CN108174587B - Display device - Google Patents
Display device Download PDFInfo
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- CN108174587B CN108174587B CN201810101536.0A CN201810101536A CN108174587B CN 108174587 B CN108174587 B CN 108174587B CN 201810101536 A CN201810101536 A CN 201810101536A CN 108174587 B CN108174587 B CN 108174587B
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- Prior art keywords
- heat dissipation
- display device
- channel
- dissipation channel
- air channel
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 81
- 238000001816 cooling Methods 0.000 claims abstract description 14
- 238000012546 transfer Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000004065 semiconductor Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 8
- 239000003566 sealing material Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 13
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000002937 thermal insulation foam Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20972—Forced ventilation, e.g. on heat dissipaters coupled to components
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a display device, comprising an inner heat dissipation channel, an outer heat dissipation channel and a heat exchange component; the inner heat dissipation channel is a channel with two closed ends and is arranged in the display device to cool the internal components of the display device; the heat exchange component is arranged between the inner heat dissipation channel and the outer heat dissipation channel to cool the air in the inner heat dissipation channel and transfer the heat generated in the cooling process to the outer heat dissipation channel; the external heat dissipation channel is arranged outside the display device and communicated with external air so as to transfer heat to the outside of the display device. By implementing the invention, the limited space can be utilized to realize the cooling of the inside of the display device.
Description
Technical Field
The present invention relates to the field of display, and more particularly, to a display device.
Background
The current electronic equipment, especially outdoor electronic equipment, usually adopts a heat exchange mode that a fan draws natural wind from an air inlet and blows the natural wind into the device and then draws hot wind from an air outlet, so as to achieve the aim of cooling the device. The internal air duct of the display device cannot be completely sealed in the existing heat exchange mode, the display device is easy to be influenced by external environment, a large amount of dust can be accumulated in the display device after long-time operation, so that performance is influenced, and in addition, the volume of the existing device can be reduced under the condition of reducing occupied space as much as possible for cost and thin and narrow appearance design. The wind channel space that the wind of reserving the fan was operated like this is less, how to utilize reasonable space reasonable wind flow direction wind channel and heat transfer mode of design then is an important technical index of current cooling technology.
Disclosure of Invention
The present invention is directed to a display device that overcomes the above-mentioned drawbacks of the prior art.
The technical scheme adopted for solving the technical problems is as follows: a display device is constructed, comprising an inner heat dissipation channel, an outer heat dissipation channel and a heat exchange component;
the inner heat dissipation channel is a channel with two closed ends and is arranged in the display device to cool the internal components of the display device;
The heat exchange component is arranged between the inner heat dissipation channel and the outer heat dissipation channel to cool the air in the inner heat dissipation channel and transfer the heat generated in the cooling process to the outer heat dissipation channel;
The external heat dissipation channel is arranged outside the display device and communicated with external air so as to transfer the heat to the outside of the display device.
Preferably, the heat exchanging part includes a semiconductor refrigerator, a first heat conductive material provided between the semiconductor refrigerator and the outer heat dissipation channel, and a second heat conductive material provided between the semiconductor refrigerator and the inner heat dissipation channel.
Preferably, a sealing material disposed against the semiconductor refrigerator is also included.
Preferably, the inner heat dissipation channel comprises an inner heat dissipation component, at least one inner fan, a cold air channel and a hot air channel;
The cold air channel is arranged between a control board and a power board in the display device, the hot air channels are arranged on two sides of the cold air channel in parallel, and the cold air channel and the hot air channel are communicated through a first connecting part and a second connecting part at two ends to form a closed circulation loop; the inner radiator is arranged in the first connecting part and is close to the heat exchange component; the inner fan is arranged at one side of the cold air channel, which is close to the inner radiator, and cold air blown out of the inner fan enters the cold air channel.
Preferably, the hot air passage communicates with opposite first and second end faces of the inner radiator, respectively.
