CN2569345Y - Loop type heat pipe structure - Google Patents
Loop type heat pipe structure Download PDFInfo
- Publication number
- CN2569345Y CN2569345Y CN 02201266 CN02201266U CN2569345Y CN 2569345 Y CN2569345 Y CN 2569345Y CN 02201266 CN02201266 CN 02201266 CN 02201266 U CN02201266 U CN 02201266U CN 2569345 Y CN2569345 Y CN 2569345Y
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- China
- Prior art keywords
- loop type
- working fluid
- heat pipe
- type heat
- condensation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000009833 condensation Methods 0.000 claims abstract description 50
- 230000005494 condensation Effects 0.000 claims abstract description 50
- 239000012530 fluid Substances 0.000 claims abstract description 45
- 238000001704 evaporation Methods 0.000 claims abstract description 44
- 230000008020 evaporation Effects 0.000 claims abstract description 38
- 238000010521 absorption reaction Methods 0.000 claims abstract description 8
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000011049 filling Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000006185 dispersion Substances 0.000 abstract description 3
- 230000008859 change Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000005192 partition Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 18
- 238000013461 design Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000005266 casting Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000002730 additional effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a loop type heat pipe structure, which comprises an evaporating part, a conveying pipe and a condensing part, wherein, the evaporating part is provided with a partition plate, a groove and an element with a capillary structure. Therefore, stream with phase change generated by the heat absorption of working fluid by a heating element flows in a single direction to the condensing part for heat dispersion along the conveying pipe; the working fluid after condensation flows back to the evaporating part by the conveying pipe on the other end to make the evaporation and the condensation of the working fluid follows a fixed circulation direction; the phenomenon that the steam bolts out blindly or flows out can not be caused to happen; besides, the area of the loop type heat pipe evaporating part and the area of the loop type heat pipe condensing part can also be made by the simple assembly mode by means of an integral forming processing. Therefore, manufacturing cost can be effectively reduced, processing time can be saved, and heat dispersion efficiency can be improved.
Description
Technical field
The utility model relates to a kind of loop type heat pipe structure, particularly relates to a kind of flat loop type heat pipe in the arrangement of simplifying by the ingenious design and craft of structure, can realize the raising of heat-transfer capability and radiating efficiency and the effect of promoting production capacity.
Background technology
In the middle of present electronic technology, heat dissipation problem is to influence the march toward problem face place of more high-effect required breakthrough of product always.For example, solve electronic component, as central processing unit (Central Processing Unit, heat dissipation problem CPU) with the traditional round tubular heat tube.But, semiconductor technology is gradually under the situation of Highgrade integration and chip size microminiaturization now, followed the surge of caloric value simultaneously, made the traditional round tubular heat tube face the situation of having too many difficulties to cope with gradually for the processing of golf calorific value element radiating problem.Therefore, the another kind of cooling application device that day by day becomes the endoadaptation golf calorific value electronic component coming years according to the loop type heat pipe of manufacturing that heat pipe principle is researched and developed.
The United States Patent (USP) 4th of technique known as authorizing Maidanik, 515, No. 209 patent documents, it is to be made of the evaporation part of pipe shape and condensation part and feed tube, when the evaporation part is connected with heater element, the working fluid that is attached to the capillary structure element in the evaporation part produces saturated steam because of the heat absorption phase transformation, be delivered in the condensation part via metal tube, carry out heat exchange by condensation part and ambient atmosphere and cause the saturated steam cooling, cool off formed working fluid and just can flow back into the evaporation part, and then proceed its heat absorption vaporization behavior by metal tube.This loop type heat pipe is owing to carry saturated steam to separate with the metal tube of cooled working fluid in the loop type heat pipe with the result that the traditional round tubular heat tube compares mutually, this just can make the viscous shearing (viscous shear) of liquid vapour interface disappear, and the working fluid that the evaporation part can not take place when the flowing velocity of saturated steam is higher to flow back to is yet taken once again to the condensation part.Such situation promptly is that the do not disperse phenomenon of boundary (entrainment limitation) and overflow boundary (flooding limitation) exists, so loop type heat pipe can obtain high heat-transfer capability.
