CN102792119A - Loop heat pipe - Google Patents
Loop heat pipe Download PDFInfo
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- CN102792119A CN102792119A CN2010800652950A CN201080065295A CN102792119A CN 102792119 A CN102792119 A CN 102792119A CN 2010800652950 A CN2010800652950 A CN 2010800652950A CN 201080065295 A CN201080065295 A CN 201080065295A CN 102792119 A CN102792119 A CN 102792119A
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- heat pipe
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/12—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overpressure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Disclosed is a loop heat pipe which provides stable cooling performance during operation by maintaining thermal contact between an evaporator case and a wick even when a working fluid is at a high temperature and high pressure. The loop heat pipe includes an evaporator for evaporating the working fluid with heat from a heat-generating element and a condenser for condensing the evaporated working fluid, the evaporator and the condenser being coupled to each other in a loop via a coupling pipe. The evaporator has a first space and a second space. The first space has a contact surface with the heat-generating element and evaporates the working fluid fed through the coupling pipe, and the second space is provided on at least one of those surfaces that define the first space and are other than the contact surface. The evaporator is constructed to have a communication hole in the division wall that separates the first and second spaces from each other, the communication hole communicating between the first space and the second space.
Description
Technical field
The present invention relates to use the ring type heat pipe in coolings such as electronic equipment.
Background technology
As the equipment that is used to cool off various heaters known have evaporimeter and condenser are connected into ring-like ring type heat pipe through steam pipe and liquid pipe; Said evaporimeter is used for making working solution (being in the working fluid of liquid condition) gasification through the heat from heater; Said condenser makes the working solution condensation (for example, with reference to patent documentation 1) of gasification through heat radiation.
Figure 1A～Fig. 1 C is the figure that the structure of existing evaporimeter 1000 is shown.Figure 1A is the profile of the mobile direction of working fluid, and Figure 1B and Fig. 1 C are its A-A' profiles.Heaters such as electronic unit 1010 are made as plane mostly.Therefore, for the evaporimeter 1000 of ring type heat pipe also easily and heater 1010 be close to, heating surface 1002 constitutes plane.In order to improve the cooling performance of ring type heat pipe, need increase the internal capacity of evaporimeter 1000 as far as possible, but, therefore use the plate heat pipe that satisfies these two requirements owing to also there is the requirement that makes compact appearance as far as possible.
For in when work (during heating) cool off heater 1010 effectively, need make working solution 1006 evaporations that are supplied to evaporimeter 1000 from liquid pipe 1003 effectively.Therefore, evaporator shell 1001 and wick 1007 are close to hot mode, the heat of flash-pot housing 1001 passes to wick 1007 effectively in the future, makes by the working solution 1006 of wick 1007 dippings promptly to gasify.The working fluid that is evaporated, gasifies imports to steam pipe 1004 through the groove 1005 that is formed on the wick 1007.But, be heated at evaporimeter 1000, inner working fluid becomes under the situation of high temperature, produce the situation that the close property of evaporator shell 1001 and wick 1007 reduces.Fig. 1 C illustrates this situation.
In Fig. 1 C, be pressed at the saturated vapor of working fluid under the operating temperature of ring type heat pipe and surpassed under the atmospheric situation, the wall of evaporator shell 1001 since interior the pressures quilt of working fluid pushed to the outside.Particularly, under the situation of using ring type heat pipe at normal temperatures and pressures, and be under the situation of the working fluid (for example, pentane or R141B, butane, ammonia etc.) more than the room temperature having used the boiling point under the atmospheric pressure, produce distortion at evaporator shell 1001.If the shape of evaporimeter is a cylinder type, then owing in circumferencial direction, press and disperseed and the expansion of evaporator shell is few, but under the situation like Fig. 1 plate heat pipe that C is shown in, on the big upper surface of area in pressure concentrated, the shell wall side expansion.Particularly be made as owing to the miniaturization that requires electronic equipment, lightness under the situation of plate evaporimeter; Because it is slim that hope is made as evaporator body as far as possible, the thickness of enough rigidity of pressing in therefore in evaporator shell 1001, being difficult to guarantee to obtain withstanding.At evaporator shell 1001 because interior pressure and under the dilated situation; The close property variation of the contact-making surface of evaporator shell 1001 and inner wick 1007 (particularly, with upper surface such as the lower surface of the heater 1010 that is fixed in CPU etc.) than evaporator shell 1001.And at high temperature, between evaporator shell 1001 and wick 1007, produce gap 1020.Under this state, causing not transmitting heat, working fluid to wick 1007 from evaporator shell 1001 can be from the surface evaporation of wick 1007 and the problem that cooling performance reduces.
Patent documentation 1: TOHKEMY 2004-218887
Summary of the invention
Therefore; The present invention is a problem so that following ring type heat pipe to be provided: even the inner working fluid of evaporimeter becomes under the situation of high temperature, high pressure when ring type heat pipe is worked; Also keep being close to of heat of evaporator shell and wick, be implemented in ring type heat pipe in working order under stable cooling performance.
