CN216905720U - Cooling device and electronic equipment - Google Patents

Abstract

The present disclosure relates to a cooling device and electronic equipment; the cooling device includes: a condensing part and a sealing part, wherein the sealing part can accommodate a cooling liquid, and the cooling liquid can submerge a circuit board installed with a heating element; the condensing part includes a condensing pipe and The air cooling structure is used to dissipate heat to the condenser pipe; the condenser pipe is communicated with the sealing part; the air cooling structure is arranged on at least one side of the condenser pipe. In this way, the present disclosure can effectively reduce the working temperature of the chip by adopting the phase change heat, and does not need to design and arrange an additional liquid cooling structure, thereby reducing the design complexity and saving the internal space of the electronic device.

Description

A cooling device and electronic equipment

technical field

The present disclosure relates to, but is not limited to, the technical field of heat sinks, and in particular, to a cooling device and electronic equipment.

Background technique

With the increasing power of electronic equipment, the heat dissipation of key components has gradually become a technical bottleneck for various manufacturers. The heat dissipation problem directly affects the life and power consumption of electronic equipment. At present, the commonly used consumer electronic equipment mostly uses natural heat dissipation or forced heat dissipation. For air-cooled heat dissipation, some data centers are equipped with water-cooled heat-dissipating devices. However, due to the arrangement of many heating elements on the circuit board and the continuous increase of heat flow density, the temperature uniformity of electronic components has become a new issue.

In the related art, additional external components are usually used when setting up liquid-cooling heat dissipation devices. For example, liquid-cooling related devices are arranged on the periphery of pumps, which are independent of the current internal heat dissipation mechanism of electronic equipment. Larger space, higher reliability and higher cost.

In view of the problem that the design complexity and volume size of solving the heat dissipation problem of electronic equipment in the related art are far greater than the actual application requirements, no effective solution has been proposed yet.

Utility model content

The present disclosure provides a cooling device and an electronic device, so as to reduce the design complexity and save the internal space of the electronic device.

According to a first aspect of the embodiments of the present disclosure, there is provided a cooling device, comprising: a condensing part and a sealing part, wherein the sealing part can accommodate a cooling liquid, and the cooling liquid can submerge a circuit board mounted with a heating element; the condensing part includes a condensing part A pipe and an air-cooling structure for dissipating heat to the condenser pipe; the condenser pipe is communicated with the sealing part; and the air-cooling structure is arranged on at least one side of the condenser pipe.

In the above solution, the condenser tube is a flat metal tube; or, a capillary structure is arranged in the condenser tube.

In the above solution, the outer wall of the condenser tube is provided with a plurality of fins.

In the above solution, the condensation part further comprises: a first casing, the first casing encloses a first accommodating cavity, and the condensation pipe is accommodated in the first accommodating cavity.

In the above solution, the air cooling structure includes a heat dissipation hole, and the heat dissipation hole is opened on the side wall of the first casing.

In the above solution, the first housing further includes a cooling air duct, wherein the cooling air duct is accommodated in the first accommodating cavity, the cooling air duct is distributed according to the position of the condenser pipe, and the cooling air duct communicates with the cooling hole.

In the above solution, the air cooling structure includes a cooling fan.

In the above solution, when the air cooling structure includes a cooling fan, the cooling device further includes: a first power supply, and the first power supply is connected to the cooling fan.

In the above solution, when the air cooling structure includes a cooling fan, the cooling device further includes: a first control circuit, and the first control circuit is connected to the cooling fan.

In the above solution, the sealing part includes a second casing, and the second casing encloses a second accommodating cavity; the condensing cavity of the condenser tube communicates with the second accommodating cavity.

In the above scheme, the second shell includes: a cover plate, a bottom plate and a side plate; wherein, the cover plate is provided with a through hole, and the condensation pipe is arranged at the through hole; the cover plate, the bottom plate, the side plate and the condensation pipe form a sealed space .

According to a second aspect of the embodiments of the present disclosure, there is provided an electronic device, comprising: the above-mentioned cooling device and a circuit board, wherein the circuit board is immersed in the cooling liquid in the sealing portion, and the first surface of the circuit board faces the cooling liquid. Liquid level, the number of heating elements arranged on the first surface is more than the number of heating elements arranged on the second surface of the circuit board, and the first surface is opposite to the second surface.

