CN113013120A

CN113013120A - Heat dissipation device and electronic equipment

Info

Publication number: CN113013120A
Application number: CN202110308927.1A
Authority: CN
Inventors: 陶建云
Original assignee: Shanghai Wingtech Electronic Technology Co Ltd
Current assignee: Shanghai Wingtech Electronic Technology Co Ltd
Priority date: 2021-03-23
Filing date: 2021-03-23
Publication date: 2021-06-22

Abstract

The invention provides a heat dissipation device, which comprises a microchannel evaporator, a condenser, a micropump, a heat regenerator and a pipeline, wherein the microchannel evaporator is arranged in the microchannel evaporator; the outlet pipe of the microchannel evaporator is connected with the condenser through the pipeline, the condenser is connected with the micropump through the pipeline, the micropump is connected with the first end of the heat regenerator through the pipeline, the second end of the heat regenerator is connected with the outlet pipe of the microchannel evaporator through the pipeline, and the first end of the heat regenerator is also connected with the inlet pipe of the microchannel evaporator through the pipeline. The invention also provides electronic equipment. The heat dissipation device and the electronic equipment provided by the invention can meet the heat dissipation requirement of a heat source with high heat flow density in a narrow space, and have high heat dissipation efficiency.

Description

Heat dissipation device and electronic equipment

[ technical field ] A method for producing a semiconductor device

The present invention relates to the field of heat dissipation technologies, and in particular, to a heat dissipation device and an electronic apparatus.

[ background of the invention ]

The rapid development of the integrated circuit and semiconductor industry has promoted the progress of processing chips toward high performance and high integration, which brings with it the problems of increasing power density and power consumption. Taking a common high-performance notebook as an example, the calorific value of high-power consumption heat source chips such as a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and the like is more than 100W, and if the generated heat is not discharged in time, the chip may automatically limit the performance due to the limitation of a power consumption wall to reduce the calorific value and avoid affecting user experience, and if the generated heat is not discharged in time, the chip may be damaged due to long-term high-temperature operation of the chip, or even cause a fire.

At present, the heat dissipation of the high-density heat source is mainly performed in a manner of combining forced air cooling and two-phase liquid cooling, and for example, a notebook computer is mostly performed in a manner of using a plurality of heat pipes or a large-area liquid-filled cold plate and performing end air cooling. However, even if a two-phase liquid cooling heat dissipation mode is adopted, the evaporation and condensation adopt the same heat dissipation loop and the heat dissipation space is limited, so that the heat dissipation requirement of a chip with higher power consumption or thinner electronic equipment is difficult to meet. Therefore, split water cooling devices on the market are promoted, a direct liquid water cooling mode is adopted, the heat dissipation cold end is independent of the device, and high-temperature liquid is cooled through a large air cooling device. However, for the split type water-cooling heat dissipation scheme, the heat dissipation volume is large, the split type water-cooling heat dissipation scheme is difficult to carry, the split type water-cooling heat dissipation scheme is not suitable for efficient heat dissipation of mobile equipment, single-phase liquid cooling heat dissipation is mostly adopted, and the heat dissipation efficiency is not high.

Therefore, there is a need to provide a novel heat dissipation device and an electronic apparatus to overcome the above-mentioned drawbacks.

[ summary of the invention ]

The invention aims to provide a heat dissipation device and electronic equipment, which can meet the heat dissipation requirement of a heat source with high heat flow density in a narrow space and have high heat dissipation efficiency.

In order to achieve the above object, in a first aspect, the present invention provides a heat dissipation device, including a microchannel evaporator, a condenser, a micropump, a heat regenerator, and a pipeline; the outlet pipe of the microchannel evaporator is connected with the condenser through the pipeline, the condenser is connected with the micropump through the pipeline, the micropump is connected with the first end of the heat regenerator through the pipeline, the second end of the heat regenerator is connected with the outlet pipe of the microchannel evaporator through the pipeline, and the first end of the heat regenerator is also connected with the inlet pipe of the microchannel evaporator through the pipeline.

