CN106052444B - A kind of flat-plate heat pipe array radiator - Google Patents
A kind of flat-plate heat pipe array radiator Download PDFInfo
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- CN106052444B CN106052444B CN201610550532.1A CN201610550532A CN106052444B CN 106052444 B CN106052444 B CN 106052444B CN 201610550532 A CN201610550532 A CN 201610550532A CN 106052444 B CN106052444 B CN 106052444B
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- plate
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- cold plate
- hot flow
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- 238000010438 heat treatment Methods 0.000 claims abstract description 48
- 238000009833 condensation Methods 0.000 claims abstract description 39
- 230000005494 condensation Effects 0.000 claims abstract description 39
- 230000005855 radiation Effects 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 15
- 230000004907 flux Effects 0.000 claims description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 7
- 238000011049 filling Methods 0.000 claims description 4
- 238000010146 3D printing Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 8
- 230000005484 gravity Effects 0.000 abstract description 5
- 238000009841 combustion method Methods 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 abstract description 3
- 230000003416 augmentation Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 241000272183 Geococcyx californianus Species 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 210000001367 artery Anatomy 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of flat-plate heat pipe array radiator, including heating plate and cold plate, the heating plate is horizontally disposed with and is used to place heating electronic device, the cold plate includes the first cold plate and the second cold plate, first cold plate and second cold plate are arranged on the both ends of the heating plate straight up respectively, the both sides of the cold plate are equipped with multiple row fin, and the first condensation road is provided with first cold plate, and the second condensation road is provided with second cold plate；Side is provided with the first hot flow path being connected with the described first condensation road in the heating plate, and the other side in the heating plate is provided with the second hot flow path being connected with the described second condensation road.The beneficial effects of the invention are as follows：The heat transfer property of radiator is improved, strengthens cooling effect；Liquid heat radiation working medium flows to hot flow path under gravity, can form the reciprocating motion of an one-way circulation, prevents that " dry combustion method " phenomenon occurs inside heating plate.
Description
Technical field
The present invention relates to field of radiating, and in particular to a kind of flat-plate heat pipe array radiator.
Background technology
Flat pulsating heat pipe carries out heat transfer using Working fluid phase changing has the advantages that heat transfer efficiency is high, and even temperature effect is good,
High heat flux electronic equipment dissipating heat direction has huge advantage.The flat pulsating heat pipe of traditional type places heating in the horizontal direction
When, the liquefaction working medium of condensation segment can not usually be back to bringing-up section in time, finally result in and " dry combustion method " occurs inside pulsating heat pipe now
As influenceing the vibration of working medium, the final heat transfer property for reducing pulsating heat pipe.
The content of the invention
In summary, for overcome the deficiencies in the prior art, the technical problems to be solved by the invention are to provide a kind of flat
Plate heat pipe array radiator.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of flat-plate heat pipe array radiator, including add
Hot plate and cold plate, the heating plate are horizontally disposed with and are used to place heating electronic device, and the cold plate includes the first condensation
Plate and the second cold plate, first cold plate and second cold plate are arranged on the two of the heating plate straight up respectively
End, the both sides of the cold plate are equipped with multiple row fin, in first cold plate with a pair of each row fin 1
The position answered is provided with the first condensation road, and second is provided with each one-to-one position of row fin in second cold plate
Condense road, the first condensation road and the second condensation road be in specular, and described first condenses road and described the
Two condensation roads be in downward opening U-shape, are respectively equipped with the cold plate to described first and condense road and described second cold
The liquid filling hole of heat radiation working medium is added in solidifying road；
Side is provided with the first hot flow path being connected with the described first condensation road, first heat in the heating plate
Runner is in opening towards U-shaped on the outside of the heating plate, and the other side in the heating plate is provided with and the described second condensation
The second hot flow path that road is connected, the second flow channel are in mirror image on the center line of the heating plate and first hot flow path
It is symmetrical arranged, and the U-shaped bottom wall of first hot flow path and second hot flow path is provided with rough capillary structure.
