CN102338582B - Thin plate type low-pressure thermosyphon plate driving by pressure gradient - Google Patents
Thin plate type low-pressure thermosyphon plate driving by pressure gradient Download PDFInfo
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- CN102338582B CN102338582B CN201010238485.XA CN201010238485A CN102338582B CN 102338582 B CN102338582 B CN 102338582B CN 201010238485 A CN201010238485 A CN 201010238485A CN 102338582 B CN102338582 B CN 102338582B
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Abstract
The invention relates to a thin plate type low-pressure thermosyphon plate driving by pressure gradient; the thin plate type low-pressure thermosyphon plate driving comprises a body and a plate body, wherein the plate body corresponds to and covers the body; the body is provided with a heating area in a position close to the center; both sides of the heating area are provided with a pressure storage area and a first flow path group; the pressure storage areas is connected with a free area which is further connected with a first condensate area and a second condensate area; the first flow path group is further connected with a third condensate area and a fourth condensate area; a second flow path group is arranged between the first condensate area and the third condensate area and is connected with the first condensate area and the third condensate area; a third flow path group is arranged between the second condensate area and the fourth condensate area and is connected with the second condensate area and the fourth condensate area; and a low-pressure end is generated through the appropriate pressure reduction design to form a driving pressure difference to drive the pressure gradient which is required for vapor water circulation in the thermosyphon plate and can drive working fluid to transfer heat without any capillary structures.
Description
Technical field
A thin plate type low-pressure thermosyphon plate driving by pressure gradient, espespecially a kind of capillary structure that can not must arrange can conduct heat, and has more the thin plate type low-pressure thermosyphon plate driving by pressure gradient of hot transfer efficiency.
Background technology
In recent years along with the progress of flourish, the process technique of electronic semi-conductor's industry, and under the trend of the market demand, electronic equipment gradually move towards compact kenel, but in the diminishing process of overall dimensions, function and operational capability are but growing on and on.The picture mobile computer that the output value is the highest in information industry and desktop PC are when actual operation; just there is multinomial electronic component to produce heat; the heat wherein being produced with central processor CPU (Central Processing Unit) is again maximum; now fin coordinates the radiator that fan formed to provide heat sinking function to play the part of the key player who protects CPU; make CPU maintain normal working temperature with the performance function that should have, therefore cpu heat is important spare part in information industry now.
So Water Cooling Technology starts to be used on personal computer widely in recent years, although water
technology seems has saved bulky fin, but be that the heat of system endogenous pyrogen was collected in hydraulic fluid in fact, and then do the action of heat exchange by heat exchanger is unified with air, because length of pipe can change voluntarily, so the position of heat exchanger is elasticity comparatively also, also allows the design of heat exchanger (radiating fin) can not be subject to the restriction on space, a liquid flow but pumping of water-cooling system needs pushes the work forward, but also need a storage tank, so whole system still has pumping reliability issues, pipeline leakage problem ... etc., but because the heat of the heat generating component in personal computer constantly increases, so although water cooled heat radiating technology is not all roses, remain the optimal selection of heat management and control in the market, but, this is because the volume of personal computer is huger, and outside is also without limiting on space, but just different at mobile computer, mobile computer is at present more and more compact, just cannot make water at all
heat dissipation technology, so remain at present, with heat pipe, do heat and shift, and then use radiating fin to do the action of heat exchange, in addition, also can only reduce the power consumption of CPU as far as possible.In view of this, industry is actively found the heat dissipation technology that heat flux is higher invariably, with in response to following one by one huge radiating requirements.
Known techniques also sees through heat pipe in addition, the radiating subassemblies such as temperature-uniforming plate are used as heat conducting component, and system manages wall moulding one sintered body in the inner thoroughly while manufacturing heat pipe and temperature-uniforming plate, as capillary structure, use, its main processing procedure system is first filled in metal (copper) or a powder in this inwall, again by its copper particle or powder densification compacting, finally send into and in sintering furnace, impose sintering processing, make this copper particle or powder form the capillary structure of porous character, make it to obtain capillary force by this sintered body, but because making the volume of this heat pipe and temperature-uniforming plate, this sintered body exists certain thickness also, and effectively slimming, described in another person, VC (Vapor chamber) is used the structures such as the core of sintering or grid or groove, and then generation capillary force phenomenon drives the steam/water circulating in heat pipe or VC (Vapor chamber), but the application manufacture in this structure is quite complicated, increase manufacturing cost, therefore very inappropriate.