In a preferred embodiment, the device further comprises a liquid storage tank and a heating base, wherein the heating base bears the liquid storage tank, the heating base is connected with the condenser through the pipeline, and the liquid storage tank is connected with the micro pump through the pipeline.

In a preferred embodiment, the microchannel evaporator comprises a cover plate and an evaporator body, the cover plate is covered on the evaporator body, the inlet pipe is connected with one end of the evaporator body, and the outlet pipe is connected with the other end of the evaporator body; the evaporator body comprises a plurality of microchannel tubes which are arranged in parallel, and one end of each microchannel tube, which is close to the inlet tube, is communicated with a plurality of throttling grooves which are connected in series.

In a preferred embodiment, a buffer structure is provided between the microchannel tube and the inlet tube, and the buffer structure is also provided between the microchannel tube and the outlet tube.

In a preferred embodiment, when the pipeline is completely filled with liquid, the liquid working medium accounting for 30% -60% of the total volume of the liquid storage tank is contained in the liquid storage tank.

In a preferred embodiment, the condenser includes a first heat dissipating fin, a first cooling fan paired with the first heat dissipating fin, a second heat dissipating fin, and a second cooling fan paired with the second heat dissipating fin; the heating base comprises a U-shaped pipeline, a first opening end of the U-shaped pipeline is connected with the pipeline between the first radiating fins and the second radiating fins through a flow regulating valve, and a second opening end of the U-shaped pipeline is connected with the pipeline between the first radiating fins and the second radiating fins.

In a preferred embodiment, a first pressure transmitter and a temperature probe are arranged on the pipeline between the second heat dissipation rib and the micro pump.

In a preferred embodiment, the number of the microchannel evaporator is plural, and the plural microchannel evaporators are connected in parallel.

In a second aspect, the present invention further provides an electronic device, including a heat source chip and the heat dissipation apparatus described in any one of the above, wherein a microchannel evaporator in the heat dissipation apparatus is fixed on the heat source chip, and a thermal interface layer is disposed between the microchannel evaporator and the heat source chip.

In a preferred embodiment, the heat sink further includes a circuit board, the heat source chip is disposed on the circuit board, and the microchannel evaporator of the heat sink includes a fixing strip fixed to the circuit board by a bolt.

Compared with the prior art, the heat dissipation device and the electronic equipment provided by the invention have the advantages that the pump drive of the micropump is used as the circulating power of the two-phase liquid cooling heat dissipation loop, the heat dissipation capacity is greatly improved, and the external disturbance resistance capacity is strong; the micro-channel evaporator is small in size and high in comparative area, can meet the heat dissipation requirement of a high heat flow density heat source in a narrow space, and the inlet of a channel of the micro-channel pipe is provided with a throttling groove, so that the micro-channel evaporator can play a role of a throttling valve, can improve the boiling stability, and can throttle and reduce pressure to spontaneously generate micro-bubbles at an equal enthalpy value, so that the boiling heat exchange effect is enhanced; the heat dissipation demand of distributed heat source can be satisfied to the mode that the multiple evaporation ware is parallelly connected, adopts the liquid storage pot to carry out the control by temperature change pressure regulating, the regenerator carries out the recovery of evaporimeter import and export working medium heat simultaneously, can control the heat transfer state of heat dissipation return circuit, under the prerequisite that satisfies the heat dissipation demand, optimizes heat exchange efficiency to the at utmost, realizes that the minimum pump work expenditure trades for getting the biggest heat dissipation income.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic block diagram of a heat dissipation device provided in the present invention;

FIG. 2 is a structural view of a microchannel evaporator of a heat dissipating device according to the present invention;

FIG. 3 is an enlarged view taken at A in FIG. 2;

FIG. 4 is a perspective view of a microchannel evaporator of a heat sink apparatus provided in accordance with the present invention;

FIG. 5 is a schematic diagram of a liquid storage tank and a heating base of a microchannel evaporator of the heat dissipation device provided by the invention;

FIG. 6 is a schematic diagram of pressure enthalpy of a heat dissipation loop of the heat dissipation apparatus provided by the present invention;

fig. 7 is a block diagram of an electronic device provided by the present invention.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, the present invention provides a heat dissipation apparatus 100, which includes a microchannel evaporator 10, a condenser 20, a micro pump 30, a heat regenerator 40, and a duct 101.

