CN105633037A - Pulsation heat pipe radiating apparatus for cooling chips - Google Patents
Pulsation heat pipe radiating apparatus for cooling chips Download PDFInfo
- Publication number
- CN105633037A CN105633037A CN201610013077.1A CN201610013077A CN105633037A CN 105633037 A CN105633037 A CN 105633037A CN 201610013077 A CN201610013077 A CN 201610013077A CN 105633037 A CN105633037 A CN 105633037A
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- CN
- China
- Prior art keywords
- heat pipe
- chip
- cooling
- pulsating heat
- auger type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Abstract
A pulsation heat pipe radiating apparatus for cooling chips is disclosed. The pulsation heat pipe radiating apparatus comprises a chip module and a chip cooling base mounted at the upper part of the chip module, wherein the chip cooling base and a closed type spiral pulsation heat pipe are tightly matched to enable an evaporation section of the closed type spiral pulsation heat pipe to be in full contact with the chip module; the evaporation section of the closed type spiral pulsation heat pipe is embedded into the chip cooling base; a cooling fan bracket is fixed on the side face of the chip cooling base; a cooling fan is fixed on the cooling fan bracket; and the cooling fan is positioned at the upper part of a condensation section of the closed type spiral pulsation heat pipe. Rapid export of the heat generated in the operating process of the high-power chips is realized by utilizing the phase changing process of the working medium in the closed type spiral pulsation heat pipe, and the heat is rapidly radiated to the surrounding environment by the cooling fan, so that the high-speed steady operation of the high-power chips can be ensured within a normal temperature range; and in addition, the pulsation heat pipe radiating apparatus has the advantages of simple structure, steady operation, low energy consumption, high radiating heat flow density, high radiating efficiency, and the like.
Description
Technical field
The present invention relates to high-power chip and efficiently cool down technical field, be specifically related to a kind of pulsating heat pipe cooling device for chip cooling technique.
Background technology
Development along with current chip Integration ofTechnology, miniaturization and high-frequency high-speed, heating power in chip unit are is increasing, temperature is more and more higher, but high-power chip also makes its fault rate significantly improve because of the impact of temperature, therefore Chip Cooling Techniques plays considerable role in chip develops.
The cooling module design of chip be mainly considered as its take up room, cooling effectiveness and cost of manufacture, it is ensured that in use the temperature of chip is able to maintain that in its normal operating temperature range. In existing Chip Cooling Techniques, topmost radiating mode is divided into wind-cooling heat dissipating technology, water-cooling technology and conventional heat pipe heat dissipation technology. Wherein, wind-cooling heat dissipating technology is less due to the thermal conductivity of its heat-conducting medium, therefore when chip heating is serious, the cooling effectiveness of chiller easily reaches its working limit, effectively chip heat can not be derived, cause that chip temperature rises rapidly, chip operation ecological deterioration. Water-cooling technology must be equipped with adjunct power plant due to it, causes that it takes up room bigger. Further, since the inside wick complex manufacturing process of conventional heat pipe heat dissipation technology, cause that its cost of manufacture is higher.
Summary of the invention
In order to overcome the shortcoming of above-mentioned prior art, it is an object of the invention to provide a kind of pulsating heat pipe cooling device for chip cooling technique, it is possible to be effectively improved cooling effectiveness and cooldown rate, reduce simultaneously and take up room and cost of manufacture.
For achieving the above object, the concrete technical scheme that the present invention adopts is:
A kind of pulsating heat pipe cooling device for chip cooling technique, chip cooling technique pedestal 2 including chip module 1 and portion mounted thereto, chip cooling technique pedestal 2 coordinates compression with enclosed auger type pulsating heat pipe 3, the evaporator section 8 of enclosed auger type pulsating heat pipe 3 embeds in chip cooling base 2, the bottom surface 7 making the evaporator section 8 of enclosed auger type pulsating heat pipe 3 is fully contacted with chip module 1, chip cooling technique pedestal 2 side is fixed with cooling blower tray 4, cooling blower tray 4 is fixed with cooling fan 5, cooling fan 5 is positioned at the top of the condensation segment 9 of enclosed auger type pulsating heat pipe 3.
