CN202329315U - Low pressure loop type thermosyphon radiating device - Google Patents
Low pressure loop type thermosyphon radiating device Download PDFInfo
- Publication number
- CN202329315U CN202329315U CN2011203318643U CN201120331864U CN202329315U CN 202329315 U CN202329315 U CN 202329315U CN 2011203318643 U CN2011203318643 U CN 2011203318643U CN 201120331864 U CN201120331864 U CN 201120331864U CN 202329315 U CN202329315 U CN 202329315U
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- low pressure
- pressure loop
- thermal siphon
- flow
- heat abstractor
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Abstract
The utility model relates to a low pressure loop type thermosyphon radiating device, which comprises a casing, an upper cover, a support, a pipe body and at least one radiating element. The casing and the upper cover are buckled in a sealing mode with each other to form a hollow chamber which is provided with a plurality of flow guiding bodies, at least one a first flow channel is formed among the flow guiding bodies to form an evaporation portion, connection ports are disposed on the casing at both ends of the first flow channel, the casing and the upper cover are fixedly installed in an All In One (AIO) system or a computer case through the support which is matched with the casing and the upper cover, the pipe body is provided with a second flow channel, one of two ends of the pipe body is respectively connected with the connection ports on the casing to communicate the second flow channel and the first flow channel, the first flow channel and the second flow channel are filled with working fluids, and the radiating element is sleeved outside the pipe body to form a cooling portion with the pipe body. The Low pressure loop type thermosyphon radiating device is reasonable in design, simple in structure, convenient to process, low in cost, and good in radiating effects.
Description
Technical field
The utility model relates to a kind of heat abstractor, specifically relates to a kind of low pressure loop formula thermal siphon heat abstractor.
Background technology
Along with the progress at full speed of the flourish and process technique of electronic semi-conductor's industry, under the tending to act of the market demand, electronic equipment moves towards frivolous form gradually in recent years.But in the diminishing process of appearance and size, the function and the operational capability of electronic equipment but are growing on and on, and caloric value is bigger during operation.For example family expenses or commercial computer and communication cabinet are when actual operation, and its inside just has multinomial electronic component to produce heat, wherein again with the electron crystal of execution computing or the heat maximum of element generation.Need configuration to dispel the heat,, make this electronic component can maintain normal operating temperature to bring into play its due function to protect this electronic component such as the heat abstractors of forming by fin and fan etc. such as radiator.
Present radiator roughly adopts water-cooled or air-cooled technology, and Water Cooling Technology only begins to be widely used in individual PC (Desktop), its mainly be with intrasystem heat collection in working fluid, and then nationality is done the action of heat exchange by heat exchanger and air.Its pipeline length can freely change, and has saved bulky fin relatively, and the position of heat exchanger is elasticity comparatively also, also lets the design of heat exchanger can not receive the restriction on the space.Fluid flows but pumping of water-cooling system needs pushes the work forward, but also needs a storage tank, so still there is the pumping poor reliability in whole system, pipeline is prone to problems such as leakage.But because the heat of the heater element in the PC constantly increases; So though the water-cooled heat dissipation technology is not all roses; Remain one of optimal selection of heat management control in the market, individual PC (Desktop) volume is huger but this is, and the outside does not have the restriction on the space yet.But along with AIO (All In One) produces; And device such as AIO or communication cabinet is at present just towards compact type development; The limited water-cooling technology of at all can't using of its overall space; Use heat pipe type or directly do the heat transfer so remain at present, and then use radiating fin to do the heat exchange action with small-sized radiator.
Heat dissipation element commonly used at present is a heat pipe, and heat dissipation elements such as temperature-uniforming plate, heat pipe and temperature-uniforming plate all are to use as capillary structure through the sinter layer with its inwall moulding.Its main making flow process is earlier copper particle or powder to be filled in this inwall, again with its metallic particles or powder densification compacting, sends into sintering processing in the sintering furnace at last, makes copper particle or powder form the capillary knot of porous character.But because the existence of this sinter layer makes heat pipe and temperature-uniforming plate have certain thickness, effectively slimming.Also there are inconvenient machining in heat pipe or temperature-uniforming plate (Vapor Chamber) in addition; Cost is higher and expend shortcomings such as man-hour.
Summary of the invention
To the defective of prior art, the purpose of the utility model provides a kind of good heat dissipation effect, no capillary structure, and is easy to process, safe and reliable low pressure loop formula thermal siphon heat abstractor.
For reaching above-mentioned purpose, the utility model has adopted following technical scheme:
A kind of low pressure loop formula thermal siphon heat abstractor; Comprise a housing, a loam cake, a support, a body and at least one heat dissipation element; Housing is sealingly fastened on loam cake and forms a hollow chamber, establishes a plurality of baffles in the chamber, forms at least one first flow between baffle; Form the evaporation part, the two ends of first flow are equipped with connector on housing; Housing and loam cake are fixedly mounted in AIO system or the cabinet through the support that is mated; Body has second runner, and its two ends are connected on the connector of housing second runner is connected with first flow, fills fluid working substance in the first flow and second runner; Heat dissipation element is set in the outside and the body of body and forms cooling end.