The outlet pipe 11 of the microchannel evaporator 10 is connected with the condenser 20 through a pipeline 101, the condenser 20 is connected with the micropump 30 through a pipeline 101, the micropump 30 is connected with the first end of the heat regenerator 40 through a pipeline 101, the second end of the heat regenerator 40 is connected with the outlet pipe 11 of the microchannel evaporator 10 through a pipeline 101, and the first end of the heat regenerator 40 is also connected with the inlet pipe 12 of the microchannel evaporator 10 through a pipeline 101. Specifically, the pipeline 101 is used for communicating the whole device, the pipeline 101 in the whole cycle can be made of stainless steel metal or alloy, and the sealing performance and the reliability of connection are guaranteed.

Referring to fig. 2, the microchannel evaporator 10 includes a cover plate 13 and an evaporator body 14, the cover plate 13 is covered on the evaporator body 14, the inlet pipe 12 is connected to one end of the evaporator body 14, and the outlet pipe 11 is connected to the other end of the evaporator body 14, it can be understood that the working medium can flow into the evaporator body 14 from the inlet pipe 12 and flow out through the outlet pipe 11. Specifically, a second pressure transmitter K2 is further disposed on the pipe 101 near the inlet pipe 12, and a liquid filling port 102 is further disposed on the pipe 101 between the first end of the regenerator 40 and the inlet pipe 12 of the microchannel evaporator 10. The microchannel evaporator 10 is made of a highly thermally conductive metal, such as aluminum or copper, to minimize the temperature gradient between the evaporator and the heat source. In practical application, when the number of the heat source chips is multiple, the number of the microchannel evaporators 10 is multiple, the multiple microchannel evaporators 10 are connected in parallel, that is, the inlet pipes of the multiple microchannel evaporators 10 are communicated with each other, the outlet pipes of the multiple microchannel evaporators 10 are communicated with each other, and the heat dissipation requirement of the distributed heat source can be met by the parallel connection mode of the multiple evaporators.

Further, the evaporator body 14 includes a plurality of microchannel tubes 141 arranged in parallel. Specifically, the microchannel tube 141 is a heat-dissipating core structure, has an ultra-high specific surface area, and has a broad application prospect in the field of efficient heat dissipation in a limited space. And the processing technology has low requirement, and is suitable for commercial development. The cross section of the microchannel tube 141 may be a regular geometric shape such as a rectangle, a triangle, etc. for easy manufacturing, in this embodiment, the cross section of the microchannel tube 141 is a rectangle, and the microchannel tube 141 is a narrow and tall channel tube.

The size of the microchannel tube 141 can be adjusted according to the heat dissipation space, and in this embodiment, the design parameters of the microchannel tube 141 should satisfy the constraint number Co > 0.5. The Co number can be used to determine what scale the evaporator belongs to, and is defined as:

wherein sigma is the surface tension of the circulating working medium, g is the gravity acceleration, rhol is the density of the liquid working medium, rhog is the density of the gaseous working medium, and Di is the hydraulic diameter of the channel. When Co is greater than 0.5, the heat transfer and flow of the channel are obviously different from those of a large channel, and the heat transfer and flow of the channel belong to the category of micro channels, so that high-efficiency heat dissipation can be realized.

Referring to fig. 3, one end of the microchannel tube 141 near the inlet tube 12 is connected to a plurality of serially connected throttling grooves 142, and specifically, the throttling grooves 142 are rectangular, and two adjacent throttling grooves 142 and the microchannel tube 141 are connected through a groove 1421. It can be understood that each throttling groove 142 forms a return-shaped structure, a plurality of return-shaped structures can provide great pressure loss, the effect of the throttling valve is achieved, on one hand, the stability of boiling of working media can be improved, backflow oscillation generated by local gas expansion is restrained, on the other hand, throttling and pressure reduction can be carried out on the working media, micro bubbles are generated spontaneously, the working media entering a channel are directly in a two-phase flow heat exchange state, and the heat exchange efficiency of the throttling groove is far higher than that of single-phase heat exchange.