By above-mentioned design principle as can be known, when the evaporation part of loop type heat pipe is attached at the heater element of electronic circuit, because the structure of this evaporation part and condensation part all is pipe shapes, so, the mode that then will cause contacting with line between evaporation part and heater element and condensation part and radiating fin is conducted heat, and contact area is little and cause conducting heat relatively poor with radiating effect respectively.In addition, though this is designed to a splendid heat abstractor, yet entire making process is rather loaded down with trivial details, and its cost and technology are the most unfavorable for stressing gradually at a low price with the ageing electronic industry of research and development.
The application scenario of loop type heat pipe required under the very strict standard environment heat dispersion mainly at space and military aspect in the past, and cost factor is not its key element of mainly considering.Yet electronic product is subjected to making chip component and heat abstractor face great challenge under the mutual conflicting request of high hot flux density and low cost in recent years.Therefore, how loop type heat pipe being visualized better simply structure and solve the loaded down with trivial details of technology, so as to reaching the purpose that reduces production costs, is the technical task of demanding urgently breaking through in fact.
Summary of the invention
The purpose of this utility model is to provide a kind of flat loop type heat pipe structure, makes that all can follow a fixed-direction after working fluid evaporation and the condensation flows, and is unlikely to cause the two-way channelling of steam, brings into play its loop effectiveness.It is via structure Design and arrangement, reach the heat sinking function of loop type heat pipe with the fabrication schedule of simplifying the processing assembling, and operation principle of the present utility model is during for the base plate that conducts heat when heater element to the evaporation part of heat pipe, be attached to working fluid in capillary structure element and the groove in the evaporation part because of evaporating by heat, formed steam is following feed tube and is flowing to condensation end, then in the condensation end release heat, condensation becomes liquid working fluid, flow back into the evaporation part via transfer pipeline again, like this circulation endlessly, the heat that can effectively remove heater element and produced.
Another purpose of the present utility model is in the condensation part of loop type heat pipe and feed tube porch the capillary structure element to be set, lodge in the working fluid of condensation part except absorption, and then the guiding of this working fluid entered outside the feed tube, can prevent that also the steam of abundant condensation is not scurried into, the capillary structure element at the feed tube inlet/outlet place of the working fluid of this external conveying condensation also can be used as and prevents the working fluid adverse current and go out, and then reaches the effect that working fluid is regulated.In addition, the radiating fin of outer end, condensation part can complete condensation part and fin structure by modes such as powder metallurgic method, die cast method or chemical method for etching with one-body molded processing mode, such way is to exempt the contact heat resistance that is produced between condensation part and radiating fin, and then increases radiating efficiency.
Above-mentioned purpose of the present utility model is achieved in that a kind of loop type heat pipe structure, dispels the heat for a heater element by flowing of a working fluid is next, and it includes:
One condensation part dissipates to the heat that this heater element produced in the atmosphere;
One feed tube connects this condensation part, in order to carry this working fluid;
One evaporation part is connected to form a loop with this condensation part and this feed tube, and this evaporation part includes:
One base plate directly contacts with this heater element, and in order to receiving the heat that this heater element produces, and this base plate has a plurality of grooves, in order to flowing of this working fluid of guiding filling in this loop;
One cover plate, in order to this base plate driving fit, this cover plate has a dividing plate and a plurality of ribs, this working fluid was scurried into this feed tube after this dividing plate was used for blocking heat absorption, this ribs is in order to strengthen the structure of this evaporation part; And
A plurality of capillary structure elements, be layed in this evaporation part respectively, in this condensation part, place, in this feed tube and the gateway of this feed tube, in order to compile this working fluid to circulate.
Loop type heat pipe structure described in the utility model, wherein this cover plate can be selected from that any one is made in the combination of powder metallurgic method, punching press casting die and chemical method for etching.
Loop type heat pipe structure described in the utility model, wherein this base plate can be selected from that any one is made in the combination of powder metallurgic method, punching press casting die and chemical method for etching.
Loop type heat pipe structure described in the utility model, wherein this working fluid can or can be a refrigerant for water.
Loop type heat pipe structure described in the utility model, wherein this ribs is in order to be fixed in this capillary structure element in this evaporation part.
Loop type heat pipe structure described in the utility model, wherein this capillary structure element can be a wire netting.
