CN104681514A - Water-cooling heat dissipation scheme of FC (Flip Chip) encapsulation chip - Google Patents
Water-cooling heat dissipation scheme of FC (Flip Chip) encapsulation chip Download PDFInfo
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- CN104681514A CN104681514A CN201310637955.3A CN201310637955A CN104681514A CN 104681514 A CN104681514 A CN 104681514A CN 201310637955 A CN201310637955 A CN 201310637955A CN 104681514 A CN104681514 A CN 104681514A
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- heat dissipation
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- cooling
- cooling heat
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Abstract
The invention provides a scheme which is beneficial for heat dissipation of an FC (Flip Chip) encapsulation chip by taking an FC structure as a starting point. The scheme is characterized in that a water (or other liquid) circulating cooling system is established, two surfaces of the FC encapsulation chip are provided with capillary pipelines, meanwhile, the two surfaces are respectively provided with a heat dissipation sheet metal group, the pipelines still pass through in a capillary shape, and a micro pump is used as a power source. The heat dissipation mode has the advantages that the flowing speed of liquid in the capillary pipelines is faster, heat can be rapidly taken away, better heat dissipation efficiency can be obtained, and both chips and cooling fins have better heat dissipation efficiency; the double-surface liquid-cooling heat dissipation efficiency is higher than the air heat dissipation efficiency; an original mechanism which realizes heat dissipation through a contact cannot be affected by a system.
Description
Technical field
The present invention relates to semiconductor device packaging technique and field of radiating, be specially a kind of water-cooling scheme of FC packaged chip.
Background technology
World today's chip science and technology develop rapidly, chip performance makes rapid progress, and volume is more and more less, and in chip package, heat dissipation problem becomes the key factor of restriction chip performance lifting simultaneously.
Flip Chip has critical role in current chip package, and Flip-Chip encapsulation technology has many obvious advantages compared with traditional lead key closing process, comprises, superior electricity and thermal property, high I/O number of pins, package dimension reduction etc.
In order to stride forward to more high-performance, chip package adopts FC method for packing on a large scale, and shorter contact connects and brings less parasitic capacitance, brings less encapsulation volume simultaneously.
In order to improve the performance of FC packaged chip, be necessary to propose the more effective radiating mode of one.
Summary of the invention
The present invention, on the basis of FC encapsulating structure, proposes a kind of water-cooling solution, its objective is and will encapsulate on the basis of excellent heat dispersion performance at FC, makes chip cooling effect more outstanding, thus brings better guarantee for chip performance promotes.
Improve a liquid-cooling heat radiation mode for Flip Chip package cooling, comprise pipeline and capillary channel (can be rubber or other materials), heat dissipation metal fin, Micropump.
Described capillary channel all has layout at chip positive and negative.
In described radiating fin, pipeline is also capillary channel.
All connect with pipeline between described each parts, pipe material can be multiple.
Described cooling liquid is generally water, also can be other liquid.
After adopting the radiator structure in the present invention, have the following advantages compared with existing common FC encapsulating structure: in capillary channel, flow rate of liquid is very fast, can take away heat as early as possible compared with air, can have good radiating efficiency, be all like this at chip place and radiating fin place; Two-sided liquid-cooling heat radiation is more much higher than air radiating efficiency; Native system can not affect original mechanism of being dispelled the heat by contact.Therefore the Cooling Solution in the present invention is more suitable for the encapsulation of high-performance height heat production chip.
Further, chip double-side liquid-cooling heat radiation is more much higher than air radiating efficiency.
Further, native system can not affect original mechanism of being dispelled the heat by contact, more can not affect chip performance and durability degree.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the liquid-cooling heat radiation scheme of a kind of FC packaged chip of the present invention.
Embodiment
For enabling above-mentioned feature of the present invention, object and advantage more become apparent, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.Because the present invention focuses on interpretation principle, therefore, chart not in scale.
Embodiment: a kind of liquid-cooling heat radiation scheme of FC packaged chip.
A liquid-cooling heat radiation scheme for FC packaged chip, with reference to shown in accompanying drawing 1, comprises 1. pipeline 2. chip 3. PCB4. capillary channel 5. heat dissipation metal fin 6. Micropumps.
Above-described embodiment, only for make a detailed explanation content of the present invention, its object is to allow those skilled in the art are afamiliar with particular content of the present invention and implementing according to this.Allly do not depart from any equivalence change that Spirit Essence of the present invention does or modify, all should belong within protection scope of the present invention.
Claims (6)
1. improve a liquid-cooling heat radiation mode for Flip Chip package cooling, comprise pipeline and capillary channel (can be rubber or other materials), heat dissipation metal fin, Micropump; It is characterized in that: chip positive and negative all has capillary channel.
2. as the liquid-cooling heat radiation mode that right 1 requires, it is characterized in that: in radiating fin, pipeline is also capillary channel.
3., as the liquid-cooling heat radiation mode that right 1 requires, it is characterized in that: connected by pipeline between each parts.
4., as the liquid-cooling heat radiation mode that right 1 requires, it is characterized in that: in pipeline, cooling liquid is generally water, but also can be other liquid, can depend on the circumstances.
5., as the liquid-cooling heat radiation mode that right 1 requires, it is characterized in that: pipe material can be determined according to cooling liquid used and specific environment.
6. as the liquid-cooling heat radiation mode that right 1 requires, it is characterized in that: pipeline and device distributing order are not limited to shown in figure, allly do not depart from any equivalence change that Spirit Essence of the present invention does or modify, all should belong within protection scope of the present invention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310637955.3A CN104681514A (en) | 2013-12-03 | 2013-12-03 | Water-cooling heat dissipation scheme of FC (Flip Chip) encapsulation chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310637955.3A CN104681514A (en) | 2013-12-03 | 2013-12-03 | Water-cooling heat dissipation scheme of FC (Flip Chip) encapsulation chip |
Publications (1)
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| CN104681514A true CN104681514A (en) | 2015-06-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310637955.3A Pending CN104681514A (en) | 2013-12-03 | 2013-12-03 | Water-cooling heat dissipation scheme of FC (Flip Chip) encapsulation chip |
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| CN106449569A (en) * | 2016-10-24 | 2017-02-22 | 华进半导体封装先导技术研发中心有限公司 | Stacked-chip micro-channel heat dissipation structure and preparation method |
| CN110505786A (en) * | 2018-05-16 | 2019-11-26 | 通用汽车环球科技运作有限责任公司 | Catheter polymer component |
| CN116469849A (en) * | 2023-04-20 | 2023-07-21 | 天芯电子科技(江阴)有限公司 | Chip packaging structure for improving heat dissipation and preparation method thereof |
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| US20050230086A1 (en) * | 2004-04-20 | 2005-10-20 | Jack Wang | Water-cooling heat dissipation system |
| CN1819165A (en) * | 2004-11-24 | 2006-08-16 | 朗迅科技公司 | Techniques for microchannel cooling |
| CN2849966Y (en) * | 2005-11-18 | 2006-12-20 | 杨志刚 | Liquid cooler for integrated computer chip |
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| CN106449569A (en) * | 2016-10-24 | 2017-02-22 | 华进半导体封装先导技术研发中心有限公司 | Stacked-chip micro-channel heat dissipation structure and preparation method |
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| CN116469849A (en) * | 2023-04-20 | 2023-07-21 | 天芯电子科技(江阴)有限公司 | Chip packaging structure for improving heat dissipation and preparation method thereof |
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Application publication date: 20150603 |