CN201344752Y - Heat radiation device for loop heat pipe - Google Patents
Heat radiation device for loop heat pipe Download PDFInfo
- Publication number
- CN201344752Y CN201344752Y CN 200820123488 CN200820123488U CN201344752Y CN 201344752 Y CN201344752 Y CN 201344752Y CN 200820123488 CN200820123488 CN 200820123488 CN 200820123488 U CN200820123488 U CN 200820123488U CN 201344752 Y CN201344752 Y CN 201344752Y
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- loop circuit
- condenser
- evaporimeter
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat radiation device for a loop heat pipe, which mainly comprises an evaporator, a condenser, and a pipeline connecting the evaporator and the condenser. The heat radiation device is characterized in that the pipeline adopts a dimensional curved structure. The heat radiation device can meet the requirements for mounting and using in different spaces, and has the advantages of compact structure, space conservation, convenient installation and high mechanical strength.
Description
Technical field
The utility model relates to the heat abstractor in a kind of electronic product field, particularly a kind of loop circuit heat pipe (loop heat pipe) heat abstractor.
Background technology
The application of great-power electronic chip cooling technology is an important link in electronics, computer, communication and the optoelectronic device.Chang Yong high-power electronic device heat dissipating method comprises following several in the market: fan, radiator combination; Fan, heat pipe and radiator combination; Fan combines with the liquid cooling technology.Though said method can solve the heat dissipation problem of high power device to a certain extent, but find that in actual applications also there is following defective in it:
1, about fan, radiator combination heat dissipating method, improve the heat-sinking capability of heat abstractor as need, can only increase the area of radiating fin or improve rotation speed of the fan, it certainly will cause, and device noise increases, volume increase and more thick and heavy, be unfavorable for installing, also can produce very big pressure electronic device;
2, about fan, heat pipe and radiator combination heat dissipating method, can avoid the shortcoming of said method, but this method apparatus structure complexity often makes the design of heat pipe and installation be restricted, and under the effect of limited heat pipe, the heat-sinking capability of device is more limited;
3, the heat dissipating method that combines with the liquid cooling technology about fan surmounts above-mentioned dual mode on heat dispersion, and the potentiality of liquid cooling heat dissipation technology are very big, existing small-sized liquid-cooling heat radiator, in the process performance optimization, and under the control noise prerequisite, distribute 1000 watts heat and can realize.But the construction for heat radiating device of using the liquid cooling technology is extremely complicated, and the pump and the present pipeline that still can not avoid fully that wherein drive the liquid working substance circulation connect leakage problem, all have a strong impact on the actual life of liquid-cooling heat radiator.In addition, the manufacturing cost of liquid-cooling heat radiator is very high, and under same heat-sinking capability, it is more than 3 times of general heat pipe radiator cost.
Loop circuit heat pipe (loop heat pipe) technological invention was in 1979, and at present wide model is applied to aerospace field, and the loop circuit heat pipe technology progresses into electronic chip heat radiation field over nearly 5 years, but still was unrealized large-scale commercial the application.Can predict, after promoting the loop properties of hot pipe comprehensively and cutting down finished cost effectively, loop circuit heat pipe will be showed one's capabilities in the electronic equipment dissipating heat field.Loop circuit heat pipe is the advantage of set heat pipe and liquid cooling heat dissipation technology, abandon a kind of radiating mode of its technological deficiency simultaneously, the heat radiation potentiality are the same with the liquid cooling technology, a tight short small loop circuit heat pipe of type, can easily realize the heat radiation (the loop circuit heat pipe overall thermal resistance can be hanged down below the 0.15C/W) more than 500 watts, and its cost is far below liquid-cooling heat radiator.
Chinese patent 01259718.X and disclose a kind of loop circuit heat pipe condenser separately No. 200810028106.7, it is bypass structure, and promptly evaporimeter and condenser link together by pipeline, and evaporimeter and condenser are on a principal plane.This structure can realize that the collection of heat and strange land discharge, and possess the advantage of loop circuit heat pipe.But still there are some shortcomings in this kind structure:
1,,, often is difficult to install above-mentioned bypass structure if the space is limited for complicated cabinet inside;
2, because bypass structure has the connecting pipe than length, its mechanical strength is difficult to guarantee, is unfavorable for producing, stores, transports and installs;
3, generally speaking, the condenser of loop circuit heat pipe all needs corresponding installing mechanism, just can be fixed on the cabinet of electronic equipment.
This shows that above-mentioned existing loop circuit heat pipe condenser obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.How to develop a kind of installation and instructions for use, compact conformation that satisfies different spaces, be convenient to install, mechanical strength is high and save the loop circuit heat pipe heat abstractor of the new structure in space, being one of current important research and development problem in this area, also is that the current industry utmost point needs improved target.
