CN207663379U - A kind of VPX conduction coolings cabinet - Google Patents
A kind of VPX conduction coolings cabinet Download PDFInfo
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- CN207663379U CN207663379U CN201721207902.8U CN201721207902U CN207663379U CN 207663379 U CN207663379 U CN 207663379U CN 201721207902 U CN201721207902 U CN 201721207902U CN 207663379 U CN207663379 U CN 207663379U
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- vpx
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Abstract
The utility model discloses a kind of VPX conduction coolings cabinets, including case box and cabinet bottom plate, the case box is installed on cabinet bottom plate, and the VPX conduction coolings cabinet further includes heat pipe, the heat pipe is at least one, and the heat pipe is installed in the case box and cabinet bottom plate.The VPX conduction coolings cabinet of the utility model increases heat pipe auxiliary heat dissipation on the basis of existing VPX conduction coolings cabinet and improves the heat conduction efficiency on the heat conduction path of VPX conduction cooling cabinets due to the fabulous thermal diffusivity of heat pipe, improves its capacity of heat transmission.So that VPX conduction cooling cabinets can adapt to more harsh temperature environment, while also extending the service life of equipment.
Description
Technical field
The utility model is related to the cooling correlative technology field of VPX bus communication technologies, more particularly to a kind of VPX conduction coolings machine
Case.
Background technology
VPX, also referred to as VITA46 are a kind of serial data communication standards.In being communicated in data, entity hardware components
Can due to electric current by by generate a large amount of heat, therefore, it is necessary to corresponding hardware device carry out timely radiating treatment and
The problems such as avoiding generating delay machine.
Fig. 1 show existing VPX conduction coolings decomposition module figure.VPX conduction coolings module by front shroud 101, center component 102,
PCB components 103 and the superposition fixation of back shroud 104 form.Meet conduction cooling module (VITA48.2-2010) packet of OpenVPX standards
Include two kinds of specifications of 3U and 6U, wherein the VPX conduction cooling modular structures composition of 6U is similar to the VPX conduction cooling modules of 3U, and Fig. 1 is shown
The VPX conduction cooling modules of 6U.
Fig. 2 show existing VPX conduction coolings casing structure exploded view.Wherein, which includes case box 3
With cabinet bottom plate 4, the case box 3 is installed on cabinet bottom plate 4.Back board module is installed on cabinet bottom plate 4
2, in the structure installed, back board module 2 is located in case box 3.Multiple VPX conduction coolings modules 1 are parallelly vertically
(directions x in Fig. 2) grafting enters in case box 3.Fig. 2 show a kind of vertical plug-in card conduction cooling cabinets of VPX, which meets VPX
Conduction cooling cabinet specification VITA48.2-2010, wherein VPX conduction coolings module 1 plugs vertically, and cooperation is equipped in the inside of case box 3
The slot that VPX conduction coolings module 1 plugs vertically.In order to coordinate the modular structure of two kinds of specifications of 3U and 6U, VPX conduction coolings cabinet that can be divided into
Two class of 3U conduction coolings cabinet and 6U conduction coolings cabinet, Fig. 2 show a kind of VPX conduction cooling cabinets of 6U.
Fig. 3 show the heat transfer direction schematic diagram of existing VPX conduction coolings cabinet.In Fig. 3, arrow direction indicates heat
Conduction orientation, from figure 3, it can be seen that the heat that VPX conduction coolings module 1 is given out is conducted to the case box 3 at its both ends
In box side 301, and then conduction is to cabinet bottom plate 4 downwards by box side 301, finally by the bottom of cabinet bottom plate 4
Portion is downwards in conduction to ambient enviroment.
The heat conduction path that can be seen that existing VPX conduction coolings cabinet from heat conduction path shown in Fig. 3 is longer, and shows
The thermal resistance of the mounting surface between case box 3 and cabinet bottom plate 4 in some VPX conduction coolings cabinets is bigger, results in VPX and leads
Chill block 1 arrives the heat sink very big of equipment mounting surface.In addition, existing VPX conduction coolings cabinet material uses aluminium alloy, thermal conductivity is not
It is high.And then for these reasons, the problem of the capacity of heat transmission deficiency of existing VPX conduction coolings cabinet is resulted in, and then result in it
Internal electronic device junction temperature increases, and the function of having seriously affected equipment uses and the service life.
Utility model content
In view of this, the utility model provides a kind of VPX conduction coolings cabinet, to improve its capacity of heat transmission.