The beneficial effects of the invention are as follows：
(1) liquid heat radiation working medium flows to hot flow path under gravity, can form the reciprocal of one-way circulation
Motion, prevent that " dry combustion method " phenomenon occurs inside heating plate, improve the heat transfer property of radiator；
(2) when heating plate is horizontal positioned, cold plate is to place vertically, is more beneficial for gravity reflux, strengthens internal working medium and shakes
Swing；
(3) radiator can regard two pulsating heat pipes as and share a bringing-up section, and chip or component are conducted to adding
The heat of hot plate is cooled down by two cold plates simultaneously, enhances cooling effect；
(4) the two cold plate surface layouts placed vertically have multiple fin, on the basis of classic flat-plate pulsating heat pipe
On increase heat loss through convection area with air, be advantageous to increase the temperature difference at the cold and hot both ends of pulsating heat pipe, strengthen internal working medium
Vibration, finally play the effect of augmentation of heat transfer；
(5) by heat spreader module, it is easy to processing and installation, can needs to be combined the module according to actual radiating
Array；
(6) capillary structure surface (various structures can be made) advantageously forms bubble core at hot flow path curved segment,
Increase the probability of bringing-up section working medium generation bubble, finally play the effect of augmentation of heat transfer.
On the basis of above-mentioned technical proposal, the present invention can also do improvement further below：
Further, first hot flow path includes the larger Orbital heat flux road of opening and multiple are arranged in Orbital heat flux road and open
The less interior hot flow path of mouth, the first condensation road described in same connect the Orbital heat flux road and the interior heat nearer apart from Orbital heat flux road
Runner or adjacent two interior hot flow paths.
Using having the beneficial effect that for above-mentioned further technical scheme：Increase area of dissipation, ensure that radiating is uniform.
Further, the heat radiation working medium is any one in methanol, ethanol and acetone or nano-fluid.
Using having the beneficial effect that for above-mentioned further technical scheme：Increase radiating efficiency.
Further, the heating plate, the cold plate and the fin are that copper or aluminum are made.
Using having the beneficial effect that for above-mentioned further technical scheme：Thermal conductivity factor is high, increases radiating efficiency.
Further, the heating plate, the cold plate and the fin are through 3D printing one-shot forming.
Using having the beneficial effect that for above-mentioned further technical scheme：Avoid flat-plate heat pipe bending causing the broken of tube chamber
It is bad.
Brief description of the drawings
Fig. 1 is the front view of the present invention；
Fig. 2 is the top view of the present invention；
Fig. 3 is Fig. 2 A-A sectional views；
Fig. 4 is the side view of the present invention；
Fig. 5 is Fig. 4 B-B sectional views.
In accompanying drawing, the list of parts representated by each label is as follows：
1st, heating plate, the 2, first cold plate, the 3, second cold plate, the 4, fin, 5, first condensation road, the 6, second condensation
Road, 7, liquid filling hole, the 8, first hot flow path, the 9, second hot flow path, 10, capillary structure.
Embodiment
The principle and feature of the present invention are described below in conjunction with accompanying drawing, the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the present invention.
As Figure 1-4, a kind of flat-plate heat pipe array radiator, including heating plate 1 and cold plate, the heating plate 1
It is horizontally disposed with and is used to place heating electronic device, the cold plate includes the first cold plate 2 and the second cold plate 3, and described the
One cold plate 2 and second cold plate 3 are arranged on the both ends of the heating plate 1 straight up respectively, the cold plate
Both sides are equipped with multiple row fin 4.Cold plate is placed vertically, and multiple fin 4 are disposed with above the wooden partition of cold plate both sides and are used
To strengthen thermolysis, the shape of fin 4 can make variously-shaped (straight wing, ripple type, S types etc.) according to radiating requirements,
The two cold plate surface layouts placed vertically have multiple fin 4, fin 4 all left between up and down it is suitable between
Gap, blowed air over so as not to equidirectional, play preferable heat exchange effect.Increased on the basis of classic flat-plate pulsating heat pipe with
The heat loss through convection area of air, be advantageous to increase the temperature difference at the cold and hot both ends of pulsating heat pipe, strengthen the vibration of internal working medium, finally rise
To the effect of augmentation of heat transfer.
The first condensation road 5 is provided with each one-to-one position of row fin in first cold plate 2, described
The second condensation road 6, the first condensation road 5 and institute are provided with second cold plate 3 with each one-to-one position of row fin
The structure for stating the second condensation road 6 is in specular, and the first condensation road 5 and the second condensation road 6 are in opening court
Under U-shape, be respectively equipped with the cold plate and add radiating work into the described first condensation road 5 and the second condensation road 6
The liquid filling hole 7 of matter.Preferably：The heat radiation working medium is any one in methanol, ethanol and acetone/methanol, ethanol and acetone
Mixed working fluid/nano-fluid.