Loop type heat pipe structure described in the utility model, wherein this outer end, condensation part preferably has a plurality of radiating fins, in order to increase the area of dissipation of this condensation part.
Loop type heat pipe structure described in the utility model, wherein this condensation part can be selected from that any one is made in the combination of powder metallurgic method, punching press casting die and chemical method for etching.
Loop type heat pipe structure described in the utility model, wherein this condensation part preferably is provided with a plurality of ribs, and this ribs makes this working fluid conflux to the bottom of this condensation part in order to guide this working fluid.
Below in conjunction with specific embodiment and accompanying drawing thereof, the utility model is described in further detail.
Description of drawings
Fig. 1 is D structure figure of the present utility model;
Fig. 2 is a structure perspective view of the present utility model;
Fig. 3 is the profile of Fig. 2 in the III-III position;
Fig. 4 makes the schematic diagram of use-case for the utility model first;
Fig. 5 makes the schematic diagram of use-case for the utility model second.
Embodiment
According to a kind of loop type heat pipe 1 structure disclosed in the utility model, at first see also Fig. 1, Fig. 2 and Fig. 3, the evaporation part 2 of this loop type heat pipe 1 is connected by feed tube 3a, 3b between the two with condensation part 4, and forms a loop.Evaporation part 2 is formed by cover plate 10 and base plate 20 mutual driving fits.Cover plate 10 is provided with dividing plate 30 and a plurality of ribs 40, then is equipped with capillary structure element 60 between dividing plate 30, ribs 40 and cover plate 10 walls.Base plate 20 has a plurality of grooves 50, and is covered in top, groove 50 places with capillary structure element 60.Promptly constitute an evaporation part 2 after cover plate 10 and base plate 20 driving fits.In evaporation part 2, dividing plate 30 and a plurality of ribs 40 can compress the capillary structure element 60 at groove 50 places that are covered in base plate 20, make loop type heat pipe 1 when using, and can not produce distortion or displacement (as shown in Figure 3) because of moving assembling or being heated.
In addition, the utility model is for reinforced structure, and evaporation part 2 all is equiped with a plurality of ribs 40 with condensation part 4, and the ribs 40 of condensation part 4 also can be used as the usefulness that auxiliary cover plate 10 condensation working fluids 80 flow to base plate 20.4 outer ends, condensation part are equiped with a plurality of radiating fins 70, and are provided with in condensation part 4 outside a plurality of ribs 40, and the front end at feed tube 3a then is equipped with a capillary structure element 60 in addition.
Machinery such as the cover plate 10 of evaporation part 2 and base plate 20 and condensation part 4 and radiating fin 70 all can powder metallurgic methods, punching press casting die or chemical method for etching or chemical process method give processing and manufacturing and are integral moulding, formed contact heat resistance between so then can reducing process time and the reduction element engaging.
Operation principle and flow process as for loop heat pipe see also Fig. 1, Fig. 2.When a heater element 5 with heat conduction during in the base plate 20 of the evaporation part 2 of loop type heat pipe 1, form steam after being layed in the capillary structure element 60 adsorbed working fluids that the accumulate 80 heat absorption phase transformations of base plate 20 tops.Since steam pressure greater than condensation after the pressure of working fluid 80, steam can follow the little place of pressure and flow, scurry migration because of the formed steam that absorbs heat is blind for the working fluid 80 of the portion of avoiding evaporating 2 and enter the feed tube 3a that working fluid 80 after the condensation flows back to evaporation part 2, therefore design a dividing plate 30 to block this steam.In addition, the feed tube 3a import and export that working fluid 80 flows back to evaporation part 2 after condensation also is provided with capillary structure element 60, so as to collecting working fluid 80 after the condensation, and can prevent that steam from entering feed tube 3a.After the working fluid 80 of meeting heat formed steam, this steam just can follow feed tube 3b and transmit and enter condensation part 4, and this moment, steam latent heat was passed to the radiating fin 70 of condensation part 4, and heat is entrainmented and was disposed to (as shown in Figure 4) in the atmosphere by fan 6.So just can be condensed into working fluid 80 after the steam release heat, condensed working fluid 80 reclaims via the capillary structure element that can anti-blocking steam enters 60 tractions of feed tube 3a front end, flow among the feed tube 3a, return to then in the evaporation part 2, by capillary structure element 60 collection that attaches in the evaporation part 2.The working fluid 80 that is positioned at dividing plate 30 is disseminated to heat affected zone by a plurality of grooves 50 of evaporation part 2 base plates 20 with capillary structure element 60 again, till forming a circulation causes backflow until the heater element 5 excessive heats of input working fluid like this and replenishing too late dry-out (dryout) and form.