Moreover the selection of steam core is a knowledge, select suitable steam core system quite important, this steam core need keep the flow velocity of condensate liquid and keep enough capillary pressure to overcome the impact of gravity.
Therefore the heat pipe of known techniques or VC (Vapor chamber) have following shortcoming:
1. processing inconvenience;
2. cannot realize slimming;
3. cost is higher;
4. expend man-hour.
Summary of the invention
For effectively solving above-mentioned problem, the main purpose of this creation, is to provide not need any capillary structure can drive working fluid transferring heat, and significantly reduces the thin plate type low-pressure thermosyphon plate driving by pressure gradient of manufacturing cost.
This creates another object, and being provides a kind of thin plate type low-pressure thermosyphon plate driving by pressure gradient with high-efficiency thermal transfer efficiency.
For reaching above-mentioned object, this creation system provides a kind of thin plate type low-pressure thermosyphon plate driving by pressure gradient, system comprises: a body, one plate body, this plate body correspondence covers aforementioned body, this body is provided with a heat affected zone near centre, these both sides, heat affected zone have a pressure accumulation district and a first flow group, Bing Gai pressure accumulation district connects a free zone, this free zone more connects one first condensing zone and one second condensing zone, this pressure accumulation district more connects one the 3rd condensing zone and one the 4th condensing zone, described first, between three condensing zones, there is one second runner group and be communicated with this first, three condensing zones, described second, four condensing zones there is one the 3rd runner group and be communicated with this second, four condensing zones, by suitable decompression design, produce low-pressure end, forming the required barometric gradient of steam/water circulating in the poor driving thermal siphon of driving pressure plate does not need any capillary structure can drive working fluid transferring heat, and significantly reduces manufacturing cost person.
Accompanying drawing explanation
Fig. 1 is this creation thin plate type low-pressure thermosyphon plate driving by pressure gradient preferred embodiment three-dimensional exploded view;
Fig. 2 is this creation thin plate type low-pressure thermosyphon plate driving by pressure gradient preferred embodiment three-dimensional combination figure;
Fig. 3 is this creation thin plate type low-pressure thermosyphon plate driving by pressure gradient preferred embodiment body top view;
Fig. 4 is this creation thin plate type low-pressure thermosyphon plate driving by pressure gradient the second embodiment body top view;
Fig. 5 is this creation thin plate type low-pressure thermosyphon plate driving by pressure gradient the 3rd embodiment body top view;
Fig. 6 is this creation thin plate type low-pressure thermosyphon plate driving by pressure gradient the 4th embodiment body top view;
Fig. 7 is this creation thin plate type low-pressure thermosyphon plate driving by pressure gradient the 5th embodiment body top view.
Primary clustering symbol description
Plate body 1a free zone 12
11 pressure accumulation districts 13, heat affected zone
Projection 111 pressure accumulation runners 131
The first condensing zone 14 second runner groups 22
The second condensing zone 15 second runners 221
The 3rd condensing zone 16 second baffles 222
The 4th condensing zone 17 the 3rd runner group 23
The first outlet 18 the 3rd runners 231
The second outlet 19 the 3rd baffles 232
The first baffle 212 fins 5
The first drift angle 2,121 first intervals 6
Between the first 2122 Second Regions, sword limit 7
The specific embodiment
Characteristic in the above-mentioned purpose of this creation and structure thereof and function, will be explained according to appended graphic preferred embodiment.
Refer to the 1st, 2,3 figure, this creation thin plate type low-pressure thermosyphon plate driving by pressure gradient preferred embodiment as shown in the figure, described thin plate type low-pressure thermosyphon plate driving by pressure gradient is to comprise: a body 1, a plate body 1a;
This plate body 1a correspondence covers this body 1.
This body 1 has a heat affected zone 11, a first flow group 21, one second runner group 22, one the 3rd runner group 23, a free zone 12, a pressure accumulation district 13, one first condensing zone 14, one second condensing zone 15, one the 3rd condensing zone 16, one the 4th condensing zone 17.