In the above solution, the included angle between the circuit board and the liquid level of the cooling liquid is a preset angle.

In the above solution, the electronic device further includes: a second power supply connected to the circuit board.

In the above solution, the electronic device further includes: a second control circuit, which is respectively connected to the circuit board and the second power supply.

In the above solution, the electronic device further includes: a third control circuit connected to the circuit board.

The technical solutions provided by the present disclosure may include the following beneficial effects:

In the present disclosure, by accommodating the cooling liquid that can be used to cool the circuit board during operation in the sealing part, after the cooling liquid is vaporized, the cooling liquid is converted from a gaseous state to a liquid state by the condensing part, and returned to the sealing part, so that the cooling liquid can pass through the liquid state. The cold mode and the air cooling mode dissipate the heat of the circuit board during operation, so that the operating temperature of the chip can be effectively reduced by using phase change heat, and since there is no need to separately design and arrange an additional liquid cooling structure, the design complexity is reduced and the cost is saved. Electronic equipment interior space.

It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure.

FIG. 1 shows a schematic diagram of a cooling device provided by an exemplary embodiment;

FIG. 2 shows a schematic diagram of a fin of a condenser tube in a cooling device provided by an exemplary embodiment;

FIG. 3 shows an exploded schematic diagram of a cooling device provided by an exemplary embodiment;

FIG. 4 shows a schematic cross-sectional view of a cooling device provided by an exemplary embodiment;

FIG. 5 shows a schematic diagram of an electronic device provided by an exemplary embodiment;

FIG. 6 shows a schematic diagram of the appearance of an electronic device provided by an exemplary embodiment.

Detailed ways

The embodiments of the present disclosure will be described below with reference to the accompanying drawings in the embodiments of the present disclosure. In the following description, reference is made to the accompanying drawings which form a part of this application and which illustrate, by way of illustration, specific aspects of embodiments of the disclosure or in which specific aspects of embodiments of the disclosure may be used. It is to be understood that the disclosed embodiments may be utilized in other aspects and may include structural or logical changes not depicted in the figures. Therefore, the following detailed description is not to be taken in a limiting sense, and the scope of the application is defined by the appended claims. For example, it should be understood that disclosures in connection with a described method may equally apply to a corresponding apparatus or system for performing the described method, and vice versa. For example, if one or more specific method steps are described, the corresponding apparatus may include one or more units, such as functional units, to perform one or more of the described method steps (eg, one unit performs one or more steps) , or units, each of which performs one or more of the steps), even if such unit or units are not explicitly described or illustrated in the figures. On the other hand, if, for example, a specific apparatus is described based on one or more units, such as functional units, the corresponding method may contain a step to perform the functionality of the one or more units (eg, a step to perform the one or more units) functionality, or steps, each of which performs the functionality of one or more of the plurality of units), even if such one or more steps are not explicitly described or illustrated in the figures. Further, it is to be understood that the features of the various exemplary embodiments and/or aspects described herein may be combined with each other unless expressly stated otherwise.

Example 1

The present disclosure provides a cooling device, which can be installed in an electronic device or externally connected to the electronic device, and is used to dissipate heat from a circuit board mounted with one or more heating elements in the electronic device. Exemplarily, the circuit board may be a computing power board in a computing device, a main board in a service cabinet, or the like.

FIG. 1 shows a schematic diagram of a cooling device provided by an exemplary embodiment. As shown in FIG. 1 , the cooling device may include: a condensation part 12 and a sealing part 14 . Wherein, the sealing portion 14 can accommodate the cooling liquid, and the cooling liquid can submerge the circuit board 20 mounted with the heating element, so as to immerse the circuit board 20 to dissipate heat. The condensing part 12 may include a condensing pipe 121 and an air cooling structure 122 for dissipating heat to the condensing pipe; the condensing pipe 121 is communicated with the sealing part 14 ;