Below will utilize two to make use-case that concrete feasibility of the present utility model is described, see also Fig. 4 and Fig. 5.In Fig. 4, the evaporation part 2 of this loop type heat pipe 1 is bonded with each other with the heater element 5 of motherboard 7 (can utilizes heat-conducting glue that two elements is engaged, so as to reducing its interelement contact heat resistance), the heat that heater element produced is conducted in the evaporation part 2, and impel working fluid 80 heat absorption to produce steam, via feed tube 3b transfer to condensation part 4, the heat that this moment, steam contained just can be passed to radiating fin 70, and by fan 6 torrid zone is walked, steam promptly can be condensed into working fluid 80.This working fluid 80 is just following feed tube 3a at last and is flowing back into evaporation part 2 once again, and then begins the circulation of another time, can realize the effect of dispelling the heat like this.Fig. 5 then is the example that same principle pattern as described above is applied to portable electronic product, and its operation principle all is identical with structure, so no longer repeat to give unnecessary details.
Use a kind of loop type heat pipe structure of the present utility model, can solve the heat dissipation problem of the high hot flux density of electronic product.The utility model is by the mode in the evaporation part of heat pipe design dividing plate, groove and capillary structure combination of elements, prevents from that steam is blind to scurry migration and can finish the work the additional effect of fluid regulation; At condensation part place promptly by integrated processing mode to reduce thermal resistance, so, just can reduce cost of manufacture effectively, save process time, raising heat-transfer capability and heat dissipation.
Though the utility model with preferred embodiment openly as above; but it is not in order to limit the utility model; any related personnel who is familiar with present technique; in not breaking away from spirit and scope of the present utility model; when doing suitable change and retouching, therefore protection range of the present utility model must be as the criterion with the determined scope of claim.
Claims (7)
1, a kind of loop type heat pipe structure dispels the heat for a heater element by flowing of a working fluid is next, it is characterized in that including:
The heat that this heater element produced is dissipated to a condensation part in the atmosphere;
One feed tube connects this condensation part;
One evaporation part is connected to form a loop with this condensation part and this feed tube, and this evaporation part includes:
One base plate directly contacts with this heater element, and this base plate has a plurality of grooves that flow in order to this working fluid of guiding filling in this loop;
Be used for blocking this working fluid after the heat absorption and scurry into a cover plate of this feed tube, this dividing plate and this base plate driving fit, this cover plate has a dividing plate and a plurality of ribs; And
Be layed in this evaporation part respectively, in this condensation part, in this feed tube and the gateway of this feed tube place, in order to compile a plurality of capillary structure elements of this working fluid to circulate.
2, loop type heat pipe structure as claimed in claim 1 is characterized in that this working fluid is a water.
3, loop type heat pipe structure as claimed in claim 1 is characterized in that this working fluid is a refrigerant.
4, loop type heat pipe structure as claimed in claim 1 is characterized in that this capillary structure element that is arranged in this evaporation part is fixed by this ribs.
5, loop type heat pipe structure as claimed in claim 1 is characterized in that this capillary structure element is a wire netting.
6, loop type heat pipe structure as claimed in claim 1 is characterized in that this outer end, condensation part has a plurality of radiating fins in order to the area of dissipation that increases this condensation part.