To achieve these goals; In one aspect of the invention, a kind of ring type heat pipe is will make the evaporimeter of working fluid gasification through the heat from heater and make vaporized working fluid condenser condensing connect into ring-type through connecting piece to form; Said annular heat pipe is characterised in that; Said evaporimeter has: first space, and said first space has the contact-making surface that contacts with said heater, and makes the said working fluid evaporation from said connecting piece supply; And second space; Said second space be set in the face that constitutes said first space, at least one face beyond the said contact-making surface, the partition wall of said first space and second spaced is provided with the intercommunicating pore with said first space and second spatial communication.
In another side of the present invention; A kind of ring type heat pipe; Be will make the evaporimeter of working fluid gasification through the heat from heater and make vaporized working fluid condenser condensing connect into ring-type through connecting piece to form, said annular heat pipe is characterised in that said evaporimeter has: first space; Said first space has the contact-making surface that contacts with said heater, and makes the said working fluid evaporation from said liquid pipe supply; Second space, said second space be set in the face that constitutes said first space, at least one face beyond the said contact-making surface, and be sealed in second fluid of the said workflow height of saturated vapor pressure ratio under the uniform temp.
According to above-mentioned formation, even evaporimeter inner working fluid has become under the situation of high temperature, high pressure when ring type heat pipe is worked, also can keep the close property of evaporator shell and wick well, realize stable cooling performance.
Description of drawings
Figure 1A is the figure that is illustrated in the formation of the plate evaporimeter in the past that uses in the ring type heat pipe, is the profile along the direction that flows of working fluid.
Figure 1B is the A-A' profile of Figure 1A, is the figure that the state when stopping that moving is shown.
Fig. 1 C is the A-A' profile of Figure 1A, is the figure that is used for explaining the problem points when existing plate evaporimeter heats.
Fig. 2 is the figure that the integral body formation of using ring type heat pipe of the present invention is shown.
Fig. 3 A is the figure of formation that the evaporimeter of first embodiment is shown, and is the profile along the flow direction of working fluid.
Fig. 3 B is the A-A' profile of Fig. 3 A.
Fig. 4 is the curve map of the temperature-saturated vapor pressure curve of each working fluid.
Fig. 5 A is the sketch map that is used to explain the effect of first embodiment, is the figure of the evaporator stage when action being shown stopping.
Fig. 5 B is the sketch map that is used to explain the effect of first embodiment, is the figure of the state of the evaporimeter when heating is shown.
Fig. 6 A is the routine simple profile of lift-launch that the evaporimeter of first embodiment is shown.
Fig. 6 B is the routine stereogram of lift-launch of the evaporimeter of Fig. 6 A.
Fig. 7 is the curve map of effect that the ring type heat pipe of the evaporimeter that has used first embodiment is shown.
Fig. 8 A is the figure of variation 1 that the evaporimeter of first embodiment is shown, and is the figure of the state of the evaporimeter when action being shown stopping.
Fig. 8 B is the figure of the state of the evaporimeter when heating in the variation 1 of Fig. 8 A is shown.
Fig. 9 A is the figure of variation 2 that the evaporimeter of first embodiment is shown, and is the figure of the state of the evaporimeter when action being shown stopping.
Fig. 9 B is the figure of the state of the evaporimeter when heating in the variation 2 of Fig. 9 A is shown.
Figure 10 A is the figure of formation that the evaporimeter of second embodiment is shown, and is the profile along the flow direction of working fluid.
Figure 10 B is the A-A' profile of Figure 10 A.
Figure 11 A is the sketch map that is used to explain the effect of second embodiment, is the figure of the state of the evaporimeter when action being shown stopping.
Figure 11 B is the sketch map that is used to explain the effect of second embodiment, is the figure of the state of the evaporimeter when heating is shown.
Figure 12 A is the figure that the variation 1 of second embodiment is shown, and is the figure that the state of the evaporimeter of action when stopping to be shown.
Figure 12 B is the figure of the state when heating in the variation 1 of Figure 12 A is shown.
Figure 13 A is the routine simple profile of lift-launch that the evaporimeter of second embodiment is shown.
Figure 13 B is the routine stereogram of lift-launch that the evaporimeter of Figure 13 A is shown.
Figure 14 is the curve map of effect that the ring type heat pipe of the evaporimeter that has used second embodiment is shown.
The specific embodiment
Fig. 2 is the figure that the integral body formation of using ring type heat pipe 1 of the present invention is shown.Ring type heat pipe 1 through be used for to condenser 11 supply come flash-pot 10 working fluid steam pipe 14 and be used for connecting evaporimeter 10 that the heat that is used for the spontaneous hot body of origin (electronic unit etc.) makes the working fluid gasification that is in liquid condition, being used for making the working fluid condenser condensing 11 that is in gaseous state connect into ring-type from the liquid pipe 13 of the working fluid of condenser 11 through heat radiation to evaporimeter 10 supplies.Liquid pipe 13 and the steam pipe 14 common connecting pieces that form.In the example of Fig. 2, be made as and Air Blast fan 12 is set near condensation part 11 promotes the formation cooled off.