It is filled with heat conductive silica gel material 6 between described chip module 1 and chip cooling technique pedestal 2.
Bottom described chip cooling technique pedestal 2, processing has the evaporator section 8 of screw type conduit and enclosed auger type pulsating heat pipe 3 to be in close contact, and chip cooling technique pedestal 2 top processing simultaneously has heat radiation fin.
Bottom surface 7 and chip module 1 contact portion of described enclosed auger type pulsating heat pipe 3 are processed as plane.
Described enclosed auger type pulsating heat pipe 3 adopts internal diameter 2mm, the copper tube bent jointing of external diameter 3mm forms, difference according to chip module 1, the helical duct number of varying number is set, liquid injection port is welded at copper tube Outboard Sections, after enclosed auger type pulsating heat pipe 3 is processed into, first evacuation is carried out, ensure the vacuum within enclosed auger type pulsating heat pipe 3, then working media is injected at low ambient temperatures, fluid injection rate is 80%��90%, and working media is fluoro trichloromethane, utilizes blending method to add copper oxide nanometer particle.
Present invention beneficial effect compared with prior art:
The present invention utilizes the phase transition process of working media in enclosed auger type pulsating heat pipe 3, realize high-power chip is run the quick derivation of produced heat, and Btu utilization is cooled down in the environment that fan 5 dissipates surrounding rapidly, thus ensureing that high-power chip stably runs at a high speed in normal temperature range, having simple in construction, stable, energy consumption is little, heat radiation heat flow density is big, radiating efficiency advantages of higher.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the explosive view of Fig. 1.
Fig. 3 is the right view of enclosed auger type pulsating heat pipe 3 of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Such as Fig. 1, shown in Fig. 2 and Fig. 3, a kind of pulsating heat pipe cooling device for chip cooling technique, chip cooling technique pedestal 2 including chip module 1 and portion mounted thereto, chip cooling technique pedestal 2 coordinates compression with enclosed auger type pulsating heat pipe 3, the evaporator section 8 of enclosed auger type pulsating heat pipe 3 embeds in chip cooling base 2, the bottom surface 7 making the evaporator section 8 of enclosed auger type pulsating heat pipe 3 is fully contacted with chip module 1, chip cooling technique pedestal 2 side is fixed with cooling blower tray 4, cooling blower tray 4 is fixed with cooling fan 5, cooling fan 5 is positioned at the top of the condensation segment 9 of enclosed auger type pulsating heat pipe 3.
It is filled with heat conductive silica gel material 6 between described chip module 1 and chip cooling technique pedestal 2, eliminates contact gap, it is ensured that the efficient transmission of heat.
Bottom described chip cooling technique pedestal 2, processing has the evaporator section 8 of screw type conduit and enclosed auger type pulsating heat pipe 3 to be in close contact, and chip cooling technique pedestal 2 top processing simultaneously has heat radiation fin, strengthens its heat-sinking capability.
Bottom surface 7 and chip module 1 contact portion of described enclosed auger type pulsating heat pipe 3 are processed as plane, it is ensured that enclosed auger type pulsating heat pipe 3 bottom surface and chip module 1 can be fully contacted.
Described enclosed auger type pulsating heat pipe 3 adopts internal diameter 2mm, the copper tube bent jointing of external diameter 3mm forms, difference according to chip module 1, the helical duct number of varying number is set, liquid injection port is welded at copper tube Outboard Sections, after enclosed auger type pulsating heat pipe 3 is processed into, first evacuation is carried out, ensure the vacuum within enclosed auger type pulsating heat pipe 3, then working media is injected at low ambient temperatures, fluid injection rate is 80%��90%, and working media is fluoro trichloromethane, utilizes blending method to add copper oxide nanometer particle.
The operation principle of the present invention is:
The heat that chip module 1 produces is delivered in chip cooling technique pedestal 2 and enclosed auger type pulsating heat pipe 3, make the vaporization of enclosed auger type pulsating heat pipe 3 internal work medium, heat on chip cooling technique pedestal 2 is quickly taken out of, then the condensation segment 9 of enclosed auger type pulsating heat pipe 3 is arrived, cooling effect due to air with cooling fan 5, working media condensation liquefaction releases heat, plays the quick derivative ac-tion of heat.
