CN201039637Y - Composite heat exchange device - Google Patents
Composite heat exchange device Download PDFInfo
- Publication number
- CN201039637Y CN201039637Y CNU2007200006662U CN200720000666U CN201039637Y CN 201039637 Y CN201039637 Y CN 201039637Y CN U2007200006662 U CNU2007200006662 U CN U2007200006662U CN 200720000666 U CN200720000666 U CN 200720000666U CN 201039637 Y CN201039637 Y CN 201039637Y
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- China
- Prior art keywords
- heat
- heat carrier
- cooling fluid
- storage tank
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002131 composite material Substances 0.000 title abstract description 3
- 239000000110 cooling liquid Substances 0.000 claims abstract description 13
- 239000012809 cooling fluid Substances 0.000 claims description 48
- 150000001875 compounds Chemical class 0.000 claims description 12
- 239000002826 coolant Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract 8
- 239000011469 building brick Substances 0.000 description 10
- 238000009833 condensation Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 230000005494 condensation Effects 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002784 hot electron Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Abstract
The utility model discloses a composite heat exchange device, which comprises a heat conductor, a pump and at least one heat pipe. The bottom of the heat conductor is contacted with a heat source for absorbing the heat produced by the heat source, and the inside of the heat conductor forms a containing slot for containing a first cooling liquid; the pump is arranged in the heat conductor for driving the first cooling liquid to flow circularly between the heat conductor and a first radiator. The section of the heat pipe forms an arched side and a plane side corresponding to the arched side, wherein, the arched side is matched with the section of the slot on the bottom of the heat conductor for leading the heat pipe to be embedded in the slot of the heat conductor and ensuring the plane side of the heat pipe and the bottom of the heat conductor to be in the same plane so as to cling to the heat source together, thus the heat pipe can produce radiating effect to the heat source.
Description
Technical field
This novel heat abstractor that relates to a kind of electronic building brick is meant a kind of compound heat-exchange device that is applied in hot electron assembly occurred frequently and has dual cooling mechanism especially.
Background technology
With regard to the radiating mode of general electronic building brick, modal promptly is mutual collocation with heat-conducting block, radiating fin and fan, wherein heat-conducting block is directly to be attached to the electronic building brick surface, and a plurality of radiating fins are formed on the heat-conducting block, the used heat that electronic building brick is produced conducts to radiating fin, and improves heat conducting contact area, relies on fan enforced guiding air communication to cross the radiating fin surface again, the used heat that electronic building brick is produced successfully removes, and maintains suitable working temperature.
Along with the breakthrough of integrated circuit manufacture process technology, various electronic building bricks not only have higher arithmetic speed, and size is also more and more littler, and the used heat that causes the electronic building brick running to produce is more also more concentrated, and derive the problem in many heat radiations.With central processor among the computer now is example, because of its computing frequency constantly promotes and volume dwindles relatively, central processing unit is improved constantly for the demand of heat radiation, and the radiating mode of aforesaid radiating fin collocation fan also can't meet the demand of its heat radiation, so water-cooled power converter and heat pipe just occur, improve the heat dissipation problem of central processing unit.
Water-cooled power converter is that the utilization circulation pipe is communicated with heat absorbing end and radiating end, wherein heat absorbing end utilizes heat-conducting block to be attached to the central processing unit surface, absorb the heat of heat-conducting block with the aqueous solution, and radiating end is provided with radiating fin and fan, the water pump of arranging in pairs or groups again drives the aqueous solution and circulates in radiating end and heat absorbing end, and the used heat that central processing unit is produced removes rapidly.
Heat pipe is the body that cooling fluid is packed into sealing, and the one end is connected heat-conducting block and forms the cooling fluid evaporation ends, and the other end then is provided with radiating fin and forms condensation end.Inboard wall of tube body has capillary structure, flows for cooling fluid absorption, with the heat energy absorption with heat-conducting block of the phase change of utilizing cooling fluid, flow to condensation end again and cool off, and the used heat that central processing unit is produced removes rapidly.