In addition, the fluid of the inside of steam pipe 14 and liquid pipe 13 may not be 100% steam or 100% liquid, is multiphase flow arbitrarily.When ring type heat pipe 1 was being worked, because the inside of steam pipe 14 almost is steam, the inside of liquid pipe 13 almost was liquid, therefore was called for ease " steam pipe " and " liquid pipe ".
Fig. 3 A and Fig. 3 B are the figure of formation that the evaporimeter 10 of first embodiment is shown.Fig. 3 A is that Fig. 3 B is the profile along the A-A' line of Fig. 3 A along the profile of the mobile direction of working fluid.In first embodiment; Stilling chamber (second space) 40B that evaporimeter 10 has vaporization chamber (first space) 40A that contains liquid feed path 46 and is used to regulate the pressure of vaporization chamber is formed with the pressure regulating hole 55 that is communicated with vaporization chamber 40A and stilling chamber 40B on the partition wall 51 that vaporization chamber 40A and stilling chamber 40B are separated.
In the example of Fig. 3 A and Fig. 3 B, the bottom surface of evaporator shell 40 becomes heating surface 42.Evaporimeter 10 is carried on heater (with reference to Fig. 6 A) with the mode that the heater of heating surface 42 and electronic unit etc. contacts, and accepts the heat from electronic unit.Wick (porous body) but 47 contact with mode machinery and heat conduction with the inwall of vaporization chamber 40A.Be supplied to the working solution (working fluid of liquid condition) 49 of vaporization chamber 40A to be submerged in the wick 47 through liquid pipe 13.Impregnated liquid is heated through the heat that passes to wick from evaporator shell 40.The inside of evaporimeter 10 is retained as the saturated vapour pressure of working fluid, and the evaporation gasification takes place the time point that surpasses the boiling point that inner saturated vapor depresses in the temperature of working solution.At this moment, working fluid obtains the latent heat energy.The steam that has obtained the latent heat energy flow into steam pipe 14 through the groove (steam is discharged and used groove) 45 that is formed in the wick 47, and its part flow into stilling chamber 40B through pressure regulating hole 55 simultaneously.Thus, vaporization chamber 40A and stilling chamber 40B are almost uniform pressure.In addition, the saturated vapour pressure in the serviceability temperature scope of working fluid 49 is to use more than the atmospheric pressure under the environment of ring type heat pipe 1.
Concrete formation example to the evaporimeter 10 shown in Fig. 3 A and Fig. 3 B describes.Evaporator shell 40 is that whole height is that 18mm, width are that 60mm, length are that 70mm is plate.The upper face side that is made as at vaporization chamber 40A is provided with stilling chamber 40B double-layer structural, and it is that 56mm, length are the space of 66mm for 1mm, width highly that stilling chamber 40B constitutes.Stilling chamber 40B and vaporization chamber 40A are that the partition wall 51 of 2mm separates by thickness, and the diameter that the steam side of leading to vaporization chamber 40A is set on partition wall 51 is the pressure regulating hole 55 of 1mm.The indoor size of vaporization chamber 40A is highly to be that 11mm, width are that 56mm, length are 66mm, and the thickness integral body of wall is 2mm.
As the material of evaporator shell 40 and partition wall 51, in first embodiment, used oxygen-free copper.Existing plate evaporimeter uses the high materials such as stainless steel of modulus of rigidity mostly for anti-higher interior pressure, but in first embodiment such as hereinafter described material that must use rigidity high of need not.The preferred use material higher than stainless steel thermal conductivity is so that the Temperature Distribution of evaporator shell 40 is balanced.For example can use the material of aluminium alloy etc. for lightweight.
The wick 47 that is configured in the inside of vaporization chamber 40A is sintrered nickel systems, and the porous diameter is 10 μ m, and void content approximately is 50%.The appearance and size of wick 47 is height 11mm, width 56mm, length 50mm, in order to take in the state of being close to the inwall of vaporization chamber 40A, especially critically makes height dimension.In addition, on the upper surface of wick 47 and lower surface (face that joins with upper surface and the lower surface of vaporization chamber 40A), width is that 1mm, the degree of depth are that vapor passageway (groove) 45 of 2mm forms 15 in each face at interval with 3mm.At the central portion of wick 47, be that 40mm, length are the liquid feed path 46 of 40mm highly for 3mm, width in order to be incorporated into the inside of wick 47 and to be provided with from the working solution 49 of liquid pipe 13 supplies.
It is that 6mm, internal diameter are the copper pipe of 5mm, the about 300mm of length that steam pipe 14, the liquid pipe 13 of binding evaporimeter 10 and condensation part 11 are external diameter.Condensation part 11 is same with steam pipe 14 and liquid pipe 13, is that external diameter is that 6mm, internal diameter are that 5mm, length are the copper pipe of 400mm, with fin can be connected in heat conduction pipe around, cool off (with reference to figure 2) through Air Blast fan 12.
In first embodiment, use the n-pentane as working fluid 49, but also can use the high fluid of vapour pressure of butane or ammonia etc.