In the heating plate 1 side be provided with described first the first hot flow path 8 for being connected of condensation road 5, described first
In opening towards the U-shaped of the outside of heating plate 1, the other side in the heating plate 1 is provided with and described second hot flow path 8
The second hot flow path 9 that condensation road 6 is connected, center line and first hot-fluid of the second flow channel 9 on the heating plate 1
Road 8 is set in specular, and the U-shaped bottom wall of first hot flow path 8 and second hot flow path 9 is provided with uneven
Capillary structure 10.Hot flow path of the heat radiation working medium in heating plate 1 from liquid absorbent heat to gaseous state convert when, hot flow path elbow
Section has the surface of capillary structure 10 (can make various structures) to advantageously form bubble core, increase bringing-up section working medium generation gas
The probability of bubble, finally play the effect of augmentation of heat transfer.First hot flow path 8 includes the larger Orbital heat flux road of opening and multiple rows
Be listed in Orbital heat flux road and the less interior hot flow path that is open, the first condensation road 5 described in same connect the Orbital heat flux road and away from
The interior hot flow path nearer from Orbital heat flux road or adjacent two interior hot flow paths.
The heating plate 1, the cold plate and the fin 4 are the high metal material of copper of thermal conductivity factor or aluminium
Material condenses road or hot flow path through 3D printing one-shot forming without flat-plate heat pipe bending is destroyed.Radiator after forming
Vacuumize and heat radiation working medium (pure refrigerant or mixed working fluid of methanol, ethanol, acetone etc., nanometer stream are filled with inside backward tube chamber
Body etc.).Heating electronic device conducts heat to the heat radiation working medium inside hot flow path in heating plate, radiating by heating plate wooden partition
After working medium absorbs heat vaporization, there is pressure differential in heating road with condensation road, so as to drive heat radiation working medium from heating road to condensation road
Flowing, the heat radiation working medium condensed put heat to fin, and the heat radiation working medium for finally condensing road is converted into liquid, liquid by gaseous state
State heat radiation working medium flows to hot flow path under gravity, eventually forms the reciprocating motion of an one-way circulation, prevents from heating
" dry combustion method " phenomenon occurs for intralamellar part, improves the heat transfer property of radiator.When heating plate 1 is horizontal positioned in addition, cold plate is vertical
Place, be more beneficial for the gravity reflux of heat radiation working medium, strengthen the vibration of internal heat dissipating working medium.Radiator can regard two arteries and veins as
Dynamic heat pipe shares a bringing-up section, and chip or component conduct to the heat of heating plate while carried out by two cold plates cold
But, cooling effect is enhanced.
Heat spreader module can also finally be selected different modules to carry out array, is easy to according to actual heating power
Processing and installation.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.
Claims (5)
1. a kind of flat-plate heat pipe array radiator, including heating plate (1) and cold plate, the heating plate (1) is horizontally disposed simultaneously
For placing the electronic device that generates heat, the cold plate includes the first cold plate (2) and the second cold plate (3), first condensation
Plate (2) and second cold plate (3) are arranged on the both ends of the heating plate (1) straight up respectively, it is characterised in that described
The both sides of cold plate are equipped with multiple row fin (4), are corresponded in first cold plate (2) with each row fin
Position be provided with first condensation road (5)；It is provided with second cold plate (3) with each one-to-one position of row fin
Second condensation road (6)；First condensation road (5) and the described second structure for condensing road (6) are in specular, and described the
One condensation road (5) and second condensation road (6) are in downward opening U-shape, are respectively equipped with the cold plate to described
The liquid filling hole (7) of heat radiation working medium is added in first condensation road (5) and second condensation road (6)；
Be provided with the heating plate (1) interior side with described first condensation road (5) first hot flow path (8) for being connected, described the
One hot flow path (8) in opening towards U-shaped on the outside of the heating plate (1), the other side in the heating plate (1) be provided with
The second hot flow path (9) that second condensation road (6) is connected, second hot flow path (9) is on the heating plate (1)
Center line is set with first hot flow path (8) in specular, and first hot flow path (8) and second hot flow path
(9) U-shaped bottom wall is provided with rough capillary structure (10).
2. radiator according to claim 1, it is characterised in that first hot flow path (8) includes larger outer of opening
Hot flow path and it is multiple be arranged in Orbital heat flux road and the less interior hot flow path that is open, the first condensation road (5) connection described in same
The Orbital heat flux road and the interior hot flow path nearer apart from Orbital heat flux road or adjacent two interior hot flow paths.
3. radiator according to claim 1, it is characterised in that the heat radiation working medium is in methanol, ethanol and acetone
Any one or nano-fluid.
4. radiator according to any one of claims 1 to 3, it is characterised in that the heating plate (1), the cold plate with
And the fin (4) is that copper or aluminum are made.
