CN216357863U - Immersion cooling system and electronic equipment - Google Patents
Immersion cooling system and electronic equipment Download PDFInfo
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- CN216357863U CN216357863U CN202121355452.3U CN202121355452U CN216357863U CN 216357863 U CN216357863 U CN 216357863U CN 202121355452 U CN202121355452 U CN 202121355452U CN 216357863 U CN216357863 U CN 216357863U
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Abstract
The application discloses submergence cooling system and electronic equipment, wherein, submergence cooling system includes: a housing hermetically disposed on the heat generating element; the condensation part is covered on the top opening of the shell, a closed space is enclosed by the condensation part, the shell and the heating element and used for containing insulating cooling media, the condensation part is used for condensing the gasified insulating cooling media, and the insulating cooling media are in contact with the heating element and the heating element. The condensation and gasification processes of the insulating cooling medium of the immersion cooling system are in a closed space, the gasified insulating cooling medium does not need to be conveyed to an external far end through a pipeline for condensation, power is not needed, energy consumption is reduced, a system pipeline is simplified, and the risk of leakage is reduced. And condensing element can be used to the heat conduction condensation, dispels the heat through condensing element's outside, can not appear condensing element and leak the problem to airtight space.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to an immersion cooling system.
The utility model also relates to an electronic device comprising an immersion cooling system.
Background
The heating parts of the electronic equipment generate heat during working, a cooling system is needed to be adopted for cooling, and the liquid immersion cooling has a good cooling effect at present aiming at cooling of the electronic equipment with high power consumption and high heat flow density. The existing liquid immersion cooling mode is as follows: the electronic equipment is immersed in the insulating liquid working medium, the circulating water condenser is directly placed in the boiling evaporation cavity above the insulating liquid working medium, the insulating liquid working medium is changed into a gaseous working medium after absorbing heat and changing phase, the gaseous working medium is directly contacted with the circulating water condenser in the boiling evaporation cavity and condensed into a liquid working medium, and the gaseous working medium directly drops back to the insulating liquid working medium below under the action of gravity to continuously absorb heat. However, in the actual use process, the risk that the circulating water in the circulating pipeline of the circulating water condenser leaks into the boiling evaporation cavity and the insulating liquid working medium causes short circuit of the device.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides an immersion cooling system, which can achieve effective cooling and reduce the risk of leakage of the condenser into the liquid working medium.
The utility model also provides electronic equipment comprising the immersion cooling system, so that the risk of the condenser leaking into the liquid working medium can be reduced while the electronic equipment is effectively cooled.
In order to achieve the purpose, the utility model provides the following technical scheme:
an immersion cooling system comprising:
the bottom of the shell is hermetically arranged on the heating element;
the condensation part is covered on the top opening of the shell, the condensation part, the shell and the heating element are enclosed to form a closed space, the closed space is used for containing insulating cooling media, the condensation part is used for condensing the insulating cooling media gasified in the closed space, and the insulating cooling media are in contact with the heating element.
Preferably, in the immersion cooling system, the immersion cooling system further includes a heat sink, and the heat sink is disposed on a side of the condensing part facing away from the enclosed space, and is configured to dissipate heat of the condensing part.
Preferably, in the immersion cooling system, an extension structure extending into the sealed space is provided on a side of the condensing unit facing the sealed space.
Preferably, in the immersion cooling system, the extension structure is one or more of a sheet structure, a column structure, a block structure and a special-shaped structure, and the extension direction of the extension structure is a vertical direction or an oblique direction.
Preferably, in the immersion cooling system described above, the insulating cooling medium in the enclosed space is divided into a liquid portion located in a lower part of the enclosed space and a gaseous portion located in an upper part of the enclosed space.
Preferably, in the immersion cooling system described above, the insulating cooling medium in the enclosed space is divided into a liquid portion located in a lower part of the enclosed space and a gaseous portion located in an upper part of the enclosed space; the extension structure portion extends into the liquid portion.
Preferably, in the immersion cooling system, the material of the condensing part is a material with a high thermal conductivity.
Preferably, in the immersion cooling system, a surface of the condensing part located in the enclosed space is provided with a first microstructure for increasing a condensing area, preventing a continuous liquid film from being formed when the gasified insulating cooling medium condenses, and guiding the condensed insulating cooling medium.
Preferably, in the immersion cooling system, the first microstructure is one or more of a combination of a protrusion, a groove, a channel and a groove.
Preferably, in the immersion cooling system, the radiator is an air-cooled fin radiator or a liquid-cooled plate radiator, and the liquid-cooled plate radiator is made of a material with a high thermal conductivity coefficient.