The centre near body 1 of this body 1 is located in this heat affected zone 11, and these 11 both sides, heat affected zone connect respectively this first flow group 21 Ji Yi pressure accumulation districts 13, Bing Gai pressure accumulation district 13 has plural pressure accumulation runner 131 and plural pressure accumulation baffle 132, these pressure accumulation runners 131 are formed between two 132 of pressure accumulation baffles, and connect aforementioned free zones 12 by this pressure accumulation runner 131.
This heat affected zone 11 has plural projection 111 and is distributed in distance, and 111 of these projections have one first spacing 112.
This free zone 12 connects respectively aforementioned the first condensing zone 14 and the second condensing zone 15, and first flow group 21 connects aforementioned the 3rd condensing zone 16 and the 4th condensing zone 17.
Described the second runner group 22, between this first and third condensing zone 14,16, and is communicated with these first and third condensing zones 14,16 by the 3rd runner group 22.
Described the 3rd runner group 23, between this second, four condensing zone 15,17, and is communicated with these second, four condensing zones 15,17 by the 3rd runner group 23.
Described first flow group 21 has plural first flow 211 and plural the first baffle 212, these first baffles 212 are distributed in distance, and this first flow 211 is formed between two 212 of the first baffles, described the second runner group 22 has plural the second runner 221 and plural the second baffle 222, these second baffles 222 are distributed in distance, and this second runner 221 is formed between two 222 of the second baffles.
Described the 3rd runner group 23 has plural number the 3rd runner 231 and plural number the 3rd baffle 232, and these grade in an imperial examination three baffles 232 are distributed in distance, and the 3rd runner 231 is formed between two 232 of the 3rd baffles.
Described first, second and third baffle 212,222,232 in this preferred embodiment is a strip rib.
Refer to the 4th figure, be thin plate type low-pressure thermosyphon plate driving by pressure gradient second embodiment of this creation, as shown in the figure, the association system of the present embodiment part-structure and inter-module is identical with aforementioned preferred embodiment, therefore do not repeat them here, only the present embodiment and aforementioned preferred embodiment difference are that described the first baffle 212 is a rib, this rib has one first drift angle 2121 and one first sword limit 2122 and one second sword limit 2123, and described first and second sword limit 2122,2123 intersects at this first drift angle 2121.
Refer to the 5th figure, be thin plate type low-pressure thermosyphon plate driving by pressure gradient the 3rd embodiment of this creation, as shown in the figure, the association system of the present embodiment part-structure and inter-module is identical with aforementioned preferred embodiment, therefore do not repeat them here, only the present embodiment and aforementioned preferred embodiment difference are that described body has more a fin 5, and this fin 5 longitudinally runs through 11Ji Gai pressure accumulation district, this heat affected zone 13 and this first flow group 21.
Refer to the 6th figure, be thin plate type low-pressure thermosyphon plate driving by pressure gradient the 4th embodiment of this creation, as shown in the figure, the association system of the present embodiment part-structure and inter-module is identical with aforementioned preferred embodiment, therefore do not repeat them here, only the present embodiment and aforementioned preferred embodiment difference are that this body has more a fin 5 and one first outlet 18 and 1 second outlet 19, and this fin 5 longitudinally runs through 11Ji Gai pressure accumulation district, this heat affected zone 13 and this first flow group 21 and this body 1 is defined between one first interval 6 and one Second Region to 7.
Refer to the 7th figure, be thin plate type low-pressure thermosyphon plate driving by pressure gradient the 5th embodiment of this creation, as shown in the figure, the association system of the present embodiment part-structure and inter-module is identical with aforementioned preferred embodiment, therefore do not repeat them here, only the present embodiment and aforementioned preferred embodiment difference be described these first, two, three baffles 211, 221, 231 have plural pit 3, and described pit 3 be can be rounded and square and triangle and fish scale-shaped and geometry wherein arbitrary, in this explanation embodiment, be to using fish scale-shaped as explanation, but do not regard it as and be limited, aforementioned first, two, three, in four embodiment, also can add the present embodiment in fish scale-shaped pit 3 technical characterictics.