Fig. 4 is the curve map that the vapor pressure curve of various fluids is shown.Boiling point under the atmospheric pressure when using the n-butane as working fluid 49 approximately is 36 ℃.When ring type heat pipe 1 work, the temperature of working fluid 49 is near 50～70 ℃, is therefore using under butane or the situation of pentane as working fluid 49, and this vapour pressure is more than the atmospheric pressure.Under the situation that the existing evaporimeter shown in Figure 1A constitutes, shown in Fig. 1 C, the upper surface of housing 1001 expands owing to the interior pressure of working fluid, so the close property variation of the evaporator shell 1000 and the wick 1007 of inside, and performance descends.Relative therewith; In first embodiment; Evaporimeter 10 is made as double-layer structural and in the upper surface side of vaporization chamber 40A stilling chamber 40A is set; And to flow into stilling chamber 40B and at partition wall 51 pressure regulating hole 55 is set in order to make from the steam of the surface evaporation of wick 47, under above-mentioned situation, vaporization chamber 40A and stilling chamber 40B become uniform pressure.
Fig. 5 A and Fig. 5 B are the sketch mapes that is used to explain the effect of first embodiment.Using under the situation of butane as working fluid 49, when since the heat that gives out from electronic unit 20 when being impregnated into the working fluid heating the wick 47, the vapour pressure in the vaporization chamber 40A rises.The working fluid that has gasified flow in the stilling chamber 40B from pressure regulating hole 55; Therefore be applied to the vapour pressure on the partition wall 51 and the vapour pressure that is applied on the partition wall 51 from stilling chamber 40B becomes equal basically from vaporization chamber 40A; Shown in Fig. 5 B, the partition wall 51 that contacts with wick 47 can be owing to interior pressure is out of shape.On the other hand, the upper surface 53 of evaporator shell 40 (also being the upper surface of stilling chamber 40B in first embodiment) is owing to press the saturated vapour pressure height of comparing butane, therefore expansion, bending toward the outer side with atmosphere outside.But because partition wall 51 self can not be out of shape, even therefore make under the situation that the interior pressure of vaporization chamber 40A uprises in the vapour pressure owing to working solution 49, vaporization chamber 40A and wick 47 also can keep good thermo-contact.
Fig. 6 A and Fig. 6 B are the routine figure of lift-launch that the evaporimeter 10 of first embodiment is shown.The evaporimeter 10 of ring type heat pipe 1 is configured on the electronic unit 20 on the printed base plate 30 via grease 21, and is fixed in printed base plate 30 through construction bolt 31.The caloric value of evaporimeter 10 approximately is 60W in first embodiment.At this moment, with not shown condensation part 11 through Air Blast fan (
12V driving) 12 at room temperature (25 ℃) cool off.
Fig. 7 is the curve map that the cooling performance of the ring type heat pipe that constitutes as stated is shown.As comparative example, the ring type heat pipe of making the evaporimeter assembled existing structure shown in Figure 1 carries out the work experiment, so with the ring type heat pipe 1 of first embodiment cooling performance relatively.The transverse axis of curve map representes that heater adds heat (caloric value of electronic unit), and the longitudinal axis is represented the resistance to heat of evaporimeter 10 and condensation part 11.Resistance to heat be difference with the mean temperature of the temperature of the heating surface 42 of evaporimeter 10 and condensation part 11 divided by the heat of heater 20 value.The resistance to heat value is low more, be that the temperature difference of heating surface 42 and condensation part 11 is more little, expression is transmitted heat from evaporimeter 10 to condensation part 11 more effectively, has high cooling performance.
Under the situation of the ring type heat pipe of prior art, caloric value is high more, and the interior pressure of evaporimeter is high more, shown in Fig. 1 C, and the gap enlargement of evaporator shell 1001 and wick 1007, cooling performance reduces (resistance to heat increase).Relative therewith; Under the situation of first embodiment; Even uprise and the temperature of evaporimeter becomes under the situation of high temperature in caloric value; As shown in Figure 5, owing to can guarantee the state that the thermo-contact of partition wall 51 and wick 47 in the evaporator shell 40 is kept well, therefore can keep high cooling performance (keep resistance to heat lower).
Fig. 8 A and Fig. 8 B are the figure that the variation 1 of first embodiment is shown.In variation 1, set the outer wall (for example upper surface) 63 of the evaporator shell 60 that constitutes stilling chamber 60B than the isolated partition wall of vaporization chamber 60A and stilling chamber 60B 61 is thin.For example, the thickness of partition wall 61 is made as 2mm, the thickness of the upper surface 63 of evaporator shell 60 is made as 1mm.Shown in Fig. 8 A, stilling chamber 60B is distortion not when action stopped.On the other hand, when heating, shown in Fig. 8 B, stilling chamber 60B expands.Through making outer side surface (upper surface) 63 thinner, receive the vapour pressure that flow into stilling chamber 60B and outer side surface 63 is in the outside that (atmospheric side) deforms, but inboard partition wall 61 does not deform basically than inboard partition wall 61.This is formed in and keeps the close property aspect of internal separation wall 61 and wick 47 effective consistently.In addition, in Fig. 8, the thickness of outer wall 63 is made as partition wall 61 thickness 1/2, but be not limited to this example, under the situation to the form generation influence of partition wall 61 not, outer wall 63 can be set at the suitable thickness that can deform.Can set based on the kind of the working fluid that uses, for example the thickness of outer wall 63 suitably set (PLSCONFM is no problem in this scope) in 1/5～2/3 scope of the thickness of partition wall 61.