The utility model also can further be realized through following technical scheme:
Described low pressure loop formula thermal siphon heat abstractor, wherein, said heat dissipation element is radiating fin group or radiator.
Described low pressure loop formula thermal siphon heat abstractor, wherein, said baffle is a strip rib, and arrange isometric lateral separation, and first flow is formed between this strip rib.
Described low pressure loop formula thermal siphon heat abstractor, wherein, said baffle is a strip rib, and isometric longitudinal separation is arranged, and first flow is formed between this strip rib.
Described low pressure loop formula thermal siphon heat abstractor; Wherein, Said baffle is a rib, and this rib has one first drift angle and one first sword limit and one second sword limit, and said first, second sword limit intersects at this first drift angle; First flow is formed between this rib, and this baffle has one first spacing between vertically.
Described low pressure loop formula thermal siphon heat abstractor, wherein, the said first sword limit is discontinuous arrangement, and the said second sword limit is discontinuous arrangement.
Described low pressure loop formula thermal siphon heat abstractor wherein, has plural pit between said baffle.
Described low pressure loop formula thermal siphon heat abstractor, wherein, said pit is rounded, square, in triangle and the fish scale shape any one.
Described low pressure loop formula thermal siphon heat abstractor, wherein, said cooling end also comprises a fan.
The low pressure loop formula thermal siphon heat abstractor of the utility model adopts the thermal siphon technology, in the first flow of second runner that thermal siphon is formed and evaporation part, stores up flowing full body working medium; When the evaporation part absorbs the heat that AIO system or cabinet distribute, the fluid expanded by heating of the inside, evaporation part, density diminishes; Just rise in second runner in the top thermal siphon; The cooling fluid that density is bigger then is back to the bottom of evaporation part, after having absorbed heat energy, continues to expand and rises; Form circulation, the heat of AIO system is taken away.Decompression design with the condensation part replaces capillary structure, realizes driving the function of working fluid circulating transfer heat in body and housing.Overall structure is simple, convenient processing and installation, and cost is low, good heat dissipation effect.
Description of drawings
Fig. 1 is the structural representation of the low pressure loop formula thermal siphon heat abstractor of the utility model;
Fig. 2 is the decomposition texture sketch map of Fig. 1;
Fig. 3 is the structural representation of the utility model low pressure loop formula thermal siphon heat abstractor in the AIO system;
Fig. 4-8 is the structural representation of the baffle in the utility model low pressure loop formula thermal siphon heat abstractor, and wherein, Fig. 4 baffle is rectangular dress rib; Fig. 5 baffle is a waveform strip rib; Fig. 6 baffle rib has drift angle and first, second sword limit structure; Fig. 7 baffle the one the second sword limits are discontinuous arrangement; Fig. 8 is for being provided with the baffle structural representation of pit therebetween.
The specific embodiment
Shown in Fig. 1-3, a kind of low pressure loop formula thermal siphon heat abstractor comprises a housing 1, a loam cake 2, a body 3, a support 4 and at least one heat dissipation element 5.
Said housing 1 has a chamber, has an evaporation part, this evaporation part to have plural baffle 11 in this chamber, and 11 of this baffles form at least one first flow 12, and these first flow 12 at least one ends are free end and connect a free space.
Body 3 two ends link to each other with the connector of housing 1 respectively, form one second runner.The sheathed heat dissipation element 5 in body 3 outsides, body 3 and heat dissipation element 5 composition condensation parts.Because to set out suitable first flow 12 between a baffle and another baffle, the fluid working substance of filling in the runner produces overheated vapour when contacting with thermal source in housing 1 chamber, set up and drive the required high pressure of carbonated drink circulation; The siphon pipe body 3 and heat dissipation element 5 of inner fill fluid medium adopted in the condensation part; Form suitable decompression design; Produce low-pressure end, form carbonated drink circulation in the driving pressure gradient-driven device, but do not need any capillary structure can drive working fluid circulating transfer heat in body and housing; The heat that electronic component produces in the system is transferred to outside the system through this device, thereby reaches the purpose to electronic element radiating in the system.
Support 4 cooperates with housing 1 and loam cake 2 formed chambers; This support 4 structurally cooperates with housing 1 and loam cake 2 formed cavitys and is pressed in above the cavity; Or support 4 become together with the cavity solder bond, support 4 is fixedly mounted on the entire heat dissipation device in the AIO system.
Preferable, shown in Fig. 5-6, baffle 11 is an isometric strip rib, and arrange this isometric shape strip rib lateral separation, and first flow is formed between these strip ribs.Baffle 11 also can vertically be arranged.
Further; Referring to shown in Figure 6; Baffle can be isometric rib, and this isometric rib has one first drift angle, one first sword limit and one second sword limit, and said first, second sword limit intersects at this first drift angle; First flow is formed between this isometric rib, and this isometric rib has one first spacing between vertically.
Better is, referring to shown in Figure 7, the first sword limit is discontinuous arrangement, and the second sword limit is discontinuous arrangement.
