CN111863740A - Self-induced jet flow passive boiling heat dissipation strengthening method and device for immersed liquid cooling system - Google Patents
Self-induced jet flow passive boiling heat dissipation strengthening method and device for immersed liquid cooling system Download PDFInfo
- Publication number
- CN111863740A CN111863740A CN202010279507.0A CN202010279507A CN111863740A CN 111863740 A CN111863740 A CN 111863740A CN 202010279507 A CN202010279507 A CN 202010279507A CN 111863740 A CN111863740 A CN 111863740A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- working medium
- jet flow
- channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
Abstract
A self-induced jet flow passive boiling heat dissipation strengthening method and a device for an immersed liquid cooling system are disclosed, wherein a heat source of a circuit board is provided with a heat accommodating cavity for working medium cavity pool phase circulation of the immersed liquid cooling system, and working medium circulation is realized through gravity so as to realize heat dissipation jet flow in vertical and/or horizontal directions on the surface of the heat source; the device includes: the heat-containing cavity is in contact with the circuit board, and the flow guide channel and the flow jet channel are used for communicating the working medium cavity pool with the heat-containing cavity to form a gas-flow guide channel and a liquid-flow jet channel. According to the invention, through arranging the jet flow channel and the flow guide channel, gas-liquid separation and self-induced jet flow without a drive source in the phase change process are realized, the boiling heat exchange performance is enhanced, the generation of critical heat flux density is delayed, and the yield of PUE (polyurethane) caused by immersed liquid cooling is maintained, so that the speed of increasing the computational power density of the data center is increased, and the heat dissipation problem of electronic equipment under high heat flux density is solved.
Description
Technical Field
The invention relates to a technology in the field of semiconductor heat dissipation, in particular to a method and a device for strengthening self-induced jet passive boiling heat dissipation of an immersed liquid cooling system.
Background
With the rapid development of 5G, AI and the emerging internet industry of cloud computing, the demand of data storage and general computing power in the market is rapidly increasing year by year, and a data center bearing the two core services and a development prospect thereof are also focused. In the present phase, for data centers, the emphasis is on lowering PUE and increasing computational power density. The traditional cooling scheme adopts a mode of combining a phase-change heat dissipation technology (a heat pipe and a pool boiling evaporator) with a single-phase air forced convection heat dissipation technology to dissipate heat, but because the single-phase air forced convection needs to use fins to enhance heat dissipation and a fan to drive air to flow, the occupied space and the system complexity are increased to some extent, and because of the heat dissipation limitation of single-phase air heat exchange, the heat dissipation capability cannot be further improved.
The prior art adopts pump drive jet boiling technique and immersed liquid cooling technique to replace original traditional cooling scheme: in the pump-driven jet boiling technology, a pump driving loop is arranged, and the heat exchange coefficient and the critical heat flux density of a phase-change heat dissipation system are greatly improved by utilizing the combination of jet heat dissipation and phase-change boiling heat dissipation at a heating surface, but the scheme has the problems that the pump loop system increases the complexity of the system and the power consumption of a pump on one hand, and reduces the reliability of the system on the other hand; the immersion liquid cooling is to immerse the heating electronic element directly in the electronic cooling liquid, thereby realizing the phase change heat dissipation process. Although this solution greatly reduces the space occupation, system complexity and pump power consumption of the heat dissipation system, its limitation is that its heat exchange coefficient and critical heat flux density are not easily increased.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a self-induced jet flow passive boiling heat dissipation strengthening method and a self-induced jet flow passive boiling heat dissipation strengthening device for an immersed liquid cooling system.
The invention is realized by the following technical scheme:
the invention relates to a self-induced jet flow passive boiling heat dissipation strengthening method for an immersed liquid cooling system.
The invention relates to a self-induced jet flow passive boiling heat dissipation strengthening device for realizing the method, which comprises the following steps: the heat capacity chamber, at least one water conservancy diversion passageway and at least one efflux passageway with circuit board contact, wherein: the guide channel and the jet flow channel are used for communicating a working medium cavity pool and a heat accommodating cavity of the immersed liquid cooling system to form a gas phase-guide channel and a liquid phase-jet flow channel, all guide channel outlets, namely channel ports of the guide channel and the working medium cavity pool, are higher than all guide channel inlets, namely channel ports of the guide channel and the heat accommodating cavity, have positive height difference along the gravity direction, and all guide channel outlets, namely channel ports of the jet flow channel and the heat accommodating cavity, are higher than all jet flow channel inlets, namely channel ports of the jet flow channel and the working medium cavity pool, have positive height difference along the gravity direction.
