CN101307996A - Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure - Google Patents
Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure Download PDFInfo
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- CN101307996A CN101307996A CN 200710103889 CN200710103889A CN101307996A CN 101307996 A CN101307996 A CN 101307996A CN 200710103889 CN200710103889 CN 200710103889 CN 200710103889 A CN200710103889 A CN 200710103889A CN 101307996 A CN101307996 A CN 101307996A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a flat evaporator structure and a loop heat pipe with the flat evaporator structure, the loop heat pipe has an evaporation section arranged on a heat source and a conduction section connected with a condensation section, the evaporation section includes an enclosed containment structure and a capillary structure, and has a bottom in which a channel structure is formed, and a liquid inlet and a gas outlet are arranged in a lateral margin of a container body to respectively connect a gas passage and a liquid passage, so that when a working fluid is heated by the heat source to become vapor, the vapor moves through the gas outlet and the gas passage to a condensing device in the condensation section where the vapor is cooled and converted back to the original form of the working fluid that is then guided through the liquid passage back to the enclosed containment structure for next cycle.
Description
Technical field
The present invention is relevant for a kind of loop hot-pipe, particularly about a kind of loop hot-pipe with flat-plate evaporators structure.
Background technology
Because the progress of semiconductor technology, the number of lead wires of chip is increasing always, and in order to hold these leads, the area after the encapsulation often is the several times of chip area (Die Area).Therefore the heat of package surface and distribution heterogeneous forms focus (Hotspot) easily and causes chip to damage because of thermal stress is uneven then.The effect of heat pipe (Heat Pipe) promptly fast with thermal conductance toward other heat abstractors, by radiating module hot type is removed again, present heat pipe design is at most the heat radiation that is applied in notebook computer, comprises following several mode:
(1) forced air cooling heat radiation;
(2) force the liquid cooling heat radiation;
(3) heat pipe phase change heat radiation;
(4) refrigerator heat radiation;
(5) freezing type heat radiation.
Wherein, the freezing type heat radiation can be divided into fluid channel heat sink (Micro Channel Heat Sink), little radiator (Micro Heat Exchanger), little refrigerator (Micro MiniatureRefrigerators), micro heat pipe (Micro Heat Pipes), little jet flow (Micro Jets), drop cooling (Droplet Cooling) again, though the radiating mode of high unit price has high heat dissipation efficiency, but do not meet now low cost high powered computer and use, therefore development heat abstractor low-cost, high-effect, low abrasion is following trend.
Fig. 1 is for showing the schematic diagram of conventional heat pipe structure, and this traditional heat pipe structure 100 is constituted (consulting shown in Figure 1) by closed container 1, capillary structure 2 with working fluid 3, and this closed container 1 is to inject an amount of working fluid 3 in vacuumizing the back.When the evaporation ends 1a of this container 1 (Evaporator) is heated, this working fluid 3 absorbs heat and gasifies, the steam 31 (Vapor) that is produced then flows to condenser 1b (Condenser) heat release, by the different saturated vapour pressure drive fluid that produced under the different temperatures, and condensation water 32 will be back to former heating location evaporation ends 1a by the capillarity of capillary structure 2, and its operation principle is to utilize the two-phase change procedure can absorb the principle of big calorimetric.Because the working fluid 3 in the heat pipe structure 100 transmits heat by two phase change, thereby can obtain high heat conductivity, reaches the purpose of quick conductive, builds a superthermal environment of leading.
The contact area that generally is applied to the heat pipe of electronic element radiating and pyrotoxin is quite limited, and its tubulose moulding also has restriction in shape, flattens, bent angle all can reduce this performance that has of heat pipe greatly, and therefore its heat pipe can lose effectiveness.Therefore, industry with two phase change utilizations among flat board, purpose is in the restriction of splashing that reduces thickness and remove heat pipe itself, this technology i.e. " flat-plate heat pipe (Plate Heat Pipe) " by name, Lei Tong technology is applied to the field of solar energy source technology therewith, be referred to as loop hot-pipe 200 (consulting shown in Figure 2), be to be heated by an evaporation ends 1a, working fluid 3 absorbs heat and gasifies, the steam 31 that is produced is directed to a condenser 1b heat release via a vapor line 11a, is back to this evaporation ends 1a by a liquid line 11b again.