The utility model content
The purpose of this utility model is, overcome the defective that existing loop circuit heat pipe condenser exists, and provide a kind of loop circuit heat pipe heat abstractor of new structure, technical problem to be solved is to make its installation that can satisfy different spaces and instructions for use, compact conformation, saving space, be convenient to install and the mechanical strength height, thereby is suitable for practicality more.
The purpose of this utility model and to solve its technical problem be to adopt following technical scheme to realize.According to a kind of loop circuit heat pipe heat abstractor that the utility model proposes, mainly comprise evaporimeter, condenser and the pipeline that connects evaporimeter and condenser, described pipeline is three-dimensional warp architecture.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid a kind of loop circuit heat pipe heat abstractor, the three-dimensional warp architecture of described pipeline is L shaped, U-shaped, and is Z-shaped, S shape or
Shape.
Aforesaid a kind of loop circuit heat pipe heat abstractor, described pipeline are one or two.
Aforesaid a kind of loop circuit heat pipe heat abstractor, described pipeline are the metallic conduit of circle, ellipse, rectangle or triangular-section, and described condenser is the radiating fin group of high heat-conducting, and described evaporimeter is high heat-conducting, and working media is a liquid.
Aforesaid a kind of loop circuit heat pipe heat abstractor, described pipeline, condenser, evaporimeter are aluminium matter or copper, perhaps other metal or nonmetal, working media is an acetone, ammoniacal liquor, ethanol, fluorine Lyons class cryogenic fluid or water.
Aforesaid a kind of loop circuit heat pipe heat abstractor, described evaporimeter lower end is provided with locking component.
Aforesaid a kind of loop circuit heat pipe heat abstractor, described locking component is buckle or screw.
Aforesaid a kind of loop circuit heat pipe heat abstractor, pipeline and evaporimeter, condenser welding, bonding or be spirally connected.
Aforesaid a kind of loop circuit heat pipe heat abstractor also comprises structure stand and fan, and fan is fixedlyed connected with condenser by structure stand, bolt.
Aforesaid a kind of loop circuit heat pipe heat abstractor, described evaporimeter is a flat-plate evaporators, inside has wick structure.
The utility model compared with prior art has tangible advantage and beneficial effect, and has the extensive value on the industry, and it has following advantage at least:
1, a kind of loop circuit heat pipe heat abstractor of the utility model, can as required metallic conduit be designed to crooked arbitrarily state, evaporimeter and condenser are positioned on the different principal planes, whole loop circuit heat pipe forms a stereochemical structure, can be placed in any space that can be used for dispelling the heat in the cabinet of computer and other electronic equipment, thus different installations and instructions for use;
2, loop circuit heat pipe heat radiation module can effectively be fitted with the heating electronic chip easily, simple installation, and structure is tightly firmly short, saves the shared space of heat radiation module;
3, owing to above reason, can promote the serviceability of loop circuit heat pipe most possibly, avoid unnecessary pipeline to extend simultaneously or extra condenser location and installing mechanism, the mechanical strength of device also improves thereupon;
4, the utlity model has that above-mentioned many a bit and it only is to do slightly structural change for existing loop circuit heat pipe condenser and return, simple in structure, manufacturing cost is lower, is suitable for industrial circle and extensively promotes the use of.
In sum, a kind of loop circuit heat pipe heat abstractor of the utility model, can satisfy different spaces installation and instructions for use, compact conformation, saving space, be convenient to install and the mechanical strength height.The utlity model has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on apparatus structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing loop circuit heat pipe condenser has outstanding effect, thereby be suitable for practicality more, and have the extensive value of industry.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the STRUCTURE DECOMPOSITION schematic diagram of a kind of embodiment of a kind of loop circuit heat pipe heat abstractor of the utility model.
Fig. 2 is the combination schematic diagram of Fig. 1.
Fig. 3 is the user mode schematic diagram of Fig. 2.
Fig. 4 is the STRUCTURE DECOMPOSITION schematic diagram of another embodiment of a kind of loop circuit heat pipe heat abstractor of the utility model.
Fig. 5 is the combination schematic diagram of Fig. 4.
Fig. 6 is the user mode schematic diagram of Fig. 5.
Fig. 7 is the textural association schematic diagram of other embodiments of a kind of loop circuit heat pipe heat abstractor of the utility model.
The specific embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to according to a kind of its specific embodiment of loop circuit heat pipe heat abstractor, structure, feature and the effect thereof that the utility model proposes, describe in detail as after.