Further, a buffer structure 143 is disposed between the microchannel tube 141 and the inlet tube 12, and a buffer structure 143 is also disposed between the microchannel tube 141 and the outlet tube 11. Specifically, buffer structure 143 is the arc, and back on evaporator body 14 is located to the apron 13 lid, forms the buffering space between apron 13 and the buffer structure 143, can play effectual buffering effect of flow equalizing, guarantees that the working medium of each passageway is in approximate heat transfer state, improves the temperature uniformity of evaporimeter horizontal direction.

Referring to fig. 4, the cover plate 13 is welded to the evaporator body 14 or directly injection molded, and the thickness of the evaporator body 14 should be as thin as possible to reduce the temperature difference between the top surface and the bottom surface of the microchannel tube 141 while satisfying the mechanical strength. In the present embodiment, the evaporator body 14 is in a flat rectangular shape, and correspondingly, the inlet pipe 12 and the outlet pipe 13 are also pressed into a flat shape, and are transited into a circular pipe after passing through a section of arc pipe 15 for flow equalization, and it can be understood that the diameter of the circular pipe is determined according to the circulation flow and the economic flow rate. For the convenience of installation, the microchannel evaporator 10 further includes fixing strips 103, the fixing strips 103 are formed by extending four corners of the microchannel evaporator 10, and the fixing strips 103 are fixed on the circuit board on which the heat source chip is mounted by bolts.

The condenser 20 may be air-cooled or water-cooled. In the present embodiment, the condenser 20 includes a first heat dissipation fin 21, a first cooling fan 22 paired with the first heat dissipation fin 21, a second heat dissipation fin 23, and a second cooling fan 24 paired with the second heat dissipation fin 23. The first heat dissipation fins 21 and the second heat dissipation fins 23 are formed integrally with the pipeline 101 by using a high thermal conductivity metal such as aluminum or copper, and are respectively paired with the first cooling fan 22 and the second cooling fan 24, and the first cooling fan 22 and the second cooling fan 24 may be implemented by using a centrifugal turbo fan or an axial fan according to the space limitation of the condensation end.

Specifically, a first pressure transmitter K1 and a temperature probe T are arranged on the pipeline 101 between the second heat dissipation fins 23 and the micro pump 30, and the first pressure transmitter K1 and the temperature probe T are used for monitoring the state of the condensed reflux working medium and transmitting signals to the temperature control chip.

The micropump 30 is the heart of the circulation loop of the whole device and is used for providing circulation power of the loop, a micro mechanical pump or a piezoelectric ceramic pump can be adopted, the micropump 30 can provide forced driving force, the circulation power is improved by several orders of magnitude compared with the capillary force of the existing heat pipe and the like, and the corresponding heat dissipation capacity is also greatly improved.

The heat regenerator 40 is used for transferring part of heat of high-temperature working medium at the outlet of the microchannel evaporator 10 to low-temperature working medium at the inlet of the microchannel evaporator 10, specifically, the second end of the heat regenerator 40 is connected with the outlet pipe 11 of the microchannel evaporator 10 through the flow regulating valve P, and the heat is regulated back through the flow regulating valve P, so that the inlet working medium is close to a saturated state as much as possible, and the supercooling degree of the working medium at the inlet of the microchannel evaporator 10 is reduced. It is understood that the regenerator 40 only exchanges heat of the inlet and outlet fluids of the microchannel evaporator 10, and does not exchange working fluid.

The heat sink 100 further comprises a liquid storage tank 50 and a heating base 60, wherein the heating base 60 is used for bearing the liquid storage tank 50, the heating base 60 is connected with the condenser 20 through a pipeline 101, and the liquid storage tank 50 is connected with the micro pump 30 through the pipeline.