Yet semiconductor industry is that China has one of industry of global competitiveness, and along with the electronic product function constantly strengthens, the high temperataure phenomena that internal electronic element produces because of high power must have good heat abstractor to be cooled off.Existing radiating fin-fan is main cooling mechanism, certainly will can't satisfy following microelectronic element radiating requirements, moreover the radiating mode of water-cooling causes easily hydrone to overflow, and influences the crisis of electronic component short circuit.
Such as modern microelectronic product (3C:Computer, Communication, Consumer ElectronProducts) and semiconductor original paper (high-capacity LED, laser, led array) and the heat dissipation problem of large scale TV backlight module, and high-tech commodity just can be thrown in the people's livelihood articles for use, become the high-tech that everybody can both have, and in the heat pipe develop actively, the caloric value of electronic product also is that day is in hundred, along with miniaturization of components, the arithmetic speed increment, the floating upper table surface of the problem of heat, therefore now much do the manufacturer of electronic semi-conductor, the research and development department of numerous and confused one-tenth erection system or element radiating is to solve this heat dissipation problem.
Summary of the invention
The technical problem that institute of the present invention desire solves is: a kind of flat-plate evaporators and loop hot-pipe are provided, can vary with temperature the working fluid of doing liquid, the variation of gas phase attitude in order to being filled with in enclosed areas, utilize this phase change to transmit heat in a large number fast.
Another technical problem that the present invention will solve is: a kind of mini flat plate heat tube is provided, makes integral body can improve the start performance and have higher radiating efficiency, with the radiating requirements in response to following high compactness electronic component.
Technical solution of the present invention is: a kind of loop hot-pipe with flat-plate evaporators structure, be that an evaporating region is set on a thermal source, and link a condensation section and form this evaporimeter with a conduction section, this evaporating region includes an airtight accommodating structure that is arranged on this thermal source, and this airtight accommodating structure is by a lid, one box body is combined to form an airtight accommodation space, and include a channel structure, one capillary structure, one in the liquid inlet that the box body lateral margin is provided with, in order to inject a working fluid, an and gas vent that is arranged at the corresponding box body lateral margin in liquid inlet, be subjected to the steam of the working fluid generation of thermal source evaporation in order to derivation, wherein, this channel structure is in the bottom surface of this airtight accommodation space, the equi-spaced apart and the plurality of grooves conduit that is arranged in parallel, and this capillary structure is set in upper horizontal, and the liquid inlet of this box body lateral margin is connected with this capillary structure, and the gas vent of box body lateral margin that should correspondence system is communicated in the groove conduit of this channel structure, and be connected to a gas flow and a flow channel for liquids, when being subjected to this thermal source to be evaporated to steam this working fluid, derive steam by this gas vent, and import by this gas flow in the condensing unit of this condensation section, to cool off again to reply and be protomorphic working fluid, lead back in this airtight accommodating structure with this flow channel for liquids, and carry out repeatedly do action.
The present invention also proposes a kind of flat-plate evaporators structure of loop hot-pipe, and this loop hot-pipe is that an evaporating region is set on a thermal source, and connects a condensation section and formed with a conduction section, and this evaporimeter includes:
One airtight accommodating structure is arranged on this thermal source, is combined into an airtight accommodation space with a lid and a box body, and this airtight accommodating structure includes:
One capillary structure is to be horizontal arrangement with this airtight accommodating structure bottom surface, is arranged in this airtight accommodation space;
One liquid inlet is arranged at this box body lateral margin, in order to injecting a working fluid, and is communicated in this capillary structure;
One gas vent is arranged at the box body lateral margin of this liquid inlet correspondence, the steam that produced by the working fluid of thermal source evaporation in order to derivation.