See also shown in Figure 1ly, a kind of loop circuit heat pipe heat abstractor of the utility model mainly comprises evaporimeter 1, condenser 3 and pipeline 2, preferable structure stand 4 and the fan 5 of also can comprising.
Wherein, evaporimeter 1 can be selected the flat-plate evaporators that heat radiation function is better, inside has wick structure for use, it selects for use high thermal conductivity coefficient materials such as copper to make, the internal work medium is an acetone, ammoniacal liquor, ethanol, fluorine Lyons class cryogenic fluid, water or other liquid, in addition, the evaporimeter lower end also can be provided with as locking components such as buckle or screw 11.
See also shown in Figure 2, pipeline 2 connects evaporimeter 1 and condenser 3, fan 5 is fixedlyed connected with condenser 3 by structure stand 4, bolt, a large amount of cold airs can be blown over fin (Fin) group and bend pipe, taking away the heat that working media in the condenser discharges, above-mentioned connected mode all can select for use welding, bonding, mode such as be spirally connected.
See also shown in Figure 3, a kind of loop circuit heat pipe heat abstractor of the utility model is installed on computer-internal, when being used to cool off CPU, by locking component 11 CPU on flat-plate evaporators 1 and the mainboard (CPU) is fitted tightly, can add the surface heat contact material as required, the pipeline 2 of condenser 3 by bending is arranged near the air outlet of cabinet.
During work, the flat-plate evaporators bottom surface receives the heat that passes over from CPU, working media is in the inner evaporation of wick structure, steam leaves evaporimeter, pipeline 2 by bending flows to the condenser 3 that has fin, steam passes through at condenser, heat is discharged in the air that flows through condenser fin, steam is through cooling or fan are forced to change liquid into after the cooling naturally, liquid under the effect of capillary force via pipeline 2 Returning evaporimeters 1, finish thermodynamic cycle one time, move in circles in view of the above, continuously heat is discharged into the surrounding air from CPU.
See also shown in Fig. 4-6, also pipeline 2 can be made
The three-dimensional warp architecture of shape, the assembling post-condenser is arranged in the top of evaporimeter.In addition, also pipeline 2 can be made other three-dimensional contourings such as U-shaped as shown in Figure 7, for example S shape or Z-shaped.
This patent product is the novel tight short small loop heat pipe that declines, employing by the three-dimensional crooked pipelines of one or two flat-plate evaporators with have the condenser ways of connecting of fin, reach with electronic chip combine closely and heat is dispersed near the purpose in any utilizable space, can use occasion easily in CPU and the heat radiation of other high power electronic device.
Below only being applied to loop circuit heat pipe (Loop Heat Pipe) device with the utility model illustrates, also can use evaporimeter and condenser that its pipeline with three-dimensional warp architecture of a kind of loop circuit heat pipe heat abstractor of the utility model connects devices such as pulsating heat pipe, hot water heat exchanger, its concrete structure and above-mentioned to be applied to the loop circuit heat pipe device basic identical does not repeat them here.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art, in not breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (10)
1, a kind of loop circuit heat pipe heat abstractor mainly comprises evaporimeter (1), condenser (3) and the pipeline (2) that connects evaporimeter and condenser, it is characterized in that described pipeline (2) is three-dimensional warp architecture.
2, a kind of loop circuit heat pipe heat abstractor according to claim 1, the three-dimensional warp architecture that it is characterized in that described pipeline (2) be L shaped, U-shaped, S shape, Z-shaped or
Shape.
3, a kind of loop circuit heat pipe heat abstractor according to claim 1 is characterized in that described pipeline is one or two.
4, a kind of loop circuit heat pipe heat abstractor according to claim 1, it is characterized in that the metallic conduit of described pipeline for circular, ellipse, rectangle or triangular-section, described condenser (3) is the radiating fin group of high heat-conducting, described evaporimeter (1) is high heat-conducting, and working media is a liquid.
5, a kind of loop circuit heat pipe heat abstractor according to claim 4 is characterized in that described pipeline (2), condenser (3), and evaporimeter (1) is an aluminium matter or copper, working media is an acetone, ammoniacal liquor, ethanol, fluorine Lyons class cryogenic fluid or water.
6, a kind of loop circuit heat pipe heat abstractor according to claim 1 is characterized in that described evaporimeter (1) lower end is provided with locking component (11).
7, a kind of loop circuit heat pipe heat abstractor according to claim 6 is characterized in that described locking component (11) is buckle or screw.
8, a kind of loop circuit heat pipe heat abstractor according to claim 1 is characterized in that described pipeline (2) and evaporimeter (1), condenser (3) welding, bonding or be spirally connected.
9, a kind of loop circuit heat pipe heat abstractor according to claim 1 is characterized in that also comprising structure stand (4) and fan (5), and fan (5) is fixedlyed connected with condenser (3) by structure stand (4), bolt.