Preferably, the hot air channel comprises a first hot air channel arranged between the glass door and the display screen.
Preferably, the hot air channel further comprises a second hot air channel provided between the housing and the internal mounting plate.
Preferably, the first connecting portion is disposed on a top side of the display screen and the internal mounting plate, and the second connecting portion is disposed on a bottom side of the display screen and the internal mounting plate.
Preferably, the at least one internal fan comprises a plurality of internal fans arranged side by side and each mechanically connected to the third end face of the internal heat sink.
Preferably, the outer heat dissipation channel comprises a plurality of outer fans arranged in a direction perpendicular to the inner fans and outer heat sinks arranged in parallel with the inner heat sinks, the outer heat sinks are close to the heat exchange component, and the outer fans are connected through the outer heat sinks.
The display device provided by the invention has the following beneficial effects: the temperature reduction in the display device can be realized by utilizing a limited space.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic side view of a first embodiment of a display device according to the present invention;
FIG. 2 is a schematic side view of a second embodiment of a display device according to the present invention;
FIG. 3 is a schematic elevational view of the structure of FIG. 1;
Fig. 4 is a partial structural schematic diagram of fig. 1.
Fig. 5 is a side view of fig. 4.
Detailed Description
For a clearer understanding of technical features, objects and effects of the present invention, a detailed description of embodiments of the present invention will be made with reference to the accompanying drawings.
As shown in fig. 1 and 3, in a first embodiment of a display device of the present invention, an inner heat dissipation path, an outer heat dissipation path are included to heat exchange a part 400; the inner heat dissipation channel is a channel with two closed ends and is arranged in the display device to cool the internal components of the display device; the heat exchange part 400 is disposed between the inner heat dissipation channel and the outer heat dissipation channel to cool the air in the inner heat dissipation channel and transfer the heat generated in the cooling process to the outer heat dissipation channel; the external heat dissipation channel is arranged outside the display device and communicated with external air so as to transfer heat to the outside of the display device.
Specifically, the internal heat dissipation channel is arranged inside the display device according to the internal structure of the display device, in order to ensure the isolation of internal heat and external heat, the internal heat dissipation channel is in a closed design inside the display device, as shown in fig. 1, the internal heat dissipation channel forms a closed channel through a glass door and a shell of the display device and a joint thereof, and for the double-screen display device shown in fig. 2, the internal heat dissipation channel forms a closed channel through two glass doors of the display device and a joint thereof. The cooled air can exchange heat with the components in the display device in the closed channel, so that the heat in the display device is taken away, and the temperature in the display device is reduced. A heat exchange part 400 is arranged between the inner heat dissipation channel and the outer heat dissipation channel, one end of the heat exchange part 400 is connected with or closely contacted with the inner heat dissipation channel, and the air of the inner heat dissipation channel is cooled; the other end of the heat exchange part 400 is connected with or closely contacted with the external heat dissipation channel, and heat generated by the heat exchange part 400 in the process of cooling the air of the internal heat dissipation channel is transferred to the outside of the display device through the external heat dissipation channel, so that the cooling of the whole display device can be finally completed. The heat exchange component 400 may be a passive component, and simply uses the difference between the internal and external temperatures to complete the heat exchange of the internal and external heat dissipation channels; or may be an active part, which generates a low temperature through the heat exchange part 400 for cooling the air in the inner heat dissipation path, and heat generated in the course of generating the low temperature is transferred to the outside of the display device through the outer heat dissipation path.
Further, as shown in fig. 5, the heat exchange member 400 includes a semiconductor refrigerator 410, a first heat conductive material 440 provided between the semiconductor refrigerator 410 and the outer heat dissipation path, and a second heat conductive material 430 provided between the semiconductor refrigerator 410 and the inner heat dissipation path.