Characteristics of the present invention and advantage are: the present invention mainly studies the making mini flat heat pipe, to be applied among the notebook computer heat radiation, how therefore its heat dissipation problem effectively guide to fixing condenser zone with thermal conductance for heat can be shed among its limited space, be considerable problem.Moreover, it is a passive thermal transmission element with high thermoconductivity that its heat pipe can be considered, because inner two phase flow heat passes mechanism, make that the Heat Transfer of Heat Pipe on Heat Pipe ability is more than hundreds of times of same size copper metal, it is superconductor for heat, when utilizing heat pipe as the transmitter of heat, have and be swift in response and advantage that thermal resistance is little, therefore cooperate the use development of heat pipe or its derived product to go out various high-performance radiating module, be fit to solve the heat dissipation problem that present various electronic product is derived because of performance boost.
The flat small heat pipe that the present invention goes out the heat sinking function development of the confined space, can be used in for example notebook computer etc., the defective that the improvement tradition reduces because of heat pipe bending usefulness, that improves also simultaneously that heat pipe causes because of size is too little carries restriction (Entertainment Limit), the flexible design in sampled-current road can increase the utilization on some spaces more in the confined space.And high-effect by loop hot-pipe, the electronic component that all genus need dispel the heat, mechanical industry, biochemical medical treatment, the heat radiation of large scale TV, indoor and outdoor LED lamp lighting device etc., all can utilize " liquid gas two phase change " principle to allow fine droplet absorb a large amount of heat energy and give gasification again, fast with the thermal source band from distance quite far away, eliminate focus and make electronic component energy operate as normal, more can avoid hydrone to overflow and cause the electronic component short circuit, provide electronic radiation new approach, more promote the development and the research of cooling technology, also can improve whole start performance and radiating efficiency by mini flat plate heat tube.
Description of drawings
Fig. 1 is for showing the schematic diagram of conventional heat pipe structure;
Fig. 2 is for showing the calcspar of conventional heat pipe structure;
Fig. 3 has the stereogram of the loop hot-pipe of flat-plate evaporators structure for showing the present invention;
Fig. 4 has the 4-4 sectional drawing of the loop hot-pipe of flat-plate evaporators structure for showing the present invention;
Fig. 5 has the 5-5 sectional drawing of the loop hot-pipe of flat-plate evaporators structure for showing the present invention;
Fig. 6 has the enlarged drawing of the loop hot-pipe of flat-plate evaporators structure for showing the present invention;
Fig. 7 has the sectional drawing of configuration porous material capillary structure of the loop hot-pipe of flat-plate evaporators structure for showing the present invention;
Fig. 8 has the second embodiment schematic diagram of the loop hot-pipe of flat-plate evaporators structure for showing the present invention;
Fig. 9 has the 3rd embodiment schematic diagram of the loop hot-pipe of flat-plate evaporators structure for showing the present invention;
Figure 10 has the vertical view of the 4th embodiment channel structure of the loop hot-pipe of flat-plate evaporators structure for showing the present invention.
[main element symbol description]
100 heat pipe structures, 523 box body lateral margins
200 loop hot-pipes, 53 channel structure
300 evaporimeters, 531 groove conduits
300a, 300b, 300c evaporimeter 531a protrude section
1 closed container, 54 liquid inlets
1a evaporation ends 541 flow channel for liquids
11b liquid line 6 capillary structures
2 capillary structure 6a porous material capillary structures
3 working fluids, 61 capillary structure front openings
31 steams, 62 dividing plates
32 condensation waters, 7 condensing units
4 thermal source 7a, 7b condensing unit
5 airtight accommodating structure 71 radiating fin modules
51 lid L1 evaporating regions
52 box body L2 condensation sections
521 airtight accommodation space L3 conduction sections
522 accommodation spaces bottom L4 compensation conduit
The specific embodiment
Specific embodiment of the present invention will be further described by following embodiment and accompanying drawing.
Consult shown in Figure 3ly, it has the stereogram of the loop hot-pipe of flat-plate evaporators structure for showing the present invention, and Fig. 4 is for showing the 4-4 sectional drawing of Fig. 3, and Fig. 5 is for showing the 5-5 sectional drawing of Fig. 3.Evaporimeter 300 of the present invention is that an evaporating region L1 is set on a thermal source 4, and links a condensation section L2 with a conduction section L3 and formed.