Specifically, as shown in FIG. 1 , the cooling device provided by the embodiment of the present disclosure is composed of a condensation part 12 and a sealing part 14 , wherein the sealing part 14 is used for storing the cooling liquid and the circuit board 20 , and the circuit board 20 is immersed in the cooling liquid , when the circuit board 20 is in the working state, when the components located in the circuit board 20 are heated, the cooling liquid takes away the surface heat of the components, converts the liquid state into the gaseous state in the way of vaporization, and reaches the condensation pipe 121 in the condensing part 12, based on The air-cooling structure 122 is disposed on at least one side of the condenser tube 121 in a positional relationship. The air-cooled structure 122 dissipates heat to the condenser tube 121 , and the vaporized cooling liquid is converted from gaseous state to liquid state in the condenser tube 121 and flows back to the sealing portion 14 .

It should be noted that, in the embodiment of the present disclosure, the circuit board 20 may be a printed circuit board assembly (Printed Circuit Board Assembly, PCBA for short). The PCBA includes the TOP surface (also known as the front surface, that is, the first surface) and the BOT surface (which can also be the reverse surface, that is, the second surface). The number of heating elements set on the TOP surface is more than the number of heating elements set on the BOT surface. the number of components.

In practical applications, the above-mentioned heating elements may be chips with relatively high power such as CPU and GPU.

In the embodiment of the present disclosure, after the cooling liquid is injected into the sealing portion 14, the entire PCBA is immersed in the cooling liquid, and the TOP surface faces the liquid surface of the cooling liquid, which can also be understood as the TOP surface facing upward.

Among them, in the embodiment of the present disclosure, the PCBA can change the shape of a specific part of the circuit board through a hollowing process, so as to promote the rise of the bubbles on the back of the PCBA, or control the inclination angle of the PCBA to promote the rise of the back of the PCBA. The embodiment of the present disclosure only The above description is given as an example, and the implementation of the cooling device provided by the present disclosure shall prevail, which is not specifically limited.

Then, after each component on the PCBA is in working state, with the increase of the power of the heating element, the heating element on the TOP surface generates heat, which causes the cooling liquid to boil locally. The cooling liquid absorbs the heat of the heating element, and takes away the heat of the heating element through vaporization (that is, the cooling liquid changes from liquid to gaseous state), so as to dissipate heat from the heating element, thereby ensuring the stability of the operating temperature of the heating element. Then, the cooling liquid in gaseous state rises from the sealing part 14 to the condensing part 12 and enters the condensing pipe 121 . The air cooling structure 122 dissipates heat from the condenser pipe 121 , so that the temperature of the inlet condenser pipe 121 is lowered to condense the gaseous cooling liquid, so that the cooling liquid changes from gaseous to liquid, and then flows back to the sealing portion 14 . In this way, heat dissipation to the circuit board 20 is achieved through the two-phase circulation of the cooling liquid.

In some possible embodiments, the above-mentioned condenser tubes 121 may be one or more. When there are multiple condensation pipes 121 in the condensation part 12, the setting positions of the condensation pipes 121 can be distributed according to the reserved positions of the sealing part 14, wherein the reserved positions can be set according to the position of each heating element on the PCBA, Therefore, the position of each heating element is targeted and collected effectively after the cooling liquid is vaporized;

Condensing pipes 121 can also be placed in groups with a unit number of condenser pipes 121, and then centralized cooling in groups, so that when heat is dissipated through the air cooling structure 122, heat dissipation can be targeted.

In a preferred embodiment, in the embodiment of the present disclosure, the condenser tube 121 may be a flat metal tube; or, a capillary structure is provided in the condenser tube 121 . It can be understood that the condensation cavity of the condensation pipe 121 has a hollow structure, wherein the hollow structure includes a flat hollow shape or a capillary structure.

Specifically, the condensation chamber of each condensation tube 121 can be used to collect the vaporized cooling liquid, and condense the vaporized cooling liquid from a gaseous state to a liquid state. Further, in order to speed up the return of the condensed cooling liquid to the sealing part 14, when the condenser tube 121 is a metal flat tube, the cross-sectional area of the flat tube will be much larger than that of the cylindrical tube, and based on the thermal conductivity of metal, when When the condensing pipe 121 is a flat metal pipe, according to the thermal conductivity of the metal and increasing the heat dissipation area of the condensing pipe 121, the conversion of the cooling liquid from a gaseous state to a liquid state is accelerated to realize a two-phase circulation; Processed by casting, etc.

