CN201044553Y - Thermal control system of air-cooled microgroove group and thermoelectric combined laser - Google Patents

Abstract

The utility model relates to a thermal control system for an air-cooled microgroove group and a thermoelectric combined laser, which relates to a heat dissipation and thermal control device for a laser device. It includes vacuumized micro-groove group evaporator, steam insulation hose, condenser, thermoelectric cooler, heat sink, fan, liquid return hose, and liquid-conducting micro-groove connector. The liquid working medium is sucked into the evaporation micro-groove group of the micro-groove evaporator, evaporated and boiled under heat, and the steam flows into the condenser through the steam insulation hose, and is condensed under the action of the thermoelectric cooler on the outer wall of the condenser. Condensation releases heat in the condensation microgroove of the device. While controlling the temperature, the thermoelectric cooler conducts heat from its hot surface to the radiator plate, and finally dissipates the heat to the outside through the air cooling of the fan; at the same time, the condensate in the condenser passes through the liquid return hose And the fluid guide microgroove connector flows back to the microgroove group evaporator, thus completing a heat extraction and heat release cycle to achieve the purpose of cooling the laser device and performing thermal control.

Description

Thermal control system of air-cooled microgroove group and thermoelectric combined laser

technical field

The utility model relates to the technical field of cooling, which is a heat dissipation and thermal control system for laser devices, electronic and electrical components and other optoelectronic devices, especially for various small-sized, high-power laser devices, electronic and electrical components and The ultimate heat sink for other optoelectronic devices adopts a combined thermal control system of capillary microgroove group and thermoelectric cooler (TEC) for forced air cooling.

Background technique

High-power lasers are essential equipment for high-precision machining and important weapons and equipment. They have extensive and significant application values in laser processing, information and military fields. However, the improvement of the laser output power of the laser is severely restricted by the heat dissipation performance and thermal control performance of the laser. Generally, only 5% of the input energy of a general flash pump source laser can be converted into laser output, and the rest must be converted into heat energy and other forms of energy. For example, if 1kw of electric energy is input, only 50w of laser output is available, and the heat dissipation needs to reach about 900w. At present, the heating heat flux of many high-performance and high-power laser devices is greater than 10 ⁶ w/m ² , so whether heat dissipation can be solved is one of the key technologies for the development of high-power lasers. On the other hand, in addition to the problem of heat dissipation, increasing the power of the laser must also realize the temperature control of the components. Avoid the thermal effect of the laser working medium causing the beam quality and efficiency to decline. For example, because the temperature of the laser crystal will rise when the laser is working, if it is not controlled, it will cause changes in the luminescence characteristics of the working substance, and the laser wavelength will shift, resulting in an increase in the laser threshold, and a decrease in efficiency and laser quality. In addition, when the laser is working, the uneven temperature distribution of the laser device will form a temperature gradient. The existence of the temperature gradient will cause a refractive index gradient and stress distribution inside the laser medium, causing the laser beam to produce thermal effects such as focusing P birefringence and depolarization. , thereby reducing the beam quality and power level of the laser. Therefore, it is also very important to implement a reliable thermal control method for the laser on the basis of ensuring the heat dissipation effect. The above-mentioned heat dissipation and thermal control problems of lasers can be summarized as thermal management technical problems in laser technology, which is the bottleneck of the development of high-power lasers and must be solved. The current conventional method is to cool the device by air or liquid, but these conventional cooling technologies cannot solve the above-mentioned problems at all, and new cooling technologies must be used to meet the requirements.

In addition, with the development of large-scale integrated circuits (LSI), the volume heating heat flux of highly integrated electronic and electrical components is increasing rapidly. The accumulation of heat will cause the temperature of the device to rise rapidly, which may cause the function of electronic and electrical components to be lost, or the device will be burned, and the entire electronic device will collapse. Therefore, it is also crucial to configure a strong heat dissipation and thermal control system to maintain the normal operation of electronic and electrical components.

At present, the heat dissipation and thermal control methods applied to laser devices, electronic and electrical components and other optoelectronic devices mainly include the following types.

(1) Direct forced air cooling

Direct forced air cooling using fans is currently the most widely used heat dissipation method for laser devices, electronic and electrical components and other optoelectronic devices. Aluminum or copper heat sinks are usually used to increase the convection area, and then fans are used for forced convection air cooling to achieve the effect of heat dissipation. The design of the heat sink and the cooperation of the fan determine the quality of the cooling effect of this method. Features: Simple device and low cost. Its heat transfer coefficient is roughly between 20~100W/(m ² ·℃). This heat dissipation method has low efficiency, high noise, high power consumption, requires a large space, and poor thermal control performance. When applied to small-sized high-power devices alone, the heat dissipation capability of this method is insufficient. For example, the forced air cooling method used for CPU cooling of personal computers can handle up to 60W of CPU chip heat at present. The combination of its heat sink and fan is close to the state of the limit load.