This evaporating region L1 includes an airtight accommodating structure 5 that is arranged on this thermal source 4, this airtight accommodating structure 5 is by a lid 51, a box body 52 combinations and forms an airtight accommodation space 521, and includes a capillary structure 6, a liquid inlet 54 and a corresponding gas vent 55.
This capillary structure 6 is to be horizontal arrangement with these airtight accommodating structure 5 bottom surfaces 522, be arranged in this airtight accommodation space 521, and liquid inlet 54 is set in box body 52 lateral margins 523, in order to inject a working fluid 3, and be communicated in this capillary structure 6, and 54 corresponding box body 52 lateral margins 523 are provided with gas vent 55 in the liquid inlet, are used to derive a steam of working fluid 3 generations that are subjected to thermal source 4 evaporations.
Preferably, this airtight accommodating structure 5 also includes a channel structure 53, and it is horizontal arrangement with these airtight accommodating structure 5 bottom surfaces 522, and including several groove conduits 531 is parallel to each other and the equi-spaced apart setting, and be horizontally disposed with this capillary structure 6 on this channel structure 53, wherein, liquid inlet 54 is connected with the front openings 61 of this capillary structure 6, and gas vent 55 is communicated in the groove conduit 531 of this channel structure 53.
This conduction section L3 is made up of a gas flow 551 and a flow channel for liquids 541, and wherein, this gas flow 551 is connected in the gas vent 55 of this airtight accommodating structure 5, and this flow channel for liquids 541 is connected in the liquid inlet 54 of this airtight accommodating structure 5.
This condensation section L2 is provided with a condensing unit 7, gas vent 55 and liquid inlet 54 that this condensing unit 7 is connected in this airtight accommodating structure via gas flow 551 and the flow channel for liquids 541 of this conduction section L3 respectively, be to import steam 31 in condensing unit 7 by gas flow 551, with the steam 31 of cooling from this evaporating region L1 generation, these steam 31 coolings are replied to protomorphic working fluid 3, lead back in the airtight accommodation space of this airtight accommodating structure 5 by this flow channel for liquids 541 again.
Preferable, the condensing unit 7 of this condensation section L2 is provided with a radiating fin modules 71, in order to preferable heat sinking function to be provided, so that this condensing unit 7 can cool off the steam 31 that this gas flow 551 imports faster.
In sum, when this airtight accommodation space 521 injects a working fluid 3, utilize the capillarity directed forces of this capillary structure 6, working fluid 3 evenly is directed to the bottom surface 533 that is covered with airtight accommodating structure 5 by liquid inlet 54, and make this working fluid 3 be evaporated to steam 31 by the thermal source 4 of evaporating region L1, utilize gas vent 55 to derive steam 31 again, and with the condensing unit 7 of gas flow 551 with steam 31 this condensation section of importing L2, by condensing unit 7 steam 31 coolings are replied again and be protomorphic working fluid 3, lead in the airtight accommodation space 521 that is back to this airtight accommodating structure 5 with flow channel for liquids 541 again, and carry out the action of this circulation repeatedly.
Consult shown in Figure 6ly, it has the enlarged drawing of the loop hot-pipe of flat-plate evaporators structure for showing the present invention.Wherein, this capillary structure 6 is horizontally placed on this channel structure 53, in order to guide the working fluid 3 of this condensation section cooling that L2 leads back, utilize the working fluid 3 of the capillarity directed forces guiding backflow of capillary structure 6 can flow into uniformly in the groove conduit 531 of this airtight accommodation space 521, after this working fluid 3 flashes to steam 31 because of this thermal source 4, can not be back in this flow channel for liquids 541 by this channel structure 53 again.
Wherein, this channel structure 53 also can not be provided with several groove conduits 531, forms a smooth channel structure 53, can make this capillary structure 6 produce high capillary motive force equally.Identical, this capillary structure 6 also can be offered the groove (not shown) of corresponding or misfit on each groove conduit 531, perhaps offer several grooves on this smooth channel structure 53, all can reach the effect of high capillary motive force.