Alternatively, in order to speed up the return of the condensed cooling liquid to the sealing part 14 , a capillary structure may be provided in the condensation pipe 121 , so that the condensed cooling liquid is less attached to the inner wall of the condensation pipe 121 and flows back to the sealing part 14 along the capillary structure. Wherein, the capillary structure may be formed by processing the inside of the condenser tube 121, and the capillary structure at least includes at least one groove opened on the inner wall of the condenser tube 121. Exemplarily, the shape of the groove on the inner wall of the condenser tube 121 may be along the inner wall. The upward spiral pattern. Based on the capillary structure, the liquid return capacity of the cooling liquid in the condenser tube 121 can be improved.

In a preferred embodiment, in the embodiment of the present disclosure, the outer wall of the condensation pipe 121 is provided with a plurality of fins.

Specifically, the outer wall of the condenser tube 121 is provided with a plurality of fins 1211, including at least two implementations, that is, the outer wall of the condenser tube is machined to form a plurality of fins on the outer wall of the condenser tube 121, or, A plurality of fins are distributed on the outer surface of the condenser tube 121 by fixing methods such as socket connection, welding or sticking. Since the provision of multiple fins increases the heat dissipation area of the condenser tube 121 , the condenser tube 121 can accelerate the completion of the two-phase circulation of the cooling liquid when condensing the gaseous cooling liquid, thereby improving the heat dissipation efficiency of the circuit board 20 during operation.

Wherein, FIG. 2 shows a schematic diagram of the fins of the condenser tubes in the cooling device provided by an exemplary embodiment. As shown in FIG. 2 , in the embodiment of the present disclosure, the outer wall of the condensation tube 121 is provided with a plurality of fins, wherein each fin is arranged in parallel, and is arranged from the bottom to the top from the bottom of the condensation tube 121 . It should be noted that FIG. 2 only shows the structure of one condenser tube 121 , and the structure of each condenser tube may be the same in the embodiment of the present disclosure.

In some possible implementations, the cooling device provided by the embodiment of the present disclosure is shown in FIG. 3 , which shows an exploded schematic diagram of the cooling device provided by an exemplary embodiment.

In the embodiment of the present disclosure, the condensing part 12 further includes: a first housing 123, the first housing 123 encloses a first accommodating cavity, and the condensing pipe 121 is accommodated in the first accommodating cavity.

As shown in FIG. 3 , the space formed by the first casing 123 of the condensing part 12 can be referred to as a first accommodating cavity, and the condenser pipe 121 and the air cooling structure 122 are both arranged on the first casing, and the condenser pipe 121 is arranged in the first accommodating cavity.

It should be noted that, the implementation manners of the embodiment of the present disclosure in the process of heat dissipation and temperature reduction of the condensation pipe 121 include at least the following three:

Method 1: Natural wind heat dissipation.

In a preferred embodiment, the air cooling structure 122 includes a heat dissipation hole 1221 , and the heat dissipation hole 1221 is opened on the side wall of the first casing 123 .

As shown in FIG. 3 , the heat dissipation holes 1221 are located on the side wall of the first housing 123 , and are used to introduce outside air (or cold air introduced by an external device) into the first accommodating cavity, so as to realize the natural wind to dissipate heat to the condensation pipe 121 .

In the embodiment of the present disclosure, the first housing 123 further includes a heat dissipation air duct, wherein the heat dissipation air duct is accommodated in the first accommodating cavity, the heat dissipation air duct is distributed according to the position of the condenser pipe 121 , the heat dissipation air duct and the heat dissipation hole 1221 Connected.

Wherein, in the case of not adding any forced air-cooling refrigeration equipment, by opening a cooling air duct in the first housing 123, the cooling air duct located in the first accommodating cavity can have a cooling effect according to the position of each condensing pipe 121. The objective is to introduce the air introduced from the heat dissipation holes 1221 into the position where each condenser pipe 121 is located, so as to realize the effective heat dissipation of the surface of the condenser pipe 121 by natural wind.

Method 2: Cooling fan for cooling.

