissipation formula quick-witted case structure is led in air-cooling which characterized in that: it includes quick-witted case, and a plurality of module assembly boxes are located quick-witted incasement range upon range of from top to bottom, and the radiating fin contact that sets up on the lateral wall of module assembly box and the quick-witted incasement wall, the fan is installed to the position that is close to radiating fin but keeps away from the module assembly box on the inside wall of machine case, and is equipped with the air exit on the relative position with the fan on the quick-witted case, wherein: the module assembling box for placing the electronic module is made of heat conducting materials, and a heat conducting pipe is embedded on the outer wall of the module assembling box.

2. The air-cooled cold-guiding combined heat dissipation type case structure of claim 1, wherein:

the module assembling boxes which are adjacent up and down are detachably clamped and fixed.

3. The air-cooled cold-guiding combined heat dissipation type case structure of claim 1, wherein:

the module assembly box comprises an upper open box body and an upper cover plate, the heat conducting pipe is arranged on the box body and/or the upper cover plate, wherein: the higher the heat dissipation of the electronic module arranged in the module assembly box is, the denser the heat conduction pipes arranged on the module assembly box are.

4. The air-cooled cold-guiding combined heat dissipation type case structure of claim 3, wherein:

a gap between the chip on the electronic module and the upper cover plate, which are placed in the module assembly box, is filled with heat-conductive silicone grease.

5. The air-cooled cold-guiding combined heat-dissipating type case structure of claim 4, wherein:

the heat conductivity coefficient of the heat-conducting silicone grease is 5W/mK.

6. The air-cooled cold-guiding combined heat dissipation type case structure of claim 1, wherein:

the fan is a fan with controllable wind speed and is connected with a temperature sensor arranged in the case.

7. The air-cooled cold-guiding combined heat-dissipating type case structure of any one of claims 1 to 6, wherein:

and a heat dissipation window is arranged on the case at a position opposite to the heat dissipation fins.

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