Specifically, in some embodiments, the heat exchange component 400 may employ active devices, such as a semiconductor refrigerator 410, where the semiconductor refrigerator is fabricated using the peltier effect of semiconductor materials. When a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. In the present embodiment, the refrigerating end of the semiconductor refrigerator 410 is disposed near the inner heat dissipation channel for cooling the air of the inner heat dissipation channel, and the heating end is disposed near the outer heat dissipation channel for transferring heat to the outside through the outer heat dissipation channel. In order to ensure the temperature transfer effect, a heat conducting material is generally disposed between the semiconductor refrigerator 410 and the inner heat dissipation channel and the outer heat dissipation channel, respectively, and the heat conducting material may be a heat conducting aluminum plate, and is closely adhered between the semiconductor refrigerator 410 and the inner heat dissipation channel and the outer heat dissipation channel for heat transfer. In some embodiments, a thermally conductive aluminum plate between the semiconductor refrigerator 410 and the inner heat dissipation channel may also be disposed inside the closed inner heat dissipation channel.
Further, a sealing material 420 is provided in close proximity to the semiconductor refrigerator 410.
Specifically, in order to ensure high efficiency of heat transfer of the semiconductor refrigerator 410, a surface of the semiconductor refrigerator 410, which is not in contact with the first heat conductive material 440 or the second heat conductive material 430, is sealed with the sealing material 420, ensuring that the semiconductor refrigerator 410 is not affected by the ambient temperature. The sealing material 420 may be thermal insulation foam.
Further, the inner heat dissipation channel includes an inner heat dissipation component 230, at least one inner fan 240, a cold air channel 210 and a hot air channel 220; the cold air channel 210 is arranged between the control panel 110 and the power panel 120 in the display device, the hot air channel 220 is arranged on two sides of the cold air channel 210 in parallel, and the cold air channel 210 and the hot air channel 220 are communicated through a first connecting part and a second connecting part at two ends to form a closed circulation loop; the inner radiator 230 is disposed in the first connection portion and is adjacent to the heat exchange member 400; the inner fan is disposed at one side of the cold air channel 210 near the inner radiator 230, and the cold air blown out by the inner fan enters the cold air channel 210.
Specifically, the inner radiator 230, the at least one inner fan 240, the cool air duct 210 and the hot air duct 220 are all disposed inside the display device to form a closed duct for communication. The inner radiator 230 disposed inside the first connection portion at one end of the cold air channel 210 and the hot air channel 220 cools the air, and the heat exchange component 400 is disposed near the first connection portion, which can be understood that the heat exchange component 400 is in close contact with the inner radiator 230, cools the air passing through the inner radiator 230 to form cold air, the inner fan 240 provides power, and forms the cold air after cooling into the cold air channel 210. It is generally understood that the control board 110 and the power board 120 of the display device, which are functional boards with numerous electronic devices, are sources of heat generation in the display device, and the cold air channel 210 is disposed close to the control board 110 and the power board 120, so that the control board 110 and the power board 120 can be cooled better, and the cooling efficiency is improved. Note here that the inner fan 240 is enclosed in the cold air channel 210, and only the air inlet thereof is connected to the inner radiator 230, so that the cold air provided by the inner radiator 230 can only pass through the cold air channel 210 after passing through the inner fan 240, thereby improving the utilization efficiency of the cold air. The cold air exchanges heat with the control board 110 and the power board 120 in the cold air channel 210, the temperature of the cold air increases, and before entering the inside of the second connection part at the other ends of the cold air channel 210 and the hot air channel 220, the cold air absorbs enough heat to become hot air, the hot air enters the hot air channel 220 through the second connection part, and then enters the inner radiator 230 through the hot air channel 220 to be cooled to become cold air. The repeated circulation is performed to cool the whole display device.