Referring to fig. 5, the liquid storage tank 50 is used for storing excessive working medium, and on one hand, can accommodate the expanded working medium to ensure the relative stability of the system pressure, and on the other hand, can regulate and control the operation state of the system by controlling the pressure of the liquid storage tank, so as to balance the system pressure, and at the same time, accommodate or supplement the liquid working medium to ensure the safety of the system operation. The shape of the liquid storage tank 50 can be various, the design of the volume of the liquid storage tank 50 should be considered together with the filling amount of the working medium, and the filling amount of the system working medium should follow the following basic principle: the liquid storage tank is ensured to still have liquid residue under the condition that all the liquid in the pipeline 101 is liquid so as to ensure the gas-liquid two-phase state of the liquid storage tank, and the liquid storage tank can contain all the working media when all the liquid in the pipeline 101 is gas, and certain gas exists so as to ensure that the temperature of the working media is the saturation temperature. Comprehensively, in order to improve the precision of temperature control and thermal inertia of the liquid storage tank, when the pipeline 101 is all liquid, the liquid working medium which accounts for about 30-60% of the total volume is contained in the liquid storage tank. Moreover, the liquid storage tank 50 is connected with the circulation loop through a single pipeline, so that the intensity of exchange between the liquid storage tank 50 and the loop working medium is reduced, and the temperature control performance of the liquid storage tank 50 is improved.

The heating base 60 is used to control the temperature of the reservoir 50, thereby adjusting the system pressure and controlling the state of the working medium condensing reflux. Specifically, the heating base 60 includes a U-shaped pipe, a first opening end 61 of the U-shaped pipe is connected to the pipe 101 between the first heat dissipation fin 21 and the second heat dissipation fin 22 through a flow control valve P, and a second opening end 62 of the U-shaped pipe is connected to the pipe between the first heat dissipation fin 21 and the second heat dissipation fin 22. The U-shaped pipeline is used for circulating a relatively high-temperature two-phase working medium, the heat of the working medium is transferred to the liquid storage tank 50, so that the temperature of the liquid storage tank 50 is increased, the pressure in the corresponding liquid storage tank 50 is increased, the overall pressure of the system is increased, and the phenomenon that the backflow working medium carries gas due to poor cold end heat dissipation conditions and insufficient heat dissipation is solved.

According to the heat dissipation device 100 provided by the invention, the whole system adopts a liquid filling mode similar to heat pipe vacuumizing and filling, the working medium is selected according to the use scene and the pressure bearing capacity of the pipeline 101, ultrapure water, ethanol, acetone and the like can be used conventionally, and some nano copper oxide particles can be doped if the boiling heat exchange strength is required to be further enhanced. It can be understood that signals of the pressure transmitters, the temperature probes, the rotation speed regulation of the micropumps, the opening degree of the electric flow regulating valve, the rotation speed of the cooling fan and the like are transmitted to the temperature control chip for unified control.

The principle of the heat sink 100 provided by the present invention is explained in detail below with reference to fig. 6:

the supercooled liquid (state point 6) from the heat radiation cold end (namely the condenser 20) is subjected to pressure rise (state point 1) under the driving action of the micro pump 30, and is subjected to heat exchange with the high-temperature working medium at the outlet pipe 11 of the microchannel evaporator 10 through the heat regenerator 40 to be close to a saturated state (state point 2); in the throttling groove 142 near the inlet pipe 12, by utilizing the throttling depressurization effect of the resistance component with the zigzag structure, the nearly saturated liquid is in a gas-liquid two-phase region (state point 3) after undergoing an isenthalpic depressurization process and enters an expansion section, so that micro bubbles are generated spontaneously, a complex boiling phase change heat transfer and two-phase flow process occurs in the expansion section, and heat transferred to the microchannel pipe 141 by a high-temperature heat source chip is taken away; the generated gas-liquid two-phase fluid (state point 4) passes through the pipeline 101 and reaches the heat regenerator 40 to the heat dissipation cold end, and the steam is condensed into the supercooled liquid (state point 5) under the air cooling heat dissipation effect.