(2) Liquid single-phase direct forced convection cooling of conventional sizes

Conventional size liquid single phase forced convection cooling is a proven and reliable conventional cooling technique. This cooling method uses cooling liquid, heat-conducting components, pumps, valves, and connected circulation pipelines to carry and transfer the heat generated by the heating device to the outside by the liquid circulating in the pipeline through the single-phase forced convection heat exchange method of the liquid. In order to achieve the effect of reducing the temperature of the heating device. The approximate range of its convective heat transfer coefficient is 1000~15000W/(m ² ·℃). Cooling higher power laser devices, electronic and electrical components and other optoelectronic devices consumes a lot of pump power. Its main disadvantages are poor thermal control performance, complex device, pressure drop during water circulation must be overcome, easy leakage of pipelines, easy to cause accidents such as lowered circuit insulation level or even short circuit, and the sealing requirements are very high.

(3) Heat pipe cooling

Heat pipe is a relatively new heat dissipation technology that has been applied in some lasers, electronic appliances and other optoelectronic devices. The heat generated by the heating element causes the liquid in the evaporating section of the heat pipe to be heated and evaporated into steam, and the steam carries heat to flow to the condensing section of the heat pipe to condense, and then the condensing section of the heat pipe is forced to be liquid-cooled or air-cooled by cooling water or a fan to take away the heat. Its main advantages are: good thermal control performance, strong heat transfer capability, high isothermal performance, and heat flux conversion capability. However, because the steam and liquid are in the same space in ordinary heat pipes, it is easy to produce entrainment phenomenon, which reduces the reflux of condensate, causes the wall temperature of the evaporation section to rise suddenly, and damages or fails the heat pipe. Generally speaking, the heat dissipation capacity of the ammonia water heat pipe is lower than 6W/cm ² , and the heat dissipation capacity of the water heat pipe is between 25-100W/cm ² . In addition, due to the small diameter of the heat pipe, the condensation area of the condensation section of the heat pipe is limited, and the total condensation heat transfer is very small. Therefore, although a large number of cooling ribs are arranged on the outer tube wall of the condensation section of the heat pipe, the total heat dissipation of the heat pipe is very limited. , it is difficult to meet the heat dissipation and thermal control requirements of small-sized, high-power electronics, optoelectronics and electrical components.

(4) Thermoelectric Cooling

Thermoelectric cooling utilizes the thermoelectric effect (Peltier effect). That is, when the current flows through the joint formed by two different conductors, heat release and heat absorption will occur at the joint. Most of the thermoelectric materials currently used are doped Bi and Te semiconductor alloy materials. Therefore, thermoelectric cooling technology is also called semiconductor cooling technology. The advantage of the thermoelectric cooler is that it has no sliding parts, and it can be used in some occasions where the space is limited, the reliability is high, and there is no refrigerant pollution. It can achieve high-precision temperature control, very small thermal inertia, and fast cooling time. However, due to the limitation of materials, the size of conventional semiconductor refrigerators is still not small enough, the cooling efficiency is not high enough, and the heat dissipation heat flux density is lower than the order of 10W/cm ² . If used alone, it cannot meet the heat dissipation and thermal control requirements of small-sized, high-power laser devices, electronic and electrical components, and other optoelectronic devices.

Utility model content

The purpose of this utility model is to: solve the technical defects of low efficiency existing in the existing heat dissipation technology, need to occupy relatively large lasers, limited functional space of electronic and electrical and other optoelectronic systems, insufficient heat dissipation capacity, and poor thermal control performance; thus providing a A heat extraction mode with no power consumption, small area, and high heat flux density. At the same time, it meets the operating temperature requirements of the heating components below the ambient temperature, and can perform high-precision temperature control on the heating components and has strong heat dissipation capabilities. The ultimate heat sink adopts a combined thermal control system of capillary microgroove group and thermoelectric cooler (TEC) for forced air cooling.

The purpose of this utility model is achieved in that:

An air-cooled micro-groove group and thermoelectric combination laser thermal control system, including: micro-groove group evaporator (3), hose, condenser (6), thermoelectric cooler (7), cooling plate (8), fan (9), liquid-conducting microgroove connector (11); wherein, the evaporator (3) is a vacuumized cavity, and a small amount of liquid working medium is poured into it, and an outer surface of the microgroove group evaporator (3) It is closely connected with the outer surface of the heating element or the second heat sink (1), and a plurality of open capillary channels are arranged on the heated inner surface of the microgroove group evaporator (3) to receive the heat generated by the heating element to form an evaporation The microgroove group (2) is used to suck the liquid working substance into the microgroove and make it undergo high-intensity evaporation and boiling to become steam; it is characterized in that it also includes the top surface of the microgroove group evaporator (3) Be provided with at least one steam outlet (15), the inner wall of the microgroove group evaporator (3) where the steam outlet (15) is located is provided with criss-cross microgrooves (4), used for the condensate at the steam outlet Pull away from the position of the steam outlet to avoid the blockage of the condensate on the steam outlet. The lower end of the evaporator (3) communicates with the upper end of the liquid guide micro-groove connector (10); one end of at least one insulation hose (5) is connected to the micro-groove The steam outlet (15) of the group evaporator (3) is connected, and the other end is connected with the steam inlet of the condenser (6). The steam flows out from the steam outlet (15) of the microgroove group evaporator (3), and is passed The pipe (5) flows into the condenser (6) from the steam inlet of the condenser (6); the condenser (6) is a vacuumized cavity with at least one steam inlet at its upper end, and the condenser (6) A plurality of open coagulation microgrooves (14) are longitudinally distributed on the inner wall of the cavity, a slope surface (13) is arranged on the bottom of the cavity, and a plurality of diversion microgrooves (12) are arranged on the slope surface (13) along the length direction of the slope, In order to quickly collect condensate, there is at least one condensate outlet at the bottom of the slope surface (13); at least one thermoelectric cooler (7) is respectively arranged on the outer walls of both sides of the condenser (6), and each thermoelectric cooler The cold surface of the condenser (7) is in close contact with the outer surface of the condenser (6) by welding or using an adhesive with good thermal conductivity or heat-conducting silicone grease, and the hot surface of the thermoelectric cooler (7) is welded or using heat-conducting silicone grease. A good adhesive or heat-conducting silicone grease is in close contact with the heat dissipation plate (8) of the rib group, and under the action of the thermoelectric cooler (7), the steam condenses in the open microgroove (14) of the condenser (6). ) condenses into condensate and releases heat; the thermoelectric cooler condenses the steam in the open condensation microgroove (14) of the condenser (6), and the heat released and the heat generated by itself pass through the thermoelectric cooler (7) The heat surface of the radiator is conducted to the radiator plate (8), and a fan (9) is installed on the top of the radiator panel (8). Through the air cooling of the fan, the heat is finally dissipated to the outside world, and the condensate is passed through the condenser ( 6) The slope surface (13) at the bottom is quickly collected at the condensate outlet of the condenser (6); the condensate outlet of the condenser (6) is connected to one end of at least one liquid return hose (10), and the liquid return The other end of the flexible pipe (10) is connected with the liquid inlet of the liquid guide microgroove connector (11) having at least one liquid inlet. Microtubes closely arranged in parallel, the upper end of the microtubes communicate with the evaporation microgroove group (2) in the microgroove group evaporator (3), and the lower end communicates with the liquid return hose (10). The condensate at the condensate outlet of the condenser (6) finally flows back to the microgroove group evaporator (3) through the liquid return hose (10) and the liquid guide microgroove connector (11), and the system thus completes a extraction process. The cycle of heat and heat release achieves the purpose of cooling and thermally controlling the heat-generating laser device.

In the thermal control system of the air-cooled micro-groove group and thermoelectric combined laser, the micro-groove group evaporator (3) is made of heat-conducting metal material, and the cross-section of the evaporation micro-groove (2) arranged on the inner heated wall surface is Rectangular, triangular or trapezoidal, the microchannels are distributed longitudinally, the width and depth of the channels are in the range of 0.01-1mm, the spacing between the microchannels is in the range of 0.01-1mm, in the microgroove group evaporator ( 3) The wall where the steam outlet (15) is located is densely covered with criss-cross microgrooves (4), the cross-section of which is rectangular, triangular, trapezoidal, or U-shaped, and the width and depth of the longitudinal and transverse microgrooves are in the range of 0.01 to 1 mm. Inside, the distance between the micro-channels is in the range of 0.01-1mm.

In the thermal control system of the air-cooled micro-groove group and thermoelectric combined laser, the condenser (6) is made of a heat-conducting metal material; the inner wall of the condenser (6) is densely covered with many open condensation micro-grooves (14) longitudinally, The cross-section of the coagulation microgrooves (14) is trapezoidal, triangular or wavy, the width and depth of the coagulation microgrooves (14) are in the range of 0.01-10mm, and the spacing between the coagulation microgrooves (14) is in the range of 0.01-20mm ; The outer surface of the condenser (6) is a smooth flat surface.

In the thermal control system of the air-cooled micro-groove group and thermoelectric combined laser, the width and depth of the rectangular guide micro-groove (12) on the bottom slope surface in the cavity of the condenser (6) are both 0.01-1mm In the range, the distance between the micro channels is in the range of 0.01-1 mm.

In the thermal control system of the air-cooled microgroove group and thermoelectric combined laser, the plurality of microtubes arranged in parallel and closely arranged in the fluid-conducting microgroove connector (11) have an inner diameter of 0.01-2mm It is made of plastic hose or soft metal or any material that can be bent freely.

In the air-cooled microgroove group and thermoelectric combined laser thermal control system, the steam insulation hose (5) is made of arbitrarily bendable material, and its inner diameter is within the range of 1-20mm.