In a preferred embodiment, the air cooling structure 122 includes a cooling fan 1222 ; wherein the cooling fan 1222 is installed on at least one side of the condensation pipe 121 .

Specifically, as shown in FIG. 3 , the connection structure between the cooling fan 1222 and other components of the condensing part 12 is as follows: the cooling fan 1222 is located on one side of the condensation pipe 121 , and the number of cooling holes 1221 is set according to the number of cooling fans 1222 . The flowing air generated by the operation of the cooling fan 1222 can dissipate heat to the condensing pipe 121 , improve the condensation efficiency of the cooling liquid, and accelerate the two-phase circulation of the cooling liquid.

The number of cooling fans 1222 is not limited in the embodiment of the present disclosure, and the number of cooling fans 1222 can be increased or decreased according to cooling requirements; According to the operating temperature of the PCBA, the number of turned-on cooling fans (or the number of turned-off cooling fans) is adjusted according to the control signal, so as to meet the cooling requirements of the PCBA in real time; the embodiment of the present disclosure only takes the above as an example for description, in order to achieve The cooling device provided in the present disclosure shall prevail, and is not specifically limited.

In addition, it should be noted that in the implementation manner of the embodiment of the present disclosure, the disposition of the cooling fan 1222 further includes: on the premise that the first housing 123 is not present, the cooling fan 1222 is arranged on one side of the condensation pipe 121 . , the condensing pipe 121 and the cooling fan 1222 are not wrapped by any casing. When the cooling fan 1222 is running, the condensing pipe 121 is in direct contact with the outside air, which increases the cooling space, improves the condensation efficiency of the cooling liquid, and accelerates the two-phase cooling of the cooling liquid. cycle.

Further, based on the connection structure between the cooling fan 1222 and the condensing pipe 121, the cooling fan 1222 cools the condensing pipe 121 and the fins, the gaseous cooling liquid is re-liquefied, and returns to the sealing part 14 under the action of gravity, thereby realizing the present disclosure Phase change cooling of the cooling device provided in the embodiment.

Wherein, when the air cooling structure 122 includes a cooling fan 1222 , the cooling device provided by the embodiment of the present disclosure further includes: a first power supply 13 connected to the cooling fan 1222 .

When the air-cooling structure 122 includes a cooling fan 1222 , the cooling device provided by the embodiment of the present disclosure further includes: a first control circuit 15 , and the first control circuit 15 is connected to the cooling fan 1222 .

Specifically, in the embodiment of the present disclosure, the first power supply 13 is connected to the cooling fan 1222, and the structure of the connection between the first control circuit 15 and the cooling fan 1222 is not shown in FIG. 3. In FIG. 3, the first power supply 13 is used for Power is supplied to the cooling fan 1222, and the first control circuit 15 is used to control the operation of the cooling fan 1222, wherein, controlling the operation of the cooling fan 1222 may include: controlling the cooling fan 1222 to be turned on or off, controlling the operating speed of the cooling fan 1222, or controlling the cooling fan 1222 At least one or a combination of the rotation directions of the fan blades.

Method 3: The combination of method 1 and method 2.

When the first casing 123 is provided with the heat dissipation holes 1221, the heat dissipation fan 1222 is matched with the heat dissipation holes 1221, and the heat dissipation fan 1222 is connected with the heat dissipation air duct. The operation of the heat dissipation fan 1222 accelerates the introduction of the outside air into the first casing. In the body 123, the accelerated air is transferred to each condensation pipe 121 through the cooling air duct according to the setting of the cooling air duct, so as to improve the condensation efficiency of the cooling liquid and accelerate the two-phase circulation of the cooling liquid.

In a preferred embodiment, the sealing part 14 includes a second housing 141, and the second housing 141 encloses a second accommodating cavity; the condensing cavity of the condensation pipe 121 communicates with the second accommodating cavity.

Among them, as shown in FIG. 3 , the meaning of the communication between the condensation cavity of the condensation pipe 121 and the second accommodation cavity is that the cooling liquid in the gaseous state in the condensation pipe 121 is condensed to form a liquid cooling liquid, which passes through the condensation pipe 121 and the second accommodating cavity. With the structure in which the accommodating chambers are connected, the liquid cooling liquid in the condensing chamber of the condenser pipe 121 can be returned to the second accommodating chamber to realize the two-phase circulation of the cooling liquid.