Further, when the environment temperature rises to cause the power of the cooling fan to reach the maximum, the supercooling degree of the working medium cannot reach the set value, or the fluid entering the micro pump 30 is in a two-phase area, the flow regulating valve connected with the liquid storage tank 50 and the heating base 60 is opened, so that the high-temperature working medium flows into the heating base 60, the temperature of the liquid storage tank 50 is raised, the back pressure of the system is improved, the saturation temperature of the corresponding working medium is improved, the heat dissipation capacity of the cold end is enhanced, and the opening degree of the valve is dynamically adjusted according to the supercooling degree. The supercooled liquid from the cooling cold end is heated and depressurized through a pipeline 101 to a suction inlet (state point 6) of the micro pump 30, the supercooling degree of the working medium at the position is ensured to be larger than a certain value, the cavitation phenomenon of the micro pump 30 is avoided, and the supercooling degree is determined according to the supercooling degree of the state point 5 and the characteristics of a circulation loop. Therefore, the pump-driven microchannel two-phase flow loop of the heat dissipation device 100 provided by the invention is a self-adaptive high-efficiency heat dissipation system, and the flow of the micropump 30, the heat regenerator 40, the liquid storage tank 50 and the opening degree of the flow regulating valve of the heating base 60 are actively regulated and controlled by monitoring the fluid state of each point of the system, so that the working medium in the microchannel tube 141 keeps a high-efficiency boiling heat transfer state, the temperature of a heat source chip is effectively controlled to be within a design range, and the maximum heat dissipation benefit is obtained by the minimum pump worker.

The heat dissipation device 100 provided by the invention is different from the existing two-phase liquid cooling heat dissipation scheme, for example, a heat pipe and a heat plate adopt capillary force as driving force, and have capillary limit; the pump-driven two-phase flow loop adopts the micro-channel as the two-phase evaporator and the micro-pump as the power source, has small volume and low working medium circulation flow, and overcomes the defects of large volume, inconvenient carrying, adoption of a single-phase water-cooling heat exchange mode, low heat exchange efficiency and high energy consumption of pumping work and a cooling fan of a split type water-cooling heat dissipation device; through the accurate control of the two-phase heat exchange state of the evaporator and the optimized design of the high-efficiency microchannel evaporator structure, the heat exchange efficiency is greatly improved, the corresponding pumping work and cooling energy consumption are low, and the energy is saved; through the temperature control of liquid storage pot, can adjust the backpressure of system, make the dynamic adjustment heat dissipation level of system in order to adapt to different external environment, avoided current heat abstractor's heat dissipation cold junction to receive the great problem of influence of environment.

It can be understood that the heat dissipation device 100 is suitable for efficient heat dissipation of high-power distributed heat sources, especially in a place with limited space, and the heat dissipation requirement of ultrahigh heat flux density can be met by using a microchannel evaporator. The heat dissipation device can be used for heat dissipation of a notebook computer, a server or other high-heating electronic components according to the requirement of a use space. Moreover, the form of the heat dissipation cold end is replaced, for example, the air cooling heat dissipation is changed into the water cooling heat dissipation, so that the integrated heat dissipation of the large-scale data center can be applied; the air-cooled heat dissipation can be transformed into a condensation radiation heat exchange mode, and the condensation radiation heat exchange mode is used for efficient temperature control heat dissipation of airborne equipment of the aerospace craft.

Referring to fig. 7, the present invention further provides an electronic device 200, which includes a heat source chip 201 and the heat dissipation apparatus 100 as described above, wherein the microchannel evaporator 10 in the heat dissipation apparatus 100 is fixed on the heat source chip 201, and a thermal interface layer 202 is disposed between the microchannel evaporator 10 and the heat source chip 201. Specifically, the material of the thermal interface layer 202 may be silicone grease, liquid metal, or the like, for heat conduction. The electronic device 200 further includes a circuit board 203, the heat source chip 201 is disposed on the circuit board 203, and the microchannel evaporator 10 of the heat dissipation apparatus 100 includes a fixing strip 103, and the fixing strip 103 is fixed on the circuit board 203 by bolts. It should be noted that all embodiments of the heat dissipation device 100 provided by the present invention are applicable to the electronic apparatus 200 provided by the present invention, and can achieve the same or similar beneficial effects.