It will be appreciated that the inner heat sink 230 may also be formed of an aluminum tab heat sink, and the semiconductor refrigerator 410 is used to cool the aluminum tab heat sink by transferring low temperature to the aluminum tab heat sink through a thermally conductive aluminum plate disposed inside the display device and in close contact with the aluminum tab heat sink. After hot air enters the aluminum insert-type radiator, heat exchange is carried out between the insert of the aluminum insert-type radiator and the aluminum insert-type radiator, and finally, low-temperature cold air is formed.
Here, it can be understood that the hot air channels 220 are disposed at two sides of the cold air channel 210, and the cold air channel 210 is wider than the hot air channel 220, so that the flowing time of cold air in the cold air channel 210 can be controlled, and the contact time of cold air and the control board 110 with the power board 120 can be increased, so that the heat exchange is more thorough. In addition, here, the flowing time of the cold air in the cold air channel 210 can also be adjusted by adjusting the speed of the fan.
Further, the hot air passage 220 communicates with opposite first and second end surfaces of the inner radiator 230, respectively.
Specifically, the hot air in the hot air channel 220 may enter the inner radiator 230 through two opposite end surfaces, namely the first end surface and the second end surface, of the inner radiator 230 to cool.
Further, the hot air path 220 includes a first hot air path between the glass door 160 and the display screen 130.
Specifically, as shown in fig. 1, in some embodiments, a glass door 160 protecting the display screen 130 is provided in front of the display screen 130, and the hot air channel 220 includes a first hot air channel that is provided between the glass door 160 and the display screen 130. In some embodiments of the display device, for example, as shown in fig. 2, a dual display screen 130 is disposed inside the display device, and thus generally includes two first hot air channels, each disposed between two display screens 130 and a respective glass door 160.
Further, the hot air path 220 further includes a second hot air path provided between the outer case 150 and the inner mounting plate 140.
Specifically, as shown in fig. 1, in some embodiments of the display device, there is only a single display screen 130, the back of which includes a housing and an internal mounting plate 140 disposed between the power board 120 and the housing 150, such that it includes a first hot air channel and a second hot air channel, the second hot air channel being disposed between the housing 150 and the internal mounting plate 140.
Further, the first connection portion is disposed on the top sides of the display screen 130 and the internal mounting plate 140, and the second connection portion is disposed on the bottom sides of the display screen 130 and the internal mounting plate 140.
Specifically, as shown in fig. 1 and fig. 2, the first connection portion and the second connection portion of the cold air channel 210 and the hot air channel 220 may be disposed opposite to each other, where the first connection portion of the internal radiator 230 is disposed on the top side of the display screen 130 and the internal mounting board 140 inside the display device, a certain space is reserved between the display screen 130 and the frame of the internal mounting board 140 and the display device, and the second connection portion is disposed on the bottom side of the display screen 130 and the internal mounting board 140, and forms a U-shaped structure together with the cold air channel 210 and the hot air channel 220, where the hot air is folded back into the hot air channel 220. It can be appreciated that by arranging the inner radiator 230 on the top side of the inside of the display device, the cold air flows downwards from the top according to gravity in the hot air, and the hot air is extruded by the cold air at the bottom to move upwards, so that the energy consumed by pushing the cold air to flow completely by the fan can be saved.
Of course, in other embodiments, the first connection portion and the second connection portion may be disposed in alternate directions, where the first connection portion is disposed on the bottom side of the display screen 130 and the internal mounting plate 140 inside the display device, and the second connection portion is disposed on the top side of the display screen 130 and the internal mounting plate 140. Or the first connecting part and the second connecting part are respectively arranged at the left side and the right side of the display device.
Further, the at least one inner fan 240 comprises a plurality of inner fans 240, and the plurality of inner fans 240 are arranged side by side and are mechanically connected to the third end surface of the inner heat sink 230.
Specifically, the inner heat sink 230 is elongated, and a plurality of inner fans 240 are sequentially arranged on an end surface of the elongated inner heat sink 230 facing the cool air duct 210, i.e., a third end surface. An aluminum tab-type heat sink provided with a plurality of small pieces, for example, is connected in order to form an inner heat sink 230 of an elongated structure. Each small aluminum plug-in heat sink 231 is connected to an internal fan 240.