The second housing 141 includes: a cover plate 1411, a bottom plate 1412 and a side plate 1413; wherein, a through hole is formed on the cover plate 1411, and the condenser pipe 121 is arranged at the through hole; the cover plate 1411, the bottom plate 1412, and the side plate 1413 A sealed space is formed with the condenser pipe 121 .

Specifically, in the embodiment of the present disclosure, the condenser tube 121 is fixed on the cover plate 1411 by friction welding, brazing, or gluing. The equal sealing methods together constitute a sealing structure, wherein the condenser tube 121 communicates with the interior of the sealing cavity.

In addition, in the embodiment of the present disclosure, the condenser tube 121 may also be connected to the sealing cavity by mechanical connection and a sealing ring.

In an embodiment of the present disclosure, FIG. 4 shows a schematic cross-sectional view of a cooling device provided by an exemplary embodiment. As shown in FIG. 4 , the cross-sectional schematic diagram of the cooling device provided by the embodiment of the present disclosure shows the condensation pipe 121 , the first power supply 13 , the first control circuit 15 and the cooling fan 1222 , wherein the condensation pipe 121 and the cooling fan 1222 are overlapped The shaded part is the fin of the condenser tube 121 .

It should be noted that, the cooling device provided by the embodiment of the present disclosure is only described by taking the above example as an example, and the implementation of the cooling device provided by the embodiment of the present disclosure shall prevail, which is not specifically limited.

The cooling device provided by the embodiment of the present disclosure is designed with an air-liquid integrated independent chassis, and the circuit board 20 and the heating element are immersed in the cooling liquid, and the heat of the heating element is taken away by the boiling of the cooling liquid, thereby ensuring the operation of the heating element. The temperature is always within a safe range, so as to achieve cooling and temperature uniformity of the heating element; through the integrated air-cooled heat exchange part (condensing part 12 and sealing part 14), the phase change liquid is directly cooled to achieve short cooling distance and high heat exchange efficiency. ;The integrated design is flexible and suitable for independent transportation and work. Cluster applications can directly replace the current air-cooled products to adapt to various application scenarios of air-cooled deployment. Compared with liquid-cooled products, its integrated design has no pump and no pipeline, and the overall design More compact and convenient.

In addition, compared with the currently widely used air cooling and water cooling, the cooling device provided by the embodiment of the present disclosure can effectively reduce the working temperature of the heating element by adopting the phase change heat, improve the temperature uniformity, and reduce the energy consumption of the system; The efficient cooling of phase change heat reduces the volume of air cooling, and the integrated design removes the complicated accessories of water cooling. And, by using the condenser pipe structure provided by the embodiments of the present disclosure, heat dissipation of a high-power system can be realized, the processing method is simple, and the cost is lower than that of VC, gravity heat pipe, and the like.

Example 2

The present disclosure provides an electronic device as shown in FIG. 5 , which shows a schematic diagram of the electronic device provided by an exemplary embodiment.

An embodiment of the present disclosure provides an electronic device, which specifically includes: a cooling device 52 and a circuit board 54 as in Embodiment 1, wherein the circuit board 54 is immersed in the cooling liquid in the sealing part, and the first surface of the circuit board 54 faces For the liquid level of the cooling liquid, the number of heating elements arranged on the first surface is greater than the number of heating elements arranged on the second surface of the circuit board 54 , and the first surface is opposite to the second surface.

The electronic device provided by the embodiment of the present disclosure may be a computing device with high computing power and high chip energy consumption, such as a server, a server cluster, or a computer. For the structure of the cooling device 52, reference may be made to the description of the cooling device in the above-mentioned Embodiment 1, which is not repeated here.

In the embodiment of the present disclosure, the first surface of the circuit board 54 may be the TOP surface of the circuit board 54 , and the second surface may be the BOT surface of the circuit board 54 . The TOP side is equivalent to the front side of the circuit board, and the BOT side is equivalent to the reverse side of the circuit board. The TOP side and the BOT side are matched. The difference between the two is: ), and there are fewer components on the BOT surface; therefore, the TOP surface is set up so that the cooling liquid can completely immerse the surface, and in the process of two-phase circulation of the cooling liquid, the heat of the heating elements on the TOP surface is accelerated to realize the circuit board. 54 for the purpose of heat dissipation.