Aforesaid water-cooled power converter and heat pipe, its condensation end or heat absorbing end are the used heat that all conducts central processing unit by heat-conducting block, though these heat-conducting blocks mostly are heat and pass the high metal material of coefficient, but cooling fluid is not the used heat of direct absorption central processing unit, still can be influential for radiating efficiency, necessity of further improvement is still arranged.
Summary of the invention
The heat abstractor of prior art is by the heat-conducting block conduct waste heat, still can reduce the radiating efficiency of central processing unit.At the deficiencies in the prior art, the purpose of this utility model is: provide a kind of compound heat-exchange device with two kinds of radiator structures, and the heat of two radiator structures biography face all directly is attached to pyrotoxin.
For reaching aforesaid purpose, the utility model provides a kind of compound heat-exchange device, and it includes a heat carrier, a pump and at least one heat pipe.Heat carrier is to contact a thermal source with its bottom surface, and wherein heat carrier has a storage tank, cooling fluid inlet, a cooling liquid outlet and at least one groove.Storage tank is formed on heat carrier inside, in order to ccontaining one first cooling fluid.The cooling fluid inlet is communicated with storage tank and heat carrier outside respectively with cooling liquid outlet, use for first cooling fluid to flow into and the outflow storage tank, and groove is formed on the bottom surface of heat carrier.Pump is in order to drive first coolant flow, first liquid circulation is flowed between heat carrier and one first radiator.Inside heat pipe is filled with one second cooling fluid, the section of heat pipe forms a curved side and a planar side with respect to curved side, wherein curved side is the section of the described groove of coupling, with so that described heat pipe embeds the groove of heat carrier, and make the planar side of heat pipe and the bottom surface of heat carrier be positioned at same plane, be attached to thermal source with common supporting, make heat pipe produce radiating effect, heat is brought to one second radiator remove thermal source.
Compared with prior art, adopt the advantage that the utlity model has of technique scheme to be: compound heat-exchange device has dual cooling mechanism, and thermally conductive interface is the direct contact heat source, needn't be used as intermediate medium with heat-conducting block again, can effectively promote the radiating efficiency of electronic building brick, avoid heat to concentrate on the contact interface place of thermal source and heat carrier, and prevent the operational effectiveness of temperatures involved electronic building brick.
Description of drawings
Fig. 1 is the three-dimensional exploded view of this new embodiment;
Fig. 2 is the sectional perspective exploded view of this new embodiment;
Fig. 3 is the stereogram of this new embodiment;
Fig. 4 is the partial sectional view of this new embodiment;
Fig. 5 is the stereogram of this new embodiment, discloses compound heat-exchange device thermal source is dispelled the heat;
Fig. 6 is the partial sectional view of Fig. 5;
Fig. 7 is the partial sectional view of Fig. 5.
Description of reference numerals: 10-thermal source; The 20-heat carrier; 21-cooling fluid inlet; The 22-cooling liquid outlet; The 23-opening; The 24-storage tank; The 25-fin; The 26-screw; The 27-bottom surface; The 28-groove; The 30-pump; The 31-fixing hole; The 32-fixed cap; The 33-fixing hole; The 34-screw piece; The 35-impeller; 50-first radiator; The 51-circulation pipe; The 511-port of export; The 512-arrival end; The 60-heat pipe; The 61-condensation end; The 62-evaporation section; The 621-curved side; The 622-planar side; 70-second radiator.
Embodiment
For making this novel purpose, structure, feature and function thereof there is further understanding, cooperates embodiment to be described in detail as follows now.
See also Fig. 1, Fig. 2 and shown in Figure 3, be a kind of compound heat-exchange device provided by the utility model, it includes a heat carrier 20, a pump 30, one first heat radiation 50, a plurality of heat pipe 60 and one second radiator 70.The material of heat carrier 20 can be metals such as copper, aluminium, almag, to promote conductive coefficient.Heat carrier 20 is in order to contact a thermal source 10, to absorb the heat that thermal source 10 produces to pass by contact heat.