Preferably, in the immersion cooling system, the condensing part and the radiator are integrally machined or separately combined.
The utility model also provides electronic equipment comprising the heating element and the immersion cooling system.
Preferably, in the electronic device, a surface of the heat-generating component, which is in contact with the insulating cooling medium of the immersion cooling system, is provided with a second microstructure for increasing a contact heat exchange area.
Preferably, in the above electronic device, the second microstructure is one or more of a porous medium structure, a fin, a groove, a tooth, a channel, a protrusion, and a groove.
Compared with the prior art, the utility model has the beneficial effects that at least:
an immersion cooling system comprises a shell, a condensing part and a radiator, wherein the shell is hermetically arranged on a heating element; the condensing part closing cap is in the open-top of casing, and condensing part, casing and heating element enclose into airtight space, and airtight space is used for holding insulating cooling medium, and condensing part is used for condensing the insulating cooling medium of gasification in the airtight space, and insulating cooling medium and heating element contact.
The immersion cooling system is a closed space formed by combining a condensing part, a shell and a heating element device, an insulating cooling medium is contained in the closed space, and the heating element device is immersed in the insulating cooling medium. During operation, the heat of the heating element enables the liquid insulating cooling medium to be gasified, the gasified insulating cooling medium contacts one side surface of the condensing part facing to the closed space, the heat is transferred to the condensing part and then condensed into the liquid insulating cooling medium again, the gasification and condensation are continuously circulated, the heat of the heating element is transferred to the condensing part, and the condensing part transfers the heat to the outside to dissipate the heat so as to keep the condensing part to continuously condense the gasified insulating cooling medium. Therefore, the insulating cooling medium condensation and gasification processes of the immersion cooling system are in a closed space, the gasified insulating cooling medium does not need to be conveyed to an external far end through a pipeline for condensation, the circulation of gasification and condensation is not needed to be realized by any external power, the energy consumption of the system is reduced, the system pipeline is simplified, and the leakage risk is reduced. And condensing element can be used to the heat conduction condensation, dispels the heat through condensing element's the outside, can not appear condensing element and leak the problem to airtight space.
The electronic equipment provided by the utility model comprises the heating component and the immersion cooling system, and the immersion cooling system can only cool the heating component with large heat productivity of the electronic equipment and does not cool other electronic components of the electronic equipment, so that the consumption of the insulating cooling medium in the immersion cooling system can be reduced, the cost is reduced, and the problem of compatibility between other electronic components in the electronic equipment and the liquid insulating cooling medium is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an immersion cooling system according to an embodiment of the present invention.
Wherein, 1 is a radiator, 2 is a condensing part, 21 is an extension structure, 3 is a shell, 31 is a closed space, 4 is a heating component, 5 is a liquid surface, 6 is a liquid part, 7 is a gas part, 8 is a bubble, and 9 is a liquid bead.
Detailed Description
The utility model provides an immersion cooling system which can effectively cool a high-power and high-heat-density heating component and can reduce the risk that a condenser leaks into a liquid working medium.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides an immersion cooling system, including a housing 3 and a condensing part 2, where the top of the housing 3 may be provided with an opening, and the bottom or the side of the housing 3 is hermetically disposed on a heat-generating component 4, as long as the height of the heat-generating component in the vertical direction is lower than that of the condensing part 2, that is, an insulating cooling medium may be gasified upward; the condensing part 2 is covered on the top opening of the shell 3, the condensing part 2, the shell 3 and the heating element 4 enclose a closed space 31, the heating element 4 is arranged in the closed space 31, the closed space 31 is used for containing an insulating cooling medium, the condensing part 2 can be used for condensing the gasified insulating cooling medium in the closed space 31, and the insulating cooling medium is in contact with the heating element 4. Wherein the insulating cooling medium can be injected into the sealed space 31 through an inlet provided on the housing 3 and discharged out of the sealed space 31 through an outlet provided on the housing 3. Before the condensation part 2 is fitted to the top opening of the casing 3, the casing 3 may be filled with an insulating cooling medium and the condensation part 2 may be covered.
The heat generating component 4 may be a high-power, high-heat-density heat generating component, such as a chip.
The immersion cooling system is characterized in that a closed space 31 is formed by combining the condensing part 2, the shell 3 and the heating element 4, an insulating cooling medium is contained in the closed space 31, and the heating element 4 is immersed in the insulating cooling medium. The housing 3 may be cylindrical. During operation, the heat of heating element 4 makes liquid insulating cooling medium gasification, and gasified insulating cooling medium contacts the lateral surface of condensing part 2 towards confined space 31, and the condensation becomes liquid insulating cooling medium again after giving condensing part 2 with the heat transfer, so constantly carry out the circulation of gasification and condensation, give condensing part 2 with the heat transfer of heating element 4, and condensing part 2 is with the heat outside transmission, dispels the heat to keep condensing part 2 to continue the gasified insulating cooling medium of condensation.