In the thermal control system of the air-cooled microgroove group and thermoelectric combined laser, the inner diameter of the liquid return hose (10) is within the range of 0.1-10 mm, which can form a capillary force driving effect, and is made of a material that can be bent arbitrarily. become.

In the thermal control system of the air-cooled microgroove group and thermoelectric combined laser, the liquid return hose (10) is provided with a capillary core along the direction of the tube axis, and the capillary core is a single-layer or multi-layer mesh with a mesh size of 50- Stainless steel or copper mesh core between 450 mesh.

In the thermal control system of the air-cooled microgroove group and thermoelectric combined laser, the thermoelectric cooler (7) is a chip-shaped semiconductor refrigeration device utilizing the thermoelectric effect (i.e. the Peltier effect), and a single thermoelectric cooler (7) The length is in the range of 1-500mm, the width is in the range of 1-500mm, the thickness is in the range of 0.5-100mm, and the maximum cooling power of a single thermoelectric cooler is in the range of 0-500W.

In the thermal control system of the air-cooled microgroove group and thermoelectric combined laser, the height of a single fin on the heat sink (8) with the fin group is in the range of 0.1-60 mm, and the thickness of the fin is 0.1 mm. In the range of -10mm, the pitch of the ribs is in the range of 0.1-10mm, the size of the fan (9) installed on the top of the cooling plate (8) matches the external dimensions of the cooling plate, and the power of the fan is in the range of 0.5-200W between.

Technical effect of the present utility model:

Studies at home and abroad have shown that the overall characteristics of flow and heat transfer in microchannels are very different from those in large-scale channels. The evaporation and boiling of working fluid in microchannels have extremely high intensity, which belongs to microspace scale The supernormal phenomenon of heat and mass transfer, the theoretical limit of the phase change evaporation heat flux is about two orders of magnitude higher than the current high-power electronic and electrical components such as high-performance computer chips. Good isothermal performance is a high-performance cooling and heat dissipation method. In addition, the thermoelectric cooler has the characteristics of precise temperature control. Through the current input feedback calculation, the temperature of the cold junction can be accurately controlled within ±0.1°C. The local heating element (micro-groove group evaporator 3) in the utility model adopts the principle of evaporation and boiling heat transfer of the working medium in the micro-groove, and its size can be as small as that of very small laser devices, electronic and electrical components and devices. The size of the heating surface of other optoelectronic devices matches; the heat and fluid transport device in the utility model adopts the principle of a two-phase suction circuit of a capillary pump, which can transport the heat of high heat flux taken by the local heating element to the far away. At the same time, the condenser in the utility model is arranged in a space away from the functional systems of lasers, electronic appliances and other optoelectronic equipment, and a thermoelectric cooler is closely attached to the outer surface of the condenser to accurately control the temperature of the outer surface of the condenser . Therefore, the utility model can combine the local heating element (micro-groove group evaporator), heat and fluid transport device, remote heat releasing element (condenser), thermoelectric cooler, cooling plate and fan in the narrow space. The high heat flux generated by tiny high-power laser devices, electronic and electrical components and other optoelectronic devices is dissipated in a timely manner to the external large environmental space in different places, and the high-intensity and high-efficiency of the microgroove group evaporator is used The micro-scale phase transformation thermal characteristics of temperature capability and the high-precision temperature control characteristics of thermoelectric coolers realize the temperature control of laser devices, electronic and electrical components and other optoelectronic devices that generate heat. The utility model does not need to arrange larger ribs, electric fans and other photoelectric devices in the limited space where the heat-generating laser devices, electronic and electrical components and other optoelectronic devices are located in order to strengthen convective heat transfer and cooling, as in some traditional cooling methods. Related heat dissipation and thermal control components, which can greatly save the functional space of lasers, electronic appliances and other optoelectronic equipment systems, and realize the heat extraction without power consumption, long-distance heat transport, silent operation, and high-intensity heat dissipation of the entire heat dissipation system Cooling and high-precision remote thermal control of heat-generating lasers, electronics, and other optoelectronic devices.

Description of drawings:

Fig. 1 is the structural representation of the evaporation micro-groove group in the micro-groove group evaporator in the utility model; Wherein:

Fig. 1(a) surface of evaporation microgroove group;

Fig. 1 (b) microchannel profile of evaporation microgroove group;

Fig. 2 is a schematic diagram of the criss-cross micro-groove structure on the internal steam outlet wall surface of the micro-groove group evaporator in the utility model;

Fig. 3 is the structural representation of condensation microgroove on condenser and its inner wall in the utility model; Wherein:

Fig. 3 (a) internal sectional view of the condenser;

Fig. 3 (b) vertical open trapezoidal coagulation microgroove;

Fig. 3 (c) vertical open trapezoidal condensation microchannel profile;

Fig. 4 is a structural schematic diagram of a liquid guiding microgroove connector in the utility model;

Fig. 5 is a structural schematic diagram of the thermal control system of the air-cooled microgroove group and thermoelectric combined laser of the present invention.