Fig. 9 A and Fig. 9 B are the figure that the variation 2 of first embodiment is shown.In variation 2, the upper surface 73 of evaporator shell 70 is same degree with the thickness of inboard partition wall 71, but makes partition wall 71 crooked slightly to the vaporization chamber 70A side that disposes wick 47 in advance.Shown in Fig. 9 A, stilling chamber 70B is distortion not when action stopped.On the other hand, shown in Fig. 9 B, stilling chamber 70B expands when heating.In this constitutes; When the outer side surface (upper surface) 73 of evaporator shell 70 expanded laterally owing to the steam that flow into stilling chamber 70B from pressure regulating hole 75, inboard partition wall 71 also deformed to the direction of increase to the degree of the bending of wick 47 sides.Consequently, with the power generation effect of partition wall 71 to wick 47 pushings.Thus, the close property of partition wall 71 and wick 47 improves more, and the cooling performance of ring type heat pipe improves.
As stated,, make the cooling performance of ring type heat pipe improve, stablize, realize the stable action of electronic equipment with simple formation according to the formation of first embodiment.
Embodiment 2
Figure 10 A and Figure 10 B are the figure of formation that the evaporimeter 80 of the second embodiment of the present invention is shown.Figure 10 A is the profile along the working fluid flow direction, and Figure 10 B is the profile along the A-A' line of Figure 10 A.In a second embodiment, evaporimeter 80 has vaporization chamber (first space) 90A that contains liquid feed path 86 and has the 90B of bubble-tight second fluid chamber (second space).Second 90B of fluid chamber is the space that is used to be contained in second fluid 100 of the high saturated vapour pressure of the saturated vapour pressure of the working fluid that has than is supplied to vaporization chamber 90A under the uniform temp.At least a portion of second fluid 100 is liquid phase 100b.With reference to the curve map of figure 4, using under the situation of ethanol as working fluid, as second fluid ethanol, pentane, butane, ammonia etc. are enclosed with the state of a part of liquid phase.At working fluid is under the situation of pentane, and second fluid and pentane, butane, ammonia etc. are enclosed with the state of a part of liquid phase.
In the example of Figure 10 A and Figure 10 B, the bottom surface of evaporator shell 90 becomes heating surface 82.Evaporimeter 80 carries on heater 20 with the mode that the heater 20 of heating surface 82 and electronic unit etc. contacts, and accepts the heat (with reference to figure 11A and Figure 11 B) from electronic unit.Wick (porous body) but 47 contact with the inwall of vaporization chamber 90A mode through the heat conduction of machinery.Be supplied to the working solution 89 of vaporization chamber 90A to be submerged in the wick 47 by liquid pipe 83, and passed to the heat heating of wick 47 from evaporator shell 40, and gasified.The steam that has been gasified flow into steam pipe 84 from the groove 45 that is formed on wick 47.On the other hand, when electronic device works, the part of second fluid that is sealing into second 90B of fluid chamber is also by the hot gasization of transmitting through evaporator shell 90, becomes to have the two state of gas phase 100a and liquid phase 100b.
Concrete formation example to the evaporimeter 80 shown in 10A and Figure 10 B describes.Evaporator shell 80 is that whole height is that 18mm, width are that 60mm, length are that 70mm is plate.Be made as the double-layer structural that is provided with second 90B of fluid chamber in the upper surface side of vaporization chamber 90A, it is that 56mm, length are the confined space of 66mm for 1mm, width highly that second 90B of fluid chamber is made as.Second 90B of fluid chamber and vaporization chamber 90A are that the partition wall 91 of 2mm separates through thickness.The indoor size of vaporization chamber 90A is highly to be that 11mm, width are that 56mm, length are 66mm, and the thickness of wall is 2mm on the whole.
The material of evaporator shell 90 and partition wall 91 has been used oxygen-free copper in a second embodiment.Existing plate evaporimeter uses the high materials such as stainless steel of modulus of rigidity mostly for anti-higher interior pressure, but does not need the material that necessarily uses rigidity high in a second embodiment as hereinafter described.The preferred use material higher than stainless steel thermal conductivity is so that the Temperature Distribution of evaporator shell 90 is balanced.The material that for example can use aluminium alloy etc. is to realize lightweight.
The wick 47 that is configured in the inside of vaporization chamber 90A is sintrered nickel systems, and the porous diameter is 10 μ m, and void content approximately is 50%.The appearance and size of wick 47 is highly to be that 11mm, width are that 56mm, length are 50mm, and in order to take in the state of being close to the inwall of vaporization chamber 90A, especially critically makes height dimension.In addition, on the upper surface of wick 47 and lower surface (face that joins with upper surface and the lower surface of vaporization chamber 90A), width is that 1mm, the degree of depth are that vapor passageway (groove) 45 of 2mm forms 15 in each face at interval with 3mm.At the central portion of wick 47, be that 40mm, length are the liquid feed path 86 of 40mm highly for 3mm, width in order to be incorporated into the inside of wick 47 and to be provided with from the working solution 49 of liquid pipe 13 supplies.