Therefore, the condensation and gasification processes of the insulating cooling medium of the immersion cooling system are in the closed space 31, the gasified insulating cooling medium does not need to be conveyed to the external far end through a pipeline for condensation, the circulation of the gasification and condensation is not needed to be realized by any external power, the energy consumption of the system is reduced, the pipeline of the system is simplified, and the leakage risk is reduced. And condensing unit 2 can be used to the heat conduction condensation, dispels the heat through condensing unit 2, the problem that condensing unit 2 takes place to leak to confined space 31 can not appear.
Further, in the present embodiment, the immersion cooling system further includes a heat sink 1, and the heat sink 1 is disposed on a side of the condensation part 2 facing away from the enclosed space 31, and is used for dissipating heat from the condensation part 2. After the heat of the heating component 4 is transferred to the condensing part 2, the condensing part 2 transfers the heat to the radiator 1 positioned outside the condensing part 2, and the condensing part 2 is cooled by the radiator 1, so that the heat dissipation effect of the condensing part 2 is improved.
In the present embodiment, the extension structure 21 extending into the sealed space 31 is provided on the side of the condensing member 2 facing the sealed space 31. This extension structure 21 has increased condensing element 2's condensation area, and can shorten the distance that gasified insulating cooling medium moved up from confined space 31 bottom for gasified insulating cooling medium contacts the condensation with the extension structure 21 of condensing element 2 as soon as possible, shortens the cycle of gasification, condensation cycle, accelerates heating element 4's cooling rate.
Preferably, in the present embodiment, the extension structure 21 is one or more of a sheet structure, a column structure, a block structure, and a special-shaped structure. Specifically, the extension structure 21 is a fin structure, and the shape of the fin structure may be any one or a combination of irregular special-shaped structures such as a rectangular sheet, a rectangular column, a polygonal column, a cylinder, a corrugated sheet, a corrugated column, a tooth forming structure, a groove shape, and an S shape. The number of the fin structures is preferably plural, and the fin structures are arranged side by side, as long as the condensation area of the condensation member 2 on the side located in the closed space 31 can be increased, and the fin structures are not limited to the structure form exemplified in the embodiment.
In the present embodiment, the extending direction of the extending structure 21 may be along the vertical direction or inclined to the vertical direction as long as the condensing area of the side of the condensing part 2 located inside the closed space 31 can be increased.
Further, in the present embodiment, the insulating cooling medium in the closed space 31 is divided into the liquid portion 6 located in the lower part of the closed space 31 and the gaseous portion 7 located in the upper part of the closed space 31. That is, the sealed space 31 is not filled with the liquid insulating cooling medium, but is filled with only a part of the liquid insulating cooling medium, a gas-liquid interface is formed in the sealed space 31, the gas portion 7 is located above the gas-liquid interface, the liquid portion 6 is located below the gas-liquid interface, and the heat-generating component 4 is completely immersed in the liquid portion 6. With this arrangement, when the heating element 4 is operated to generate heat, the liquid portion 6 absorbs heat to increase in temperature and undergoes phase change boiling to generate the bubble 8, and the bubble 8 moves toward the liquid surface 5 by buoyancy after separating from the heating element 4. A part of the bubbles 8 is condensed by the liquid part 6 before reaching the liquid surface 5, and another part of the bubbles 8, after reaching the liquid surface 5, diffuses to the gaseous part 7, contacts the condenser 2 in the gaseous part 7 and condenses to form liquid beads 9, which drop back to the liquid part 6 under the action of gravity. With the liquid insulating cooling medium of part of the intussuseption in confined space 31, for the gasification of liquid insulating cooling medium provides gaseous accommodation space, make bubble 8 and liquid insulating cooling medium quickly separating, come-up to gaseous state part 7 for the quick contact condensation of gaseous insulating cooling medium and condenser 2 has increased gaseous flow region, has increased the condensation area, has improved condensation efficiency.
Of course, the enclosed space 31 may be filled with a liquid insulating cooling medium, one side of the condensing part 2 located in the enclosed space 31 is in complete contact with the liquid insulating cooling medium, the vaporized insulating cooling medium forms the bubbles 8, the bubbles condense in the liquid insulating cooling medium and directly condense after contacting the surface of the condensing part 2, and one side of the condensing part 2 located in the enclosed space 31 may also be in direct contact with the liquid insulating cooling medium to cool the liquid insulating cooling medium, so as to reduce the temperature of the liquid insulating cooling medium, and the bubbles 8 condense through the liquid insulating cooling medium.