Detailed ways

The ultimate heat sink provided by the utility model adopts the air-cooled micro-groove group and thermoelectric combination laser thermal control system which adopts forced air cooling to dissipate heat. The evaporation microgroove group 2 is formed on the heated inner surface of the heating device itself or the sub-heat sink 1 of the heat generating device in the cavity of the evaporator; the size of the evaporation microgroove group 2 is suitable for forming capillary force, The liquid working substance on the side of the micro-channel can be sucked into the evaporation micro-groove group 2, as shown in Figure 1; it is characterized in that it also includes micro-grooves 4 criss-crossed on the wall where the vapor outlet 15 of the evaporator 3 is located , as shown in Figure 2; the liquid inlet of evaporator 3 links to each other with liquid guide microgroove connector 11, as shown in Figure 4; Open condensation microgrooves 14 are distributed, and the inner cavity is arranged with a slope surface 13 that quickly collects condensate. On the slope surface 13, there are many diversion microgrooves 12 arranged along the length of the slope, which can accelerate the condensation liquid by using gravity and capillary force. As shown in Figure 3; one or more thermoelectric coolers 7 are respectively arranged on the two outer walls of the condenser 6, and the cold surface of each thermoelectric cooler is welded or bonded with better thermal conductivity The heat-conducting agent or heat-conducting silicone grease is in close contact with the outer surface of the condenser, and the hot surface of the thermoelectric cooler is in close contact with the heat sink plate 8 with rib groups by welding or using an adhesive with better thermal conductivity or heat-conducting silicone grease. A fan 9 is mounted on the top of the board 8, as shown in FIG. 5 . One end of one or more insulation hoses 5 is connected to the steam outlet 15 of the microgroove group evaporator 3, and the other end is connected to the steam inlet of the condenser 6; One end is connected to the condensate outlet of the condenser 6, and the other end is connected to the liquid inlet of the liquid guide micro-groove connector 11; a capillary core can be installed in the liquid return hose 10 to increase the condensate to flow back quickly. Capillary force of microgroove group evaporator 3.

The micro-groove group evaporator 3 is made of a heat-conducting metal material, such as metal copper, and the evaporation micro-channels arranged on the heated wall surface of the micro-groove group evaporator 3 are rectangular, triangular or trapezoidal channels, and the micro-channels are longitudinally distributed. arrangement, the width and depth of the channels are all in the range of 0.01-1mm, and the spacing between the micro-channels is in the range of 0.01-1mm, as shown in Figure 1; the size of the open micro-channels is suitable for forming capillary force, to The liquid working substance on the side of the microchannel is sucked into the microchannel. As shown in Figure 2, the criss-cross microgrooves form capillary gravitational force, which can quickly pull the condensate at the gas outlet away from the steam outlet, avoiding the blockage of the condensate along the way in the steam pipe to the steam outlet. The wall surface where the steam outlet in the evaporator is located is densely covered with criss-cross microgrooves, the width and depth of the longitudinal and transverse microgrooves are in the range of 0.01-1 mm, and the distance between the micro-grooves is in the range of 0.01-1 mm. Such criss-cross micro-grooves and evaporation micro-grooves micro-groove group heat sink form a through channel, which can form a good continuous capillary gravitational effect, and can avoid the blockage of the condensate along the steam pipe to the steam outlet.

The evaporation micro-grooves arranged on the heated wall surface of the above-mentioned micro-groove group evaporator 3 are preferably rectangular channels, and the micro-channels are longitudinally distributed and arranged, and the width and depth of the channels are all in the range of 0.1-0.8mm. The distance between them is in the range of 0.1-0.8mm, and the heat extraction capacity of the microgroove group evaporator 3 is relatively strong.

The condenser 6 is made of metal material with high thermal conductivity, such as metal copper. The inner wall of the condenser is densely covered with many open condensation microgrooves in the longitudinal direction. The geometric shape of the condensation microgrooves is trapezoidal, triangular or wavy. The width and depth of the condensation microgrooves are in the range of 0.01-10mm, and the spacing between the condensation microgrooves is 0.01 -20mm range. The outer surface of the condenser 6 is a smooth flat surface.

The width and depth of the rectangular guide microchannels 12 on the slope inside the condenser are both in the range of 0.01-1mm, and the distance between the microchannels is in the range of 0.01-1mm.

The thermoelectric cooler 7 is a kind of chip semiconductor refrigeration device utilizing thermoelectric effect, that is, the Peltier effect. The length of a single thermoelectric cooler 7 is in the range of 1-500mm, the width is in the range of 1-500mm, and the thickness is in the range of 0.5 mm. In the range of -100mm, the maximum cooling power of a single thermoelectric cooler is in the range of 0-500W.