The heat containing cavity wraps the heat source to seal and limit the phase change process at the heat source.
Technical effects
Compared with the prior art, the gas-liquid separation is realized in the phase change process by reasonably arranging the jet flow channel and the flow guide channel, the expansion work of the gas in the phase change process is effectively utilized, the self-induced jet flow without a driving source is realized, and the double advantages of the jet flow boiling heat exchange technology and the immersed liquid cooling technology are obtained on the premise of not increasing additional components and system complexity, so that the speed of improving the data center computing power density is increased, and the heat dissipation problem of electronic equipment under high heat flow density is solved.
Drawings
FIG. 1 is a top view and an isometric view of example 1;
FIG. 2 is a schematic sectional view of example 1;
FIG. 3 is a schematic view of the working state of embodiment 1;
FIG. 4 is a top view and an isometric view of embodiment 2;
FIG. 5 is a schematic sectional view of example 2;
FIG. 6 is a schematic view of the working state of embodiment 2;
FIG. 7 is a top view and an isometric view of example 3
FIG. 8 is a schematic sectional view of example 3;
FIG. 9 is a schematic view showing the operation of embodiment 3;
in the figure: the triangle represents the working medium liquid level; the arrow and letter G indicate the direction of gravity; the heat dissipation strengthening device comprises a heat dissipation strengthening device 1, a heat accommodating cavity 11, a jet flow channel 12, a jet flow channel inlet 121, a jet flow channel outlet 122, a flow guide channel 13, a flow guide channel inlet 131, a flow guide channel outlet 132, a heat source 2, a circuit board 3, a working medium cavity pool 4, a condensing device 5, a liquid phase working medium 6 and a gas phase working medium 7.
Detailed Description
Example 1
The embodiment is directed to a situation that a normal vector of a heat source plane is perpendicular to the gravity direction, namely, a vertical server heat dissipation situation adopted by a conventional immersion type liquid cooling server.
As shown in fig. 1 to 3, the present embodiment relates to a self-induced jet passive boiling heat dissipation enhancing device, including: heat-holding cavity 11, water conservancy diversion passageway 13 and efflux passageway 12 with circuit board 3 contact, wherein: the flow guide channel 13 and the jet flow channel 12 are both arranged on the heat accommodating cavity 11 and communicated with the heat accommodating cavity so as to communicate the working medium cavity pool 4 with the heat accommodating cavity to form a gas phase-flow guide channel and a liquid phase-jet flow channel, thereby forming vertical jet flow aiming at the surface of the heat source 2 and realizing the enhancement of boiling heat dissipation.
The plane shape of the concave part of the heat accommodating cavity 11 is slightly larger than the plane projection shape of the heat source 2, and the plane projection shape is matched with the circuit board 3 to close and limit the phase change process generated at the heat source 2.
The fluidic channel 12 comprises: a circular array of fluidic channels, wherein: the circular array jet flow channel is arranged in the middle of the heat accommodating cavity 11.
The on-way length of the jet flow channel 12 is 1-2 mm.
The guide channel 13 is connected with the upper end of the heat accommodating cavity 11, the guide channel outlet 132 is rectangular, a positive height difference along the gravity direction exists between the guide channel 13 outlet 132 and the guide channel 13 inlet 131, and a positive height difference along the gravity direction exists between the guide channel 13 outlet 132 and the jet channel 12 inlet 121.
The working medium cavity pool 4 is a container cavity pool which can be filled with working medium in the immersed liquid cooling system and enables the working medium to generate phase change heat exchange.
The heat dissipation enhancing device 1 is manufactured by casting, CNC, 3D printing or hot pressing, and preferably is a high-temperature-resistant low-heat-conduction material which can tolerate a liquid-phase working medium 6 and a gas-phase working medium 7, such as plastics: PEEK, PTFE, PI, or PA 66; metals: stainless steel, cast iron or titanium alloy.
The liquid-phase working medium 6 is preferably an insulating electronic cooling liquid, and comprises: HFE7100, R245fa or R1233 zd.