Working media forms the air-liquid plug of random distribution in the evaporator section 8 of enclosed auger type pulsating heat pipe 3, condensation segment 9. At evaporator section 8, working media evaporation forms bubble, expands rapidly therewith and boosting, and the medium that pushes the work forward flows to condensation at low temperature section 9; In condensation segment 9, bubble condensation contraction crack, pressure declines, owing to two ends exist pressure reduction, thus providing the driving force of working media flow; The working media evaporation process of evaporator section 8 adjacency channel has asynchronous, pressure differential can be formed between adjacency channel, this pressure differential medium that can push the work forward flows to another runner from a runner, thus forming the restoring force of pulsating heat pipe, under the interaction of driving force and restoring force, define working media local concussion flowing between evaporator section 8 and condensation segment 9 and overall the circulating of pulsating heat pipe, thus realizing the transmission of heat.
Claims (5)
1. the pulsating heat pipe cooling device for chip cooling technique, chip cooling technique pedestal (2) including chip module (1) and portion mounted thereto, it is characterized in that: chip cooling technique pedestal (2) coordinates compression with enclosed auger type pulsating heat pipe (3), the evaporator section (8) of enclosed auger type pulsating heat pipe (3) embeds in chip cooling base (2), the bottom surface (7) making the evaporator section (8) of enclosed auger type pulsating heat pipe (3) is fully contacted with chip module (1), chip cooling technique pedestal (2) side is fixed with cooling blower tray (4), cooling blower tray (4) is fixed with cooling fan (5), cooling fan (5) is positioned at the top of the condensation segment (9) of enclosed auger type pulsating heat pipe (3).
2. a kind of pulsating heat pipe cooling device for chip cooling technique according to claim 1, it is characterised in that: it is filled with heat conductive silica gel material (6) between described chip module (1) and chip cooling technique pedestal (2).
3. a kind of pulsating heat pipe cooling device for chip cooling technique according to claim 1, it is characterized in that: the processing of described chip cooling technique pedestal (2) bottom has the evaporator section (8) of screw type conduit and enclosed auger type pulsating heat pipe (3) be in close contact, while chip cooling technique pedestal (2) top process and have heat radiation fin.
4. a kind of pulsating heat pipe cooling device for chip cooling technique according to claim 1, it is characterised in that: the bottom surface (7) of described enclosed auger type pulsating heat pipe (3) and chip module (1) contact portion are processed as plane.
5. a kind of pulsating heat pipe cooling device for chip cooling technique according to claim 1, it is characterized in that: described enclosed auger type pulsating heat pipe (3) adopts internal diameter 2mm, the copper tube bent jointing of external diameter 3mm forms, difference according to chip module (1), the helical duct number of varying number is set, liquid injection port is welded at copper tube Outboard Sections, after enclosed auger type pulsating heat pipe (3) is processed into, first evacuation is carried out, ensure the vacuum that enclosed auger type pulsating heat pipe (3) is internal, then working media is injected at low ambient temperatures, fluid injection rate is 80%��90%, working media is fluoro trichloromethane, blending method is utilized to add copper oxide nanometer particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610013077.1A CN105633037A (en) | 2016-01-08 | 2016-01-08 | Pulsation heat pipe radiating apparatus for cooling chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610013077.1A CN105633037A (en) | 2016-01-08 | 2016-01-08 | Pulsation heat pipe radiating apparatus for cooling chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105633037A true CN105633037A (en) | 2016-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610013077.1A Pending CN105633037A (en) | 2016-01-08 | 2016-01-08 | Pulsation heat pipe radiating apparatus for cooling chips |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110943058A (en) * | 2019-10-30 | 2020-03-31 | 佛山科学技术学院 | Heat radiator |
| CN113008057A (en) * | 2021-02-03 | 2021-06-22 | 江苏大学 | Preparation method of double-sided micro-channel flat pulsating heat pipe and application of double-sided micro-channel flat pulsating heat pipe in high-power chip heat dissipation device |
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Application publication date: 20160601 |