The height of the individual fins on the fin group radiating plate 8 is in the range of 0.1-60mm, the thickness of the fins is in the range of 0.1-10mm, and the spacing between the fins is in the range of 0.1-10mm. The plate height is preferably in the range of 1-50 mm, the fin thickness is in the range of 0.5-2 mm, and the fin spacing is in the range of 1-5 mm. The size of the fan 9 installed on the top of the heat dissipation plate 8 matches the external dimensions of the heat dissipation plate, and the power of the fan is between 0.5-200W.

The liquid-guiding microgroove connector 11 is strip-shaped and consists of a plurality of microtubes closely arranged in parallel. The inner diameter of a single microtube is in the range of 0.01-2mm, and it is made of plastic hose or soft metal or other materials that can be bent arbitrarily. When the inner diameter of a single microtube is in the range of 0.01-1mm, the liquid guide microgroove connector has a stronger effect on stably transporting the condensate in the liquid return hose to the evaporation microgroove in the evaporator .

The steam heat preservation hose 5 can be made of polyurethane pipe, the inner diameter of the steam heat preservation hose is in the range of 1-20 mm, directly made of arbitrarily bendable material with small thermal conductivity, or soft metal material , and made by adding an insulating sleeve outside the tube. The insulating hose plays the role of transporting the steam generated in the local evaporator to the remote condenser.

One end of the liquid return hose 10 is connected to the condensate outlet of the condenser, and the other end is connected to the liquid inlet of the liquid guiding microgroove connector. The inner diameter of the liquid return hose 10 is in the range of 0.1-10mm, and is made of arbitrarily bendable material such as polyurethane material, which can form capillary force. The return hose utilizes gravity and capillary forces to transport condensate from a remote condenser to the drain connector. A capillary wick can be installed in the liquid return hose to increase the capillary force that makes the condensate flow back to the evaporator quickly. The capillary is a porous solid material such as stainless steel wire mesh.

The thermal control system is a sealed system with a certain degree of vacuum. When the absolute pressure in the system is in the range of 0.1-50kPa, the heat dissipation and cooling capacity of the entire heat dissipation system is relatively strong.

The inner diameter of the steam heat insulating hose 5 is in the range of 1-10mm, and when the pipe jacket has a better heat insulating material, the whole heat dissipation system has a better heat dissipation effect.

Example 1

Below in conjunction with accompanying drawing and embodiment the present invention is described in detail:

Referring to Fig. 5, a microgroove group evaporator 3 with a rectangular sealed cavity made of metallic copper with good thermal conductivity can also be called a heat-taking element. The inner wall of the heating surface of the micro-groove group evaporator 3 cavity has a rectangular micro-groove to form an evaporation micro-groove group 2, the spacing of the micro-groove 2 is 0.4mm, the width of the micro-groove 2 is 0.3mm and the groove The track depth is 0.8mm. The size of described rectangular micro-channel 2 is suitable for forming stronger capillary force, so that dehydrated alcohol or distilled water etc. in the micro-groove group evaporator 3 have higher vaporization latent heat liquid working medium through micro-channel 2 Inhaled into the heated area in the microchannel 2 to form high-intensity evaporation and boiling, and become steam to take away the heat generated by the heating element. In this embodiment, the outer surface of the heating surface of the cavity of the micro-groove group evaporator 3 is closely adhered to the outer surface of the heat-generating device or the second heat sink 1 through heat-conducting silicone grease.

One end of a polyurethane insulation hose 5 with a diameter of 5 mm is connected to the steam outlet of the micro-groove group evaporator 3, and the other end is connected to the steam inlet of the condenser 6; another polyurethane return hose 10 with a diameter of 3 mm , one end of which is connected to the condensate outlet of the condenser 6, and the other end is connected to the liquid inlet of the liquid guide microgroove connector 11. The steam flows into the condenser 6 through the thermal insulation hose 5 connected with the micro-groove group evaporator 3 .

The condenser 6 of the present embodiment is a rectangular sealed cavity made of metal aluminum with good thermal conductivity. The inner wall of the condenser 6 is arranged with many vertical open trapezoidal condensation microgrooves 14, the width and depth of the condensation microgrooves 14 are all 1.5mm, and the spacing between the condensation microgrooves is 0.5mm, as shown in Figure 3. Make slope surface 13 in the bottom region in the condenser, the angle of slope is 45 °, open rectangular diversion microchannel 12 on it, the width of diversion microchannel 12 is 1.5mm, depth is 2mm, diversion microchannel The distance between the channels 12 is 1.5 mm. A thermoelectric cooler 7 is respectively arranged on the two outer walls of the condenser 6. The cold surface of each thermoelectric cooler 7 is in close contact with the outer surface of the condenser through heat-conducting silicone grease, and the hot surface of the thermoelectric cooler 7 is passed through heat conduction. The silicon grease is in close contact with the bottom surface of the heat sink 8 of the fin group, and a fan 9 is installed on the top of the heat sink 8. The height of the rectangular fins on the heat sink 8 is 20 mm, the thickness of the fins is 1 mm, and the distance between the fins is 1.5mm, the power of fan 9 is 30W.