In the case where the insulating cooling medium is divided into the liquid part 6 and the gaseous part 7, if the condensation part 2 is provided with the extension structure 21, the extension structure 21 may extend to the inside of the liquid part 6, or may extend only to the inside of the gaseous part 7 without extending to the inside of the liquid part 6. Preferably, extend extension structure 21 to inside liquid part 6, because condensing part 2 has the heat conduction effect, consequently, extension structure 21 inserts liquid part 6, can carry out direct cooling to liquid part 6 through extension structure 21 for the temperature of liquid part 6 is lower, consequently, after the insulating cooling medium of liquid near heating element 4 is heated the gasification and forms bubble 8, can be in the in-process of come-up, through the liquid part 6 rapid condensation of lower temperature, become liquid, further improve cooling rate. At the same time, the gas bubbles 8 can also contact the extension structure 21 extending into the liquid part 6 as early as possible, allowing condensation and return to the liquid state. The extension structure 21 is immersed in the liquid portion 6, on the one hand directly contacting and condensing a portion of the bubbles 8 located in the liquid portion 6, and on the other hand cooling the liquid portion 6, lowering the temperature of the liquid portion 6, condensing the bubbles 8 by means of the liquid portion 6; the extension structure 21, which is not submerged in the liquid part 6, i.e. in the gaseous part 7, serves to condense the gaseous insulating cooling medium of the gaseous part.
Of course, if the extension structure 21 extends only into the gaseous portion 7, most of the bubbles 8 may float up into the gaseous portion 7 and then contact the extension structure 21 for condensation, rather than extending the extension structure 21 into the liquid portion 6.
In this embodiment, the material of the condensation component 2 is a material with a high thermal conductivity coefficient, and specifically, the material of the condensation component 2 may be any one or a combination of multiple materials of red copper, oxygen-free copper, aluminum alloy, stainless steel, and a high thermal conductivity composite material. The material having a high thermal conductivity may be used, and is not limited to the material listed in the present embodiment.
Further, in the present embodiment, the surface of the condensing part 2 located in the enclosed space 31 is provided with a first microstructure for increasing the condensing area, preventing the vaporized insulating cooling medium from forming a continuous liquid film when condensed, and guiding the condensed insulating cooling medium. The condensation area of the condensation part 2 is increased by the extension structure 21, and then further increased by the first microstructure. And after the vaporized insulating cooling medium is condensed on the surface of the condensing part 2, if the surface is smooth, a continuous liquid film is easily formed, so that the subsequent contact condensation of the vaporized insulating cooling medium and the condensing part 2 is prevented, and in order to make the condensed insulating cooling medium, namely, liquid beads, fall back to the liquid part 6 quickly by means of gravity. The present embodiment can further increase the condensation area by providing the first microstructure on the surface of the condensation part 2, prevent the formation of a continuous liquid film, and guide the liquid bead 9 to quickly fall back to the liquid part 6.
Specifically, in the present embodiment, the first microstructure is one or more combinations of protrusions, grooves, channels, and grooves. The sizes of the structures are smaller, and specifically can be millimeter-sized or micron-sized. The flow guide directions of the grooves, the channels and the grooves are along the vertical direction, and the liquid beads cannot form a continuous liquid film or can obstruct the formation of the continuous liquid film under the action of self tension through the structures. Of course, the first microstructure may also be other structures, and is not limited to the structure form listed in this embodiment.
As an optimization, in the present embodiment, the processing manner of the first microstructure on the surface of the condensation part 2 may be any one or more combination of numerical control processing, etching, laser etching, electrochemical deposition, and high-temperature sintering.
In this embodiment, the radiator 1 is an air-cooled fin radiator or a liquid-cooled plate radiator, wherein the liquid-cooled plate radiator is made of a material with a high thermal conductivity coefficient. Specifically, the material may be any one or combination of red copper, oxygen-free copper, aluminum material and stainless steel. The material having a high thermal conductivity may be used, and is not limited to the material listed in the present embodiment.
In this embodiment, the liquid working medium in the liquid cooling plate heat exchanger may be any one or a combination of water, deionized water, ethylene glycol, and fluorinated liquid.
Further, in the present embodiment, the condensation part 2 and the heat sink 1 are integrally formed, so that the thermal contact resistance between the two is eliminated, and the heat transfer performance is further improved. Of course, the condensing part 2 and the heat sink 1 may be assembled after being separately processed, and may be specifically detachably mounted, or welded, or adhesively fixed.