7, loop type heat pipe structure as claimed in claim 1 is characterized in that this condensation part is provided with a plurality of ribs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02201266 CN2569345Y (en) | 2002-01-10 | 2002-01-10 | Loop type heat pipe structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02201266 CN2569345Y (en) | 2002-01-10 | 2002-01-10 | Loop type heat pipe structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2569345Y true CN2569345Y (en) | 2003-08-27 |
Family
ID=33684162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02201266 Expired - Lifetime CN2569345Y (en) | 2002-01-10 | 2002-01-10 | Loop type heat pipe structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2569345Y (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100383963C (en) * | 2005-07-08 | 2008-04-23 | 富准精密工业(深圳)有限公司 | Thin loop type radiating apparatus |
| CN100395684C (en) * | 2005-07-02 | 2008-06-18 | 富准精密工业(深圳)有限公司 | Loop radiating module |
| CN100437004C (en) * | 2005-06-04 | 2008-11-26 | 富准精密工业(深圳)有限公司 | Ring type heat exchanging system |
| CN101090621B (en) * | 2006-06-16 | 2010-05-26 | 鸿富锦精密工业（深圳）有限公司 | Loop heat sink module |
| CN101307996B (en) * | 2007-05-17 | 2010-06-02 | 私立淡江大学 | Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure |
| US7775262B2 (en) | 2005-06-03 | 2010-08-17 | Foxconn Technology Co., Ltd. | Loop-type heat exchange device |
| CN101900504A (en) * | 2010-08-19 | 2010-12-01 | 中冶南方工程技术有限公司 | Flat type loop heat pipe |
| CN101453859B (en) * | 2007-11-29 | 2011-06-08 | 中山伟强科技有限公司 | Loop type heat pipe radiator and manufacturing method thereof |
| CN104661484A (en) * | 2013-11-19 | 2015-05-27 | 宏碁股份有限公司 | Heat dissipation assembly and electronic device using same |
| CN104717875A (en) * | 2013-12-17 | 2015-06-17 | 广达电脑股份有限公司 | Method for manufacturing heat radiation assembly |
| CN105940279A (en) * | 2014-01-28 | 2016-09-14 | 松下知识产权经营株式会社 | Cooling device and data center with same |
| US9977474B2 (en) | 2013-11-07 | 2018-05-22 | Acer Incorporated | Heat dissipating assembly and electronic device using the same |
-
2002
- 2002-01-10 CN CN 02201266 patent/CN2569345Y/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7775262B2 (en) | 2005-06-03 | 2010-08-17 | Foxconn Technology Co., Ltd. | Loop-type heat exchange device |
| CN100437004C (en) * | 2005-06-04 | 2008-11-26 | 富准精密工业(深圳)有限公司 | Ring type heat exchanging system |
| US7665509B2 (en) | 2005-07-02 | 2010-02-23 | Foxconn Technology Co., Ltd. | Heat exchange module for electronic components |
| CN100395684C (en) * | 2005-07-02 | 2008-06-18 | 富准精密工业(深圳)有限公司 | Loop radiating module |
| CN100383963C (en) * | 2005-07-08 | 2008-04-23 | 富准精密工业(深圳)有限公司 | Thin loop type radiating apparatus |
| CN101090621B (en) * | 2006-06-16 | 2010-05-26 | 鸿富锦精密工业（深圳）有限公司 | Loop heat sink module |
| CN101307996B (en) * | 2007-05-17 | 2010-06-02 | 私立淡江大学 | Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure |
| CN101453859B (en) * | 2007-11-29 | 2011-06-08 | 中山伟强科技有限公司 | Loop type heat pipe radiator and manufacturing method thereof |
| CN101900504A (en) * | 2010-08-19 | 2010-12-01 | 中冶南方工程技术有限公司 | Flat type loop heat pipe |
| US9977474B2 (en) | 2013-11-07 | 2018-05-22 | Acer Incorporated | Heat dissipating assembly and electronic device using the same |
| CN104661484A (en) * | 2013-11-19 | 2015-05-27 | 宏碁股份有限公司 | Heat dissipation assembly and electronic device using same |
| CN104661484B (en) * | 2013-11-19 | 2017-11-03 | 宏碁股份有限公司 | Radiating subassembly is with applying its electronic installation |
| CN104717875A (en) * | 2013-12-17 | 2015-06-17 | 广达电脑股份有限公司 | Method for manufacturing heat radiation assembly |
| CN104717875B (en) * | 2013-12-17 | 2017-06-23 | 广达电脑股份有限公司 | Method for manufacturing heat radiation assembly |
| CN105940279A (en) * | 2014-01-28 | 2016-09-14 | 松下知识产权经营株式会社 | Cooling device and data center with same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20120110 Granted publication date: 20030827 |