Consult Fig. 1, Fig. 2 and shown in Figure 3, heat carrier 20 has a cooling fluid enter the mouth 21, one cooling liquid outlet 22, an opening 23 and a storage tank 24.Storage tank 24 is formed on heat carrier 20 inside, and in order to ccontaining first cooling fluid, wherein to can be with water be the aqueous solution that main component is added extra composition to first cooling fluid, but do not exceed with the aqueous solution.The a plurality of fins 25 of heat carrier 20 inner formation extend in the storage tank 24, in order to increase the contact area of first cooling fluid and heat carrier 20.Opening 23 is formed in the end face of heat carrier 20, is communicated with storage tank 24 and heat carrier 20 outsides.Cooling fluid inlet 21 and cooling liquid outlet 22 are respectively formed at the side of heat carrier 20, be communicated with storage tank 24 and heat carrier 20 outsides, wherein to enter the mouth 21 be to use for first cooling fluid to flow into storage tank 24 to cooling fluid, and cooling liquid outlet 22 is to use for first cooling fluid to flow out storage tank 24, so that first cooling fluid is inner mobile with outer loop at heat carrier 20.The bottom surface 27 of heat carrier 20 is planes, and in order to being flattened on thermal source 10, and the bottom surface 27 of heat carrier 20 has more a plurality of grooves 28.
Consult Fig. 1, Fig. 2 and shown in Figure 3 again, pump 30 is fixed on the end face of heat carrier 20, and covers the opening 23 of heat carrier 20.Pump 30 has an impeller 35, is arranged in storage tank 24, drives first coolant flow and by cooling fluid inlet 21 and described cooling liquid outlet 22 in order to rotation.Pump 30 edges have plurality of fixed hole 31, the corresponding respectively screw 26 at heat carrier 20 end faces.One fixed cap 32 covers the top of pump 30, and fixed cap 32 edges form plurality of fixed hole 33, and is corresponding to respectively each fixing hole 31 of pump 30 and each screw 26 of heat carrier 20 end faces.A plurality of screw pieces 34 are can pass fixing hole 33 and fixing hole 31 and screw in screw 26, in order to fixed cap 32 is locked on pump 30, and pump 30 is installed in heat carrier 20 together with fixed cap 32, and the storage tank 24 that makes the impeller 35 of pump 30 be arranged in heat carrier 20 is rotated.
Refer again to Fig. 1, Fig. 2 and shown in Figure 3, circulation pipe 51 has a port of export 511 and an arrival end 512.Circulation pipe 51 is to pass one first radiator 50.The port of export 511 of circulation pipe 51 is communicated with the cooling fluid inlet 21 at heat carrier 20, makes first cooling fluid enter the mouth 21 by circulation pipe 51 inflow storage tanks 24 via cooling fluid.The cooling liquid outlet 21 that the arrival end 512 of circulation pipe 51 is communicated with at heat carrier 20 makes first cooling fluid flow into circulation pipe 51 by storage tank 24 via cooling liquid outlet 21.Connecting storage tank 24, the first cooling fluids by circulation pipe 51 can carry out heat exchange with heat carrier 20 in storage tank 24, absorb the heat that heat carrier 20 is received by thermal source 10.Then first cooling fluid can enter in the circulation pipe 51, by first radiator 50, carry out heat exchange with first radiator 50 and with heat release to extraneous.
Refer again to Fig. 1, Fig. 2, Fig. 3 and shown in Figure 4, each heat pipe 60 inside is filled with second cooling fluid, and for example ethylene glycol solution can carry out two phase change in heat pipe 60, obtains liquid phase and the required latent heat of gas phase variation by heat exchange.Each heat pipe 60 has two condensation ends 61 and an evaporation section 62.The section of heat pipe 60 forms a curved side 621 and a planar side 622 with respect to curved side 621, wherein the profile of curved side 621 is coupling grooves 28 at heat carrier 20, with so that heat pipe 60 embeds the groove 28 of heat carriers 20, the planar side 622 of heat pipe 60 then is positioned at same plane with the bottom surface 27 of heat carrier 20, heat pipe 60 make heat pipe 60 and heat carrier 20 can directly be attached to the surface of thermal source 10, so that can absorb the heat that thermal source 10 produces.Second cooling fluid is that the evaporation section 62 at heat pipe 60 absorbs heats as latent heat, and gasification is gaseous state.Each condensation end 61 is to embed one second radiator 70, to cool off for second cooling fluid, makes second cooling fluid of gaseous state be condensed into liquid state, and the capillary structure by heat pipe 60 inside returns evaporation section 62.