Consult shown in Figure 7ly, it has the sectional drawing of configuration porous material capillary structure of the loop hot-pipe of flat-plate evaporators structure for showing the present invention.This capillary structure 6 is a porous material capillary structure 6a, be arranged at equally on this channel structure 53, when this cooled working fluid 3 imports, utilize the capillary attraction of this porous material capillary structure 6a, this working fluid 3 can be flowed in the groove conduit 531 of this channel structure 53 uniformly, and the steam 31 after the evaporation can be back to this flow channel for liquids 541 by the capillary structure 6 on this channel structure 53.Moreover, this capillary structure 6 can be various materials with powerful capillary force and constitutes, pile up as wire netting, nonmetal net piles up, the wire netting diffusion bond, metal powder sintered, the non-metal powder sintering, cotton-wool is weaved cotton cloth etc., with titanium, copper mesh, the metal material of metal mesh structure, or ceramic material, plastic cement, epoxy resin, fiber, the nonmetallic materials of porous heat-resistant brick are made, utilize the capillary structure 6 of special tectonic to form a high capillary motive force, it not only holds on to moisture and stops that also steam 31 refluxes, and can enter in the gas flow 551 its steam 31 with single direction.
Preferable, be provided with a dividing plate 62 between this capillary structure 6 and this airtight accommodation space 521, between the lid 51 of these capillary structure 6 end faces and this airtight accommodating structure 5, its near and perpendicular to the liquid inlet 54 of these box body 52 lateral margins 523, be back in this flow channel for liquids 541 in order to the steam 31 of avoiding evaporation in this airtight accommodation space 521.
The present invention is by being provided with several groove conduits 531 at this airtight accommodation space 521, make working fluid 3 after being subjected to thermal source 4 to be evaporated to steam 31, can break away from this evaporating region L1 fast and import this conduction section L3, but and the pressure of this steam of the design balance of these several groove conduits 531 31 when importing these gas flows 551, make this steam 31 can with one uniformly pressure reduction enter this gas flow 551 smoothly.Preferable, the channel structure 53 of this airtight accommodating structure 5 is with a preset distance level this groove conduit 531 to be divided into several sections, design by this channel structure 53, make that the working fluid 3 in this capillary structure 6 can rapid evaporation, provide one uniformly pressure differential to enter this gas flow 551.Moreover, also can have a difference in height between each section conduit of this channel structure 53, to form the conduit of a ladder structure.
Wherein, in this airtight accommodation space 521, be provided with a compensation conduit L4, between this liquid inlet 54 and channel structure 53, when the working fluid 3 in this channel structure 53 is subjected to this thermal source 4 and when evaporation, this compensation conduit L4 can replenish working fluid 3 in this channel structure 53, moreover when this evaporimeter during in the state of no thermal source 4, this compensation conduit L4 can provide this space that working fluid 3 stores.
Consult shown in Figure 8ly, it has the second embodiment schematic diagram of the loop hot-pipe of flat-plate evaporators structure for showing the present invention, and Fig. 9 has the 3rd embodiment schematic diagram of the loop hot-pipe of flat-plate evaporators structure for showing the present invention.It is made up of several evaporimeters 300a, 300b, 300c, and this several evaporimeter 300a, 300b, 300c be connected in this condensing unit 7, and this several evaporimeter 300a, 300b, 300c can be arranged on the different thermal source 4, in order to the effect of multiple cooling.Moreover, this evaporimeter 300 also can be equiped with condensing unit 7a, the 7b more than two, when cooling effect that too high and this condensing unit 7 of the temperature of this thermal source 4 is not enough to provide enough, can install condensing unit 7a, 7b more than two, to reach enough cooling effects.