As shown in fig. 3, the above-described device operates by: a condensing device 5 is arranged above the liquid level of the working medium, and the condensing device 5 is a device for condensing a gas-phase working medium 7 into a liquid-phase working medium 6. The device 1 is fixed with the circuit board 3 through a fastener, glue or a buckle mode, so that a closed heat accommodating cavity is formed by the heat accommodating cavity 11 and the circuit board 3 to surround the heat source 2, and the heat source 2 can be a chip bare chip to be radiated or a boiling reinforced heat sink fully contacted with the chip bare chip to be radiated. In order to reduce the contact thermal resistance between the boiling enhanced heat sink and the chip to be radiated, the contact surface can be filled with high-thermal-conductivity thermal interface materials or connected by adopting various welding methods. When the heat source 2 starts to generate heat, the temperature of the heat source is continuously increased to exceed the saturation temperature of the liquid-phase working medium 6 in the working medium cavity pool 4, and then the liquid-phase working medium 6 is subjected to a phase change process from a liquid state to a gas state along with heat absorption, so that a gas-phase working medium 7 is generated. Because the phase change process is limited in the heat-containing cavity, and because of the existence of gravity, the gas phase working medium 7 with lower density tries to move in the direction opposite to the gravity direction. Since the fluid will move by selecting the channel with relatively small resistance, the gas-phase working medium 7 will enter the working medium cavity pool 4 through the diversion channel 13 instead of the jet flow channel 12. Under the dual action of wrapping the liquid-phase working medium 6 caused by the phase change process and the movement of the gas-phase working medium 7 in the diversion channel 13, the liquid-phase working medium 6 in the heat accommodating cavity can be continuously reduced, and under the action of gravity, the liquid-phase working medium 6 in the working medium cavity pool 4 can supplement the working medium in the heat accommodating cavity through the jet flow channel 12, so that the directional circulation of the working medium with the gas-phase-diversion channel and the liquid-phase-jet flow channel is formed, the gas-liquid separation is realized, and the flow resistance of the whole working medium circulation is reduced. Meanwhile, the liquid-phase working medium 6 also forms jet impact on the heat source 2 at the jet flow channel 12, and under the combined action of the two aspects, the boiling heat dissipation is enhanced.
Example 2
The embodiment is directed to a situation that a normal vector of a heat source plane is perpendicular to the gravity direction, namely, a vertical server heat dissipation situation adopted by a conventional immersion type liquid cooling server.
As shown in fig. 4 to 6, the present embodiment relates to a self-induced jet passive boiling heat dissipation enhancing device, which includes: heat-holding cavity 11, water conservancy diversion passageway 13 and efflux passageway 12 with circuit board 3 contact, wherein: the flow guide channel 13 and the jet flow channel 12 are both arranged on the heat accommodating cavity 11 and communicated with the heat accommodating cavity so as to communicate the working medium cavity pool 4 with the heat accommodating cavity to form a gas phase-flow guide channel and a liquid phase-jet flow channel, thereby forming a horizontal jet flow aiming at the surface of the heat source 2 and realizing the enhancement of boiling heat dissipation.
The fluidic channel 12 comprises: a slit fluidic channel, wherein: the slit fluidic channel is connected to the lower end of the thermal cavity 11.
The plane shape of the concave part of the heat accommodating cavity 11 is larger than the plane projection shape of the heat source 2, and the plane projection shape is matched with the circuit board 3 to close and limit the phase change process generated at the heat source 2.
Example 3
The embodiment is directed to a situation that a normal vector of a heat source plane is perpendicular to the gravity direction, namely, a vertical server heat dissipation situation adopted by a conventional immersion type liquid cooling server.
As shown in fig. 7 to 9, the present embodiment relates to a self-induced jet passive boiling heat dissipation enhancing device, which includes: heat-holding cavity 11, water conservancy diversion passageway 13 and efflux passageway 12 with circuit board 3 contact, wherein: the flow guide channel 13 and the jet flow channel 12 are both arranged on the heat accommodating cavity 11 and communicated with the heat accommodating cavity so as to communicate the working medium cavity pool 4 with the heat accommodating cavity to form a gas phase-flow guide channel and a liquid phase-jet flow channel, thereby forming vertical and horizontal double-direction jet flow aiming at the surface of the heat source 2 and realizing the enhancement of boiling heat dissipation.
The fluidic channel 12 comprises: a circular array fluidic channel and a slit fluidic channel, wherein: the circular array jet flow channel is arranged in the middle of the heat accommodating cavity 11, the cross-sectional area of the single circular array jet flow channel is reduced along with the jet flow direction, and the slit jet flow channel is connected with the lower end part of the heat accommodating cavity 11.
The plane shape of the concave part of the heat accommodating cavity 11 is slightly larger than the plane projection shape of the heat source 2, and the plane projection shape is matched with the circuit board 3 to close and limit the phase change process generated at the heat source 2.