Further, as shown in fig. 3,4 and 5, the outer heat dissipation path includes a plurality of outer fans 320 disposed in a direction perpendicular to the inner fans 240 and outer heat sinks 310 disposed in parallel with the inner heat sinks 230, the outer heat sinks 310 being adjacent to the heat exchange member 400, and the outer fans 320 being connected by the outer heat sinks 310.
Specifically, the outer heat dissipation channels include at least two outer heat sinks 310 and outer fans 320 that can exchange heat with external air, and the outer fans 320 are connected in a conducting manner through the outer heat sinks 310, when a plurality of outer fans 320 are present, the outer fans are connected in turn through the plurality of outer heat sinks 310, so that a conducting path is formed in which the outer fans 320 and the outer heat sinks 310 are connected in turn alternately, and external air enters the first outer heat sink 310 through the first outer fan 320, then enters the second outer fan 320, and then enters the second outer heat sink 310, and then sequentially passes through the outer heat dissipation channels through the last outer fan 320, so that internal and external heat transfer is completed. It will be appreciated that the outer radiator 310 is connected to the inner radiator 230 through the heat exchange member 400, and heat generated by cooling the inner radiator 230 passes through the heat exchange member 400, then enters the outer heat dissipation channel through the outer radiator 310, and finally is transferred to the air through the outer heat dissipation channel. Here, the wind direction of the outer fan 320 and the wind direction of the inner fan 240 are perpendicular to each other. The air flow direction in the outer heat dissipation channel is perpendicular to the inner heat dissipation channel. The outer heat sink 310 may also be an aluminum tab heat sink.
It is to be understood that the above examples only represent preferred embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the invention; it should be noted that, for a person skilled in the art, the above technical features can be freely combined, and several variations and modifications can be made without departing from the scope of the invention; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (8)
1. A display device characterized by comprising an inner heat dissipation channel, an outer heat dissipation channel, and a heat exchange member (400);
the inner heat dissipation channel is a channel with two closed ends and is arranged in the display device to cool the internal components of the display device;
the heat exchange component (400) is arranged between the inner heat dissipation channel and the outer heat dissipation channel, so as to cool air in the inner heat dissipation channel and transfer heat generated in the cooling process to the outer heat dissipation channel, wherein the inner heat dissipation channel comprises at least one inner fan;
The external heat dissipation channel is arranged outside the display device and communicated with external air so as to transfer the heat to the outside of the display device;
One end of the heat exchange component (400) is connected with or closely contacted with the inner heat dissipation channel to cool the air of the inner heat dissipation channel; the other end of the heat exchange part (400) is connected or closely contacted with the external heat dissipation channel;
The outer heat dissipation channel comprises a plurality of outer fans (320) arranged in the vertical direction with the inner fans (240) and outer radiators (310) arranged in parallel with the inner radiators (230), the outer radiators (310) are close to the heat exchange component (400), and the outer fans (320) are connected through the outer radiators (310);
The heat exchange member (400) includes a semiconductor refrigerator (410), a first thermally conductive material (440) disposed between the semiconductor refrigerator (410) and the outer heat dissipation channel, and a second thermally conductive material (430) disposed between the semiconductor refrigerator (410) and the inner heat dissipation channel.
2. The display device of claim 1, further comprising a sealing material (420) disposed against the semiconductor cooler (410).
3. The display device of claim 1, wherein the inner heat dissipation channel further comprises an inner heat dissipation assembly, a cold air channel (210), and a hot air channel (220);
The cold air channel (210) is arranged between a control board (110) and a power board (120) in the display device, the hot air channels (220) are arranged on two sides of the cold air channel (210) in parallel, and the cold air channel (210) and the hot air channel (220) are communicated through a first connecting part and a second connecting part at two ends to form a closed circulation loop; the inner radiator (230) is arranged in the first connecting part and is close to the heat exchange component (400); the inner fan is arranged on one side, close to the inner radiator (230), in the cold air channel (210), and cold air blown by the inner fan enters the cold air channel (210).