Consult shown in Figure 10ly, it has the vertical view of the 4th embodiment channel structure of the loop hot-pipe of flat-plate evaporators structure for showing the present invention.Wherein, this channel structure 53 is protruded section 531a for several, equi-spaced apart and level are crisscross arranged, and perpendicular to this liquid inlet 54, when this airtight accommodation space 521 injects a working fluid 3, this working fluid 3 protrudes section 531a by staggered several of this level, makes to reach that this working fluid 3 is evenly distributed, heating surface area is even, and makes this working fluid 3 evaporate purpose fast.
Such as being familiar with this skill person all can learn easily, the material of its airtight accommodating structure 5 of flat-plate evaporators structure of the present invention can be the material of any heat conduction, comprise copper, aluminium, stainless steel, but various metals such as titanium or heat conduction is nonmetal, as diamond etc., make the different working fluid 3 of metal needs collocation of usefulness, make it that chemical reaction not take place, and can normal operation be main, and should conduct the runner of the transmission usefulness of section L3, can be metal or nonmetal heat-resisting material, as copper pipe, aluminum pipe, stainless steel tube, plastic cement or other flexible metal or non-metallic pipe, condensation section L2 then are the various device that can get rid of heat, can be any heat abstractor.
Above narration only be preferred embodiment explanation of the present invention, allly is skillful in this skill person when doing other all improvement according to above-mentioned explanation, and only these change and still belong in the spiritual and claim that defined of invention of the present invention.
Claims (19)
1. the loop hot-pipe with flat-plate evaporators structure is that an evaporating region is set on a thermal source, and links condensation section composition with a conduction section, wherein:
This evaporating region includes:
One airtight accommodating structure is arranged on this thermal source, is combined to form an airtight accommodation space with a lid and a box body, and this airtight accommodating structure includes:
One capillary structure is to be horizontal arrangement with this airtight accommodating structure bottom surface, is arranged in this airtight accommodation space;
One liquid inlet is arranged at this box body lateral margin, in order to injecting a working fluid, and is communicated in this capillary structure;
One gas vent is arranged at the box body lateral margin of this liquid inlet correspondence, the steam that produced by the working fluid of thermal source evaporation in order to derivation;
This conduction section includes:
One gas flow is connected in the gas vent of this airtight accommodating structure;
One flow channel for liquids is connected in the liquid inlet of this airtight accommodating structure;
This condensation section includes:
One condensing unit, gas vent and the liquid inlet that is connected in this airtight accommodating structure via the gas flow and the flow channel for liquids of this conduction section respectively, and this gas flow is a select location that is arranged at condensing unit with this flow channel for liquids with subtend;
When this airtight accommodation space injects a working fluid, this working fluid is subjected to this thermal source to be evaporated to steam, and be communicated with the condensing unit that gas flow imports this condensation section by this gas vent, treat that this steam cooling answer is for behind the protomorphic working fluid, lead back in this airtight accommodation space via this flow channel for liquids again, and carry out repeatedly do action.
2. the loop hot-pipe with flat-plate evaporators structure as claimed in claim 1, it is characterized in that, this airtight accommodating structure includes a channel structure, and this channel structure is to be horizontal arrangement with this airtight accommodating structure bottom surface, and equi-spaced apart and several groove conduits that have been arranged in parallel.
3. the loop hot-pipe with flat-plate evaporators structure as claimed in claim 2 is characterized in that, the channel structure of this airtight accommodating structure is to distinguish with a preset distance several sections conduits are arranged, and has a difference in height between each section conduit.
4. the loop hot-pipe with flat-plate evaporators structure as claimed in claim 2 is characterized in that, the channel structure of this airtight accommodating structure is to protrude the equidistant layout level of section with several to interlock, and is vertical setting with this liquid inlet.
5. the loop hot-pipe with flat-plate evaporators structure as claimed in claim 2 is characterized in that, the channel structure of this airtight accommodating structure includes a compensation conduit, and this compensation conduit is positioned between this liquid inlet and channel structure.
6. the loop hot-pipe with flat-plate evaporators structure as claimed in claim 1, it is characterized in that the capillary structure of this airtight accommodating structure is that wire netting piles up, nonmetal net piles up, wire netting diffusion bond, metal powder sintered, non-metal powder sintering, cotton-wool one of are weaved cotton cloth.