The difference between the flow guide channel 12 and the embodiments 1 and 2 is that the flow cross-sectional area of the whole channel is enlarged, so that the flow guide channel is suitable for gas-phase working media generated under the condition of high power, and the loss of the strengthening effect caused by overlarge flow resistance of the gas-phase working media is prevented.
The foregoing embodiments may be modified in many different ways by those skilled in the art without departing from the spirit and scope of the invention, which is defined by the appended claims and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (8)
1. A self-induced jet flow passive boiling heat dissipation strengthening method for an immersed liquid cooling system is characterized in that a heat accommodating cavity which is in circulation with a working medium cavity pool of the immersed liquid cooling system is arranged on a heat source of a circuit board, a flow guide channel and a jet flow channel which are communicated with the heat accommodating cavity are arranged, and working medium circulation is achieved through gravity to achieve heat dissipation jet flow in the vertical and/or horizontal directions on the surface of the heat source.
2. A self-induced jet passive boiling heat dissipation enhancement device for implementing the method of claim 1, comprising: the heat capacity chamber, at least one water conservancy diversion passageway and at least one efflux passageway with circuit board contact, wherein: the guide channel and the jet flow channel connect the working medium cavity pool and the heat accommodating cavity to form a gas phase-guide channel and a liquid phase-jet flow channel, all guide channel outlets, namely channel ports of the guide channel and the working medium cavity pool, which are intersected, are higher than all guide channel inlets, namely channel ports of the guide channel and the heat accommodating cavity are provided with positive height difference along the gravity direction, and all guide channel outlets, namely channel ports of the jet flow channel and the heat accommodating cavity, which are intersected, are higher than all jet flow channel inlets, namely channel ports of the jet flow channel and the working medium cavity pool, which are intersected, are provided with positive height difference along the gravity direction;
the heat containing cavity wraps the heat source to seal and limit the phase change process at the heat source.
3. The passive boiling heat dissipation enhancement device of claim 2, wherein the heat source is a die to be dissipated or a boiling enhancement heatsink in substantial contact with the die to be dissipated.
4. The passive boiling heat dissipation enhancing device of claim 2, wherein the working medium chamber pool is a container type chamber pool capable of being filled with working medium and performing phase change heat exchange on the working medium in the immersed liquid cooling system.
5. The self-induced jet passive boiling heat dissipation enhancement device of claim 2, wherein the heat dissipation enhancement device is fabricated by casting, CNC, 3D printing or hot pressing.
6. The self-induced jet flow passive boiling heat dissipation enhancing device as claimed in claim 2 or 5, wherein the heat dissipation enhancing device is made of a high temperature resistant low heat conduction material resistant to liquid phase working media and gas phase working media.
7. The passive boiling heat dissipation enhancement device of claim 6, wherein the heat dissipation enhancement device is made of PEEK, PTFE, PI, PA66, stainless steel, cast iron or titanium alloy.
8. The passive boiling heat dissipation enhancement device of claim 4, wherein the working medium in the working medium cavity pool is an insulating electronic cooling liquid, comprising: HFE7100, R245fa, R1233zd or deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010279507.0A CN111863740A (en) | 2020-04-10 | 2020-04-10 | Self-induced jet flow passive boiling heat dissipation strengthening method and device for immersed liquid cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010279507.0A CN111863740A (en) | 2020-04-10 | 2020-04-10 | Self-induced jet flow passive boiling heat dissipation strengthening method and device for immersed liquid cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111863740A true CN111863740A (en) | 2020-10-30 |
Family
ID=72985980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010279507.0A Pending CN111863740A (en) | 2020-04-10 | 2020-04-10 | Self-induced jet flow passive boiling heat dissipation strengthening method and device for immersed liquid cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111863740A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543588A (en) * | 2021-06-24 | 2021-10-22 | 西安交通大学 | Jet flow-transverse flow combined immersed heat dissipation device and method |