What the technical solution of the utility model was realized in:
A kind of VPX conduction coolings cabinet, including case box and cabinet bottom plate, the case box are installed on cabinet bottom plate
On, the VPX conduction coolings cabinet further includes:
Heat pipe, the heat pipe are at least one, and the heat pipe is installed in the case box and cabinet bottom plate.
Further, every heat pipe all has evaporator section and condensation segment, wherein the evaporator section of heat pipe is located at the cabinet case
The condensation segment of body, heat pipe is located at the cabinet bottom plate.
Further, the perpendicular bending of every heat pipe so that its evaporator section and condensation segment are mutually perpendicular to.
Further, the case box offers the first groove, to accommodate the heat pipe.
Further, the cabinet bottom plate offers the second groove, to accommodate the heat pipe.
Further, the VPX conduction coolings cabinet further includes the first groove baffle, and the first groove baffle is installed on described
The notch of one groove is to cover the heat pipe for blocking first groove and being located therein.
Further, the VPX conduction coolings cabinet further includes the second groove baffle, and the second groove baffle is installed on described
The notch of two grooves is to cover the heat pipe for blocking second groove and being located therein.
Further, heat-conducting silicone grease is filled between first groove and heat pipe.
Further, heat-conducting silicone grease is filled between second groove and heat pipe.
Further, the heat pipe is arranged in parallel.
From said program as can be seen that the VPX conduction coolings cabinet of the utility model increases on the basis of existing VPX conduction coolings cabinet
Heating tube auxiliary heat dissipation improves the heat transfer on the heat conduction path of VPX conduction cooling cabinets due to the fabulous thermal diffusivity of heat pipe
Efficiency improves its capacity of heat transmission.So that VPX conduction cooling cabinets can adapt to more harsh temperature environment, while also extending
The service life of equipment.
Description of the drawings
Fig. 1 is existing VPX conduction coolings decomposition module figure;
Fig. 2 is existing VPX conduction coolings casing structure exploded view;
Fig. 3 is the heat transfer direction schematic diagram of existing VPX conduction coolings cabinet;
Fig. 4 is the principle schematic diagram of heat pipe;
Fig. 5 is the schematic cross-sectional view of the VPX conduction cooling cabinets of the utility model embodiment;
Fig. 6 is the schematic shapes of heat pipe used in the utility model embodiment;
Fig. 7 is the case box cross-sectional view in the utility model embodiment;
Fig. 8 is the cabinet bottom plate cross-sectional view in the utility model embodiment;
Fig. 9 is the upward view of the cabinet bottom plate in the utility model embodiment;
Figure 10 is the cross-sectional view of the first groove of case box and heat pipe section in the utility model embodiment;
Figure 11 is the overall appearance structural representation of the VPX conduction cooling cabinets of the utility model embodiment.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, develop simultaneously reality referring to the drawings
Example is applied, the utility model is described in further detail.
The utility model embodiment is improved to existing VPX conduction coolings casing structure, is installed in VPX conduction cooling cabinets more
Root heat pipe improves VPX conduction cooling cabinet capacity of heat transmissions using the outstanding heat conduction efficiency of heat pipe.
Fig. 4 show the principle schematic diagram of heat pipe.Heat pipe is a kind of heat transfer element with very high thermal conductivity, such as
Shown in Fig. 4, heat pipe transmits heat by the evaporation of the liquid in Totally enclosed vacuum pipe with condensation, utilizes the streams such as capillarity
Body principle plays the effect of similar freezer compressor refrigeration.Heat pipe has very high thermal conductivity, excellent isothermal, hot-fluid close
Spend changeability, direction of heat flow irreversibility, can remotely transferring, thermostatic characteristics (controllable heat pipe), thermal diode and thermal switch
Can etc. series of advantages, and the heat exchanger being made of heat pipe has that heat transfer efficiency is high, compact-sized, fluid resistance damage it is small etc. excellent
Point.One end of heat pipe is evaporator section (bringing-up section), and the other end is condensation segment (cooling section), according to using needs, in evaporator section and
Isolation section is arranged between condensation segment.Liquid evaporation vaporization when one end of heat pipe is heated in capillary wick, steam is in small pressure
Other end releasing heat is flowed under difference and condenses into liquid, and evaporator section is flowed back in effect of the liquid again along porous material by capillary force, such as
This cycle not oneself, and then heat reaches another-end by one end of heat pipe, as shown in arrow direction in Fig. 4.
As shown in figure 5, the schematic cross-sectional view of the VPX conduction cooling cabinets for the utility model embodiment.The utility model
The VPX conduction cooling cabinets of embodiment, including case box 3 and cabinet bottom plate 4, wherein the case box 3 is installed on cabinet bottom
On cover board 4, the VPX conduction cooling cabinets of the utility model embodiment further include heat pipe 5, and the heat pipe is at least one, the heat pipe 5
It is installed in the case box 3 and cabinet bottom plate 4.