Best is that referring to shown in Figure 8,11 of baffles have a plurality of pits 13.Said pit is 13 rounded, square, triangle, fish scale shape or random geometry.
The above is merely the preferred embodiment of the utility model, is not the utility model is done any pro forma qualification.Any change that is equal to, modification or differentiation etc. that all those skilled in the art utilize the technical scheme of the utility model that the foregoing description is made all still belong in the scope of the utility model technical scheme.
Claims (9)
1. low pressure loop formula thermal siphon heat abstractor is characterized in that:
Comprise a housing, a loam cake, a support, a body and at least one heat dissipation element; Housing is sealingly fastened on loam cake and forms a hollow chamber; Establish a plurality of baffles in the chamber; Form at least one first flow between baffle, form the evaporation part, the two ends of first flow are equipped with connector on housing; Housing and loam cake are fixedly mounted in AIO system or the cabinet through the support that is mated; Body has second runner, and its two ends are connected on the connector of housing second runner is connected with first flow, fills fluid working substance in the first flow and second runner; Heat dissipation element is set in the outside and the body of body and forms cooling end.
2. low pressure loop formula thermal siphon heat abstractor according to claim 1 is characterized in that:
Said heat dissipation element is radiating fin group or radiator.
3. low pressure loop formula thermal siphon heat abstractor according to claim 1 and 2 is characterized in that:
Said baffle is a strip rib, and arrange isometric lateral separation, and first flow is formed between this strip rib.
4. low pressure loop formula thermal siphon heat abstractor according to claim 1 and 2 is characterized in that:
Said baffle is a strip rib, and isometric longitudinal separation is arranged, and first flow is formed between this strip rib.
5. low pressure loop formula thermal siphon heat abstractor according to claim 1 and 2 is characterized in that:
Said baffle is a rib, and this rib has one first drift angle and one first sword limit and one second sword limit, and said first, second sword limit intersects at this first drift angle, and first flow is formed between this rib, and this baffle has one first spacing between vertically.
6. low pressure loop formula thermal siphon heat abstractor according to claim 5 is characterized in that:
The said first sword limit is discontinuous arrangement, and the said second sword limit is discontinuous arrangement.
7. low pressure loop formula thermal siphon heat abstractor according to claim 1 and 2 is characterized in that:
Has plural pit between said baffle.
8. low pressure loop formula thermal siphon heat abstractor according to claim 7 is characterized in that:
Said pit is rounded, square, in triangle and the fish scale shape any one.
9. low pressure loop formula thermal siphon heat abstractor according to claim 6 is characterized in that:
Said cooling end also comprises a fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203318643U CN202329315U (en) | 2011-09-06 | 2011-09-06 | Low pressure loop type thermosyphon radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203318643U CN202329315U (en) | 2011-09-06 | 2011-09-06 | Low pressure loop type thermosyphon radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202329315U true CN202329315U (en) | 2012-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203318643U Expired - Fee Related CN202329315U (en) | 2011-09-06 | 2011-09-06 | Low pressure loop type thermosyphon radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202329315U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105392330A (en) * | 2015-11-11 | 2016-03-09 | 中冶南方（武汉）自动化有限公司 | Liquid heat dissipation structure for motor controller |
| WO2017037921A1 (en) * | 2015-09-03 | 2017-03-09 | 富士通株式会社 | Loop heat pipe, manufacturing method for same, and electronic device |
| WO2017195254A1 (en) * | 2016-05-09 | 2017-11-16 | 富士通株式会社 | Loop heat pipe, manufacturing method for same, and electronic equipment |
| CN109413945A (en) * | 2018-11-05 | 2019-03-01 | 英业达科技有限公司 | Server cabinet and its hydrocone type radiator |
-
2011
- 2011-09-06 CN CN2011203318643U patent/CN202329315U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017037921A1 (en) * | 2015-09-03 | 2017-03-09 | 富士通株式会社 | Loop heat pipe, manufacturing method for same, and electronic device |
| US10881021B2 (en) | 2015-09-03 | 2020-12-29 | Fujitsu Limited | Loop heat pipe and fabrication method therefor, and electronic device |
| US11536518B2 (en) | 2015-09-03 | 2022-12-27 | Fujitsu Limited | Fabrication method for loop heat pipe |
| CN105392330A (en) * | 2015-11-11 | 2016-03-09 | 中冶南方（武汉）自动化有限公司 | Liquid heat dissipation structure for motor controller |
| WO2017195254A1 (en) * | 2016-05-09 | 2017-11-16 | 富士通株式会社 | Loop heat pipe, manufacturing method for same, and electronic equipment |
| JPWO2017195254A1 (en) * | 2016-05-09 | 2019-02-21 | 富士通株式会社 | Loop heat pipe, manufacturing method thereof, and electronic device |
| US10420253B2 (en) | 2016-05-09 | 2019-09-17 | Fujitsu Limited | Loop heat pipe, manufacturing method thereof, and electronic device |
| CN109413945A (en) * | 2018-11-05 | 2019-03-01 | 英业达科技有限公司 | Server cabinet and its hydrocone type radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20170906 |
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| CF01 | Termination of patent right due to non-payment of annual fee |