| CN114578934A (en) * | 2022-04-29 | 2022-06-03 | 苏州浪潮智能科技有限公司 | Server heat dissipation control device and server heat dissipation control method |
| WO2024066546A1 (en) * | 2022-09-28 | 2024-04-04 | 华为数字能源技术有限公司 | Heat dissipation apparatus, power device, and photovoltaic system |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4949164A (en) * | 1987-07-10 | 1990-08-14 | Hitachi, Ltd. | Semiconductor cooling apparatus and cooling method thereof |
| US5270572A (en) * | 1991-06-26 | 1993-12-14 | Hitachi, Ltd. | Liquid impingement cooling module for semiconductor devices |
| CN101874300A (en) * | 2007-11-28 | 2010-10-27 | 株式会社丰田自动织机 | Ebullient cooling unit |
| US20120026745A1 (en) * | 2010-07-30 | 2012-02-02 | Microbase Technology Corp. | Lamp device, cooling system and cooling module |
| CN103824825A (en) * | 2014-02-13 | 2014-05-28 | 中国科学院工程热物理研究所 | Microchannel phase-change heat transfer device |
| CN109216302A (en) * | 2018-06-12 | 2019-01-15 | 上海交通大学 | Reinforcing immersion cooling device with diversion function |
| CN110537257A (en) * | 2017-01-30 | 2019-12-03 | Yasa有限公司 | The cooling arrangement of semiconductor |
-
2020
- 2020-04-10 CN CN202010279507.0A patent/CN111863740A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4949164A (en) * | 1987-07-10 | 1990-08-14 | Hitachi, Ltd. | Semiconductor cooling apparatus and cooling method thereof |
| US5270572A (en) * | 1991-06-26 | 1993-12-14 | Hitachi, Ltd. | Liquid impingement cooling module for semiconductor devices |
| CN101874300A (en) * | 2007-11-28 | 2010-10-27 | 株式会社丰田自动织机 | Ebullient cooling unit |
| US20120026745A1 (en) * | 2010-07-30 | 2012-02-02 | Microbase Technology Corp. | Lamp device, cooling system and cooling module |
| CN103824825A (en) * | 2014-02-13 | 2014-05-28 | 中国科学院工程热物理研究所 | Microchannel phase-change heat transfer device |
| CN110537257A (en) * | 2017-01-30 | 2019-12-03 | Yasa有限公司 | The cooling arrangement of semiconductor |
| CN109216302A (en) * | 2018-06-12 | 2019-01-15 | 上海交通大学 | Reinforcing immersion cooling device with diversion function |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543588A (en) * | 2021-06-24 | 2021-10-22 | 西安交通大学 | Jet flow-transverse flow combined immersed heat dissipation device and method |
| CN114578934A (en) * | 2022-04-29 | 2022-06-03 | 苏州浪潮智能科技有限公司 | Server heat dissipation control device and server heat dissipation control method |
| WO2024066546A1 (en) * | 2022-09-28 | 2024-04-04 | 华为数字能源技术有限公司 | Heat dissipation apparatus, power device, and photovoltaic system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111863740A (en) | Self-induced jet flow passive boiling heat dissipation strengthening method and device for immersed liquid cooling system | |
| CN107567248B (en) | Liquid cooling heat radiator | |
| US8813834B2 (en) | Quick temperature-equlizing heat-dissipating device | |
| WO2010050129A1 (en) | Cooling structure, electronic device, and cooling method | |
| US7143815B2 (en) | Liquid cooling device | |
| US20160330868A1 (en) | Cooling module, water-cooled cooling module and cooling system | |
| TWI436019B (en) | The structure of the heat siphon plate is improved | |
| JP4551261B2 (en) | Cooling jacket | |
| CN102577654A (en) | Heat conveying structure for electronic device | |
| JP2006310363A (en) | Power semiconductor device | |
| US7992625B1 (en) | Fluid-operated heat transfer device | |
| JP2010522996A (en) | Thin thermal diffusion liquid chamber using boiling | |
| US10874034B1 (en) | Pump driven liquid cooling module with tower fins | |
| CN109548363A (en) | A kind of porous media liquid cooling device for cooling, production method and application method | |
| CN113260235A (en) | Immersion cooling system and electronic equipment | |
| CN113013120A (en) | Heat dissipation device and electronic equipment | |
| JP2010080455A (en) | Cooling device and cooling method for electronic equipment | |
| JP5828322B2 (en) | Boiling cooler and electronic equipment using the same | |
| JP2011187523A (en) | Liquid cooling unit | |
| WO2023134141A1 (en) | Computing device and cold plate thereof | |
| CN216357863U (en) | Immersion cooling system and electronic equipment | |
| JP2007081375A (en) | Cooling device | |
| JP2006135275A (en) | Cooler of liquid-cooled cooling device | |
| CN113543600A (en) | Incomplete filling staggered micro-channel heat exchanger | |
| JP3165057U (en) | Heat dissipation device driven by pressure gradient accompanying evaporation and condensation of refrigerant |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201030 |
|
| RJ01 | Rejection of invention patent application after publication |