Refer again to Fig. 5, Fig. 6 and shown in Figure 7, the heat that thermal source 10 produces has two kinds of heat conduction paths externally to dispel the heat.One carries out heat exchange for first cooling fluid and the thermal source 10 by heat carrier 20 inside, heat up after making first cooling fluid absorb the heat of thermal source 10, cool and drive first coolant flow to the first radiator 50 that heats up by pump 30, pump 30 continues to keep on the go simultaneously, flow back to heat carrier 20 inside again with first cooling fluid that drives cooling and carry out heat exchange, so constantly carry out circulative convection, dispel the heat with the variations in temperature that relies on first cooling fluid.It two carries out heat exchange at evaporation section 62 and thermal source 10 for second cooling fluid by heat pipe 60 inside, be vaporizated into gaseous state after making second cooling fluid absorb the heat of thermal source 10, and second cooling fluid of gaseous state because of the pressure differential diffuses flow to condensation end 61, rely on 70 heat radiations of second radiator and lower the temperature, make the second cooling fluid condensation of gaseous state revert to liquid state, adsorption and diffusion is to the heat of evaporation section 62 absorption thermals source 10 again and the second liquid cooling fluid is because of capillarity, and so continuous phase change by means of second cooling fluid is dispelled the heat.
This NEW TYPE OF COMPOSITE heat-exchange device has two kinds of heat exchange mechanisms, and heat carrier 20 is directly to contact with thermal source 10 with heat pipe 60, needn't be used as heat transfer medium with extra heat-conducting block again, can effectively promote heat conducting speed, promptly used heat is removed from thermal source 10, to avoid the operational effectiveness of temperatures involved electronic building brick.Because heat pipe 60 can remove heat by contact interface rapidly, therefore can avoid between thermal source 10 and the heat carrier 20 because the existence of contact heat resistance, the problem in interface formation high temperature concentrated area is with the temperature of effective control thermal source 10.The thermal power that heat pipe 60 can't be born then conducts to first cooling fluid by heat carrier 20, further cools off, to reach the dual-cooled effect.
More than explanation is just illustrative for the utility model, and it is nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited, can make many modifications, variation or equivalence, but but all will fall within the claim restricted portion of the present utility model.
Claims (5)
1. a compound heat-exchange device is characterized in that: include: a heat carrier, a pump and at least one heat pipe;
Described heat carrier is to contact a thermal source with its bottom surface, and described heat carrier has:
One storage tank is formed on described heat carrier inside, in order to ccontaining one first cooling fluid;
One cooling fluid enters the mouth, and is formed on the side of described heat carrier, is communicated with described storage tank and described heat carrier outside, uses for described first cooling fluid and flows into described storage tank;
One cooling liquid outlet is formed on the side of described heat carrier, is communicated with described storage tank and described heat carrier outside, uses for described first cooling fluid and flows out described storage tank; With
At least one groove is formed on the bottom surface of described heat carrier;
Described pump is arranged on the described heat carrier, in order to drive described first coolant flow;
Described at least one heat pipe, inside is filled with one second cooling fluid, the section of wherein said heat pipe is to form a curved side and a planar side with respect to described curved side, wherein said curved side is the section of the described groove of coupling, described heat pipe is the groove that embeds described heat carrier, and the planar side of described heat pipe and the bottom surface of described heat carrier are positioned at same plane.
2. compound heat-exchange device according to claim 1, it is characterized in that: described heat carrier has an opening, be formed on the end face of described heat carrier, and described pump has an impeller, wherein said pump is to be fixed on described end face and to cover described opening, and described impeller is to be arranged in described storage tank.
3. compound heat-exchange device according to claim 1, it is characterized in that: more comprise the circulation pipe that one first radiator and passes described first radiator, two ends of wherein said circulation pipe are to be communicated with described cooling fluid inlet and described cooling liquid outlet respectively.
4. compound heat-exchange device according to claim 1 is characterized in that: more comprise one second radiator, at least one end of described heat pipe is to embed described second radiator.