10, according to the described a kind of loop circuit heat pipe heat abstractor of the arbitrary claim of claim 1-9, it is characterized in that described evaporimeter (1) is a flat-plate evaporators, inside has wick structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820123488 CN201344752Y (en) | 2008-11-05 | 2008-11-05 | Heat radiation device for loop heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820123488 CN201344752Y (en) | 2008-11-05 | 2008-11-05 | Heat radiation device for loop heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201344752Y true CN201344752Y (en) | 2009-11-11 |
Family
ID=41276332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200820123488 Expired - Fee Related CN201344752Y (en) | 2008-11-05 | 2008-11-05 | Heat radiation device for loop heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201344752Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881569A (en) * | 2010-07-19 | 2010-11-10 | 王永刚 | Variable working condition and aclinal heat tube heat exchanger |
| CN103189708A (en) * | 2010-11-01 | 2013-07-03 | 富士通株式会社 | Loop-shaped heat pipe and electronic device equipped with same |
| CN105066756A (en) * | 2015-08-13 | 2015-11-18 | 袁竹 | Device for changing energy by using loop heat pipe |
| CN105633037A (en) * | 2016-01-08 | 2016-06-01 | 西安交通大学 | Pulsation heat pipe radiating apparatus for cooling chips |
| CN106052444A (en) * | 2016-07-13 | 2016-10-26 | 梁才航 | Flat-plate heat pipe arrayed radiator |
| CN109963446A (en) * | 2019-04-22 | 2019-07-02 | 南京工业大学 | A kind of server installs data center's cabinet compound thermal management system of loop circuit heat pipe heat exchanger and cross flow fan additional |
| CN111928705A (en) * | 2019-05-13 | 2020-11-13 | 亚浩电子五金塑胶（惠州）有限公司 | Gravity type loop heat pipe and heat radiating device with same |
-
2008
- 2008-11-05 CN CN 200820123488 patent/CN201344752Y/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881569A (en) * | 2010-07-19 | 2010-11-10 | 王永刚 | Variable working condition and aclinal heat tube heat exchanger |
| CN101881569B (en) * | 2010-07-19 | 2012-08-22 | 王永刚 | Variable working condition and aclinal heat tube heat exchanger |
| CN103189708A (en) * | 2010-11-01 | 2013-07-03 | 富士通株式会社 | Loop-shaped heat pipe and electronic device equipped with same |
| CN103189708B (en) * | 2010-11-01 | 2015-04-01 | 富士通株式会社 | Loop-shaped heat pipe and electronic device equipped with same |
| CN105066756A (en) * | 2015-08-13 | 2015-11-18 | 袁竹 | Device for changing energy by using loop heat pipe |
| CN105633037A (en) * | 2016-01-08 | 2016-06-01 | 西安交通大学 | Pulsation heat pipe radiating apparatus for cooling chips |
| CN106052444A (en) * | 2016-07-13 | 2016-10-26 | 梁才航 | Flat-plate heat pipe arrayed radiator |
| CN106052444B (en) * | 2016-07-13 | 2017-11-14 | 桂林电子科技大学 | A kind of flat-plate heat pipe array radiator |
| CN109963446A (en) * | 2019-04-22 | 2019-07-02 | 南京工业大学 | A kind of server installs data center's cabinet compound thermal management system of loop circuit heat pipe heat exchanger and cross flow fan additional |
| CN111928705A (en) * | 2019-05-13 | 2020-11-13 | 亚浩电子五金塑胶（惠州）有限公司 | Gravity type loop heat pipe and heat radiating device with same |
| US11162738B2 (en) | 2019-05-13 | 2021-11-02 | Vast Glory Electronic & Hardware & Plastic (Hui Zhou) Ltd | Gravity loop thermosyphon and heat dissipation device comprising the same |
| CN111928705B (en) * | 2019-05-13 | 2022-03-25 | 亚浩电子五金塑胶（惠州）有限公司 | Heat radiator with gravity type loop heat pipe |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: XKCOOLER (BEIJING) CO., LTD. Free format text: FORMER OWNER: LI JI Effective date: 20111209 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100000 HAIDIAN, BEIJING TO: 100000 SHIJINGSHAN, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20111209 Address after: 100000 Beijing city Shijingshan District Jinding Street No. 1 Jinding Technology Park South floor No. 1 East Patentee after: Beijing Core Cablediameter Electronic Cooling Technology Co.,Ltd. Address before: 100000 No. 5, No. 3, building 30, 704 south Ling Road, Beijing, Haidian District Patentee before: Li Ji |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091111 Termination date: 20161105 |