As shown in fig. 6, in the utility model embodiment, the perpendicular bending of each every heat pipe 5.In conjunction with Fig. 4
Shown in heat pipe structure, every heat pipe all has evaporator section and condensation segment, and in the utility model embodiment, the evaporator section of heat pipe is set
It is placed in the case box 3, the condensation segment of heat pipe is set to the cabinet bottom plate 4, and then 5 evaporator section of heat pipe and condensation
Section is mutually perpendicular to.In conjunction with the schematic diagram in the heat transfer direction of existing VPX conduction coolings cabinet shown in Fig. 3, the utility model is implemented
In example, the heat that VPX conduction coolings module 1 is given out conducts the evaporation of the heat pipe 5 into the box side of the case box 3 at its both ends
Section, so heat conducted by the evaporator section in the box side of case box 3 in heat pipe 5 it is cold into the cabinet bottom plate 4
Solidifying section, finally by the bottom of cabinet bottom plate 4 downwards conduction to ambient enviroment.
In order to install the heat pipe 5, the case box 3 and cabinet bottom plate 4 open up groove.Specifically, such as Fig. 7 institutes
Show, the case box 3 offers the first groove 303, to accommodate the heat pipe 5, as shown in figure 8, the cabinet bottom plate 4 is opened
Equipped with the second groove 403, to accommodate the heat pipe 5.
In addition, in order to protect heat pipe 5, as shown in Figure 5, Figure 7, the VPX conduction coolings cabinet further includes the first groove baffle
302, the first groove baffle 302 is installed on the notch of first groove 303 and blocks 303 He of the first groove to cover
The heat pipe 5 being located therein can be directed to individually designed one the first groove baffle 302 of each first groove baffle 302 with one-to-one
The heat pipe 5 that ground covering is blocked each first groove 303 and is located therein.As shown in Figure 8, Figure 9, the VPX conduction coolings cabinet also wraps
The second groove baffle 402 is included, the notch that the second groove baffle 402 is installed on second groove 403 blocks institute to cover
It groove 403 and the heat pipe 5 that is located therein to state second, can the second groove baffle 402 be made one whole and the cabinet bottom that is covered in
The bottom of cover board 4, and then it groove 403 and the heat pipe 5 that is located therein to cover second blocked in cabinet bottom plate 4 simultaneously, such as Fig. 9
It is shown.
After heat pipe 5 is installed in the first groove 303 and the second groove 403, can exist between thermotube wall and groove
The air gap can influence heat conduction in this way.In view of the problem, in the utility model embodiment, as shown in Figure 10, in case box
3 parts are filled with heat-conducting silicone grease in the gap 304 between the first groove 303 and the tube wall 501 of heat pipe 5, similarly, in machine
4 part of bottom cover board is also filled with heat-conducting silicone grease in the gap between the second groove 403 and the tube wall of heat pipe 5.
Figure 11 shows the overall appearance structure of the VPX conduction cooling cabinets of the utility model embodiment, referring to Figure 11, Fig. 5 and
Shown in Fig. 9, in the utility model embodiment, multiple heat pipes 5 are arranged in parallel, can play the effect of Homogeneouslly-radiating in this way.
It is two symmetrically arranged heat pipes 5 in the section of each groove with heat pipe 5 in addition, in section shown in Figure 5,
The two 5 evaporator sections of heat pipe are located in two box sides opposite in case box 3, just play symmetrical heat in this way
The effect of conduction so that wherein the heat of VPX conduction coolings module 1 can equably shed.
The process of the VPX conduction cooling cabinets of the utility model, can be on the basis of existing VPX conduction coolings cabinet, in cabinet
Half slot is processed on the outer wall of babinet 3, to form the first groove 303, in addition processes a part --- cabinet exterior baffle, i.e.,
One groove baffle 302, and then a circular cavity is formed after the first groove baffle 302 and the cooperation of 3 outer wall of case box, to accommodate heat
The evaporator section of pipe 1.
Similarly, half slot is processed in cabinet bottom plate 4, to form the second groove 403, in addition processes one zero
Part --- cabinet bottom plate cover board, i.e. the second groove baffle 402, the second groove 403 are formed after coordinating with the second groove baffle 402
One circular cavity, to accommodate the condensation segment of heat pipe 1.