5. compound heat-exchange device according to claim 1 is characterized in that: described heat carrier has a plurality of fins, and it is inner and extend in the described storage tank to be formed on described heat carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200006662U CN201039637Y (en) | 2007-01-10 | 2007-01-10 | Composite heat exchange device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200006662U CN201039637Y (en) | 2007-01-10 | 2007-01-10 | Composite heat exchange device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201039637Y true CN201039637Y (en) | 2008-03-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200006662U Expired - Lifetime CN201039637Y (en) | 2007-01-10 | 2007-01-10 | Composite heat exchange device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201039637Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101308398B (en) * | 2008-06-30 | 2012-08-22 | 中山大学 | Radiation system for calculation processing arrangements and equipment adopting the heat radiation system |
| CN106550583A (en) * | 2015-09-16 | 2017-03-29 | 宏碁股份有限公司 | Heat radiation module |
| US20180066895A1 (en) * | 2015-09-16 | 2018-03-08 | Acer Incorporated | Thermal dissipation module |
| CN108287603A (en) * | 2018-02-28 | 2018-07-17 | 魏大平 | The method that multistage atomizing water-cooling is carried out to computer CPU |
| CN111366020A (en) * | 2020-03-30 | 2020-07-03 | 厦门大学 | Extended water-cooled heat pipe radiator |
| TWI768944B (en) * | 2021-06-02 | 2022-06-21 | 英業達股份有限公司 | Heat dissipating device |
-
2007
- 2007-01-10 CN CNU2007200006662U patent/CN201039637Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101308398B (en) * | 2008-06-30 | 2012-08-22 | 中山大学 | Radiation system for calculation processing arrangements and equipment adopting the heat radiation system |
| CN106550583A (en) * | 2015-09-16 | 2017-03-29 | 宏碁股份有限公司 | Heat radiation module |
| CN106550584A (en) * | 2015-09-16 | 2017-03-29 | 宏碁股份有限公司 | Heat radiation module |
| US20180066895A1 (en) * | 2015-09-16 | 2018-03-08 | Acer Incorporated | Thermal dissipation module |
| CN106550583B (en) * | 2015-09-16 | 2020-04-07 | 宏碁股份有限公司 | Heat radiation module |
| US10634435B2 (en) | 2015-09-16 | 2020-04-28 | Acer Incorporated | Thermal dissipation module |
| CN108287603A (en) * | 2018-02-28 | 2018-07-17 | 魏大平 | The method that multistage atomizing water-cooling is carried out to computer CPU |
| CN111366020A (en) * | 2020-03-30 | 2020-07-03 | 厦门大学 | Extended water-cooled heat pipe radiator |
| TWI768944B (en) * | 2021-06-02 | 2022-06-21 | 英業達股份有限公司 | Heat dissipating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: LIAN-YI ELECTRONICS (HUIZHOU) CO., LTD. Free format text: FORMER OWNER: XUNKAI INTERNATIONAL CO., LTD. Effective date: 20090612 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090612 Address after: Four floor, No. 9 Huicheng Arts crafts emporium in Guangdong city of Huizhou province Huifeng Zhongkai east two zip code: 516006 Patentee after: Lianyi Electronic (Huizhou) Co., Ltd. Address before: Postcode of Taiwan, china: Patentee before: Xunkai International Co., Ltd. |
|
| ASS | Succession or assignment of patent right |
Owner name: COOLER MASTER (SHANGHAI) TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: COOLERMASTER (HUIZHOU) CO., LTD. Effective date: 20141121 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 516006 HUIZHOU, GUANGDONG PROVINCE TO: 201512 JINSHAN, SHANGHAI |
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| TR01 | Transfer of patent right |
Effective date of registration: 20141121 Address after: 201512, room 6, building 421, 2062 West Ching Road, Shanghai, Jinshan District Patentee after: Cooler Master (Shanghai) Technology Co., Ltd. Address before: Four Building No. 9 Huicheng Arts crafts emporium 516006 Guangdong province Huizhou City Zhongkai Huifeng east two road Patentee before: Lianyi Electronic (Huizhou) Co., Ltd. |
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| CX01 | Expiry of patent term |
Granted publication date: 20080319 |
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| EXPY | Termination of patent right or utility model |