7. the loop hot-pipe with flat-plate evaporators structure as claimed in claim 6 is characterized in that, the capillary structure of this airtight accommodating structure is one of metal material of titanium, copper, metal mesh structure.
8. the loop hot-pipe with flat-plate evaporators structure as claimed in claim 6 is characterized in that, the capillary structure of this airtight accommodating structure is one of nonmetallic materials of ceramic material, plastic cement, epoxy resin, fiber, porous heat-resistant brick.
9. the loop hot-pipe with flat-plate evaporators structure as claimed in claim 1 is characterized in that the condensing unit of this condensation section is provided with a radiating fin modules.
10. the loop hot-pipe with flat-plate evaporators structure as claimed in claim 1 is characterized in that, has a gap between the lid of this capillary structure and this airtight accommodating structure, so that a baffle plate to be set.
11. the flat-plate evaporators structure of a loop hot-pipe, this loop hot-pipe are that an evaporating region is set on a thermal source, and connect a condensation section and formed with a conduction section, it is characterized in that this evaporimeter includes:
One airtight accommodating structure is arranged on this thermal source, is combined into an airtight accommodation space with a lid and a box body, and this airtight accommodating structure includes:
One capillary structure is to be horizontal arrangement with this airtight accommodating structure bottom surface, is arranged in this airtight accommodation space;
One liquid inlet is arranged at this box body lateral margin, in order to injecting a working fluid, and is communicated in this capillary structure;
One gas vent is arranged at the box body lateral margin of this liquid inlet correspondence, the steam that produced by the working fluid of thermal source evaporation in order to derivation.
12. the flat-plate evaporators structure of loop hot-pipe as claimed in claim 11, it is characterized in that, this airtight accommodating structure includes a channel structure, and this channel structure is arranged at the bottom surface of this airtight accommodation space, and equi-spaced apart and several groove conduits that are arranged in parallel.
13. the flat-plate evaporators structure of loop hot-pipe as claimed in claim 12 is characterized in that, the channel structure of this airtight accommodating structure is distinguished with a preset distance several sections conduits, and has a difference in height between each section conduit.
14. the flat-plate evaporators structure of loop hot-pipe as claimed in claim 12 is characterized in that, the channel structure of this airtight accommodating structure is to protrude the equidistant layout level of section with several to interlock, and is vertical setting with this liquid inlet.
15. the flat-plate evaporators structure of loop hot-pipe as claimed in claim 12 is characterized in that, the channel structure of this airtight accommodating structure includes a compensation conduit, is positioned between this liquid inlet and channel structure.
16. the flat-plate evaporators structure of loop hot-pipe as claimed in claim 11, it is characterized in that the capillary structure of this airtight accommodating structure is that wire netting piles up, nonmetal net piles up, wire netting diffusion bond, metal powder sintered, non-metal powder sintering, cotton-wool one of are weaved cotton cloth.
17. the flat-plate evaporators structure of loop hot-pipe as claimed in claim 16 is characterized in that, the capillary structure of this airtight accommodating structure is one of metal material of titanium, copper, metal mesh structure.
18. the flat-plate evaporators structure of loop hot-pipe as claimed in claim 16 is characterized in that, the capillary structure of this airtight accommodating structure is one of nonmetallic materials of ceramic material, plastic cement, epoxy resin, fiber, porous heat-resistant brick.
19. the flat-plate evaporators structure of loop hot-pipe as claimed in claim 11 is characterized in that, has a gap between the lid of this capillary structure and this airtight accommodating structure, so that a baffle plate to be set.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200710103889 CN101307996B (en) | 2007-05-17 | 2007-05-17 | Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200710103889 CN101307996B (en) | 2007-05-17 | 2007-05-17 | Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure |
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| CN101307996A true CN101307996A (en) | 2008-11-19 |
| CN101307996B CN101307996B (en) | 2010-06-02 |
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| CN 200710103889 Expired - Fee Related CN101307996B (en) | 2007-05-17 | 2007-05-17 | Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure |
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