It is that 6mm, internal diameter are the copper pipe of 5mm, the about 300mm of length that steam pipe 84, the liquid pipe 83 of binding evaporimeter 80 and condensation part 11 (with reference to Fig. 2) are external diameter.Condensation part 11 is same with steam pipe 84 and liquid pipe 83, is that external diameter is that 6mm, internal diameter are that 5mm, length are the copper pipe of 400mm, with fin can be connected in heat conduction pipe around, and cool off through Air Blast fan 12.
In a second embodiment, use the n-pentane as working fluid 89.Pentane boiling point under atmospheric pressure approximately is 36 ℃, and when ring type heat pipe 1 work, the temperature of working fluid 89 is near 50～70 ℃, so the vapour pressure of pentane is more than the atmospheric pressure.On the other hand, in second 90B of fluid chamber, enclose the butane of 1cc in advance as second fluid.Be and enclose the same method of working fluid to the inclosure of the butane of second 90B of fluid chamber, after the inner space is made as vacuum state, only enclose second fluid (butane) to ring type heat pipe.Second fluid gas phase when heater (electronic unit) 20 work becomes advantage, but at least a portion of second fluid is a liquid phase when work and when not working.
Figure 11 A and Figure 11 B are the sketch mapes that is used to explain the effect of second embodiment.Using under the situation of butane as second fluid, the saturated vapour pressure of the butane under the uniform temp likens to the saturated vapour pressure of the n-pentane of working fluid is high, but not distortion of second 90B of fluid chamber when action stops.In when heating, if be made as the workflow side (vaporization chamber 90A) of evaporator shell 90 with the temperature of second fluid side (second 90B of fluid chamber) is identical basically, then partition wall 91 is by to the pressure downside, promptly be provided with the vaporization chamber 90A thruster pressure of wick 47.Because temperature is high more, the pressure differential of working fluid 89 and second fluid 100 is big more, and therefore along with evaporator shell 90 is accepted to become high temperature from the heat of heater 20, partition wall 91 and wick 47 are close to more.At this moment; Shown in Figure 11 B; Compare second 90B of fluid chamber and atmospheric difference with the difference of the interior pressure of second 90B of fluid chamber bigger because with vaporization chamber 90A; Therefore the upper surface 93 of second 90B of fluid chamber is crooked toward the outer side, but because partition wall 91 yet expands to vaporization chamber 90A side, therefore the close property with wick 47 improves.
Figure 12 A and Figure 12 B are the figure of variation that the evaporimeter of second embodiment is shown.In a second embodiment; Make the thickness of partition wall 91 and the identical 2mm of being made as of wall thickness of evaporator shell 90; But in variation with the thickness setting of the partition wall 91a that separates the vaporization chamber 90A and second 90B of fluid chamber of evaporimeter 80a for wall thickness than evaporator shell 90, for example be set at 1mm.Through formation like this, not distortion (Figure 12 A) of second 90B of fluid chamber when action stops, but when heating partition wall 91a easy deformation, can make partition wall 91a and wick 47 be close to (Figure 12 B) with stronger power.
Figure 13 A and Figure 13 B are the routine figure of lift-launch that the evaporimeter 80 of second embodiment is shown.The evaporimeter 80 of ring type heat pipe 1 is configured on the electronic unit 20 on the printed base plate 30 via grease 21, and is fixed in printed base plate 30 through construction bolt 31.The caloric value of evaporimeter 80 approximately is 60W in a second embodiment.At this moment, not shown condensation part 11 is at room temperature cooled off under (25 ℃) through Air Blast fan (
12V driving) 12.The working solution that is immersed in the wick 47 owing to the heat that passes to evaporator shell 90 from heat generating components 20 is gasified; And the saturated vapor pressure ratio is sealing into also generating gasification of the second big fluid of the working solution of second 90B of fluid chamber, with wick 47 pushings of partition wall 91 to vaporization chamber 90A side.
Figure 14 is the curve map of cooling performance that the ring type heat pipe of second embodiment is shown.As comparative example, make the ring type heat pipe assembled the existing wick structure shown in Figure 1A～Fig. 1 C and carry out the work experiment, and then with the ring type heat pipe 1 of second embodiment cooling performance relatively.The transverse axis of curve map representes that heater adds heat (caloric value of electronic unit), and the longitudinal axis is represented the resistance to heat of evaporimeter 80 and condensation part 11.Resistance to heat be difference with the mean temperature of the temperature of the heating surface 82 of evaporimeter 80 and condensation part 11 divided by the heat of heater 20 value.The resistance to heat value is low more, be that the temperature difference of heating surface 82 and condensation part 11 is more little, expression is transmitted heat from evaporimeter 80 to condensation part 11 more effectively, has high cooling performance.