In summary, in the heat dissipation apparatus 100 and the electronic device 200 provided by the present invention, the pump drive of the micro pump 30 is used as the circulating power of the two-phase liquid cooling heat dissipation loop, so that the heat dissipation capability is greatly improved, and the external disturbance resistance capability is strong; the micro-channel evaporator 10 has a small volume and a large relative area, and can meet the heat dissipation requirement of a high heat flow density heat source in a narrow space, the inlet of the micro-channel tube 141 is provided with the throttling groove 142, so that the micro-channel evaporator can play a role of a throttling valve, can improve the boiling stability, and can throttle and reduce pressure to spontaneously generate micro-bubbles at an equal enthalpy value, thereby enhancing the boiling heat exchange effect; the heat dissipation requirement of a distributed heat source can be met by the mode that multiple evaporators are connected in parallel, meanwhile, the liquid storage tank 50 is used for temperature control and pressure regulation, the heat regenerator 40 is used for recycling working medium heat at the inlet and the outlet of the evaporators, the heat exchange state of a heat dissipation loop can be controlled, the heat exchange efficiency is optimized to the greatest extent on the premise that the heat dissipation requirement is met, and the largest heat dissipation benefit is obtained by replacing the smallest pump work expenditure.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A heat dissipation device is characterized by comprising a microchannel evaporator, a condenser, a micropump, a heat regenerator and a pipeline; the outlet pipe of the microchannel evaporator is connected with the condenser through the pipeline, the condenser is connected with the micropump through the pipeline, the micropump is connected with the first end of the heat regenerator through the pipeline, the second end of the heat regenerator is connected with the outlet pipe of the microchannel evaporator through the pipeline, and the first end of the heat regenerator is also connected with the inlet pipe of the microchannel evaporator through the pipeline.

2. The heat dissipating device of claim 1, further comprising a reservoir and a heating base, said heating base carrying said reservoir, said heating base being connected to said condenser via said conduit, said reservoir being connected to said micro-pump via said conduit.

3. The heat dissipating device of claim 1, wherein said microchannel evaporator comprises a cover plate and an evaporator body, said cover plate covering said evaporator body, said inlet pipe being connected to one end of said evaporator body, said outlet pipe being connected to the other end of said evaporator body; the evaporator body comprises a plurality of microchannel tubes which are arranged in parallel, and one end of each microchannel tube, which is close to the inlet tube, is communicated with a plurality of throttling grooves which are connected in series.

4. The heat sink of claim 3, wherein a buffer structure is disposed between the microchannel tube and the inlet tube, and wherein the buffer structure is also disposed between the microchannel tube and the outlet tube.

5. The heat dissipating device of claim 2, wherein when all of said conduits are liquid, said reservoir contains liquid working substance in an amount of 30% to 60% of the total volume of said reservoir.

6. The heat dissipating device of claim 2, wherein said condenser comprises a first heat dissipating fin, a first cooling fan paired with said first heat dissipating fin, a second heat dissipating fin, and a second cooling fan paired with said second heat dissipating fin; the heating base comprises a U-shaped pipeline, a first opening end of the U-shaped pipeline is connected with the pipeline between the first radiating fins and the second radiating fins through a flow regulating valve, and a second opening end of the U-shaped pipeline is connected with the pipeline between the first radiating fins and the second radiating fins.

7. The heat dissipating device of claim 6, wherein a first pressure transducer and a temperature probe are disposed in the conduit between said second heat dissipating fin and said micro-pump.

8. The heat dissipating device of claim 1, wherein the number of the microchannel evaporators is plural, and the plural microchannel evaporators are connected in parallel.

9. An electronic device comprising a heat source chip and the heat dissipating apparatus of any one of claims 1 to 8, wherein a microchannel evaporator in the heat dissipating apparatus is fixed to the heat source chip, and a thermal interface layer is provided between the microchannel evaporator and the heat source chip.

10. The electronic device of claim 9, further comprising a circuit board, wherein the heat source chip is disposed on the circuit board, and wherein the microchannel evaporator of the heat dissipation device comprises a fastening strip, and wherein the fastening strip is fastened to the circuit board by a bolt.