Specifically, the circuit board 54 is completely immersed in the cooling liquid. When the electronic device is running, when the temperature of the heating element (such as the chip) exceeds the boiling point of the liquid, the cooling liquid is partially boiled in the area near the chip, and the heat of the chip is taken away by the surface liquid vaporization. When the equipment runs stably, the system reaches the heat transfer balance, and the heat generated by the chip is continuously taken away through the phase transition, which ensures the stability of the operating temperature of the chip.

It should be noted that, in the embodiment of the present disclosure, the material of the PCBA (ie, the circuit board 54 in the embodiment of the present disclosure) may be FR-4 grade material, aluminum-based material, copper-based material, etc., which is not made in the embodiment of the present disclosure specific restrictions. In addition, the surface of the chip may be a non-thermal expansion surface, or may be a form of increasing thermal expansion surface such as chip surface welding, gluing, deposition, etc., which is only based on the realization of the electronic device provided by the embodiment of the present disclosure, and is not specifically limited.

In the embodiment of the present disclosure, the included angle between the circuit board 54 and the liquid level of the cooling liquid may be a preset angle.

Specifically, the angle between the circuit board 54 and the liquid level of the cooling liquid is set to a preset angle so that the heating element with high power consumption can effectively contact the cooling liquid according to the inclined positional relationship, so that the cooling liquid is more effective during the vaporization process. Take away the heat emitted by the heating element and maintain the normal working state of the heating element.

In a preferred embodiment, the electronic device provided by the embodiment of the present disclosure further includes: a second power supply 56 connected to the circuit board 54 .

Specifically, as shown in FIG. 5 , the second power supply 56 is connected to the circuit board 54 through copper strips, the copper strips pass through the holes opened in the sealing part in the cooling device 52 , and sealant is sealed around the copper strips to complete the copper strips. The hole is sealed, and the second power supply 56 supplies power to the circuit board 54 .

It should be noted that the first power supply in the cooling device 52 and the second power supply 56 may be the same power supply, or two power supply modules in the same power supply that respectively supply power to the circuit board and the cooling fan.

In the embodiment of the present disclosure, the control circuit in the electronic device includes two implementation manners:

Mode 1, the second control circuit 58 is respectively connected to the circuit board 54 and the second power supply 56

In a preferred embodiment, the electronic device provided by the embodiment of the present disclosure further includes: a second control circuit 58 connected to the circuit board 54 and the second power supply 56 respectively.

Specifically, in the embodiment of the present disclosure, the second control circuit 58 is respectively connected to the circuit board 54 and the second power supply 56 for monitoring and controlling the circuit board 54 and obtaining power from the second power supply 56 . Wherein, the second control circuit 58 in the embodiment of the present disclosure may be the first control circuit in the first embodiment, or two different control units on the same integrated control board as the first control circuit.

In an embodiment of the present disclosure, FIG. 6 shows a schematic appearance diagram of an electronic device provided by an exemplary embodiment. As shown in FIG. 6 , the electronic device is composed of a cooling device, a second power supply 56 and a second control circuit 58 , wherein , the circuit board is mounted on the sealing part of the cooling device, the second power supply 56 is arranged below the cooling device, and the second control circuit 58 is located on the right side of the cooling device. The embodiment of the present disclosure only takes the above example as an example to illustrate the realization of the The electronic devices provided in the embodiments of the present disclosure shall prevail, which are not specifically limited.

In addition, the installation position of the second power supply 56 may also be located on the top of the machine and on the left and right sides, which is subject to the implementation of the electronic device provided by the embodiment of the present disclosure, which is not specifically limited.

In a preferred embodiment, the third control circuit is connected to the circuit board 54

In the above solution, the electronic device provided by the embodiment of the present disclosure further includes: a third control circuit connected to the circuit board 54 .

The third control circuit is connected to the circuit board 54 for controlling the operation of the circuit board 54 , or forwarding the external command to the circuit board 54 through the third control circuit.