Under the situation of the ring type heat pipe of prior art, caloric value is high more, and the temperature of evaporimeter is high more, thus shown in Fig. 1 C, and the gap enlargement of evaporator shell 1001 and wick 1007, cooling performance reduces (resistance to heat increase).Relative therewith; Under the situation of second embodiment; The temperature of evaporimeter becomes the situation of high temperature even caloric value uprises; Shown in Figure 11 B or Figure 12 B, be retained as good state owing to can keep the thermo-contact of partition wall 91,91a and wick 47 in the evaporator shell 90, therefore can keep high cooling performance (maintain resistance to heat lower).
In order to prove such effect, calculate and using pentane as the deflection of the width under the situation of working fluid as the Cu system evaporator shell 90 of 56mm.In existing formation shown in Figure 1, the atmospheric pressure of (paying near for 70 ℃) during owing to LHP work and the difference of the pressure in the evaporator shell are 0.2MPa (with reference to Fig. 4), and 95 μ m dilatancies take place housing laterally.Think that thus housing and wick can not thermo-contacts, resistance to heat increases.On the other hand, shown in figure 11, enclosing under the situation of butane to second 90B of fluid chamber, compare the interior pressure step-down 0.5MPa of vaporization chamber 90A with the interior pressure of second fluid chamber 90.Do not have wick if be made as in vaporization chamber 90A, then the partition wall 91 of evaporator shell is to the side-prominent 140 μ m of vaporization chamber 90A, but because wick 47 is arranged in vaporization chamber 90A, so partition wall 91 is thought that close property improves by to wick 47 pushings.
In addition, relatively the curve map of Figure 14 can be known with the curve map of Fig. 7, under the situation that the evaporimeter that has adopted second embodiment constitutes, compares with the evaporimeter formation of first embodiment and can further realize high cooling effect.
In first embodiment and second embodiment; Only the upper surface of the big evaporator shell of heat-conducting area, with the face of heating surface opposition side on second space be set be made as double-layer structural, but can form second space with the mode of one or two sidewalls of covering vaporization chamber (first space).Upper surface and two side covering vaporization chamber (first space) form under the situation in second space, and three faces that spread all over except the heating surface of evaporimeter adopt double-layer structural.Under this situation, the heat of wick and vaporization chamber is close to further raising.
This international application is advocated the priority at the patent application 2010-075443 of Japan's application on March 29th, 2010, and its full content is programmed in this international application with hereby.
Utilizability on the industry
The ring type heat pipe that the present invention relates to can be applied to the cooling device of various heaters such as electronic equipment.
Symbol description:
1 ... Ring type heat pipe; 10,80 ... Evaporimeter; 13,83 ... The liquid pipe; 14,84 ... Steam pipe; 20 ... Heater (electronic equipment); 40,60,70,90 ... Evaporator shell; 40A, 60A, 70A, 90A ... Vaporization chamber (first space); 42,82 ... Heating surface; 47 ... Wick; 49,89 ... Working fluid; 40B, 60B, 70B ... Stilling chamber (second space); 51,61,71,91,91a ... Partition wall; 55,65,75 ... Pressure regulating hole (intercommunicating pore); 90B ... Second fluid chamber (second space); 100 ... Second fluid; 100a ... Second fluid of gas phase state; 100b ... Second fluid of liquid phase state.
Claims (10)
1. ring type heat pipe is the evaporimeter that will make the working fluid gasification through the heat from heater through connecting piece with make vaporized working fluid condenser condensing connect into ring-type forms, and said annular heat pipe is characterised in that,
Said evaporimeter has:
First space, said first space has the contact-making surface that contacts with said heater, and makes the said working fluid evaporation from said connecting piece supply; And
Second space, said second space be set in the face that constitutes said first space, at least one face beyond the said contact-making surface,
The partition wall of said first space and second spaced is provided with the intercommunicating pore with said first space and second spatial communication.
2. ring type heat pipe according to claim 1 is characterized in that,
Said second space is formed on the face of a side opposite with the contact-making surface that contacts with said heater in said first space at least.
3. ring type heat pipe according to claim 2 is characterized in that,
The steaming pressure ratio atmospheric pressure of said working fluid is high, and the thickness of the outer wall that said second space and atmosphere are separated compares the thin thickness with the partition wall of said first space and second spaced.
4. ring type heat pipe according to claim 2 is characterized in that,
The steaming pressure ratio atmospheric pressure of said working fluid is high, and the partition wall of said first space and second spaced is bent towards the said first space lateral bending.
5. ring type heat pipe according to claim 4 is characterized in that,
Said working fluid is selected from pentane, butane and ammonia.
6. ring type heat pipe is the evaporimeter that will make the working fluid gasification through the heat from heater through connecting piece with make vaporized working fluid condenser condensing connect into ring-type forms, and said annular heat pipe is characterised in that,
Said evaporimeter has:
First space, said first space has the contact-making surface that contacts with said heater, and makes the said working fluid evaporation from said liquid pipe supply;
Second space, said second space be set in the face that constitutes said first space, at least one face beyond the said contact-making surface, and be sealed in second fluid of the said workflow height of saturated vapor pressure ratio under the uniform temp.