The condenser 6 is placed vertically outside the cabinet or cabinet of lasers, electronic appliances or other optoelectronic equipment, or embedded in the wall of the cabinet or cabinet. The steam mainly condenses and releases heat at the top of the open trapezoidal condensation micro-groove on the inner wall of the condenser 6. Under the action of surface tension, the condensate flows horizontally to the valley area of the micro-groove, so that the liquid film at the top of the groove is thinned, and the tank The condensate in the valley area is discharged to the bottom of the condenser 6 from top to bottom along the valley. The bottom of the condenser 6 is arranged with a slope surface 13 for quickly collecting the condensate. The slope surface 13 is arranged along the length direction of the slope. The rectangular diversion microgroove 12 can accelerate the collection of condensate by utilizing the effects of gravity and capillary force. The heat released by the condensation of the steam is conducted from the inner wall of the condenser 6 to the outer surface of the condenser 6, and is absorbed by the cold surface of the thermoelectric cooler 7. The heat generated by the device itself is conducted from the hot surface of the thermoelectric cooler to the ribs of the cooling plate 8, and then the heat is exchanged with the external environment through the air forced convection heat exchange conditions created by the fan 9, and finally the heat is lost to the external environment to go. The condensate at the bottom of the condenser 6 passes through the liquid return hose 10, and the gravity and the strong continuous capillary attraction formed by the liquid return hose 10, the liquid guide microgroove connector 11 and the evaporation microgroove 2 form in time. It flows back into the microgroove group evaporator 3 to complete a cycle of heat extraction and heat release to achieve the purpose of cooling and thermally controlling the heat-generating device.

Embodiment 2: In this embodiment, a capillary wick is installed in the liquid return hose 10 along the direction of the tube axis to increase the capillary force for the condensate to quickly flow back to the evaporator. The capillary core is a 2-layer 250-mesh stainless steel wire mesh core. Other parts of this embodiment are the same as Embodiment 1.

Embodiment 3: In the present embodiment, one end of four polyurethane insulation hoses 5 with a diameter of 4mm is connected with the steam outlet of the microgroove group evaporator 3, and the other end is connected with the steam inlet of the condenser; the other three diameters are 5mm Polyurethane liquid return hose 10, one end of which is connected to the condensate outlet of the condenser, and the other end is connected to the liquid inlet of the liquid guiding microgroove connector 11. Other parts of this embodiment are the same as Embodiment 1.

Embodiment 4: The heat-receiving surface in the heat-taking element (microgroove group evaporator) of this embodiment is the outer surface of the heat-generating device or the second heat sink. That is to directly integrate the outer surface of the heating device or the second heat sink with the micro-groove group evaporator as the inner heating surface of the micro-groove group evaporator and engrave rectangular micro-grooves on its surface to form a micro-groove group. Other parts of this embodiment are the same as Embodiment 1.

Claims (10)