Please consult again the 3rd figure, as shown in the figure, this creation preferred embodiment and second and third, four embodiment propose two-phase thin plate type low-pressure thermosyphon plate driving by pressure gradient recirculation refrigerating technology, the method is self-drive endless form, it is wherein arbitrary that the working fluid using can be the refrigerants such as pure water, methyl alcohol, acetone, R134A, it within thin plate type low-pressure thermosyphon plate driving by pressure gradient, is the state vacuumizing, therefore in inner working fluid of being filled, be the saturation temperature of working fluid in 20～30 degree Celsius; This heat affected zone be provided with projection 111 arrays produce superheated steam bubbles 4 in, flow through free zone 12 and moment step-down produces and drives the required barometric gradient of steam/water circulating; Be subject in addition first, second, third and fourth condensing zone 14,15,16,17 guidings via this first, second and third runner group, flow back to heat affected zone 11 (region with projection 111), complete steam/water circulating.
Be that the heat affected zone 11 that system utilization contacts with heat generating component (not shown) produces overheated vapour, set up and drive steam/water circulating, be that heat is directed in 11 surfaces, body 1 heat affected zone and reaches this heat affected zone 11 again and produce boiling phenomenons and make partially-working fluid vaporization, again by vapor bubbles 4 because of the degree of superheat produce pressure (being that pressure accumulation district 13 pressure are larger) promote this fluid by 11Zhi Gai free zone, heat affected zone 12 again to this first, two, three, four condensing zones 14, 15, 16, 17 heat radiations, working fluid after condensation is got back to heat affected zone 11 by 13 pressurizations of pressure accumulation district, be absorb heat and recycle in the heat affected zone 11 that heat affected zone 11 contacts with heat generating component (not shown).
Application evaporation (pressurization), condensation (step-down), set up the required barometric gradient of steam-condensate circulating and circulatory flow, can avoid using capillary structure, significantly reduce VC thickness, significantly improve the uniform temperature of thin plate type low-pressure thermosyphon plate driving by pressure gradient, and reduce thermal resistance.
In addition, this creation is for guaranteeing that fluid is refluxed also can be equipped with the capillary structures such as mesh, to help working fluid to be back to pressure accumulation district or heat affected zone person.
Though each large heat radiation factory drops into many Water Cooling Technology in recent years, especially active Water Cooling Technology, be side Pu and produce circulation power, yet, this kind of method easily produces reliability and the life problems of side Pu valve member, but the two-phase thin plate type low-pressure thermosyphon plate driving by pressure gradient that this creation proposed circulation
but the advantage of technology be in system without moving part, therefore without problems such as part consume and life-spans, and do not need additional extra pumping and capillary structure, can save the energy, more can solve the problem of noise.
Claims (11)
1. a thin plate type low-pressure thermosyphon plate driving by pressure gradient is to comprise:
One body, near centre, be provided with a heat affected zone, these both sides, heat affected zone have respectively a pressure accumulation district and a first flow group, Bing Gai pressure accumulation district connects a free zone, this free zone more connects one first condensing zone and one second condensing zone, this first flow group more connects one the 3rd condensing zone and one the 4th condensing zone, has one second runner group and be communicated with this first and third condensing zone between described first and third condensing zone, and described second, four condensing zones have one the 3rd runner group and are communicated with this second, four condensing zone;
One plate body, correspondence covers aforementioned body.
2. thin plate type low-pressure thermosyphon plate driving by pressure gradient as claimed in claim 1, wherein said heat affected zone has plural projection and is distributed in distance, and has one first spacing between these projections.
3. thin plate type low-pressure thermosyphon plate driving by pressure gradient as claimed in claim 1, wherein said first flow group has plural first flow and plural the first baffle, these first baffles are distributed in distance, and this first flow is formed between two between the first baffle, described the second runner group has plural the second runner and plural the second baffle, these second baffles are distributed in distance, and this second runner is formed between two between the second baffle, described the 3rd runner group has plural number the 3rd runner and plural number the 3rd baffle, these grade in an imperial examination three baffles are distributed in distance, and the 3rd runner be formed between two between the 3rd baffle.
4. thin plate type low-pressure thermosyphon plate driving by pressure gradient as claimed in claim 3, wherein said first, second and third baffle is a strip rib.
5. thin plate type low-pressure thermosyphon plate driving by pressure gradient as claimed in claim 1, has plural pit between wherein said these first, second and third runners.