7. ring type heat pipe according to claim 6 is characterized in that,
When said ring type heat pipe was not worked, at least a portion of said second fluid was a liquid phase.
8. ring type heat pipe according to claim 7 is characterized in that,
With the thickness of the partition wall of said first space and second spaced thin thickness than the outer wall that said second space and atmosphere are separated.
9. according to claim 1 or 6 described ring type heat pipes, it is characterized in that,
Inwall in the inside in said first space along said first space is provided with porous body, in said porous body, forms the path through the working fluid of said connecting piece supply.
10. according to claim 1 or 6 described ring type heat pipes, it is characterized in that,
Said evaporimeter forms through the material higher than stainless steel thermal conductivity.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-075443 | 2010-03-29 | ||
| JP2010075443 | 2010-03-29 | ||
| PCT/JP2010/066329 WO2011121819A1 (en) | 2010-03-29 | 2010-09-21 | Loop heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102792119A true CN102792119A (en) | 2012-11-21 |
Family
ID=44711595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800652950A Pending CN102792119A (en) | 2010-03-29 | 2010-09-21 | Loop heat pipe |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20120312506A1 (en) |
| JP (2) | JPWO2011121819A1 (en) |
| CN (1) | CN102792119A (en) |
| WO (1) | WO2011121819A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109612315A (en) * | 2019-01-29 | 2019-04-12 | 株洲智热技术有限公司 | Phase-change heat radiating device |
| CN109612314A (en) * | 2019-01-29 | 2019-04-12 | 株洲智热技术有限公司 | Phase-change heat radiating device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| SK822013A3 (en) | 2013-09-11 | 2015-04-01 | Žilinská Univerzita V Žiline | Compact evaporator with closed circuit |
| TWM512883U (en) * | 2015-05-05 | 2015-11-21 | Cooler Master Co Ltd | Heat dissipation module, water-cooling heat dissipation module and heat dissipation system |
| WO2016201080A1 (en) * | 2015-06-09 | 2016-12-15 | Hamilton Sunstrand Corporation | Modular heat exchanger design |
| US10622282B2 (en) * | 2017-07-28 | 2020-04-14 | Qualcomm Incorporated | Systems and methods for cooling an electronic device |
| US20190360759A1 (en) * | 2018-05-25 | 2019-11-28 | Purdue Research Foundation | Permeable membrane microchannel heat sinks and methods of making |
| US10985085B2 (en) * | 2019-05-15 | 2021-04-20 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method for manufacturing the same |
| CN113776371B (en) * | 2020-11-03 | 2022-12-16 | 山东交通学院 | Linear wall guide loop heat pipe |
| CN113776370B (en) * | 2020-11-03 | 2022-12-16 | 山东交通学院 | Curved arc wall drainage loop heat pipe |
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| JPS63201493A (en) * | 1987-02-16 | 1988-08-19 | Furukawa Electric Co Ltd:The | Heat pipe |
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2010
- 2010-09-21 JP JP2012508014A patent/JPWO2011121819A1/en active Pending
- 2010-09-21 CN CN2010800652950A patent/CN102792119A/en active Pending
- 2010-09-21 WO PCT/JP2010/066329 patent/WO2011121819A1/en active Application Filing
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- 2012-08-22 US US13/591,397 patent/US20120312506A1/en not_active Abandoned
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2013
- 2013-08-23 JP JP2013173479A patent/JP2013231597A/en not_active Withdrawn
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| JPS63201793A (en) * | 1987-02-12 | 1988-08-19 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | Vector display device |
| CN1591849A (en) * | 2003-09-03 | 2005-03-09 | 株式会社日立制作所 | Electronic apparatus |
| JP2005259747A (en) * | 2004-03-09 | 2005-09-22 | Sony Corp | Heat transport apparatus and electronic device |
| US20060162903A1 (en) * | 2005-01-21 | 2006-07-27 | Bhatti Mohinder S | Liquid cooled thermosiphon with flexible partition |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109612315A (en) * | 2019-01-29 | 2019-04-12 | 株洲智热技术有限公司 | Phase-change heat radiating device |
| CN109612314A (en) * | 2019-01-29 | 2019-04-12 | 株洲智热技术有限公司 | Phase-change heat radiating device |
| WO2020155899A1 (en) * | 2019-01-29 | 2020-08-06 | 株洲智热技术有限公司 | Phase change heat radiating device |
| WO2020155900A1 (en) * | 2019-01-29 | 2020-08-06 | 株洲智热技术有限公司 | Phase change heat radiating device |
| TWI801696B (en) * | 2019-01-29 | 2023-05-11 | 大陸商株洲智熱技術有限公司 | Phase change cooling device |
| TWI818134B (en) * | 2019-01-29 | 2023-10-11 | 大陸商株洲智熱技術有限公司 | Phase change heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011121819A1 (en) | 2011-10-06 |
| JPWO2011121819A1 (en) | 2013-07-04 |
| US20120312506A1 (en) | 2012-12-13 |
| JP2013231597A (en) | 2013-11-14 |
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Application publication date: 20121121 |