In this embodiment, the liquid insulating cooling medium may be any one or more of fluorinated liquid (e.g., FC-72, Novec7100, Novec 7200, etc.), alcohol, ethylene glycol, deionized water, and nanofluid.
In the present embodiment, the position of the liquid surface 5 of the liquid insulating and condensing medium can be determined by the amount of heat dissipated from the heat generating component 4 and the characteristics of the condensing member 2 and the available space.
Based on the immersion cooling system described in any of the above embodiments, an embodiment of the present invention further provides an electronic device, which includes the heat-generating component 4, and further includes the immersion cooling system described in any of the above embodiments.
The electronic equipment cools the heating element 4 in the electronic equipment through the immersion cooling system, and does not cool other electronic elements, so that the consumption of insulating cooling media in the immersion cooling system can be reduced, the cost is reduced, and the problem of compatibility between other electronic elements in the electronic equipment and liquid insulating cooling media is solved.
Further, in this embodiment, the surface of the heat generating component 4 that is in contact with the liquid insulating cooling medium of the immersion cooling system is provided with a second microstructure for increasing the contact heat exchange area.
Specifically, the second microstructure is one or a combination of a porous medium structure, a fin, a groove, a tooth, a channel, a protrusion, and a groove, and the size of the second microstructure is millimeter or micron, as long as the contact heat exchange area can be increased, and the second microstructure is not limited to the structural form listed in this embodiment.
In this embodiment, the electronic device may be a server, the heating element may be a chip, and the chip is the heating element 4 with high power density, so that by using the immersion cooling system in the present application, not only is the problem of compatibility between some electronic elements and insulating cooling media on the server or the PCB solved, but also the usage amount of the insulating cooling media is greatly reduced, and the cost is reduced.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. An immersion cooling system, comprising:
the shell is hermetically arranged on the heating component;
the condensation part is covered on the top opening of the shell, a closed space is enclosed by the condensation part, the shell and the heating element and used for containing an insulating cooling medium, the condensation part is used for condensing the insulating cooling medium gasified in the closed space, and the insulating cooling medium is in contact with the heating element and used for heating the heating element.
2. The immersion cooling system as claimed in claim 1, further comprising a heat sink disposed on a side of the condensing part facing away from the enclosed space for dissipating heat from the condensing part.
3. The immersion cooling system as claimed in claim 1, wherein a side of the condensing part facing the enclosed space is provided with an extension structure extending into the enclosed space; the heating element is hermetically arranged at the bottom or the side of the shell.
4. The immersion cooling system as claimed in claim 3, wherein the extension structure is one or more of a sheet structure, a column structure, a block structure, and a profile structure, and the extension direction of the extension structure is a vertical direction or an oblique direction to the vertical direction.
5. An immersion cooling system according to any one of claims 1-4, wherein the insulating cooling medium in the enclosed space is divided into a liquid part in a lower part of the enclosed space and a gaseous part in an upper part of the enclosed space.
6. An immersion cooling system according to claim 3 or 4, wherein the insulating cooling medium in the enclosed space is divided into a liquid part in a lower part of the enclosed space and a gaseous part in an upper part of the enclosed space; the extension structure portion extends into the liquid portion.
7. An immersion cooling system according to any one of claims 1 to 4, wherein the condensation member is of a material having a high thermal conductivity.
8. An immersion cooling system as claimed in any one of claims 1 to 4, wherein a surface of the condensing part within the enclosed space is provided with a first microstructure for increasing a condensing area, preventing a continuous liquid film from being formed when the vaporized insulating cooling medium condenses, and guiding the condensed insulating cooling medium; the first microstructure is one or more combination of bulges, grooves, channels and grooves.
9. An electronic device comprising a heat-generating component, further comprising the immersion cooling system of any one of claims 1-8.
10. The electronic device according to claim 9, wherein a surface of the heat generating component in contact with the insulating cooling medium of the immersion cooling system is provided with a second microstructure for increasing a contact heat exchange area.
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| CN202121355452.3U CN216357863U (en) | 2021-06-17 | 2021-06-17 | Immersion cooling system and electronic equipment |
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| CN202121355452.3U CN216357863U (en) | 2021-06-17 | 2021-06-17 | Immersion cooling system and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113260235A (en) * | 2021-06-17 | 2021-08-13 | 深圳市英维克科技股份有限公司 | Immersion cooling system and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113260235A (en) * | 2021-06-17 | 2021-08-13 | 深圳市英维克科技股份有限公司 | Immersion cooling system and electronic equipment |
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