6. thin plate type low-pressure thermosyphon plate driving by pressure gradient as claimed in claim 5, wherein said pit be rounded and square and triangle and fish scale-shaped wherein arbitrary.
7. thin plate type low-pressure thermosyphon plate driving by pressure gradient as claimed in claim 1, wherein has more working fluid in this body, and this working fluid is that pure water and methyl alcohol and acetone and R134A refrigerant are wherein arbitrary.
8. thin plate type low-pressure thermosyphon plate driving by pressure gradient as claimed in claim 1, wherein this pressure accumulation district has plural pressure accumulation runner and plural pressure accumulation baffle, and this pressure accumulation baffle is distributed in distance, and this pressure accumulation runner is formed between two between pressure accumulation baffle.
9. thin plate type low-pressure thermosyphon plate driving by pressure gradient as claimed in claim 3, wherein this first baffle is a rib, this rib has one first drift angle and one first sword limit and one second sword limit, described first and second sword limit intersects at this first drift angle, these first flows are formed between these ribs, and have one first spacing between these first diversion divisions.
10. thin plate type low-pressure thermosyphon plate driving by pressure gradient as claimed in claim 1, has more a fin, and this fin longitudinally runs through Ji Gai pressure accumulation district, this heat affected zone and this first flow group.
11. thin plate type low-pressure thermosyphon plate driving by pressure gradients as claimed in claim 1, have more a fin and one first outlet and one second outlet, this fin longitudinally runs through Ji Gai pressure accumulation district, this heat affected zone and this first flow group and by this body defining one first between an interval and Second Region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010238485.XA CN102338582B (en) | 2010-07-23 | 2010-07-23 | Thin plate type low-pressure thermosyphon plate driving by pressure gradient |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010238485.XA CN102338582B (en) | 2010-07-23 | 2010-07-23 | Thin plate type low-pressure thermosyphon plate driving by pressure gradient |
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| Publication Number | Publication Date |
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| CN102338582A CN102338582A (en) | 2012-02-01 |
| CN102338582B true CN102338582B (en) | 2014-03-26 |
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| CN201010238485.XA Expired - Fee Related CN102338582B (en) | 2010-07-23 | 2010-07-23 | Thin plate type low-pressure thermosyphon plate driving by pressure gradient |
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| CN108402890A (en) * | 2018-01-10 | 2018-08-17 | 浙江苏泊尔家电制造有限公司 | Cooking control method for cooking apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1786647A (en) * | 2004-12-06 | 2006-06-14 | 乐金电子（昆山）电脑有限公司 | Heat pipe |
| JP2008153423A (en) * | 2006-12-18 | 2008-07-03 | Yaskawa Electric Corp | Vapor chamber, and electronic device using it |
| CN101307996A (en) * | 2007-05-17 | 2008-11-19 | 私立淡江大学 | Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure |
| CN101738117A (en) * | 2008-11-20 | 2010-06-16 | 索尼株式会社 | Heat transport device, electronic apparatus, and heat transport device manufacturing method |
| CN201828174U (en) * | 2010-07-23 | 2011-05-11 | 奇鋐科技股份有限公司 | Thin plate type low pressure thermosyphon plate driven by pressure gradient |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100438825B1 (en) * | 2001-10-29 | 2004-07-05 | 삼성전자주식회사 | Heat transferring device having adiabatic means |
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2010
- 2010-07-23 CN CN201010238485.XA patent/CN102338582B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1786647A (en) * | 2004-12-06 | 2006-06-14 | 乐金电子（昆山）电脑有限公司 | Heat pipe |
| JP2008153423A (en) * | 2006-12-18 | 2008-07-03 | Yaskawa Electric Corp | Vapor chamber, and electronic device using it |
| CN101307996A (en) * | 2007-05-17 | 2008-11-19 | 私立淡江大学 | Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure |
| CN101738117A (en) * | 2008-11-20 | 2010-06-16 | 索尼株式会社 | Heat transport device, electronic apparatus, and heat transport device manufacturing method |
| CN201828174U (en) * | 2010-07-23 | 2011-05-11 | 奇鋐科技股份有限公司 | Thin plate type low pressure thermosyphon plate driven by pressure gradient |
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