5. radiator according to claim 4, it is characterised in that the heating plate (1), the cold plate and it is described dissipate
Backing (4) is through 3D printing one-shot forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610550532.1A CN106052444B (en) | 2016-07-13 | 2016-07-13 | A kind of flat-plate heat pipe array radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610550532.1A CN106052444B (en) | 2016-07-13 | 2016-07-13 | A kind of flat-plate heat pipe array radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106052444A CN106052444A (en) | 2016-10-26 |
| CN106052444B true CN106052444B (en) | 2017-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610550532.1A Active CN106052444B (en) | 2016-07-13 | 2016-07-13 | A kind of flat-plate heat pipe array radiator |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106777754B (en) * | 2016-12-30 | 2020-04-28 | 吉林建筑大学 | Optimization method for flat micro heat pipe array radiator |
| CN109565945B (en) * | 2017-03-02 | 2020-07-28 | 华为技术有限公司 | Heat conduction part and mobile terminal |
| CN107529321A (en) * | 2017-09-06 | 2017-12-29 | 邹剑青 | A kind of radiator for electronic product |
| CN107466195A (en) * | 2017-09-14 | 2017-12-12 | 郭良安 | Pulsating heat pipe and heat exchanger |
| TWI699507B (en) * | 2017-12-13 | 2020-07-21 | 奇鋐科技股份有限公司 | Basic structural body for constructing heat dissipation device and manufacturing method thereof |
| DE102021204758A1 (en) * | 2021-05-11 | 2022-11-17 | Robert Bosch Gesellschaft mit beschränkter Haftung | cooler |
| DE102021214936A1 (en) * | 2021-12-22 | 2023-06-22 | Robert Bosch Gesellschaft mit beschränkter Haftung | cooler |
| CN114895512B (en) * | 2022-06-09 | 2023-08-15 | 中国科学院长春光学精密机械与物理研究所 | Industrial camera conformal active and passive mixed cooling heat dissipation rear cover |
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|---|---|---|---|---|
| CN2869741Y (en) * | 2005-12-21 | 2007-02-14 | 李建明 | Flat-heat-tube radiator |
| CN201344752Y (en) * | 2008-11-05 | 2009-11-11 | 李骥 | Heat radiation device for loop heat pipe |
| CN203177704U (en) * | 2013-01-25 | 2013-09-04 | 苏州聚力电机有限公司 | Clamping locating type uniform temperature board fin integration module |
| CN104567499A (en) * | 2015-01-20 | 2015-04-29 | 北京建筑大学 | Pulse heat pipe heat radiation device used for electronic device and heat radiation device thereof |
| CN205991730U (en) * | 2016-07-13 | 2017-03-01 | 梁才航 | A kind of flat-plate heat pipe array radiator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4324367B2 (en) * | 2002-11-06 | 2009-09-02 | ナブテスコ株式会社 | Element heatsink |
| US20110214842A1 (en) * | 2010-03-05 | 2011-09-08 | Lea-Min Technologies Co., Ltd. | Heat sink |
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2016
- 2016-07-13 CN CN201610550532.1A patent/CN106052444B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2869741Y (en) * | 2005-12-21 | 2007-02-14 | 李建明 | Flat-heat-tube radiator |
| CN201344752Y (en) * | 2008-11-05 | 2009-11-11 | 李骥 | Heat radiation device for loop heat pipe |
| CN203177704U (en) * | 2013-01-25 | 2013-09-04 | 苏州聚力电机有限公司 | Clamping locating type uniform temperature board fin integration module |
| CN104567499A (en) * | 2015-01-20 | 2015-04-29 | 北京建筑大学 | Pulse heat pipe heat radiation device used for electronic device and heat radiation device thereof |
| CN205991730U (en) * | 2016-07-13 | 2017-03-01 | 梁才航 | A kind of flat-plate heat pipe array radiator |
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| CN106052444A (en) | 2016-10-26 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20170705 Address after: 541000 1 Jinji Road, Qixing District, Guilin, the Guangxi Zhuang Autonomous Region Applicant after: GUILIN University OF ELECTRONIC TECHNOLOGY Address before: 541000 the Guangxi Zhuang Autonomous Region Qixing District, Guilin City jinji Road No. 1, Guilin University of Electronic Technology Applicant before: Liang Caihang |
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Application publication date: 20161026 Assignee: Guilin Qunmei Technology Co.,Ltd. Assignor: GUILIN University OF ELECTRONIC TECHNOLOGY Contract record no.: X2023980044664 Denomination of invention: A flat heat pipe array heat sink Granted publication date: 20171114 License type: Common License Record date: 20231031 |
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| EE01 | Entry into force of recordation of patent licensing contract |