4. A display device according to claim 3, wherein the hot air channel (220) communicates with opposite first and second end faces of the inner heat sink (230), respectively.
5. The display device of claim 4, wherein the hot air channel (220) comprises a first hot air channel disposed between the glass door (160) and the display screen (130).
6. The display device of claim 5, wherein the hot air channel (220) further comprises a second hot air channel disposed between the housing (150) and the internal mounting plate (140).
7. The display device according to claim 6, wherein the first connection portion is provided on a top side of the display screen (130) and the internal mounting plate (140), and the second connection portion is provided on a bottom side of the display screen (130) and the internal mounting plate (140).
8. The display device according to any of claims 3-7, wherein the at least one internal fan (240) comprises a plurality of internal fans arranged side by side and each mechanically connected to a third end face of the internal heat sink (230).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810101536.0A CN108174587B (en) | 2018-02-01 | 2018-02-01 | Display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810101536.0A CN108174587B (en) | 2018-02-01 | 2018-02-01 | Display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108174587A CN108174587A (en) | 2018-06-15 |
| CN108174587B true CN108174587B (en) | 2024-04-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810101536.0A Active CN108174587B (en) | 2018-02-01 | 2018-02-01 | Display device |
Country Status (1)
| Country | Link |
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| CN (1) | CN108174587B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019148416A1 (en) * | 2018-02-01 | 2019-08-08 | 深圳市飓风智云科技有限公司 | Display device |
| US11382243B1 (en) * | 2020-12-29 | 2022-07-05 | Dynascan Technology Corp. | Display apparatuses |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101965120A (en) * | 2010-09-27 | 2011-02-02 | 同辉佳视(北京)信息技术有限公司 | Heat dissipation equipment and outdoor display cabinet of outdoor display |
| CN104143295A (en) * | 2013-05-09 | 2014-11-12 | Lg电子株式会社 | Digital signage |
| CN106253632A (en) * | 2016-07-27 | 2016-12-21 | 西安特锐德智能充电科技有限公司 | A kind of air-cooled heat dissipation structure of high-power modular power supply |
| CN206147561U (en) * | 2016-08-24 | 2017-05-03 | 深圳Tcl新技术有限公司 | Display device |
| CN206365212U (en) * | 2017-01-12 | 2017-07-28 | 中国科学技术大学 | Closed outdoor communication cabinet with cooling mechanism |
| CN206698574U (en) * | 2017-05-15 | 2017-12-01 | 杭州海康威视数字技术股份有限公司 | A kind of display device |
-
2018
- 2018-02-01 CN CN201810101536.0A patent/CN108174587B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101965120A (en) * | 2010-09-27 | 2011-02-02 | 同辉佳视(北京)信息技术有限公司 | Heat dissipation equipment and outdoor display cabinet of outdoor display |
| CN104143295A (en) * | 2013-05-09 | 2014-11-12 | Lg电子株式会社 | Digital signage |
| CN106253632A (en) * | 2016-07-27 | 2016-12-21 | 西安特锐德智能充电科技有限公司 | A kind of air-cooled heat dissipation structure of high-power modular power supply |
| CN206147561U (en) * | 2016-08-24 | 2017-05-03 | 深圳Tcl新技术有限公司 | Display device |
| CN206365212U (en) * | 2017-01-12 | 2017-07-28 | 中国科学技术大学 | Closed outdoor communication cabinet with cooling mechanism |
| CN206698574U (en) * | 2017-05-15 | 2017-12-01 | 杭州海康威视数字技术股份有限公司 | A kind of display device |
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| CN108174587A (en) | 2018-06-15 |
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