It should be noted that, in the embodiment of the present disclosure, the second control circuit 58 and the third control circuit may be the same control circuit, or, two different control units on the same integrated control board, the second control circuit Both the 58 and the third control circuit can be connected to the circuit board 54 through aviation plugs, wherein the aviation plugs are also sealed and fixed on the outer side wall of the sealing part in the cooling device by sealing glue.

In the embodiment of the present disclosure, the electronic device provided by the embodiment of the present disclosure accommodates the cooling liquid that can be used to cool the circuit board during operation through the sealing part in the cooling device, and after the cooling liquid is vaporized, the cooling liquid is cooled by the condensing part. The gaseous state is converted into a liquid state and returned to the sealing part, which realizes the heat dissipation of the circuit board during operation through the liquid cooling mode and the air cooling mode, so that the use of phase change heat can effectively reduce the operating temperature of the chip and improve the temperature uniformity. The energy consumption of the system is reduced; the volume of air cooling is reduced, and the integrated design removes the complicated accessories of water cooling.

In the above-mentioned embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

The above is only an exemplary embodiment of the present application, but the protection scope of the present application is not limited to this. Substitutions should be covered within the protection scope of this application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims (16)

1. A cooling apparatus, comprising: a condensing part and a sealing part, wherein,

the sealing part can contain cooling liquid, and the cooling liquid can immerse the circuit board provided with the heating element;

the condensation part comprises a condensation pipe and an air cooling structure for radiating heat of the condensation pipe; the condensation pipe is communicated with the sealing part; the air cooling structure is arranged on at least one side of the condensation pipe.

2. The cooling device according to claim 1, wherein the condensation pipe is a metal flat pipe; or a capillary structure is arranged in the condensation pipe.

3. A cooling apparatus according to claim 1 or 2, wherein an outer wall of the condensation duct is provided with a plurality of fins.

4. The cooling apparatus according to claim 1, wherein the condensing portion further comprises: the condenser comprises a first shell, wherein the first shell surrounds a first accommodating cavity, and the condenser pipe is accommodated in the first accommodating cavity.

5. The cooling device as claimed in claim 4, wherein the air-cooling structure comprises heat dissipation holes opened on a side wall of the first housing.

6. The cooling device as claimed in claim 5, wherein the first housing further comprises a heat dissipation air duct, wherein the heat dissipation air duct is accommodated in the first accommodating chamber, the heat dissipation air duct is distributed according to the position of the condensation pipe, and the heat dissipation air duct is communicated with the heat dissipation holes.

7. A cooling apparatus according to claim 1 or 5, wherein the air-cooled structure comprises a radiator fan.

8. The cooling device of claim 7, wherein when the air-cooling structure comprises a heat-dissipating fan, the cooling device further comprises: and the first power supply is connected with the cooling fan.

9. The cooling apparatus according to claim 7 or 8, wherein when the air-cooling structure includes a heat-dissipating fan, the cooling apparatus further comprises: the first control circuit is connected with the heat dissipation fan.

10. The cooling device of claim 1, wherein the sealing portion includes a second housing enclosing a second receiving chamber; and the condensation cavity of the condensation pipe is communicated with the second accommodating cavity.

11. The cooling apparatus of claim 10, wherein the second housing comprises: a cover plate, a bottom plate and a side plate; the condenser pipe is arranged at the through hole; the cover plate, the bottom plate, the side plates and the condensation pipe form a sealed space.

12. An electronic device, comprising:

the cooling device and the circuit board according to any one of claims 1 to 11, wherein the circuit board is immersed in the cooling liquid in the sealed portion, a first surface of the circuit board faces a liquid surface of the cooling liquid, the first surface has a greater number of heat generating elements than those of a second surface of the circuit board, and the first surface is opposite to the second surface.

13. The electronic device of claim 12, wherein the circuit board is at a predetermined angle relative to a surface of the cooling fluid.

14. The electronic device of claim 12, further comprising: and the second power supply is connected with the circuit board.

15. The electronic device of claim 14, further comprising: and the second control circuit is respectively connected with the circuit board and the second power supply.

16. The electronic device of claim 12, further comprising: and the third control circuit is connected with the circuit board.

Images