Later, half be embedded to after heat-conducting silicone grease is uniformly smeared on the surface of heat pipe 5 in case box 3 and cabinet bottom plate 4
In circular groove, later, upper box outer wall baffle and cabinet bottom plate cover board are pressed, screw is used in combination to fasten, rationally designing structure needs to ensure
The unilateral gap of the cylindrical cavity (the first groove 303) of heat pipe 5 and case box 3, the cylindrical cavity (the second groove 403) of cabinet bottom plate 4 is not
More than 0.15mm, this gap is filled with heat-conducting silicone grease.
Above-described embodiment is illustrated by taking the VPX conduction cooling cabinets of 6U as an example, and the VPX conduction coolings cabinet of 3U and its structure are similar
Seemingly, details are not described herein again.
The VPX conduction coolings cabinet of the utility model increases heat pipe auxiliary heat dissipation on the basis of existing VPX conduction coolings cabinet, due to
The fabulous thermal diffusivity of heat pipe, improves the heat conduction efficiency on the heat conduction path of VPX conduction cooling cabinets, improves its heat transfer energy
Power.So that VPX conduction cooling cabinets can adapt to more harsh temperature environment, while also extending the service life of equipment.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent substitution, improvement and etc. done should be included in the utility model
Within the scope of protection.
Claims (8)
1. a kind of VPX conduction coolings cabinet, including case box and cabinet bottom plate, the case box are installed on cabinet bottom plate
On, which is characterized in that the VPX conduction coolings cabinet further includes:
Heat pipe, the heat pipe are at least one, and the heat pipe is installed in the case box and cabinet bottom plate;
Wherein, the case box offers the first groove, to accommodate the heat pipe;
The VPX conduction coolings cabinet further includes the first groove baffle, and the first groove baffle is installed on the slot of first groove
Mouth is to cover the heat pipe for blocking first groove and being located therein.
2. VPX conduction coolings cabinet according to claim 1, it is characterised in that:
Every heat pipe all has evaporator section and condensation segment, wherein the evaporator section of heat pipe is located at the case box, the condensation of heat pipe
Section is located at the cabinet bottom plate.
3. VPX conduction coolings cabinet according to claim 2, it is characterised in that:
The perpendicular bending of every heat pipe so that its evaporator section and condensation segment are mutually perpendicular to.
4. VPX conduction coolings cabinet according to claim 1, it is characterised in that:
The cabinet bottom plate offers the second groove, to accommodate the heat pipe.
5. VPX conduction coolings cabinet according to claim 4, it is characterised in that:
The VPX conduction coolings cabinet further includes the second groove baffle, and the second groove baffle is installed on the slot of second groove
Mouth is to cover the heat pipe for blocking second groove and being located therein.
6. VPX conduction coolings cabinet according to claim 1, it is characterised in that:
Heat-conducting silicone grease is filled between first groove and heat pipe.
7. VPX conduction coolings cabinet according to claim 4, it is characterised in that:
Heat-conducting silicone grease is filled between second groove and heat pipe.
8. VPX conduction coolings cabinet according to any one of claims 1 to 7, it is characterised in that:
The heat pipe is arranged in parallel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201721207902.8U CN207663379U (en) | 2017-09-20 | 2017-09-20 | A kind of VPX conduction coolings cabinet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201721207902.8U CN207663379U (en) | 2017-09-20 | 2017-09-20 | A kind of VPX conduction coolings cabinet |
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CN207663379U true CN207663379U (en) | 2018-07-27 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111263567A (en) * | 2020-01-21 | 2020-06-09 | 中国科学院电子学研究所 | Machine box |
CN116234245A (en) * | 2023-02-07 | 2023-06-06 | 中国科学院国家空间科学中心 | Cold-conducting and heat-dissipating device for ultra-large power consumption electronic components |
-
2017
- 2017-09-20 CN CN201721207902.8U patent/CN207663379U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111263567A (en) * | 2020-01-21 | 2020-06-09 | 中国科学院电子学研究所 | Machine box |
CN116234245A (en) * | 2023-02-07 | 2023-06-06 | 中国科学院国家空间科学中心 | Cold-conducting and heat-dissipating device for ultra-large power consumption electronic components |
CN116234245B (en) * | 2023-02-07 | 2023-09-15 | 中国科学院国家空间科学中心 | Cold-conducting and heat-dissipating device for ultra-large power consumption electronic components |
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Address after: 16th Floor of No.63 Satellite Building, Zhichun Road, Haidian District, Beijing, 100190 Patentee after: Beijing Guoke Huanyu Science and Technology Co., Ltd. Address before: 16th Floor of No.63 Satellite Building, Zhichun Road, Haidian District, Beijing, 100190 Patentee before: Beijing Guokehuanyu Space Technology Co., Ltd. |