1. An air-cooled micro-groove group and thermoelectric combination laser thermal control system, including: micro-groove group evaporator (3), hose, condenser (6), thermoelectric cooler (7), heat dissipation plate (8) , fan (9), liquid guide micro-groove connector (11); wherein, the evaporator (3) is a vacuumized cavity, and liquid working medium is perfused in it, and an outer part of the micro-groove group evaporator (3) The surface is closely connected to the outer surface of the heating element or the second heat sink (1), and a plurality of open capillary micro-grooves are arranged on the heated inner surface of the micro-groove group evaporator (3) to receive the heat generated by the heating element, forming The evaporation microgroove group (2) is used to suck the liquid working substance into the microgroove and make it undergo high-intensity evaporation and boiling to become steam; it is characterized in that it also includes the top surface of the microgroove group evaporator (3) Be provided with at least one steam outlet (15) on the top, be provided with criss-cross microgrooves (4) on the inner wall of the microgroove group evaporator (3) where steam outlet (15) is located, the lower end of evaporator (3) and the liquid guide The upper end of the microgroove connector (10) is communicated; one end of at least one insulating hose (5) is connected with the steam outlet (15) of the microgroove group evaporator (3), and the other end is connected with the steam inlet of the condenser (6) Connected, steam flows out from the steam outlet (15) of the micro-groove group evaporator (3), and flows into the condenser (6) by the steam inlet of the condenser (6) by the thermal insulation hose (5); the condenser ( 6) It is a vacuumized cavity with at least one steam inlet at its upper end. The inner wall of the cavity of the condenser (6) is longitudinally distributed with a plurality of open condensation microgrooves (14), and the bottom of the cavity is provided with a slope ( 13), on the slope surface (13), there are a plurality of diversion microgrooves (12) arranged along the length direction of the slope, and at least one condensate outlet is arranged at the bottom of the slope surface (13); At least one thermoelectric cooler (7) is respectively arranged on the top, and the cold surface of each thermoelectric cooler (7) is in close contact with the outer surface of the condenser (6) by welding or using an adhesive with good thermal conductivity or thermal conductive silicone grease , the hot surface of the thermoelectric cooler (7) is in close contact with the heat dissipation plate (8) of the rib group by welding or using an adhesive with good thermal conductivity or heat conduction silicone grease, and the top of the heat dissipation plate (8) is set There is a fan (9); the condensate outlet of the condenser (6) is connected to one end of at least one liquid return hose (10), and the other end of the liquid return hose (10) is connected to a liquid guide with at least one liquid inlet The liquid inlet of the microgroove connector (11) is connected, and the liquid guide microgroove connector (11) is a strip, which is provided with a plurality of microtubes closely arranged in parallel, and the microtube upper end is connected with the microgroove group evaporator ( The evaporation microgroove group (2) in 3) is connected, and the lower end is connected with the liquid return hose (10); the absolute pressure in the system is in the range of 0.1-50kPa. 2. air-cooled micro-groove group and thermoelectric combination laser thermal control system according to claim 1, is characterized in that, described micro-groove group evaporator (3) is made of heat-conducting metal material, and the inner heating wall surface is provided with The cross-section of the evaporation micro-channel (2) is rectangular, triangular or trapezoidal, the micro-channels are arranged longitudinally, the width and depth of the channels are in the range of 0.01-1mm, and the distance between the micro-channels is in the range of 0.01-1mm Inside, on the wall where the steam outlet (15) of the microgroove group evaporator (3) is located, there are densely criss-crossed microgrooves (4), whose cross-sections are rectangular, triangular, trapezoidal, U-shaped geometric shapes, longitudinal and transverse microgrooves (4) The width and depth are in the range of 0.01-1 mm, and the distance between the micro channels is in the range of 0.01-1 mm. 3. air-cooled microgroove group and thermoelectric combination laser thermal control system according to claim 1, is characterized in that, described condenser (6) is made by heat-conducting metal material; Condenser (6) inner wall is vertically densely covered with many An open coagulation microgroove (14), the cross section of the coagulation microgroove (14) is trapezoidal, triangular or wavy, the width and depth of the coagulation microgroove (14) are in the range of 0.01-10mm, and the coagulation microgroove (14) The distance between them is in the range of 0.01-20mm; the outer surface of the condenser (6) is a smooth and flat surface. 4. The air-cooled micro-groove group and thermoelectric combination laser thermal control system according to claim 1, wherein the rectangular guide micro-groove (12) on the bottom slope in the cavity of the condenser (6) The width and depth of the microchannels are both in the range of 0.01-1 mm, and the spacing between the micro-channels is in the range of 0.01-1 mm. 5. air-cooled microgroove group and thermoelectric combination laser thermal control system according to claim 1, it is characterized in that, the plurality of parallel microtubes closely arranged in the described liquid guide microgroove connector (11), its single The inner diameter of the root microtube is in the range of 0.01-2mm, and it is made of plastic hose or soft metal or a material that can be bent arbitrarily. 6. The thermal control system of air-cooled microgroove group and thermoelectric combined laser according to claim 1, wherein said steam insulation hose (5) is made of arbitrarily bendable material, and its inner diameter is 1-20mm In the range. 7. The thermal control system of air-cooled microgroove group and thermoelectric combined laser according to claim 1, characterized in that, the inner diameter of the liquid return hose (10) is within the range of 0.1-10mm, which can form a capillary force drive Function, made of materials that can be bent arbitrarily. 8. The air-cooled microgroove group and thermoelectric combined laser thermal control system according to claim 1, wherein a capillary core is provided along the tube axis direction in the liquid return hose (10), and the capillary core is a single Stainless steel or copper mesh core with one or more layers of mesh between 50-450 mesh. 9. air-cooled microgroove group and thermoelectric combination laser thermal control system according to claim 1, is characterized in that, described thermoelectric cooler (7) is a kind of sheet semiconductor refrigeration device utilizing thermoelectric effect, single The length of the thermoelectric cooler (7) is in the range of 1-500mm, the width is in the range of 1-500mm, the thickness is in the range of 0.5-100mm, and the maximum cooling power of a single thermoelectric cooler is in the range of 0-500W. 10. The thermal control system of air-cooled microgroove group and thermoelectric combined laser according to claim 1, characterized in that, the height of a single fin on the heat dissipation plate (8) of the fin group is 0.1-60mm In the range of 0.1-10mm, the fin thickness is in the range of 0.1-10mm, and the fin spacing is in the range of 0.1-10mm. The size of the fan (9) installed on the top of the cooling plate (8) is related to the overall size of the cooling plate Matching, the fan power is between 0.5-200W.

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